CN221768318U - Anticreep high heat conduction Printed Circuit Board (PCB) - Google Patents

Abstract

The utility model discloses an anticreep high heat conduction printed PCB circuit board, comprising: the mounting seat is provided with a mounting cavity, the bottom of the mounting cavity is provided with a heat conducting structure, and one side of the bottom of the mounting cavity is provided with a grounding wire; the circuit board is arranged in the mounting cavity and is positioned above the taking-out end of the taking-out structure; the grounding end of the circuit board is contacted with the grounding wire, so that the circuit board is grounded; the cover plate is arranged above the mounting seat through a positioning structure and compresses the circuit board in the mounting cavity. According to the utility model, through the arrangement of the heat conducting plate and the heat radiating fins, the heat conducting performance and the heat radiating effect of the circuit board are effectively improved, and the circuit board is prevented from being damaged due to overheating.

Description

A kind of anti-leakage high thermal conductivity printed circuit board

Technical Field

The utility model relates to a PCB circuit board, in particular to a leakage-proof and high-heat-conductivity printed PCB circuit board.

Background Art

The heat dissipation effect of the traditional PCB circuit board is poor, and the circuit board is easily damaged due to overheating. Although the existing anti-leakage high thermal conductivity printed PCB circuit board has certain thermal conductivity and heat dissipation effect, it still has deficiencies in removal, installation and stability. Therefore, the present invention provides an anti-leakage high thermal conductivity printed PCB circuit board.

Utility Model Content

The technical problem to be solved by the utility model is to provide a leakage-proof and high-thermal-conductivity printed circuit board (PCB) to solve the problems that still exist in the aspects of removal, installation and stability, and to increase the heat dissipation effect thereof.

The utility model is realized by the following technical schemes:

A mounting seat, wherein a mounting cavity is arranged on the mounting seat, a heat conducting structure is arranged at the bottom of the mounting cavity, and a grounding wire is arranged at one side of the bottom of the mounting cavity;

The circuit board is arranged in the installation cavity and is located above the extraction end of the extraction structure; the grounding end of the circuit board is in contact with the grounding wire, thereby grounding the circuit board;

The cover plate is arranged above the mounting seat through a positioning structure and presses the circuit board tightly into the mounting cavity.

As a preferred technical solution, a ventilation groove is set through the bottom of the mounting base, and the heat-conducting structure includes a heat-conducting plate and heat-dissipating fins. The heat-conducting plate is placed under the circuit board, and the heat of the circuit board is absorbed by the heat-conducting plate; the heat-dissipating fins are installed under the heat-conducting plate and placed in the ventilation groove.

As a preferred technical solution, the removal structure includes mounting grooves and movable blocks arranged on both sides of the mounting seat. The movable blocks are in a Z-shaped structure, and the movable blocks are slidably arranged on the mounting grooves through guide blocks; the lower end of the movable block is flush with the bottom surface of the mounting cavity and contacts with the bottom of the circuit board.

As a preferred technical solution, an air cavity is provided above the cover plate, and a cooling fan is provided in the air cavity, the air outlet of the cooling fan corresponds to the upper end of the circuit board; air outlet slots are obliquely provided on both sides of the cover plate.

As a preferred technical solution, the positioning structure includes positioning columns arranged around the bottom of the cover plate and positioning holes arranged on the mounting seat. The positioning columns are inserted into the positioning holes and are adsorbed and fixed by a magnetic structure.

As a preferred technical solution, the magnetic attraction structure includes a magnet arranged on the positioning column and a magnetic attraction member arranged in the positioning hole, and the positioning column and the positioning hole are adsorbed and fixed by the magnet and the magnetic member.

As a preferred technical solution, a power supply line is arranged on the other side of the bottom of the installation cavity, and the power supply line is in contact with the power supply end of the circuit board.

The beneficial effects of the utility model are:

1. The utility model effectively improves the thermal conductivity and heat dissipation effect of the circuit board by setting the heat conduction plate and the heat dissipation fins, and avoids damage to the circuit board caused by overheating.

2. The utility model facilitates the replacement and maintenance of the circuit board by setting up the removal structure.

3. The utility model further improves the heat dissipation effect of the circuit board by arranging the heat dissipation fan and the air outlet slot on the cover plate.

4. The utility model makes the installation of the circuit board more convenient and stable by setting the positioning structure and the magnetic attraction structure.

5. The utility model has the function of preventing leakage by setting the grounding wire.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

FIG1 is a schematic diagram of the three-dimensional structure of the utility model;

Fig. 2 is a schematic cross-sectional view of the utility model;

FIG3 is a schematic diagram of the installation of a circuit board of the present invention;

FIG. 4 is a schematic diagram of a mounting base of the present invention.

DETAILED DESCRIPTION

All features disclosed in this specification, or steps in all methods or processes disclosed, except mutually exclusive features and/or steps, can be combined in any manner.

As shown in FIGS. 1 to 4 , the utility model is a leakage-proof high-thermal-conductivity printed PCB circuit board, comprising:

A mounting base 1, wherein a mounting cavity 4 is disposed on the mounting base 1, a heat conducting structure is disposed at the bottom of the mounting cavity 4, and a grounding wire is disposed at one side of the bottom of the mounting cavity 4;

The circuit board 2 is arranged in the installation cavity 4 and is located above the extraction end of the extraction structure; the grounding end of the circuit board 2 is in contact with the grounding wire, thereby grounding the circuit board 2 to prevent leakage;

The cover plate 3 is arranged above the mounting seat 1 through a positioning structure, and presses the circuit board 2 into the mounting cavity 4.

Among them, a ventilation groove 6 is set through the bottom of the mounting base 1, and the heat-conducting structure includes a heat-conducting plate 5 and heat-dissipating fins 6. The heat-conducting plate 5 is placed under the circuit board 2, and the heat of the circuit board 2 is absorbed by the heat-conducting plate 5; the heat-dissipating fins 6 are installed under the heat-conducting plate 5 and placed in the ventilation groove 6, thereby achieving the effect of dissipating heat for the circuit board 2.

In order to facilitate the removal, replacement and maintenance of the circuit board while ensuring the stability of the circuit board, in the present embodiment, the removal structure includes mounting grooves 7 and movable blocks 8 arranged on both sides of the mounting base 1. The movable blocks 8 are Z-shaped structures, and the movable blocks 8 are slidably arranged on the mounting grooves 7 through guide blocks; the lower end of the movable block 8 is flush with the bottom surface of the mounting cavity 4 and contacts with the bottom of the circuit board 2.

In order to further improve the heat dissipation effect of the circuit board, an air cavity 9 is arranged above the cover plate 3, and a cooling fan 10 is arranged at the air cavity 9, and the air outlet end of the cooling fan 10 corresponds to the upper end of the circuit board 2; air outlet slots 11 are obliquely arranged on both sides of the cover plate 3, and the wind blown by the cooling fan 10 takes away the heat of the circuit board 2 and is discharged through the air outlet slots 11.

In order to make the installation of the circuit board more convenient and stable, in this embodiment, the positioning structure includes positioning columns arranged around the bottom of the cover plate 3 and positioning holes 12 arranged on the mounting base 1. The positioning column is inserted into the positioning hole 12 and is adsorbed and fixed by a magnetic structure. The magnetic structure includes a magnet arranged on the positioning column and a magnetic component arranged in the positioning hole 12. The positioning column and the positioning hole are adsorbed and fixed by the magnet and the magnetic component.

In order to facilitate the power supply of the circuit board and ensure the normal operation of the circuit board, a power supply line 13 is arranged on the other side of the bottom of the installation cavity 4, and the power supply line 13 is in contact with the power supply end of the circuit board.

Here’s how it works:

The leakage-proof high-thermal-conductivity printed PCB circuit board is arranged with a mounting base, a circuit board and a cover plate, so that the circuit board can be easily taken out, replaced and repaired, and the stability of the circuit board is ensured; the heat-conducting structure includes a heat-conducting plate and heat-dissipating fins, and the heat of the circuit board is absorbed by the heat-conducting plate, and the heat-dissipating fins have the effect of dissipating the heat of the circuit board; an air cavity and a heat-dissipating fan are arranged above the cover plate, and the wind blown by the heat-dissipating fan takes away the heat of the circuit board and is discharged through the air outlet slot; the positioning structure includes a positioning column and a positioning hole, which is adsorbed and fixed by a magnetic attraction structure; the power supply line is in contact with the power supply end of the circuit board, thereby ensuring the normal operation of the circuit board.

The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that are not conceived through creative work should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope defined in the claims.

Claims (7)

1. A leakage-proof and high-thermal-conductivity printed circuit board, comprising: A mounting seat (1), wherein a mounting cavity (4) is provided on the mounting seat (1), a heat conducting structure is provided at the bottom of the mounting cavity (4), and a grounding wire is provided at one side of the bottom of the mounting cavity (4); A circuit board (2), the circuit board (2) being arranged in the installation cavity (4) and located above the extraction end of the extraction structure; the grounding end of the circuit board (2) is in contact with a grounding wire, thereby grounding the circuit board (2); A cover plate (3), wherein the cover plate (3) is arranged above the mounting seat (1) via a positioning structure, and presses the circuit board (2) tightly into the mounting cavity (4). 2. The anti-leakage high thermal conductivity printed circuit board according to claim 1 is characterized in that: a ventilation groove (6) is provided through the bottom of the mounting seat (1), the heat conduction structure comprises a heat conduction plate (5) and heat dissipation fins (14), the heat conduction plate (5) is placed below the circuit board (2), and the heat of the circuit board (2) is absorbed by the heat conduction plate (5); the heat dissipation fins (14) are installed below the heat conduction plate (5) and placed at the ventilation groove (6). 3. The anti-leakage high thermal conductivity printed circuit board according to claim 1 is characterized in that: the removal structure comprises mounting grooves (7) and movable blocks (8) arranged on both sides of the mounting seat (1), the movable blocks (8) are in a Z-shaped structure, and the movable blocks (8) are slidably arranged on the mounting grooves (7) through guide blocks; the lower end of the movable block (8) is flush with the bottom surface of the mounting cavity (4) and contacts with the bottom of the circuit board (2). 4. The anti-leakage high thermal conductivity printed circuit board according to claim 1, characterized in that: an air cavity (9) is arranged above the cover plate (3), and a heat dissipation fan (10) is arranged at the air cavity (9), and the air outlet end of the heat dissipation fan (10) corresponds to the upper end of the circuit board (2); air outlet slots (11) are obliquely arranged on both sides of the cover plate (3), and the wind blown out by the heat dissipation fan (10) takes away the heat of the circuit board (2) and is discharged through the air outlet slots (11). 5. The anti-leakage high thermal conductivity printed circuit board according to claim 1 is characterized in that: the positioning structure includes positioning columns arranged around the bottom of the cover plate (3) and positioning holes (12) arranged on the mounting seat (1), and the positioning columns are inserted into the positioning holes (12) and fixed by adsorption through a magnetic attraction structure. 6. The anti-leakage high thermal conductivity printed circuit board according to claim 5 is characterized in that: the magnetic attraction structure comprises a magnet arranged on the positioning column and a magnetic attraction component arranged in the positioning hole (12), and the positioning column and the positioning hole are adsorbed and fixed by the magnet and the magnetic component. 7. The anti-leakage and high thermal conductivity printed circuit board according to claim 1, characterized in that a power supply line (13) is arranged on the other side of the bottom of the installation cavity (4), and the power supply line (13) is in contact with the power supply end of the circuit board.