CN221748774U - Electronic circuit substrate mounting device - Google Patents
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- CN221748774U CN221748774U CN202323472857.7U CN202323472857U CN221748774U CN 221748774 U CN221748774 U CN 221748774U CN 202323472857 U CN202323472857 U CN 202323472857U CN 221748774 U CN221748774 U CN 221748774U
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- 239000000758 substrate Substances 0.000 title claims abstract description 71
- 238000009434 installation Methods 0.000 claims abstract description 27
- 230000017525 heat dissipation Effects 0.000 claims abstract description 20
- 230000007246 mechanism Effects 0.000 claims abstract description 18
- 230000005855 radiation Effects 0.000 abstract 1
- 230000009286 beneficial effect Effects 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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Abstract
Description
技术领域Technical Field
本实用新型涉及电子电路基板技术领域，具体而言，涉及一种电子电路基板安装装置。The utility model relates to the technical field of electronic circuit substrates, in particular to an electronic circuit substrate installation device.
背景技术Background Art
基板是制造PCB的基本材料，一般情况下，基板就是覆铜箔层压板，单、双面印制板在制造中是在基板材料-覆铜箔层压板上，有选择地进行孔加工、化学镀铜、电镀铜、蚀刻等加工，得到所需电路图形。The substrate is the basic material for manufacturing PCB. Generally, the substrate is a copper-clad laminate. In the manufacturing of single-sided and double-sided printed circuit boards, hole processing, chemical copper plating, electroplating copper, etching and other processing are selectively performed on the substrate material - copper-clad laminate to obtain the required circuit pattern.
现在的电子电路基板大部分是通过螺栓固定的方式与机体进行连接，当在使用中电路模块产生故障时，维修时需要将螺栓拆卸下来，然后对电路模块进行更换，安拆速度较慢，不利于维护。Most of the current electronic circuit substrates are connected to the body by bolts. When a circuit module fails during use, the bolts need to be removed for maintenance, and then the circuit module needs to be replaced. The installation and removal speed is slow and not conducive to maintenance.
实用新型内容Utility Model Content
为了弥补以上不足，本实用新型提供了一种电子电路基板安装装置。In order to make up for the above deficiencies, the utility model provides an electronic circuit substrate mounting device.
本实用新型是这样实现的：The utility model is achieved in this way:
一种电子电路基板安装装置，包括电子基板，所述电子基板的两侧均卡合有安装杆，且一对所述安装杆的内部均设有插槽，所述电子基板的两侧均与插槽相互卡合，所述电子基板的顶部安装有一对固定板，且一对所述固定板之间等距离安装有若干散热鳍片，所述电子基板的内部两侧均设有固定槽，一对所述安装杆的内部两侧均设有一对滑槽，且两对所述滑槽的内部均设有安装机构，所述安装机构包括两对固定块，其中一个所述固定板的两侧均连接有连接板，且所述连接板的内部一侧设有连接槽，一对所述安装杆的内部中心处均设有移动槽，且一对所述移动槽的内部均设有散热机构，所述散热机构包括一对插块。A device for installing an electronic circuit substrate comprises an electronic substrate, both sides of the electronic substrate are engaged with mounting rods, and a pair of the mounting rods are provided with slots inside, both sides of the electronic substrate are engaged with the slots, a pair of fixing plates are installed on the top of the electronic substrate, and a plurality of heat dissipation fins are installed equidistantly between the pair of fixing plates, both sides of the electronic substrate are provided with fixing grooves, both sides of the interior of the pair of mounting rods are provided with a pair of slide grooves, and both pairs of the slide grooves are provided with mounting mechanisms inside, the mounting mechanisms comprise two pairs of fixing blocks, both sides of one of the fixing plates are connected to connecting plates, and one side of the interior of the connecting plate is provided with a connecting groove, a pair of the mounting rods are provided with movable grooves at the inner centers, and both the pair of movable grooves are provided with heat dissipation mechanisms inside, and the heat dissipation mechanisms comprise a pair of plug blocks.
进一步的，所述滑槽的内部滑动安装有固定块，且所述固定块的两侧均安装有滑块，所述安装杆的顶部在滑槽的两侧均竖直安装有滑杆，且一对所述滑块均滑动安装有滑杆的外部。Furthermore, a fixed block is slidably installed inside the slide groove, and sliders are installed on both sides of the fixed block, and sliding bars are vertically installed on the top of the mounting rod on both sides of the slide groove, and a pair of sliders are slidably installed on the outside of the sliding bar.
进一步的，所述滑杆的外部连接有第一弹簧，且所述第一弹簧的一端与滑块相互连接，所述第一弹簧的底端与滑杆的底端相互连接。Furthermore, a first spring is connected to the outside of the slide rod, one end of the first spring is connected to the slider, and the bottom end of the first spring is connected to the bottom end of the slide rod.
采用上述进一步方案的有益效果是，通过安装有一对滑块，且滑块在一对滑杆上进行移动，可以在固定块移动过程中保持平衡和稳定。The beneficial effect of adopting the above further solution is that by installing a pair of sliders, and the sliders move on a pair of slide bars, balance and stability can be maintained during the movement of the fixed block.
进一步的，所述固定块的底端贯穿滑槽，并与固定槽相互卡合，所述电子基板的内部两侧均设有安装槽，且所述安装槽的内部一侧连接有第二弹簧。Furthermore, the bottom end of the fixing block passes through the slide slot and engages with the fixing slot. Both sides of the inside of the electronic substrate are provided with mounting slots, and one side of the inside of the mounting slot is connected to a second spring.
采用上述进一步方案的有益效果是，通过设有第二弹簧，可以带动固定块进行自动复位。The beneficial effect of adopting the above further solution is that, by providing the second spring, the fixing block can be driven to automatically reset.
进一步的，所述第二弹簧的一端连接有卡块，所述插槽的内部设有卡槽，且所述卡块与卡槽相互卡合。Furthermore, one end of the second spring is connected to a clamping block, a clamping slot is provided inside the slot, and the clamping block and the clamping slot are engaged with each other.
采用上述进一步方案的有益效果是，通过安装有卡块，可以对电子基板进行初步的安装和固定，从而使固定块与固定槽相互卡合。The beneficial effect of adopting the above further solution is that, by installing the clamping block, the electronic substrate can be preliminarily installed and fixed, so that the fixing block and the fixing groove are engaged with each other.
进一步的，所述移动槽的内部滑动安装有拉杆，且所述拉杆的一侧连接有插块，所述插块的一端贯穿安装杆，并与连接槽相互卡合。Furthermore, a pull rod is slidably installed inside the movable groove, and an insert block is connected to one side of the pull rod, and one end of the insert block passes through the installation rod and is engaged with the connecting groove.
采用上述进一步方案的有益效果是，通过安装有插块，便于使插块与连接槽相互卡合，对散热鳍片进行安装，对电子基板进行散热。The beneficial effect of adopting the above further solution is that, by installing the plug-in block, it is convenient to engage the plug-in block with the connecting groove, install the heat dissipation fins, and dissipate heat for the electronic substrate.
进一步的，所述移动槽的内壁一侧安装有第三弹簧，且所述第三弹簧的一端与拉杆的一侧相互连接。Furthermore, a third spring is installed on one side of the inner wall of the movable groove, and one end of the third spring is connected to one side of the pull rod.
采用上述进一步方案的有益效果是，通过安装有第三弹簧，可以带动插块进行复位。The beneficial effect of adopting the above further solution is that, by installing the third spring, the insert block can be driven to reset.
本实用新型的有益效果是：本实用新型通过上述设计得到的一种电子电路基板安装装置，在对电子基板进行安装时，把电子基板插入一对插槽之间，在插入过程中，对两对卡块进行挤压，使第二弹簧带动卡块进行移动，之后卡块与卡槽相互卡合，对电子基板进行初次安装，然后两对固定块与固定槽相互卡合，对电子基板进行固定和安装，之后需要取下电子基板时，同时拉动两对固定块，使滑块在滑杆上进行移动，带动固定块与固定槽相互分离，之后松开固定块，第一弹簧带动固定块进行复位，且在电子基板使用中，会产生很多的热量，把固定板放置在电子基板上，然后一对插块与一对连接槽相互卡合，对若干散热鳍片进行安装和固定，便于对电子基板进行散热，之后拉动拉杆，使拉杆带动插块进行移动，带动插块与连接槽相互分离，可以在不需要使用时，取下散热鳍片，进行重复利用，提高使用的便捷性。The beneficial effects of the utility model are as follows: the utility model obtains an electronic circuit substrate installation device through the above design, when installing the electronic substrate, the electronic substrate is inserted between a pair of slots, during the insertion process, the two pairs of card blocks are squeezed, so that the second spring drives the card block to move, then the card block and the card slot are engaged with each other, the electronic substrate is initially installed, then the two pairs of fixed blocks and the fixed slot are engaged with each other, the electronic substrate is fixed and installed, and then when the electronic substrate needs to be removed, the two pairs of fixed blocks are pulled at the same time, the slider moves on the slide bar, driving the fixed block and the fixed slot to separate from each other, then the fixed block is released, the first spring drives the fixed block to reset, and a lot of heat is generated during the use of the electronic substrate, the fixing plate is placed on the electronic substrate, then a pair of plug-in blocks and a pair of connecting slots are engaged with each other, a plurality of heat dissipation fins are installed and fixed, which is convenient for heat dissipation of the electronic substrate, then the pull rod is pulled, so that the pull rod drives the plug-in block to move, driving the plug-in block and the connecting slot to separate from each other, the heat dissipation fins can be removed when not needed, and reused, thereby improving the convenience of use.
附图说明BRIEF DESCRIPTION OF THE DRAWINGS
为了更清楚地说明本实用新型实施方式的技术方案，下面将对实施方式中所需要实用的附图作简单地介绍，应当理解，以下附图仅示出了本实用新型的某些实施例，因此不应被看作是对范围的限定，对于本领域普通技术人员来讲，在不付出创造性劳动的前提下，还可以根据这些附图获得其他相关的附图。In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the following is a brief introduction to the drawings required for use in the implementation mode. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.
图1为本实用新型提供的一种电子电路基板安装装置的立体结构示意图；FIG1 is a schematic diagram of the three-dimensional structure of an electronic circuit substrate installation device provided by the utility model;
图2为本实用新型提供的一种电子电路基板安装装置的立体展开示意图；FIG2 is a three-dimensional unfolded schematic diagram of an electronic circuit substrate installation device provided by the utility model;
图3为本实用新型提供的一种电子电路基板安装装置的局部平面剖视示意图；FIG3 is a partial plan cross-sectional schematic diagram of an electronic circuit substrate mounting device provided by the present invention;
图4为图2中A结构的结构放大示意图。FIG. 4 is an enlarged schematic diagram of the structure A in FIG. 2 .
图中：1001、电子基板；1002、安装杆；1003、插槽；1004、固定板；1005、散热鳍片；2001、固定槽；2002、滑槽；2003、固定块；2004、滑块；2005、滑杆；2006、第一弹簧；2007、安装槽；2008、卡块；2009、卡槽；2010、第二弹簧；3001、连接板；3002、连接槽；3003、移动槽；3004、拉杆；3005、插块；3006、第三弹簧。In the figure: 1001, electronic substrate; 1002, mounting rod; 1003, slot; 1004, fixing plate; 1005, heat sink fin; 2001, fixing slot; 2002, slide slot; 2003, fixing block; 2004, slider; 2005, slide rod; 2006, first spring; 2007, mounting slot; 2008, block; 2009, slot; 2010, second spring; 3001, connecting plate; 3002, connecting slot; 3003, moving slot; 3004, pull rod; 3005, plug-in block; 3006, third spring.
具体实施方式DETAILED DESCRIPTION
为使本实用新型实施方式的目的、技术方案和优点更加清楚，下面将结合本实用新型实施方式中的附图，对本实用新型实施方式中的技术方案进行清楚、完整地描述，显然，所描述的实施方式是本实用新型一部分实施方式，而不是全部的实施方式。基于本实用新型中的实施方式，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施方式，都属于本实用新型保护的范围。In order to make the purpose, technical solution and advantages of the implementation of the utility model clearer, the technical solution in the implementation of the utility model will be clearly and completely described below in conjunction with the drawings in the implementation of the utility model. Obviously, the described implementation is a part of the implementation of the utility model, not all of the implementations. Based on the implementation of the utility model, all other implementations obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
因此，以下对在附图中提供的本实用新型的实施方式的详细描述并非旨在限制要求保护的本实用新型的范围，而是仅仅表示本实用新型的选定实施方式。基于本实用新型中的实施方式，本领域普通技术人员在没有作出创造性劳动前提下所获得的所有其他实施方式，都属于本实用新型保护的范围。Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.
本实用新型一种电子电路基板安装装置的实施例一Embodiment 1 of the utility model of an electronic circuit substrate mounting device
本实用新型提供以下技术方案：如参照图1和图4，包括电子基板1001，所述电子基板1001的两侧均卡合有安装杆1002，且一对所述安装杆1002的内部均设有插槽1003，所述电子基板1001的两侧均与插槽1003相互卡合，所述电子基板1001的顶部安装有一对固定板1004，且一对所述固定板1004之间等距离安装有若干散热鳍片1005，所述电子基板1001的内部两侧均设有固定槽2001，一对所述安装杆1002的内部两侧均设有一对滑槽2002，且两对所述滑槽2002的内部均设有安装机构，所述安装机构包括两对固定块2003，其中一个所述固定板1004的两侧均连接有连接板3001，且所述连接板3001的内部一侧设有连接槽3002，一对所述安装杆1002的内部中心处均设有移动槽3003，且一对所述移动槽3003的内部均设有散热机构，所述散热机构包括一对插块3005，所述滑槽2002的内部滑动安装有固定块2003，且所述固定块2003的两侧均安装有滑块2004，所述安装杆1002的顶部在滑槽2002的两侧均竖直安装有滑杆2005，且一对所述滑块2004均滑动安装有滑杆2005的外部，所述滑杆2005的外部连接有第一弹簧2006，且所述第一弹簧2006的一端与滑块2004相互连接，所述第一弹簧2006的底端与滑杆2005的底端相互连接，所述固定块2003的底端贯穿滑槽2002，并与固定槽2001相互卡合，所述电子基板1001的内部两侧均设有安装槽2007，且所述安装槽2007的内部一侧连接有第二弹簧2010，所述第二弹簧2010的一端连接有卡块2008，所述插槽1003的内部设有卡槽2009，且所述卡块2008与卡槽2009相互卡合，通过安装有一对滑块2004，且滑块2004在一对滑杆2005上进行移动，可以在固定块2003移动过程中保持平衡和稳定，通过设有第二弹簧2010，可以带动固定块2003进行自动复位，通过安装有卡块2008，可以对电子基板1001进行初步的安装和固定，从而使固定块2003与固定槽2001相互卡合。The utility model provides the following technical solution: as shown in Figures 1 and 4, it includes an electronic substrate 1001, both sides of the electronic substrate 1001 are engaged with mounting rods 1002, and a pair of the mounting rods 1002 are provided with slots 1003 inside, both sides of the electronic substrate 1001 are engaged with the slots 1003, a pair of fixing plates 1004 are installed on the top of the electronic substrate 1001, and a plurality of heat dissipation fins 1005 are installed equidistantly between the pair of fixing plates 1004, both sides of the electronic substrate 1001 are provided with fixing grooves 2001, and both sides of the mounting rods 1002 are provided with a pair of sliding grooves 2003. 002, and the interiors of the two pairs of the slide grooves 2002 are provided with mounting mechanisms, the mounting mechanisms include two pairs of fixed blocks 2003, both sides of one of the fixed plates 1004 are connected with connecting plates 3001, and one side of the interior of the connecting plate 3001 is provided with a connecting groove 3002, a pair of the mounting rods 1002 are provided with a moving groove 3003 at the inner center, and a pair of the moving grooves 3003 are provided with a heat dissipation mechanism, the heat dissipation mechanism includes a pair of plug blocks 3005, the interior of the slide groove 2002 is slidably installed with a fixed block 2003, and both sides of the fixed block 2003 are installed with sliders 2004, the mounting The top of the rod 1002 is vertically installed with a slide bar 2005 on both sides of the slide slot 2002, and a pair of the sliders 2004 are slidably installed with the outside of the slide bar 2005, the outside of the slide bar 2005 is connected with a first spring 2006, and one end of the first spring 2006 is connected to the slider 2004, the bottom end of the first spring 2006 is connected to the bottom end of the slide bar 2005, the bottom end of the fixed block 2003 passes through the slide slot 2002 and is engaged with the fixed slot 2001, the inside of the electronic substrate 1001 is provided with mounting grooves 2007 on both sides, and the inside of the mounting groove 2007 is connected to a second spring 2006. Spring 2010, one end of the second spring 2010 is connected to a card block 2008, a card slot 2009 is provided inside the slot 1003, and the card block 2008 and the card slot 2009 are engaged with each other. By installing a pair of sliders 2004, and the sliders 2004 move on a pair of slide bars 2005, the fixed block 2003 can maintain balance and stability during the movement process. By providing a second spring 2010, the fixed block 2003 can be driven to automatically reset. By installing the card block 2008, the electronic substrate 1001 can be preliminarily installed and fixed, so that the fixed block 2003 and the fixed slot 2001 are engaged with each other.
本实用新型一种电子电路基板安装装置的实施例二Embodiment 2 of the utility model of an electronic circuit substrate mounting device
参照，具体的如图2和图3，所述移动槽3003的内部滑动安装有拉杆3004，且所述拉杆3004的一侧连接有插块3005，所述插块3005的一端贯穿安装杆1002，并与连接槽3002相互卡合，所述移动槽3003的内壁一侧安装有第三弹簧3006，且所述第三弹簧3006的一端与拉杆3004的一侧相互连接，通过安装有插块3005，便于使插块3005与连接槽3002相互卡合，对散热鳍片1005进行安装，对电子基板1001进行散热，通过安装有第三弹簧3006，可以带动插块3005进行复位。Referring to Figures 2 and 3, a pull rod 3004 is slidably installed inside the movable groove 3003, and a plug block 3005 is connected to one side of the pull rod 3004, one end of the plug block 3005 passes through the installation rod 1002 and is engaged with the connecting groove 3002, a third spring 3006 is installed on one side of the inner wall of the movable groove 3003, and one end of the third spring 3006 is connected to one side of the pull rod 3004. By installing the plug block 3005, it is convenient to make the plug block 3005 and the connecting groove 3002 engage with each other, install the heat dissipation fins 1005, and dissipate heat for the electronic substrate 1001, and by installing the third spring 3006, the plug block 3005 can be driven to reset.
具体的，该种电子电路基板安装装置的工作原理：在对电子基板1001进行安装时，把电子基板1001插入一对插槽1003之间，在插入过程中，对两对卡块2008进行挤压，使第二弹簧2010带动卡块2008进行移动，之后卡块2008与卡槽2009相互卡合，对电子基板1001进行初次安装，然后两对固定块2003与固定槽2001相互卡合，对电子基板1001进行固定和安装，之后需要取下电子基板1001时，同时拉动两对固定块2003，使滑块2004在滑杆2005上进行移动，带动固定块2003与固定槽2001相互分离，之后松开固定块2003，第一弹簧2006带动固定块2003进行复位，且在电子基板1001使用中，会产生很多的热量，把固定板1004放置在电子基板1001上，然后一对插块3005与一对连接槽3002相互卡合，对若干散热鳍片1005进行安装和固定，便于对电子基板1001进行散热，之后拉动拉杆3004，使拉杆3004带动插块3005进行移动，带动插块3005与连接槽3002相互分离，可以在不需要使用时，取下散热鳍片1005，进行重复利用，提高使用的便捷性。Specifically, the working principle of the electronic circuit substrate installation device is as follows: when installing the electronic substrate 1001, the electronic substrate 1001 is inserted between a pair of slots 1003. During the insertion process, the two pairs of card blocks 2008 are squeezed so that the second spring 2010 drives the card block 2008 to move. Then, the card block 2008 and the card slot 2009 are engaged with each other to perform the initial installation of the electronic substrate 1001. Then, the two pairs of fixing blocks 2003 and the fixing slots 2001 are engaged with each other to fix and install the electronic substrate 1001. When the electronic substrate 1001 needs to be removed, the two pairs of fixing blocks 2003 are pulled at the same time to move the slider 2004 on the slide bar 2005, driving the fixing blocks 2003. The electronic substrate 1001 is separated from the fixing groove 2001, and then the fixing block 2003 is released. The first spring 2006 drives the fixing block 2003 to reset. When the electronic substrate 1001 is in use, a lot of heat will be generated. The fixing plate 1004 is placed on the electronic substrate 1001, and then a pair of plug-in blocks 3005 and a pair of connecting grooves 3002 are engaged with each other. A plurality of heat dissipation fins 1005 are installed and fixed to facilitate heat dissipation of the electronic substrate 1001. Then, the pull rod 3004 is pulled to make the pull rod 3004 drive the plug-in block 3005 to move, and drive the plug-in block 3005 to separate from the connecting groove 3002. When not in use, the heat dissipation fins 1005 can be removed and reused to improve the convenience of use.
以上所述仅为本实用新型的优选实施方式而已，并不用于限制本实用新型，对于本领域的技术人员来说，本实用新型可以有各种更改和变化。凡在本实用新型的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本实用新型的保护范围之内。The above description is only the preferred implementation of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.
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| CN120723033A (en) * | 2025-08-29 | 2025-09-30 | 苏州元脑智能科技有限公司 | Installation equipment and electronic equipment |
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