CN221826936U - Chip carrier and system-level test device - Google Patents
Chip carrier and system-level test device Download PDFInfo
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Abstract
本实用新型公开了芯片承载装置,包括:承载平台;托框,所述承载平台内安装有托框,所述承载平台内均匀开设有活动腔,所述活动腔内安装有弹性件二,所述托框底部均匀设有导向杆,所述导向杆伸进活动腔内与弹性件二连接,所述托框的四个角均设有耳板,所述耳板内开设有伸缩槽,所述伸缩槽内安装有弹性件一,所述弹性件一另一端固定有锥形卡块;锁止件,所述承载平台内对应耳板的位置设有锁止件,所述锁止件包括固定杆,所述固定杆顶部固定有圆锥台一,所述固定杆外围活动套有圆锥台二。通过向下按压托框,配合锁止件,能够在不借助镊子等辅助工具的情况下快速的取放芯片,从而提高测试效率,同时也能够有效避免镊子等辅助工具损坏芯片。
The utility model discloses a chip carrier device, including: a carrier platform; a support frame, a support frame is installed in the carrier platform, a movable cavity is evenly opened in the carrier platform, a second elastic member is installed in the movable cavity, a guide rod is evenly arranged at the bottom of the support frame, the guide rod extends into the movable cavity and is connected with the second elastic member, ear plates are arranged at the four corners of the support frame, a telescopic groove is opened in the ear plate, an elastic member is installed in the telescopic groove, and a conical block is fixed at the other end of the elastic member; a locking member, a locking member is arranged at a position corresponding to the ear plate in the carrier platform, the locking member includes a fixing rod, a truncated cone is fixed on the top of the fixing rod, and a truncated cone is movablely sleeved on the outer periphery of the fixing rod. By pressing the support frame downward and cooperating with the locking member, the chip can be quickly taken and placed without the aid of auxiliary tools such as tweezers, thereby improving the test efficiency, and at the same time, the chip can be effectively prevented from being damaged by auxiliary tools such as tweezers.
Description
技术领域Technical Field
本实用新型属于芯片测试设备技术领域,尤其涉及芯片承载装置及系统级测试装置。The utility model belongs to the technical field of chip testing equipment, and in particular relates to a chip carrying device and a system-level testing device.
背景技术Background Art
芯片在出厂前需要对其进行系统级测试,测试时要将芯片放置在测试设备的承载装置上。The chip needs to undergo system-level testing before leaving the factory. During the test, the chip must be placed on the carrier of the test equipment.
目前在对芯片进行测试时,需要借助镊子等辅助工具将芯片放置在承载装置上,测试完毕后也需要通过镊子等辅助工具将芯片取出来,这样较为麻烦。Currently, when testing a chip, it is necessary to place the chip on a carrier with the aid of auxiliary tools such as tweezers. After the test is completed, the chip also needs to be taken out with auxiliary tools such as tweezers, which is rather troublesome.
实用新型内容Utility Model Content
本实用新型针对现有技术中存在的问题,提出如下技术方案:The utility model aims at solving the problems existing in the prior art and proposes the following technical solutions:
芯片承载装置,包括:A chip carrier device, comprising:
承载平台;Carrying platform;
托框,所述承载平台内安装有托框,所述承载平台内均匀开设有活动腔,所述活动腔内安装有弹性件二,所述托框底部均匀设有导向杆,所述导向杆伸进活动腔内与弹性件二连接,所述托框的四个角均设有耳板,所述耳板内开设有伸缩槽,所述伸缩槽内安装有弹性件一,所述弹性件一另一端固定有锥形卡块,所述锥形卡块贯穿耳板;A support frame is installed in the carrying platform, and movable cavities are evenly provided in the carrying platform, and a second elastic member is installed in the movable cavity. A guide rod is evenly provided at the bottom of the support frame, and the guide rod extends into the movable cavity and is connected with the second elastic member. Ear plates are provided at the four corners of the support frame, and a telescopic groove is provided in the ear plate, and an elastic member 1 is installed in the telescopic groove. A conical block is fixed to the other end of the elastic member 1, and the conical block passes through the ear plate;
锁止件,所述承载平台内对应耳板的位置设有锁止件,所述锁止件包括固定杆,所述固定杆顶部固定有圆锥台一,所述固定杆外围活动套有圆锥台二,所述圆锥台二与圆锥台一相对称,所述锥形卡块与圆锥台二与圆锥台一相匹配。A locking piece is provided at a position corresponding to the ear plate in the bearing platform, and the locking piece includes a fixing rod, a frustum one is fixed on the top of the fixing rod, a frustum two is movably sleeved on the outer periphery of the fixing rod, the frustum two is symmetrical with the frustum one, and the conical clamping block matches the frustum two and the frustum one.
作为上述技术方案的优选,所述托框上对称开设有凹口。As a preferred embodiment of the above technical solution, the support frame is symmetrically provided with notches.
作为上述技术方案的优选,所述托框两侧对称设有导向板,所述承载平台内对应开设有导向槽,所述导向板滑动安装在导向槽内。As a preferred embodiment of the above technical solution, guide plates are symmetrically provided on both sides of the support frame, and guide grooves are correspondingly opened in the bearing platform, and the guide plates are slidably installed in the guide grooves.
作为上述技术方案的优选,所述托框内侧尺寸小于芯片外侧尺寸,芯片外边搭设在托框上。As a preferred embodiment of the above technical solution, the inner dimension of the support frame is smaller than the outer dimension of the chip, and the outer edge of the chip is placed on the support frame.
芯片系统级测试装置,包括:Chip system-level test equipment, including:
上述芯片承载装置;The chip carrier device mentioned above;
测试座,所述测试座包括探针座,所述探针座安装在承载平台内,且位于托框内侧,所述探针座上均匀设有探针;A test seat, the test seat comprising a probe seat, the probe seat is installed in the bearing platform and located inside the support frame, and probes are evenly arranged on the probe seat;
按压机构,所述按压机构包括防护罩,所述防护罩与承载平台相匹配,所述防护罩与承载平台铰接安装在一起,所述防护罩上贯穿设有调节杆,所述调节杆一端设有按压罩,所述按压罩内套有按压板,所述按压板与按压罩之间均匀设有弹性件三。The pressing mechanism includes a protective cover, the protective cover matches the bearing platform, the protective cover and the bearing platform are hingedly installed together, an adjusting rod is passed through the protective cover, a pressing cover is provided at one end of the adjusting rod, a pressing plate is sleeved in the pressing cover, and three elastic members are evenly provided between the pressing plate and the pressing cover.
本实用新型的有益效果为:The beneficial effects of the utility model are:
本实用新型设置有托框和锁止件,通过向下按压托框,配合锁止件,能够在不借助镊子等辅助工具的情况下快速的取放芯片,从而提高测试效率,同时也能够有效避免镊子等辅助工具损坏芯片。The utility model is provided with a support frame and a locking piece. By pressing the support frame downward and cooperating with the locking piece, the chip can be quickly taken and placed without the aid of auxiliary tools such as tweezers, thereby improving the test efficiency and also effectively preventing the chip from being damaged by auxiliary tools such as tweezers.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本实用新型整体结构示意图;Figure 1 is a schematic diagram of the overall structure of the utility model;
图2为承载平台剖面结构示意图;FIG2 is a schematic diagram of the cross-sectional structure of the load-bearing platform;
图3为按压机构剖面结构示意图;FIG3 is a schematic diagram of a cross-sectional structure of a pressing mechanism;
图4为现有芯片结构示意图。FIG. 4 is a schematic diagram of a conventional chip structure.
图中:In the figure:
1、承载平台;11、导向槽;12、活动腔;2、托框;21、耳板;211、伸缩槽;212、弹性件一;213、锥形卡块;22、导向板;23、凹口;24、导向杆;25、弹性件二;3、锁止件;31、固定杆;32、圆锥台一;33、圆锥台二;4、测试座;41、探针座;42、探针;5、按压机构;51、防护罩;52、调节杆;53、按压罩;54、按压板;55、弹性件三。1. Carrying platform; 11. Guide groove; 12. Movable cavity; 2. Support frame; 21. Ear plate; 211. Telescopic groove; 212. Elastic part 1; 213. Conical block; 22. Guide plate; 23. Notch; 24. Guide rod; 25. Elastic part 2; 3. Locking part; 31. Fixing rod; 32. Cone truncated cone 1; 33. Cone truncated cone 2; 4. Test seat; 41. Probe seat; 42. Probe; 5. Pressing mechanism; 51. Protective cover; 52. Adjusting rod; 53. Pressing cover; 54. Pressing plate; 55. Elastic part 3.
具体实施方式DETAILED DESCRIPTION
为使本实用新型实施例的目的、技术方案和优点更加清楚,下面将结合实施例对本实用新型技术方案进行清楚、完整地描述。In order to make the purpose, technical solution and advantages of the embodiments of the present utility model clearer, the technical solution of the present utility model will be clearly and completely described below in conjunction with the embodiments.
实施例Example
如图1、图2、图4所示;As shown in Figure 1, Figure 2, and Figure 4;
芯片承载装置,包括承载平台1,承载平台1内开设有凹槽,凹槽内安装有托框2,托框2内侧尺寸小于芯片外侧尺寸,芯片外边搭设在托框2上,承载平台1内均匀开设有活动腔12,活动腔12内安装有弹性件二25,弹性件二25可为弹簧,托框2底部均匀设有导向杆24,导向杆24伸进活动腔12内与弹性件二25连接,托框2的四个角均设有耳板21,耳板21内开设有伸缩槽211,伸缩槽211内安装有弹性件一212,弹性件一212可为弹簧,弹性件一212另一端固定有锥形卡块213,锥形卡块213贯穿耳板21;承载平台1内对应耳板21的位置设有锁止件3,锁止件3包括固定杆31,固定杆31顶部固定有圆锥台一32,固定杆31外围活动套有圆锥台二33,圆锥台二33与圆锥台一32相对称,锥形卡块213与圆锥台二33与圆锥台一32相匹配,当需要对芯片进行测试时,将芯片放在托框2上,然后向下按压托框2,锥形卡块213受到圆锥台一32的挤压而缩进伸缩槽211内,当锥形卡块213移动到圆锥台一32下方是,锥形卡块213由于解除限制,同时导向杆24挤压弹性件二25,配合弹性件一212的回弹使得锥形卡块213伸出抵在圆锥台一32下方,芯片与测试设备接触进行测试,当测试完毕时,继续向下按压托框2,使得锥形卡块213继续被圆锥台二33挤压,由于圆锥台二33的倾斜面朝斜上方,使得锥形卡块213慢慢伸出,此时从开托框2,由于弹性件二25的回弹,锥形卡块213会带动圆锥台二33向上移动,当圆锥台二33与圆锥台一32贴合时,锥形卡块213慢慢收缩,从而配合弹性件二25的弹力直接移动到圆锥台一32上方,此时芯片被托起来,方便拿取,从而提高测试效率,同时也能够有效避免镊子等辅助工具损坏芯片;The chip carrying device comprises a carrying platform 1, a groove is provided in the carrying platform 1, a support frame 2 is installed in the groove, the inner size of the support frame 2 is smaller than the outer size of the chip, the outer edge of the chip is placed on the support frame 2, an active cavity 12 is evenly provided in the carrying platform 1, an elastic member 25 is installed in the active cavity 12, and the elastic member 25 can be a spring, and a guide rod 24 is evenly provided at the bottom of the support frame 2, the guide rod 24 extends into the active cavity 12 and is connected to the elastic member 25, and ear plates 21 are provided at the four corners of the support frame 2, and a telescopic groove 211 is provided in the ear plate 21, and the telescopic groove 2 An elastic member 212 is installed in the bearing platform 11, and the elastic member 212 can be a spring. A conical block 213 is fixed at the other end of the elastic member 212, and the conical block 213 passes through the ear plate 21; a locking member 3 is provided at a position corresponding to the ear plate 21 in the bearing platform 1, and the locking member 3 includes a fixing rod 31, a frustum 32 is fixed on the top of the fixing rod 31, and a frustum 33 is movably sleeved on the periphery of the fixing rod 31, and the frustum 33 is symmetrical with the frustum 32, and the conical block 213 matches the frustum 33 and the frustum 32. When the chip needs to be tested During the test, the chip is placed on the support frame 2, and then the support frame 2 is pressed downward, and the conical block 213 is squeezed by the truncated cone 32 and retracted into the telescopic groove 211. When the conical block 213 moves to the bottom of the truncated cone 32, the conical block 213 is released from the restriction, and at the same time, the guide rod 24 squeezes the elastic member 25, and the elastic member 212 rebounds so that the conical block 213 extends out and rests under the truncated cone 32. The chip contacts the test equipment for testing. When the test is completed, the support frame 2 is pressed downward again, so that the conical block 213 is further squeezed by the truncated cone 32. The cone 2 33 is squeezed, and since the inclined surface of the cone 2 33 faces obliquely upward, the conical block 213 slowly extends out. At this time, from the opening support frame 2, due to the rebound of the elastic member 25, the conical block 213 will drive the cone 2 33 to move upward. When the cone 2 33 fits the cone 1 32, the conical block 213 slowly contracts, and thus cooperates with the elastic force of the elastic member 2 25 to move directly above the cone 1 32. At this time, the chip is lifted up, which is convenient for taking, thereby improving the test efficiency, and at the same time, it can also effectively prevent auxiliary tools such as tweezers from damaging the chip;
进一步地,托框2上对称开设有凹口23,凹口23方便操作人员通过两个手指将芯片取出来;Furthermore, the support frame 2 is symmetrically provided with notches 23, which facilitate the operator to take out the chip with two fingers;
进一步地,托框2两侧对称设有导向板22,承载平台1内对应开设有导向槽11,导向板22滑动安装在导向槽11内,这样一方面能够保证托框2上下移动时的稳定性,另一方面可通过按压导向板22使托框2下移,避免直接按压托框2时碰到芯片而损坏芯片。Furthermore, guide plates 22 are symmetrically provided on both sides of the support frame 2, and corresponding guide grooves 11 are opened in the supporting platform 1. The guide plates 22 are slidably installed in the guide grooves 11. On the one hand, this can ensure the stability of the support frame 2 when it moves up and down, and on the other hand, the support frame 2 can be moved down by pressing the guide plates 22, avoiding directly pressing the support frame 2 to hit the chip and damage the chip.
如图1和图3所示;As shown in Figures 1 and 3;
芯片系统级测试装置,包括上述芯片承载装置、测试座4和按压机构5,测试座4包括探针座41,探针座41安装在承载平台1内,且位于托框2内侧,探针座41上均匀设有探针42,通过探针42与芯片接触从而对芯片进行测试处理;按压机构5包括防护罩51,防护罩51与承载平台1相匹配,防护罩51与承载平台1铰接安装在一起,防护罩51一方面能够为芯片测试时提供无尘环境,从而提高测试效果,防护罩51上贯穿设有调节杆52,调节杆52可为丝杆,调节杆52一端设有按压罩53,按压罩53内套有按压板54,按压板54与按压罩53之间均匀设有弹性件三55,弹性件三55可为弹簧,通过调节杆52可调节按压板54的位置,从而使按压板54在按压芯片时力度适当,避免力度较大损坏芯片,力度较小导致芯片无法与探针42接触导致测试无法进行,弹性件三55给按压板54提供缓冲,从而更好的保护芯片。The chip system-level testing device comprises the above-mentioned chip carrying device, a test seat 4 and a pressing mechanism 5. The test seat 4 comprises a probe seat 41, which is installed in the carrying platform 1 and located on the inner side of the support frame 2. Probes 42 are evenly arranged on the probe seat 41, and the chip is tested by contacting the probes 42 with the chip; the pressing mechanism 5 comprises a protective cover 51, which matches the carrying platform 1, and the protective cover 51 is hingedly installed with the carrying platform 1. On the one hand, the protective cover 51 can provide a dust-free environment for chip testing, thereby improving the test effect, and the protective cover An adjusting rod 52 is passed through 51, and the adjusting rod 52 can be a screw rod. A pressing cover 53 is provided at one end of the adjusting rod 52, and a pressing plate 54 is sleeved in the pressing cover 53. Elastic parts 55 are evenly arranged between the pressing plate 54 and the pressing cover 53, and the elastic parts 55 can be springs. The position of the pressing plate 54 can be adjusted by the adjusting rod 52, so that the pressing plate 54 can press the chip with appropriate force to avoid damaging the chip due to excessive force, and preventing the chip from being unable to contact the probe 42 due to insufficient force, resulting in the inability to perform the test. The elastic part 55 provides a buffer for the pressing plate 54, thereby better protecting the chip.
以上实施例仅用以说明本实用新型的技术方案,而非对其限制。The above embodiments are only used to illustrate the technical solution of the utility model, but not to limit it.
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