CN221759554U - Drainage system of water-guided laser processing equipment - Google Patents

Drainage system of water-guided laser processing equipment Download PDF

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CN221759554U
CN221759554U CN202421961815.1U CN202421961815U CN221759554U CN 221759554 U CN221759554 U CN 221759554U CN 202421961815 U CN202421961815 U CN 202421961815U CN 221759554 U CN221759554 U CN 221759554U
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water
drainage
drainage system
filter
guided laser
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杨森
踪振华
张聪
张贵龙
岳娜
党雪
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Xi'an Shengguang Silicon Semiconductor Technology Co ltd
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Xi'an Shengguang Silicon Semiconductor Technology Co ltd
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Abstract

本实用新型涉及一种水导激光加工设备的排水系统,包括:集水装置、过滤装置、动力装置,其中,所述集水装置上开设有排水孔;所述过滤装置的入口端连通所述排水孔,出口端连通所述动力装置,且所述过滤装置的内部沿所述入口端到所述出口端的方向依次设置有过滤结构和吸附结构。本实用新型提供的水导激光加工设备的排水系统,通过在集水装置上开设排水孔,以将加工设备的废水排出,通过过滤装置内部的过滤结构对废水进行过滤,除去废水中的加工废屑,避免废水中的加工废屑堵塞排水系统,并通过吸附结构对废水进行吸附,除去废水中的有害物质和异味,避免废水排出后造成环境污染。

The utility model relates to a drainage system of water-conducting laser processing equipment, including: a water collecting device, a filtering device, and a power device, wherein a drainage hole is provided on the water collecting device; the inlet end of the filtering device is connected to the drainage hole, and the outlet end is connected to the power device, and the interior of the filtering device is provided with a filtering structure and an adsorption structure in sequence along the direction from the inlet end to the outlet end. The drainage system of water-conducting laser processing equipment provided by the utility model provides a drainage hole on the water collecting device to discharge the waste water of the processing equipment, filters the waste water through the filtering structure inside the filtering device to remove the processing waste in the waste water, and avoids the processing waste in the waste water from clogging the drainage system, and adsorbs the waste water through the adsorption structure to remove harmful substances and odor in the waste water, and avoids environmental pollution caused by the waste water after discharge.

Description

一种水导激光加工设备的排水系统A drainage system for water-guided laser processing equipment

技术领域Technical Field

本实用新型属于水导激光加工,具体涉及一种水导激光加工设备的排水系统。The utility model belongs to water-conducting laser processing, and in particular relates to a drainage system of water-conducting laser processing equipment.

背景技术Background Art

水导激光加工技术是一种将激光耦合进水射流内部,利用激光能量实现材料去除的加工技术。水导激光加工技术具有低热影响、高效率、工作距离大、加工尺寸可达微米级等特点,被广泛用于半导体行业加工。Water-guided laser processing technology is a processing technology that couples laser into the water jet and uses laser energy to remove materials. Water-guided laser processing technology has the characteristics of low thermal impact, high efficiency, large working distance, and processing size up to micron level. It is widely used in semiconductor industry processing.

在水导激光加工过程中,水射流会产生大量的废水,而废水在水导激光加工设备中无法排出,会影响设备的正常运行。During the water-guided laser processing process, the water jet will produce a large amount of wastewater, and the wastewater cannot be discharged in the water-guided laser processing equipment, which will affect the normal operation of the equipment.

实用新型内容Utility Model Content

为了解决现有技术中存在的上述问题,本实用新型提供了一种水导激光加工设备的排水系统。本实用新型要解决的技术问题通过以下技术方案实现:In order to solve the above problems existing in the prior art, the utility model provides a drainage system for water-conducting laser processing equipment. The technical problem to be solved by the utility model is achieved through the following technical solutions:

一种水导激光加工设备的排水系统,包括:集水装置、过滤装置、动力装置,其中,A drainage system for water-conducting laser processing equipment includes: a water collecting device, a filtering device, and a power device, wherein:

所述集水装置上开设有排水孔;The water collecting device is provided with a drainage hole;

所述过滤装置的入口端连通所述排水孔,出口端连通所述动力装置,且所述过滤装置的内部设置有过滤结构和吸附结构;The inlet end of the filter device is connected to the drainage hole, and the outlet end is connected to the power device, and a filter structure and an adsorption structure are arranged inside the filter device;

所述过滤结构和所述吸附结构沿所述过滤装置的入口端到所述过滤装置的出口端的方向依次设置。The filtering structure and the adsorption structure are sequentially arranged along the direction from the inlet end of the filtering device to the outlet end of the filtering device.

在一个具体的实施例中,所述集水装置的表面具有倾斜部和槽部;In a specific embodiment, the surface of the water collecting device has an inclined portion and a groove portion;

所述倾斜部的高度由中心向两侧逐渐降低;The height of the inclined portion gradually decreases from the center to both sides;

所述槽部位于所述倾斜部的两侧。The grooves are located at both sides of the inclined portion.

在一个具体的实施例中,所述排水孔位于所述槽部中。In a specific embodiment, the drainage hole is located in the groove.

在一个具体的实施例中,所述倾斜部的表面设置有凸台。In a specific embodiment, a boss is provided on the surface of the inclined portion.

在一个具体的实施例中,所述凸台的表面开设有用于固定待加工工件的T型槽。In a specific embodiment, a T-slot for fixing a workpiece to be processed is formed on the surface of the boss.

在一个具体的实施例中,所述过滤结构包括:第一过滤网和第二过滤网;In a specific embodiment, the filter structure includes: a first filter screen and a second filter screen;

所述第二过滤网设置于所述第一过滤网靠近所述过滤装置的出口端的一侧,且所述第二过滤网的孔径小于所述第一过滤网的孔径。The second filter screen is arranged on a side of the first filter screen close to the outlet end of the filter device, and the aperture of the second filter screen is smaller than the aperture of the first filter screen.

在一个具体的实施例中,所述吸附结构包括:活性炭吸附层;In a specific embodiment, the adsorption structure includes: an activated carbon adsorption layer;

所述活性炭吸附层设置于所述第二过滤网靠近所述过滤装置的出口端的一侧。The activated carbon adsorption layer is arranged on one side of the second filter screen close to the outlet end of the filter device.

在一个具体的实施例中,还包括:第一排水管道;In a specific embodiment, it also includes: a first drainage pipe;

所述第一排水管道的一端连通所述排水孔,另一端连通所述过滤装置的入口端。One end of the first drainage pipe is connected to the drainage hole, and the other end is connected to the inlet end of the filter device.

在一个具体的实施例中,所述动力装置包括:排水泵;In a specific embodiment, the power device includes: a drainage pump;

所述排水泵的入口端连通所述过滤装置的出口端。The inlet end of the drainage pump is connected to the outlet end of the filtering device.

在一个具体的实施例中,还包括:第二排水管道;In a specific embodiment, it further includes: a second drainage pipe;

所述第二排水管道的一端连通所述过滤装置的出口端,另一端连通所述排水泵的入口端。One end of the second drainage pipe is connected to the outlet end of the filter device, and the other end is connected to the inlet end of the drainage pump.

与现有技术相比,本实用新型的有益效果:Compared with the prior art, the utility model has the following beneficial effects:

本实用新型提供的水导激光加工设备的排水系统,通过在集水装置上开设排水孔,将加工设备的废水排出,通过过滤装置内部的过滤结构对废水进行过滤,除去废水中的加工废屑,避免废水中的加工废屑堵塞排水系统,并通过吸附结构对废水进行吸附,除去废水中的有害物质和异味,避免废水排出后造成环境污染。The drainage system of water-conducting laser processing equipment provided by the utility model discharges waste water from the processing equipment by opening a drainage hole on a water collecting device, filters the waste water through a filtering structure inside the filtering device to remove processing waste in the waste water, thereby preventing the processing waste in the waste water from clogging the drainage system, and absorbs the waste water through an adsorption structure to remove harmful substances and odor in the waste water, thereby preventing environmental pollution caused by the waste water after being discharged.

附图说明BRIEF DESCRIPTION OF THE DRAWINGS

图1是本实用新型实施例中的一种水导激光加工设备的排水系统的结构示意图;FIG1 is a schematic structural diagram of a drainage system of a water-conducting laser processing device in an embodiment of the present utility model;

图2是本实用新型实施例中的集水装置的结构示意图。FIG. 2 is a schematic structural diagram of a water collecting device in an embodiment of the present utility model.

附图标记:Reference numerals:

1:集水装置;11:排水孔;12:倾斜部;13:槽部;14:凸台;141:T型槽;2:过滤装置;21:过滤结构;211:第一过滤网;212:第二过滤网;22:吸附结构;3:动力装置;4:第一排水管道;5:第二排水管道。1: water collecting device; 11: drainage hole; 12: inclined portion; 13: groove portion; 14: boss; 141: T-slot; 2: filter device; 21: filter structure; 211: first filter screen; 212: second filter screen; 22: adsorption structure; 3: power device; 4: first drainage pipe; 5: second drainage pipe.

具体实施方式DETAILED DESCRIPTION

下面结合具体实施例对本实用新型做进一步详细的描述,但本实用新型的实施方式不限于此。The present invention is further described in detail below in conjunction with specific embodiments, but the implementation methods of the present invention are not limited thereto.

实施例一Embodiment 1

请参见图1,图1是本实用新型实施例中的一种水导激光加工设备的排水系统的结构示意图。Please refer to FIG. 1 , which is a schematic structural diagram of a drainage system of a water-guided laser processing device in an embodiment of the present utility model.

本实施例提供的一种水导激光加工设备的排水系统,包括:集水装置1、过滤装置2、动力装置3。其中,集水装置1上开设有排水孔11。过滤装置2的入口端连通排水孔11,出口端连通动力装置3,且过滤装置2的内部设置有过滤结构21和吸附结构22。过滤结构21和吸附结构22沿过滤装置2的入口端到过滤装置2的出口端的方向依次设置。The present embodiment provides a drainage system for a water-conducting laser processing device, comprising: a water collecting device 1, a filtering device 2, and a power device 3. A drainage hole 11 is provided on the water collecting device 1. The inlet end of the filtering device 2 is connected to the drainage hole 11, and the outlet end is connected to the power device 3, and a filtering structure 21 and an adsorption structure 22 are provided inside the filtering device 2. The filtering structure 21 and the adsorption structure 22 are sequentially arranged in a direction from the inlet end of the filtering device 2 to the outlet end of the filtering device 2.

具体地,集水装置1设置在待加工工件的下方,水导激光对待加工工件进行加工的过程中,水射流产生的废水流至集水装置1的表面,通过集水装置1上开设的排水孔11流动至过滤装置2的内部。由于水导激光对待加工工件进行加工的过程中,会产生加工废屑,加工废屑会随废水流动,加工废屑堆积则会造成排水系统堵塞,因此本实施例通过过滤装置2内部的过滤结构21对废水进行过滤,除去废水中的加工废屑,避免废水中的加工废屑堵塞排水系统,以确保加工设备正常工作,并通过吸附结构22对废水进行吸附,除去废水中的有害物质和异味,对废水进行进一步处理,避免废水排出后造成环境污染。废水依次通过过滤结构21和吸附结构22后,由过滤装置2的出口端流至动力装置3中,并通过动力装置3排出。Specifically, the water collection device 1 is arranged below the workpiece to be processed. During the process of the water-guided laser processing the workpiece to be processed, the wastewater generated by the water jet flows to the surface of the water collection device 1, and flows to the inside of the filter device 2 through the drainage hole 11 provided on the water collection device 1. Since processing waste chips will be generated during the process of the water-guided laser processing the workpiece to be processed, the processing waste chips will flow with the wastewater, and the accumulation of processing waste chips will cause the drainage system to be blocked. Therefore, in this embodiment, the wastewater is filtered through the filtering structure 21 inside the filtering device 2 to remove the processing waste chips in the wastewater, so as to avoid the processing waste chips in the wastewater from clogging the drainage system, so as to ensure the normal operation of the processing equipment, and the wastewater is adsorbed through the adsorption structure 22 to remove harmful substances and odors in the wastewater, and the wastewater is further processed to avoid environmental pollution caused by the wastewater after being discharged. After the wastewater passes through the filtering structure 21 and the adsorption structure 22 in turn, it flows to the power device 3 from the outlet end of the filtering device 2 and is discharged through the power device 3.

在本实施例中,集水装置1的表面具有倾斜部12和槽部13。倾斜部12的高度由中心向两侧逐渐降低。槽部13位于倾斜部12的两侧。排水孔11位于槽部13中。倾斜部12的表面设置有凸台14。凸台14的表面开设有用于固定待加工工件的T型槽141。In this embodiment, the surface of the water collecting device 1 has an inclined portion 12 and a groove portion 13. The height of the inclined portion 12 gradually decreases from the center to both sides. The groove portion 13 is located on both sides of the inclined portion 12. The drainage hole 11 is located in the groove portion 13. A boss 14 is provided on the surface of the inclined portion 12. A T-slot 141 is provided on the surface of the boss 14 for fixing the workpiece to be processed.

具体地,请参见图2,待加工工件固定在凸台14的T型槽141中,倾斜部12中间的高度最高,倾斜部12靠近槽部13的两侧的高度最小,水导激光对待加工工件进行加工的过程中,水射流产生的废水由凸台14的斜面流至倾斜部12的表面,由于倾斜部12中间的高度大于两侧,废水会自然流至倾斜部12两侧的槽部13中,排水孔11贯穿槽部13的槽底,槽部13中的废水通过排水孔11流出。示例性地,排水孔11的数量为4个,4个排水孔11分别位于集水装置1的四个角落,即每个槽部13的两端。Specifically, please refer to FIG. 2 , the workpiece to be processed is fixed in the T-slot 141 of the boss 14, the height in the middle of the inclined portion 12 is the highest, and the height of the inclined portion 12 near the two sides of the groove 13 is the lowest. During the process of water-guided laser processing the workpiece to be processed, the wastewater generated by the water jet flows from the inclined surface of the boss 14 to the surface of the inclined portion 12. Since the height in the middle of the inclined portion 12 is greater than the two sides, the wastewater will naturally flow to the groove 13 on both sides of the inclined portion 12. The drainage hole 11 runs through the bottom of the groove 13, and the wastewater in the groove 13 flows out through the drainage hole 11. Exemplarily, the number of drainage holes 11 is 4, and the 4 drainage holes 11 are respectively located at the four corners of the water collection device 1, that is, at both ends of each groove 13.

在本实施例中,过滤结构21包括:第一过滤网211和第二过滤网212。第二过滤网212设置于第一过滤网211靠近过滤装置2的出口端的一侧,且第二过滤网212的孔径小于第一过滤网211的孔径。吸附结构22包括:活性炭吸附层。活性炭吸附层设置于第二过滤网212靠近过滤装置2的出口端的一侧。In this embodiment, the filter structure 21 includes: a first filter screen 211 and a second filter screen 212. The second filter screen 212 is arranged on a side of the first filter screen 211 close to the outlet end of the filter device 2, and the pore size of the second filter screen 212 is smaller than the pore size of the first filter screen 211. The adsorption structure 22 includes: an activated carbon adsorption layer. The activated carbon adsorption layer is arranged on a side of the second filter screen 212 close to the outlet end of the filter device 2.

具体地,请参见图1,第一过滤网211、第二过滤网212和活性炭吸附层沿过滤装置2入口端到出口端的方向依次设置。废水流经第一过滤网211时,携带的粒径较大的加工废屑被第一过滤网211滤除,流经第二过滤网212时,第二过滤网212对废水进行第二次过滤,滤除粒径较小的加工废屑。经过第一过滤网211和第二过滤网212对废水中不同粒径的加工废屑进行两次过滤,能够有效去除废水中携带的加工废屑,避免加工废屑堵塞排水系统。废水经过第一过滤网211和第二过滤网212滤除加工废屑后,流至活性炭吸附层,活性炭吸附层对废水进行吸附,去除废水中的有害物质和异味。Specifically, referring to FIG. 1 , the first filter 211, the second filter 212 and the activated carbon adsorption layer are sequentially arranged along the direction from the inlet end to the outlet end of the filter device 2. When the wastewater flows through the first filter 211, the processing waste with larger particle size is filtered out by the first filter 211. When the wastewater flows through the second filter 212, the second filter 212 performs a second filtration on the wastewater to filter out the processing waste with smaller particle size. The processing waste with different particle sizes in the wastewater is filtered twice by the first filter 211 and the second filter 212, which can effectively remove the processing waste carried in the wastewater and prevent the processing waste from clogging the drainage system. After the wastewater passes through the first filter 211 and the second filter 212 to filter out the processing waste, it flows to the activated carbon adsorption layer, which adsorbs the wastewater to remove harmful substances and odors in the wastewater.

在本实施例中,动力装置3包括:排水泵。排水泵的入口端连通过滤装置2的出口端。In this embodiment, the power device 3 includes a drainage pump, the inlet of which is connected to the outlet of the filter device 2 .

具体地,废水经过滤装置2进行过滤和吸附后,经过过滤装置2的出口端流至排水泵的入口端,在排水泵的作用下,废水从排水泵的出口端排出排水系统。优选地,排水泵为变频排水泵,能够根据排水系统中废水的数量调节水泵转速,实现节能高效排水。Specifically, after the wastewater is filtered and adsorbed by the filter device 2, it flows to the inlet end of the drainage pump through the outlet end of the filter device 2. Under the action of the drainage pump, the wastewater is discharged from the drainage system from the outlet end of the drainage pump. Preferably, the drainage pump is a variable frequency drainage pump, which can adjust the pump speed according to the amount of wastewater in the drainage system to achieve energy-saving and efficient drainage.

在本实施例中,排水系统还包括:第一排水管道4和第二排水管道5。第一排水管道4的一端连通排水孔11,第一排水管道4的另一端连通过滤装置2的入口端。第二排水管道5的一端连通过滤装置2的出口端,第二排水管道5的另一端连通排水泵的入口端。In this embodiment, the drainage system further includes: a first drainage pipe 4 and a second drainage pipe 5. One end of the first drainage pipe 4 is connected to the drainage hole 11, and the other end of the first drainage pipe 4 is connected to the inlet end of the filter device 2. One end of the second drainage pipe 5 is connected to the outlet end of the filter device 2, and the other end of the second drainage pipe 5 is connected to the inlet end of the drainage pump.

具体地,废水由集水装置1上的排水孔11,通过第一排水管道4流至过滤装置2中,经过过滤装置2的过滤和吸附后,再经过第二排水管道5流至排水泵中,并经过排水泵排出排水系统。优选地,第一排水管道4和第二排水管道5的材料均为耐腐蚀、耐高压的材料,且第一排水管道4和第二排水管道5的内壁光滑,以减少水流阻力,防止杂质附着。Specifically, the wastewater flows from the drainage hole 11 on the water collecting device 1 through the first drainage pipe 4 to the filter device 2, and after being filtered and adsorbed by the filter device 2, flows to the drainage pump through the second drainage pipe 5, and is discharged from the drainage system through the drainage pump. Preferably, the materials of the first drainage pipe 4 and the second drainage pipe 5 are corrosion-resistant and high-pressure-resistant materials, and the inner walls of the first drainage pipe 4 and the second drainage pipe 5 are smooth to reduce water flow resistance and prevent impurities from adhering.

本实施例提供的一种水导激光加工设备的排水系统,在集水装置1上开设排水孔11,以将加工设备的废水排出,通过过滤装置2内部的过滤结构21对废水进行过滤,除去废水中的加工废屑,避免废水中的加工废屑堵塞排水系统,并通过吸附结构22对废水进行吸附,除去废水中的有害物质和异味,避免废水排出后造成环境污染。The present embodiment provides a drainage system for a water-conducting laser processing equipment, in which a drainage hole 11 is opened on a water collecting device 1 to discharge waste water from the processing equipment, and the waste water is filtered by a filtering structure 21 inside a filtering device 2 to remove processing waste in the waste water, thereby preventing the processing waste in the waste water from clogging the drainage system, and the waste water is adsorbed by an adsorption structure 22 to remove harmful substances and odor in the waste water, thereby preventing environmental pollution caused by the waste water after being discharged.

以上内容是结合具体的优选实施方式对本实用新型所作的进一步详细说明,不能认定本实用新型的具体实施只局限于这些说明。对于本实用新型所属技术领域的普通技术人员来说,在不脱离本实用新型构思的前提下,还可以做出若干简单推演或替换,都应当视为属于本实用新型的保护范围。The above contents are further detailed descriptions of the present invention in combination with specific preferred implementations, and it cannot be determined that the specific implementation of the present invention is limited to these descriptions. For ordinary technicians in the technical field to which the present invention belongs, several simple deductions or substitutions can be made without departing from the concept of the present invention, which should be regarded as falling within the protection scope of the present invention.

Claims (10)

1. A drainage system for a water-guided laser machining apparatus, comprising: a water collecting device (1), a filtering device (2) and a power device (3), wherein,
A drain hole (11) is formed in the water collecting device (1);
The inlet end of the filtering device (2) is communicated with the drain hole (11), the outlet end of the filtering device is communicated with the power device (3), and a filtering structure (21) and an adsorption structure (22) are arranged in the filtering device (2);
The filter structure (21) and the adsorption structure (22) are sequentially arranged along the direction from the inlet end of the filter device (2) to the outlet end of the filter device (2).
2. A drainage system of a water-guided laser machining apparatus according to claim 1, characterized in that the surface of the water collecting device (1) has an inclined portion (12) and a groove portion (13);
the height of the inclined part (12) gradually decreases from the center to the two sides;
the groove parts (13) are positioned on both sides of the inclined part (12).
3. A drainage system of a water-guided laser machining apparatus according to claim 2, characterized in that the drainage hole (11) is located in the groove (13).
4. A drainage system of a water-guided laser machining apparatus according to claim 2, characterized in that the surface of the inclined portion (12) is provided with a boss (14).
5. The drainage system of a water-guided laser machining apparatus according to claim 4, characterized in that the surface of the boss (14) is provided with a T-shaped groove (141) for fixing a workpiece to be machined.
6. A drainage system of a water-guided laser machining apparatus according to claim 1, characterized in that the filtering structure (21) comprises: a first filter screen (211) and a second filter screen (212);
the second filter screen (212) is arranged on one side of the first filter screen (211) close to the outlet end of the filter device (2), and the aperture of the second filter screen (212) is smaller than that of the first filter screen (211).
7. A drainage system of a water-guided laser machining apparatus according to claim 6, characterized in that the adsorption structure (22) comprises: an activated carbon adsorption layer;
the activated carbon adsorption layer is arranged on one side of the second filter screen (212) close to the outlet end of the filter device (2).
8. The drainage system of a water-guided laser machining apparatus of claim 1, further comprising: a first drain pipe (4);
One end of the first drainage pipeline (4) is communicated with the drainage hole (11), and the other end of the first drainage pipeline is communicated with the inlet end of the filtering device (2).
9. A drainage system of a water-guided laser machining apparatus according to claim 1, characterized in that the power device (3) comprises: a draining pump;
the inlet end of the drainage pump is communicated with the outlet end of the filtering device (2).
10. The water drainage system of a water-guided laser machining apparatus of claim 9, further comprising: a second drain pipe (5);
One end of the second drainage pipeline (5) is communicated with the outlet end of the filtering device (2), and the other end of the second drainage pipeline is communicated with the inlet end of the drainage pump.
CN202421961815.1U 2024-08-14 2024-08-14 Drainage system of water-guided laser processing equipment Active CN221759554U (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119635006A (en) * 2024-11-22 2025-03-18 中国航空制造技术研究院 A water-conducting laser processing method and tooling for water collection, waterproofing and laser damage prevention
CN119635006B (en) * 2024-11-22 2026-02-17 中国航空制造技术研究院 A water-conducting laser processing method and tooling that collects water, prevents water damage, and protects against laser damage.

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN119635006A (en) * 2024-11-22 2025-03-18 中国航空制造技术研究院 A water-conducting laser processing method and tooling for water collection, waterproofing and laser damage prevention
CN119635006B (en) * 2024-11-22 2026-02-17 中国航空制造技术研究院 A water-conducting laser processing method and tooling that collects water, prevents water damage, and protects against laser damage.

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