CN221793320U - Cutting device for diamond cutting piece - Google Patents
Cutting device for diamond cutting piece Download PDFInfo
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- CN221793320U CN221793320U CN202323479345.3U CN202323479345U CN221793320U CN 221793320 U CN221793320 U CN 221793320U CN 202323479345 U CN202323479345 U CN 202323479345U CN 221793320 U CN221793320 U CN 221793320U
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- 238000005520 cutting process Methods 0.000 title claims abstract description 145
- 239000010432 diamond Substances 0.000 title claims abstract description 69
- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 68
- 230000007246 mechanism Effects 0.000 claims abstract description 28
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- 230000001360 synchronised effect Effects 0.000 claims description 4
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 3
- 239000000725 suspension Substances 0.000 description 3
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 2
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 239000004575 stone Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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Abstract
本实用新型涉及切割技术领域,具体为一种金刚石切割片用切割装置,包括支撑平台和金刚石切割片,支撑平台的上方通过升降机构连接有开口朝下设置的切割罩,金刚石切割片转动连接在切割罩上的内底部且金刚石切割片的底部凸出于切割罩的底部,切割罩的底部连接有伸缩遮挡罩,伸缩遮挡罩在自由状态下底部低于金刚石切割片的底端,金刚石切割片的两侧均设置有与切割罩固定连通的吸屑罩,两个吸屑罩内均设置有与金刚石切割片固定连接的吸屑螺带,且两个吸屑螺带的螺旋方向反向设置,本实用新型便于对碎屑进行遮挡和收集,避免碎屑四溅,同时还可避免在水平移动工件时操作人员手被切割的情况,进一步提高安全性能。
The utility model relates to the field of cutting technology, specifically to a cutting device for a diamond cutting blade, comprising a supporting platform and a diamond cutting blade, wherein a cutting cover with an opening facing downward is connected above the supporting platform through a lifting mechanism, the diamond cutting blade is rotatably connected to the inner bottom of the cutting cover, and the bottom of the diamond cutting blade protrudes from the bottom of the cutting cover, a telescopic shielding cover is connected to the bottom of the cutting cover, and the bottom of the telescopic shielding cover is lower than the bottom end of the diamond cutting blade in a free state, both sides of the diamond cutting blade are provided with chip suction covers fixedly connected to the cutting cover, and chip suction spiral belts fixedly connected to the diamond cutting blade are provided in the two chip suction covers, and the spiral directions of the two chip suction spiral belts are arranged in opposite directions. The utility model is convenient for shielding and collecting debris, avoiding the debris from splashing, and can also avoid the situation where the operator's hands are cut when the workpiece is moved horizontally, thereby further improving the safety performance.
Description
技术领域Technical Field
本实用新型涉及切割技术领域,具体为一种金刚石切割片用切割装置。The utility model relates to the technical field of cutting, in particular to a cutting device for a diamond cutting blade.
背景技术Background Art
金刚石切割是一种切割工具,广泛应用于石材,混凝土,预制板,新老马路,陶瓷等硬脆材料的加工.金刚石切割片主要由两部分组成;基体与刀头,基体是粘结刀头的主要支撑部分,而刀头则是在使用过程中起切割的部分,刀头会在使用中而不断地消耗掉,而基体则不会,刀头之所以能起切割的作用是因为其中含有金刚石,金刚石作为目前最硬的物质,它在刀头中摩擦切割被加工对象,而金刚石颗粒则由金属包裹在刀头内部,金刚石切割片不能够单独使用,一般安装至切割装置上进行使用,经检索,公开号为CN209453943U的中国专利公开了一种金刚石切割片切割机,其在使用时,将待切割材料固定在工作台上,启动转动组件,转动组件带动工作台转动,从而使待切割材料转动到切割所需的角度,然后停止转动组件,启动气压缸,气压缸带动伸缩杆伸长,从而带动金刚石切割片向下移动,当金刚石切割片移动到所需位置时,停止气压缸,启动驱动电机,驱动电机带动金刚石切割片转动,从而对待切割材料进行切割;本实施例中,通过转动电机带动工作台转动,从而带动工作台上的待切割材料转动,调节金刚石切割片对待切割材料的切割角度,避免人力将材料进行旋转,提高工作效率,降低劳动强度,节省人力,且可以提高切割的精确度,保证不同的切割需求,但是,其在切割过程中,不仅容易有碎屑四溅,当将工件在切割时进行移动时,还容易误伤操作人员的手,安全性较低。Diamond cutting is a cutting tool widely used in the processing of hard and brittle materials such as stone, concrete, prefabricated panels, new and old roads, ceramics, etc. The diamond cutting blade is mainly composed of two parts: a substrate and a cutter head. The substrate is the main supporting part of the bonded cutter head, and the cutter head is the part that cuts during use. The cutter head will be continuously consumed during use, while the substrate will not. The cutter head can play a cutting role because it contains diamonds. Diamond is currently the hardest substance. It rubs and cuts the object to be processed in the cutter head, and the diamond particles are wrapped in metal inside the cutter head. Diamond cutting blades cannot be used alone and are generally installed on cutting devices for use. After searching, the Chinese patent with publication number CN209453943U discloses a diamond cutting blade cutting machine. When it is used, the material to be cut is fixed on the workbench, the rotating assembly is started, and the rotating assembly The components drive the workbench to rotate, so that the material to be cut is rotated to the required cutting angle, and then the rotating component is stopped, and the pneumatic cylinder is started. The pneumatic cylinder drives the telescopic rod to extend, thereby driving the diamond cutting blade to move downward. When the diamond cutting blade moves to the required position, the pneumatic cylinder is stopped, and the driving motor is started. The driving motor drives the diamond cutting blade to rotate, thereby cutting the material to be cut; in this embodiment, the workbench is driven to rotate by the rotating motor, thereby driving the material to be cut on the workbench to rotate, and adjusting the cutting angle of the diamond cutting blade to the material to be cut, avoiding manual rotation of the material, improving work efficiency, reducing labor intensity, saving manpower, and improving cutting accuracy to meet different cutting requirements. However, during the cutting process, not only is it easy for debris to splash, but when the workpiece is moved during cutting, it is also easy to accidentally injure the operator's hand, and the safety is relatively low.
实用新型内容Utility Model Content
(一)解决的技术问题1. Technical issues to be solved
针对现有技术的不足,本实用新型提供了一种金刚石切割片用切割装置,便于对碎屑进行遮挡和收集,避免碎屑四溅,同时还可避免在水平移动工件时操作人员手被切割的情况,进一步提高安全性能。In view of the deficiencies in the prior art, the utility model provides a cutting device for a diamond cutting blade, which is convenient for shielding and collecting debris to avoid debris splashing, and can also prevent the operator's hands from being cut when the workpiece is moved horizontally, thereby further improving safety performance.
(二)技术方案(II) Technical solution
为实现上述目的,本实用新型提供如下技术方案:一种金刚石切割片用切割装置,包括支撑平台和金刚石切割片,所述支撑平台的上方通过升降机构连接有开口朝下设置的切割罩,所述金刚石切割片转动连接在切割罩上的内底部且金刚石切割片的底部凸出于切割罩的底部,所述切割罩的底部设置有伸缩遮挡罩,所述伸缩遮挡罩在自由状态下底部低于金刚石切割片的底端,所述金刚石切割片的两侧均设置有与切割罩固定连通的吸屑罩,两个所述吸屑罩内均设置有与金刚石切割片固定连接的吸屑螺带,且两个吸屑螺带的螺旋方向反向设置,所述切割罩上还设置有驱动金刚石切割片旋转的驱动机构和与两个吸屑罩连通的碎屑收集处理机构。To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cutting device for a diamond cutting blade, comprising a supporting platform and a diamond cutting blade, a cutting cover with an opening facing downward connected to the top of the supporting platform through a lifting mechanism, the diamond cutting blade is rotatably connected to the inner bottom of the cutting cover and the bottom of the diamond cutting blade protrudes from the bottom of the cutting cover, a telescopic shielding cover is provided at the bottom of the cutting cover, the bottom of the telescopic shielding cover is lower than the bottom end of the diamond cutting blade in a free state, both sides of the diamond cutting blade are provided with chip suction covers fixedly connected to the cutting cover, two chip suction covers are provided with chip suction spiral belts fixedly connected to the diamond cutting blade, and the spiral directions of the two chip suction spiral belts are arranged in opposite directions, and the cutting cover is also provided with a driving mechanism for driving the diamond cutting blade to rotate and a debris collection and processing mechanism connected to the two chip suction covers.
优选的,所述碎屑收集处理机构包括固定安装在切割罩顶部的收屑箱,所述收屑箱的顶部固定安装有滤网,所述收屑箱上位于滤网的底部设置有可与滤网的底部滑动配合的集屑斗,两个所述吸屑罩通过连通管网密封固定贯穿滤网并与收屑箱连通。Preferably, the debris collection and processing mechanism includes a chip box fixedly mounted on the top of the cutting cover, a filter screen fixedly mounted on the top of the chip box, and a chip collecting bucket slidably matched with the bottom of the filter screen is provided on the chip box at the bottom of the filter screen. The two chip suction hoods are sealed and fixed through a connecting pipe network to penetrate the filter screen and are connected to the chip box.
优选的,所述驱动机构包括驱动电机,所述金刚石切割片的两侧均固定连接有各自侧的吸屑罩旋转的转轴,且位于两侧的吸屑螺带分别固定安装在位于同侧的转轴上,所述驱动电机的输出轴与其中一个转轴传动连接。Preferably, the driving mechanism includes a driving motor, and both sides of the diamond cutting blade are fixedly connected with rotating shafts for rotating chip suction covers on their respective sides, and the chip suction spiral belts on both sides are respectively fixedly mounted on the rotating shafts on the same side, and the output shaft of the driving motor is transmission-connected to one of the rotating shafts.
优选的,所述升降机构包括固定安装在支撑平台上的龙门架,所述龙门架上竖向固定安装有竖向驱动缸,所述竖向驱动缸的底部与切割罩固定连接。Preferably, the lifting mechanism comprises a gantry fixedly mounted on the supporting platform, a vertical driving cylinder is vertically fixedly mounted on the gantry, and the bottom of the vertical driving cylinder is fixedly connected to the cutting cover.
优选的,所述驱动电机通过安装架吊装在收屑箱上且位于滤网上方的位置,且驱动电机的输出轴与其中一个转轴通过同步带传动连接。Preferably, the drive motor is hoisted on the chip collecting box through a mounting frame and is located above the filter screen, and the output shaft of the drive motor is connected to one of the rotating shafts through a synchronous belt transmission.
优选的,所述伸缩遮挡罩的底部固定连接有固定底框,所述固定底框的顶部固定连接有多个与切割罩导向滑动配合的导向角钢。Preferably, the bottom of the telescopic shielding cover is fixedly connected to a fixed bottom frame, and the top of the fixed bottom frame is fixedly connected to a plurality of guide angle steels that are slidingly matched with the cutting cover guides.
(三)有益效果(III) Beneficial effects
与现有技术相比,本实用新型提供了一种金刚石切割片用切割装置,具备以下有益效果:Compared with the prior art, the utility model provides a cutting device for a diamond cutting blade, which has the following beneficial effects:
该金刚石切割片用切割装置,通过升降机构可将金刚石切割片下移至放置在支撑平台上的待切割工件,通过伸缩遮挡罩的设置,便于对金刚石切割片进行遮挡,避免操作人员的手触碰到金刚石切割片上,同时便于在切割过程中进行对碎屑进行遮挡,通过两个分设在金刚石切割片两侧的吸屑螺带,便于随着金刚石切割片的旋转进行旋转,并将切割过程中产生碎屑吸入两侧的吸屑罩内,并通过碎屑处理机构进行收集处理,由于两个吸屑螺带与金刚石切割片固定连接,从而便于在驱动机构驱动金刚石切割片旋转的同时带动两个吸屑螺带进行旋转,从而使切割和碎屑收集进行同时启闭,该装置便于对碎屑进行遮挡和收集,避免碎屑四溅,同时还可避免在水平移动工件时操作人员手被切割的情况,进一步提高安全性能,同时碎屑收集的启闭伴随着切割的启闭同时进行,操作简便。The cutting device for a diamond cutting blade can move the diamond cutting blade down to a workpiece to be cut placed on a supporting platform through a lifting mechanism. The arrangement of a telescopic shielding cover facilitates shielding of the diamond cutting blade to prevent an operator's hands from touching the diamond cutting blade, and facilitates shielding of debris during the cutting process. Two chip suction spiral belts are arranged on both sides of the diamond cutting blade, which can rotate along with the rotation of the diamond cutting blade, and absorb the debris generated during the cutting process into the chip suction covers on both sides, and collect and process the debris through a debris processing mechanism. Since the two chip suction spiral belts are fixedly connected to the diamond cutting blade, the two chip suction spiral belts can be driven to rotate while the driving mechanism drives the diamond cutting blade to rotate, so that cutting and debris collection can be opened and closed at the same time. The device facilitates shielding and collecting debris to prevent debris from splashing, and can also prevent the operator's hands from being cut when the workpiece is moved horizontally, further improving safety performance. At the same time, the opening and closing of the debris collection is carried out simultaneously with the opening and closing of the cutting, and the operation is simple.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
图1为本实用新型整体的结构示意图;FIG1 is a schematic diagram of the overall structure of the utility model;
图2为本实用新型图1中A处的局部放大结构示意图;FIG2 is a schematic diagram of a partial enlarged structure of the A portion in FIG1 of the present utility model;
图3为本实用新型无支撑平台和龙门架升降机构的整体的结构示意图;FIG3 is a schematic diagram of the overall structure of the unsupported platform and gantry lifting mechanism of the utility model;
图4为本实用新型切割罩、吸屑罩、驱动机构和伸缩遮挡罩配合分解的局部剖视的结构示意图。Fig. 4 is a schematic diagram of the structure of a partial cross-section of the cutting cover, the chip suction cover, the driving mechanism and the telescopic shielding cover in the present invention.
附图中标记:1、支撑平台;2、龙门架;3、竖向驱动缸;4、切割罩;5、金刚石切割片;6、吸屑罩;7、转轴;8、吸屑螺带;9、收屑箱;10、滤网;11、连通管网;12、集屑斗;13、安装架;14、驱动电机;15、同步带;16、伸缩遮挡罩;17、固定底框;18、导向角钢;19、顶板;20、固定吊杆;21、导向杆。Markings in the attached drawings: 1. Support platform; 2. Gantry; 3. Vertical drive cylinder; 4. Cutting hood; 5. Diamond cutting blade; 6. Chip suction hood; 7. Rotating shaft; 8. Chip suction screw belt; 9. Chip collection box; 10. Filter screen; 11. Connecting pipe network; 12. Chip collection bucket; 13. Mounting frame; 14. Drive motor; 15. Synchronous belt; 16. Telescopic shielding hood; 17. Fixed bottom frame; 18. Guide angle steel; 19. Top plate; 20. Fixed suspension rod; 21. Guide rod.
具体实施方式DETAILED DESCRIPTION
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本实用新型一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本实用新型保护的范围。The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
实施例:Example:
请参阅图1-4,一种金刚石切割片用切割装置,包括支撑平台1和金刚石切割片5,支撑平台1的上方通过升降机构连接有开口朝下设置的切割罩4,金刚石切割片5转动连接在切割罩4上的内底部且金刚石切割片5的底部凸出于切割罩4的底部,切割罩4的底部固定连接有伸缩遮挡罩16,伸缩遮挡罩16在自由状态下底部低于金刚石切割片5的底端,金刚石切割片5的两侧均设置有与切割罩4固定连通的吸屑罩6,两个吸屑罩6内均设置有与金刚石切割片5固定连接的吸屑螺带8,且两个吸屑螺带8的螺旋方向反向设置,切割罩4上还设置有驱动金刚石切割片5旋转的驱动机构和与两个吸屑罩6连通的碎屑收集处理机构。Please refer to Figures 1-4, a cutting device for a diamond cutting blade includes a supporting platform 1 and a diamond cutting blade 5. A cutting cover 4 with an opening facing downward is connected to the top of the supporting platform 1 through a lifting mechanism. The diamond cutting blade 5 is rotatably connected to the inner bottom of the cutting cover 4 and the bottom of the diamond cutting blade 5 protrudes from the bottom of the cutting cover 4. A telescopic shielding cover 16 is fixedly connected to the bottom of the cutting cover 4. The bottom of the telescopic shielding cover 16 is lower than the bottom end of the diamond cutting blade 5 in a free state. Both sides of the diamond cutting blade 5 are provided with chip suction covers 6 fixedly connected to the cutting cover 4. Both chip suction covers 6 are provided with chip suction spiral belts 8 fixedly connected to the diamond cutting blade 5, and the spiral directions of the two chip suction spiral belts 8 are set in opposite directions. The cutting cover 4 is also provided with a driving mechanism for driving the diamond cutting blade 5 to rotate and a debris collection and processing mechanism connected to the two chip suction covers 6.
具体的,碎屑收集处理机构包括固定安装在切割罩4顶部的收屑箱9,收屑箱9的顶部固定安装有滤网10,收屑箱9上位于滤网10的底部设置有可与滤网10的底部滑动配合的集屑斗12,两个吸屑罩6通过连通管网11密封固定贯穿滤网10并与收屑箱9连通,由于连通管网11的连通,可使从两个吸屑罩6导出的碎屑从顶部导入收屑箱9内,同时气体通过滤网10从顶部出去,由于滤网10的设置,使碎屑残留在集屑斗12内,由于集屑斗12与滤网10的底部可滑动配合,当将集屑斗12从收屑箱9内拉出时,可将滤网10底部的碎屑刮下来并进入集屑斗12内。Specifically, the debris collection and processing mechanism includes a chip box 9 fixedly mounted on the top of the cutting hood 4, a filter screen 10 fixedly mounted on the top of the chip box 9, and a chip collecting bucket 12 slidably matched with the bottom of the filter screen 10 is provided on the chip box 9 at the bottom of the filter screen 10. The two chip suction hoods 6 are sealed and fixed through the filter screen 10 and connected to the chip box 9 through a connecting pipe network 11. Due to the connection of the connecting pipe network 11, the debris exported from the two chip suction hoods 6 can be introduced into the chip box 9 from the top, and the gas goes out from the top through the filter screen 10. Due to the setting of the filter screen 10, the debris remains in the chip collecting bucket 12. Since the chip collecting bucket 12 is slidably matched with the bottom of the filter screen 10, when the chip collecting bucket 12 is pulled out of the chip box 9, the debris at the bottom of the filter screen 10 can be scraped off and enter the chip collecting bucket 12.
具体的,驱动机构包括驱动电机14,金刚石切割片5的两侧均固定连接有各自侧的吸屑罩6旋转的转轴7,且位于两侧的吸屑螺带8分别固定安装在位于同侧的转轴7上,驱动电机14的输出轴与其中一个转轴7传动连接,启动驱动电机14,便于带动其中一个转轴7旋转,进而带动金刚石切割片5和两个吸屑螺带8同时进行旋转。Specifically, the driving mechanism includes a driving motor 14, and both sides of the diamond cutting blade 5 are fixedly connected with the rotating shaft 7 for rotating the chip suction cover 6 on their respective sides, and the chip suction belts 8 on both sides are respectively fixedly installed on the rotating shaft 7 on the same side. The output shaft of the driving motor 14 is transmission-connected to one of the rotating shafts 7. Starting the driving motor 14 facilitates driving one of the rotating shafts 7 to rotate, thereby driving the diamond cutting blade 5 and the two chip suction belts 8 to rotate at the same time.
具体的,升降机构包括固定安装在支撑平台1上的龙门架2,龙门架2上竖向固定安装有竖向驱动缸3,竖向驱动缸3的底部与切割罩4固定连接,通过竖向驱动缸3,便于对切割罩4进行升降调节,进一步的,所述竖向驱动缸3的底部输出轴固定安装有顶板19,所述切割罩4的四周设置有多个与顶板19固定连接的固定吊杆20,通过顶板19和多个固定吊杆20的配合,便于连接竖向驱动缸3和切割罩4,进一步的,所述竖向驱动缸3的两侧均设置有与龙门架2竖向导向滑动配合的导向杆21,所述导向杆21的底部与顶板19固定连接,通过导向杆21的设置,便于增加顶板19上下移动的稳定性,进一步保护竖向驱动缸3,避免在切割过程中对竖向驱动缸3的底部形成横向的剪切力。Specifically, the lifting mechanism includes a gantry 2 fixedly mounted on the supporting platform 1, a vertical driving cylinder 3 is vertically fixedly mounted on the gantry 2, the bottom of the vertical driving cylinder 3 is fixedly connected to the cutting hood 4, and the cutting hood 4 can be lifted and lowered by the vertical driving cylinder 3. Furthermore, a top plate 19 is fixedly mounted on the bottom output shaft of the vertical driving cylinder 3, and a plurality of fixed suspension rods 20 fixedly connected to the top plate 19 are arranged around the cutting hood 4. Through the cooperation of the top plate 19 and the plurality of fixed suspension rods 20, the vertical driving cylinder 3 and the cutting hood 4 can be connected conveniently. Furthermore, guide rods 21 that are vertically guided and slidably matched with the gantry 2 are arranged on both sides of the vertical driving cylinder 3, and the bottom of the guide rods 21 is fixedly connected to the top plate 19. Through the provision of the guide rods 21, the stability of the up and down movement of the top plate 19 can be increased, and the vertical driving cylinder 3 can be further protected to avoid the formation of a lateral shear force on the bottom of the vertical driving cylinder 3 during the cutting process.
具体的,驱动电机14通过安装架13吊装在收屑箱9上且位于滤网10上方的位置,且驱动电机14的输出轴与其中一个转轴7通过同步带15传动连接,将驱动电机14吊装在滤网10的上方,便于在从滤网10往外排风时,对驱动电机14进行吹风散热,虽然切割过程中会产生一定的热量,热量同样通过滤网10吹至驱动电机14上,但是在风力吹上驱动电机14上时会一同将驱动电机14运行产生的热量一并吹走一部分,达到对驱动电机14进行降温散热的情况,同时在切割接触后,可将热量全部吹走,加速驱动电机14的降温。Specifically, the drive motor 14 is hoisted on the chip collection box 9 through the mounting frame 13 and is located above the filter 10, and the output shaft of the drive motor 14 is connected to one of the rotating shafts 7 through a synchronous belt 15. The drive motor 14 is hoisted above the filter 10 to facilitate blowing and cooling the drive motor 14 when exhausting air from the filter 10. Although a certain amount of heat is generated during the cutting process, the heat is also blown to the drive motor 14 through the filter 10. However, when the wind blows on the drive motor 14, a part of the heat generated by the operation of the drive motor 14 will be blown away together, thereby achieving the situation of cooling and dissipating the heat of the drive motor 14. At the same time, after the cutting contact, all the heat can be blown away, thereby accelerating the cooling of the drive motor 14.
具体的,伸缩遮挡罩16的底部固定连接有固定底框17,固定底框17的顶部固定连接有多个与切割罩4导向滑动配合的导向角钢18,通过固定底框17,便于对伸缩遮挡罩16的底部进行保护,通过多个导向角钢18的配合,便于对固定底框17和伸缩遮挡罩16进行限位,使伸缩遮挡罩16仅能进行上下伸缩,避免在切割过程中,由于移动工件使伸缩遮挡罩16发生侧向形变的情况,保证伸缩遮挡罩16对切割出的遮挡密封性。Specifically, the bottom of the telescopic shielding cover 16 is fixedly connected to a fixed bottom frame 17, and the top of the fixed bottom frame 17 is fixedly connected to a plurality of guide angle steels 18 that slide and cooperate with the cutting cover 4. The fixed bottom frame 17 facilitates the protection of the bottom of the telescopic shielding cover 16, and the cooperation of the plurality of guide angle steels 18 facilitates the limiting of the fixed bottom frame 17 and the telescopic shielding cover 16, so that the telescopic shielding cover 16 can only be extended and retracted up and down, thereby avoiding the lateral deformation of the telescopic shielding cover 16 due to the moving workpiece during the cutting process, thereby ensuring the sealing of the telescopic shielding cover 16 for the cut.
在使用时,将待切割的工件放置在支撑平台1上,并通过升降机构将切割罩4下降至金刚石切割片5接触至工件上,在金刚石切割片5接触至工件的同时,固定底框17先接触工件并相应的进行压缩,同时启动驱动机构,进而带动金刚石切割片5和两个吸屑螺带8同时旋转,通过金刚石切割片5对工件进行切割,切割产生的碎屑通过切割罩4和伸缩遮挡罩16罩住,避免四溅,同时两个吸屑螺带8将产生的碎屑从两侧分别吸引至两个吸屑罩6内,并排至碎屑收集处理机构中进行收集处理,同时沿着切缝水平推动工件,此时,由于伸缩遮挡罩16的设置,可避免手触金刚石切割片5,进一步提高安全性能,切割完毕,通过升降机构使切割罩4复位,并将切割完毕的工件取下来即可。When in use, the workpiece to be cut is placed on the supporting platform 1, and the cutting cover 4 is lowered by the lifting mechanism until the diamond cutting blade 5 contacts the workpiece. When the diamond cutting blade 5 contacts the workpiece, the fixed bottom frame 17 contacts the workpiece first and compresses it accordingly, and the driving mechanism is started at the same time, thereby driving the diamond cutting blade 5 and the two chip suction belts 8 to rotate simultaneously, and the workpiece is cut by the diamond cutting blade 5. The debris generated by the cutting is covered by the cutting cover 4 and the telescopic shielding cover 16 to prevent splashing. At the same time, the two chip suction belts 8 attract the generated debris from both sides into the two chip suction covers 6 respectively, and arrange them side by side in the debris collection and processing mechanism for collection and processing, and at the same time, the workpiece is pushed horizontally along the cutting seam. At this time, due to the setting of the telescopic shielding cover 16, the hand can avoid touching the diamond cutting blade 5, further improving the safety performance. After cutting, the cutting cover 4 is reset by the lifting mechanism, and the cut workpiece can be taken down.
应当指出,在说明书中提到的“一个实施例”、“实施例”、“示例性实施例”、“一些实施例”等表示所述的实施例可以包括特定特征、结构或特性,但未必每个实施例都包括该特定特征、结构或特性。此外,这样的短语未必是指同一实施例。此外,在结合实施例描述特定特征、结构或特性时,结合明确或未明确描述的其他实施例实现这样的特征、结构或特性处于本领域技术人员的知识范围之内。It should be noted that the phrases "one embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. mentioned in the specification indicate that the described embodiments may include certain features, structures or characteristics, but not every embodiment may include the certain features, structures or characteristics. In addition, such phrases do not necessarily refer to the same embodiment. In addition, when a certain feature, structure or characteristic is described in conjunction with an embodiment, it is within the knowledge of those skilled in the art to implement such feature, structure or characteristic in conjunction with other embodiments, whether explicitly or not explicitly described.
应当容易地理解,应当按照最宽的方式解释本公开中的“在……上”、“在……以上”和“在……之上”,以使得“在……上”不仅意味着“直接处于某物上”,还包括“在某物上”且其间具有中间特征或层的含义,并且“在……以上”或者“在……之上”不仅包括“在某物以上”或“之上”的含义,还可以包括“在某物以上”或“之上”且其间没有中间特征或层(即,直接处于某物上)的含义。It should be easily understood that “on,” “above,” and “over” in the present disclosure should be interpreted in the broadest manner, so that “on” means not only “directly on something,” but also includes the meaning of “on something” with intervening features or layers therebetween, and “above” or “over” includes not only the meaning of “above” or “over,” but also may include the meaning of “above” or “over something” with no intervening features or layers therebetween (i.e., directly on something).
此外,文中为了便于说明可以使用空间相对术语,例如,“下面”、“以下”、“下方”、“以上”、“上方”等,以描述一个元件或特征相对于其他元件或特征的如图所示的关系。空间相对术语意在包含除了附图所示的取向之外的处于使用或操作中的器件的不同取向。装置可以具有其他取向(旋转90度或者处于其他取向上),并且文中使用的空间相对描述词可以同样被相应地解释。In addition, spatially relative terms, such as "below," "below," "beneath," "above," "above," etc., may be used herein for ease of description to describe the relationship of one element or feature relative to other elements or features as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation shown in the figures. The device may have other orientations (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may likewise be interpreted accordingly.
需要说明的是,在本文中,诸如“第一”和“第二”等之类的关系术语仅仅用来将一个实体或者操作与另一个实体或操作区分开来,而不一定要求或者暗示这些实体或操作之间存在任何这种实际的关系或者顺序。而且,术语“包括”、“包含”或者其任何其他变体意在涵盖非排他性的包含,从而使得包括一系列要素的过程、方法、物品或者设备不仅包括那些要素,而且还包括没有明确列出的其他要素,或者是还包括为这种过程、方法、物品或者设备所固有的要素。在没有更多限制的情况下,由语句“包括一个……”限定的要素,并不排除在包括所述要素的过程、方法、物品或者设备中还存在另外的相同要素。It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.
最后应说明的是:以上各实施例仅用以说明本申请的技术方案,而非对其限制;尽管参照前述各实施例对本申请进行了详细的说明,本领域的普通技术人员应当理解:其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分或者全部技术特征进行等同替换;而这些修改或者替换,并不使相应技术方案的本质脱离本申请各实施例技术方案的范围。Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
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