CN221734196U - Semiconductor substrate cleaning device - Google Patents

Abstract

The utility model relates to a semiconductor substrate cleaning device, comprising a cleaning box, wherein the upper end surface of the cleaning box is hinged with a cover plate through a hinge shaft, a first handle is fixed on the upper end surface of the cover plate, a cleaning mechanism is arranged on the rear end surface of the cleaning box, two slide rails are fixed on the lower end surface of the cleaning box, a connecting rod is hinged on the outer side of the water outlet pipe through a hinge seat, a conveying rod is fixed on both left and right end surfaces of the connecting rod, and a plurality of nozzles are installed on the outer sides of the two conveying rods. The semiconductor substrate cleaning device draws water flow from the inside of the water tank into the inside of the two conveying rods through the operation of a water pump, so that the water flow is sprayed out through a plurality of nozzles on both sides to clean the semiconductor substrate from top to bottom, and the cleaning box is set to be ultrasonic, so that the internal semiconductor substrate is cleaned from inside to outside, so that the semiconductor substrate can be fully cleaned and the cleaning quality is improved.

Description

Semiconductor substrate cleaning device

Technical Field

The utility model relates to the technical field of semiconductor substrates, in particular to a semiconductor substrate cleaning device.

Background Art

A semiconductor substrate is a wafer made of semiconductor single crystal material. The substrate can directly enter the wafer manufacturing process to produce semiconductor devices, or it can undergo epitaxial processing to produce epitaxial wafers. During the processing, it must be cleaned by a cleaning device.

In order to improve the cleaning efficiency of wafers, an ultrasonic cleaning machine is usually used for cleaning. The wafer shell and the wafer are placed in the cleaning machine together, eliminating the problem of low cleaning efficiency of each wafer. However, this cleaning method will cause some problems. Since the wafers are placed in the wafer shell for cleaning together, the structure of the wafer shell may cause the wafers to be not cleaned thoroughly enough and may leave residues. Therefore, a semiconductor substrate cleaning device is proposed to solve the above-mentioned problems.

Utility Model Content

In view of the deficiencies in the prior art, the utility model provides a semiconductor substrate cleaning device having the advantages of simple structure and good cleaning effect, and solves the problem that the wafers are placed in a wafer shell for cleaning together, and the structure of the wafer shell may cause the wafers to be not cleaned thoroughly enough and may leave residues.

To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor substrate cleaning device comprises a cleaning box, the cleaning box is hinged with a cover plate on its upper end surface through a hinge shaft, a first handle is fixed on the upper end surface of the cover plate, a cleaning mechanism is arranged on the rear end surface of the cleaning box, two slide rails are fixed on the lower end surface of the cleaning box, the same slide plate is slidably connected inside the two slide rails, and a second handle is fixed on the front end surface of the slide plate;

Among them, the cleaning mechanism includes a water tank fixed on the rear end face of the cleaning box, a water pump is fixed on the upper end face of the water tank, the input end of the water pump is connected to a water inlet pipe, the output end of the water pump is connected to a water outlet pipe, the outer side of the water outlet pipe is hinged with a connecting rod through a hinge seat, and the left and right end faces of the connecting rod are fixed with conveying rods, and a number of nozzles are installed on the outer sides of the two conveying rods.

Furthermore, a plurality of filter holes are provided on the inner bottom wall of the cleaning box, and the upper end surface of the slide plate is in contact with the lower end surface of the cleaning box.

Furthermore, grooves having the same height as the slide plate are formed on opposite sides of the two slide rails.

Furthermore, the two slide rails are symmetrically distributed on the left and right sides of the vertical center axis of the cleaning box, and the connection between the slide rail and the cleaning box is welding.

Furthermore, a through hole having the same diameter as the water inlet pipe is formed on the upper end surface of the water tank.

Furthermore, one end of the water inlet pipe away from the water pump is located at the bottom of the water tank, and the water inlet pipe is L-shaped.

Furthermore, the number of the plurality of nozzles is four, and a plurality of spray holes are formed at one end of the nozzle away from the conveying rod.

Furthermore, the connection between the water pump and the water tank is plug-in, which is easy to disassemble, and the cleaning box is an ultrasonic cleaning machine.

Compared with the prior art, the technical solution of this application has the following beneficial effects:

The semiconductor substrate cleaning device, through the operation of a water pump, draws water from the inside of a water tank into the inside of two conveying rods, and then sprays the water through a plurality of nozzles on both sides to clean the semiconductor substrate from top to bottom. By setting the cleaning box to ultrasonic, the internal semiconductor substrate is cleaned from the inside to the outside, so that the semiconductor substrate can be fully cleaned and the cleaning quality is improved.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a schematic diagram of the structure of the utility model;

Figure 2 is a schematic diagram of the structure of the cleaning mechanism of the utility model;

FIG3 is an enlarged structural schematic diagram of FIG2A of the present invention.

In the figure: 1. cleaning box; 2. cover plate; 3. first handle; 4. cleaning mechanism; 401. water tank; 402. water pump; 403. water inlet pipe; 404. water outlet pipe; 405. connecting rod; 406. delivery rod; 407. nozzle; 5. slide rail; 6. slide plate; 7. second handle.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

Please refer to Figures 1-3. A semiconductor substrate cleaning device in this embodiment includes a cleaning box 1. The cleaning box 1 has a cover plate 2 hinged on its upper end surface via a hinge shaft. A first handle 3 is fixed to the upper end surface of the cover plate 2. A cleaning mechanism 4 is provided on the rear end surface of the cleaning box 1. Two slide rails 5 are fixed to the lower end surface of the cleaning box 1. The two slide rails 5 are internally slidably connected with the same slide plate 6. A second handle 7 is fixed to the front end surface of the slide plate 6.

Please refer to Figures 2-3. In order to comprehensively clean the semiconductor substrate, the cleaning mechanism 4 in this embodiment includes a water tank 401 fixed to the rear end surface of the cleaning box 1. A water pump 402 is fixed to the upper end surface of the water tank 401. The input end of the water pump 402 is connected to a water inlet pipe 403, and the output end of the water pump 402 is connected to a water outlet pipe 404. The outer side of the water outlet pipe 404 is hinged with a connecting rod 405 through a hinge seat. By setting the hinge seat, it is convenient to rotate the connecting rod 405. Conveying rods 406 are fixed to the left and right end surfaces of the connecting rod 405. When the connecting rod 405 rotates, the two conveying rods 406 are driven to rotate accordingly, so that the conveying rods 406 are closer to the inside of the cleaning box 1. A plurality of nozzles 407 are installed on the outer sides of the two conveying rods 406. Through the rotation of the two conveying rods 406, the nozzles 407 on both sides are driven to get closer to the semiconductor substrate, which is convenient for cleaning.

A plurality of filtering holes are provided on the inner bottom wall of the cleaning box 1, the upper end surface of the slide plate 6 is fitted with the lower end surface of the cleaning box 1, and grooves with the same height as the slide plate 6 are provided on the opposite sides of the two slide rails 5. The two slide rails 5 are symmetrically distributed on the left and right sides of the vertical center axis of the cleaning box 1, and the connection between the slide rail 5 and the cleaning box 1 is welding. A through hole with the same diameter as the water inlet pipe 403 is provided on the upper end surface of the water tank 401, and the end of the water inlet pipe 403 away from the water pump 402 is located at the bottom of the water tank 401. The water inlet pipe 403 is L-shaped, and the number of the plurality of nozzles 407 is four. A plurality of spray holes are provided on the end of the nozzle 407 away from the conveying rod 406, and the connection between the water pump 402 and the water tank 401 is plug-in, which is easy to disassemble, and the cleaning box 1 is an ultrasonic cleaning machine.

The cleaning mechanism 4 in this embodiment, through the operation of the water pump 402, draws the water flow inside the water tank 401 through the water inlet pipe 403, the water outlet pipe 404 and the connecting rod 405 into the inside of the two conveying rods 406, so that the nozzles 407 on both sides spray the water flow inside the conveying rods 406 out, and through the cooperation of the cleaning box 1, the semiconductor substrate inside it is fully cleaned.

The working principle of the above embodiment is:

Pull the first handle 3, open the cover 2, place the semiconductor substrate inside the cleaning box 1, and perform ultrasonic cleaning from the inside to the outside through the structure inside the cleaning box 1. At this time, rotate the connecting rod 405, so that the two conveying rods 406 drive the nozzles 407 on both sides to rotate accordingly, so that it is closer to the semiconductor substrate. At this time, turn on the water pump 402. Through the operation of the water pump 402, the input end of the mouse water pump 402 draws the water flow inside the water tank 401 into the water inlet pipe 403. The water flows through the output of the output end of the water pump 402 and enters the inside of the connecting rod 405 through the water outlet pipe 404. Through the continuous operation of the water pump 402, it enters the inside of the two conveying rods 406. Through the operation of the nozzle 407, the water flow inside the conveying rod 406 is sprayed out, so that the semiconductor substrate placed in the cleaning box 1 is cleaned from top to bottom. After cleaning, pull the second handle 7 to drive the slide plate 6 to start sliding, so that it moves away from the lower end surface of the cleaning box 1. At this time, the cleaning water inside the cleaning box 1 is discharged through a plurality of filter holes.

Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims (8)

1. A semiconductor substrate cleaning device, comprising a cleaning box (1), characterized in that: the cleaning box (1) is hingedly connected to a cover plate (2) on its upper end surface via a hinge shaft, a first handle (3) is fixed to the upper end surface of the cover plate (2), a cleaning mechanism (4) is arranged on the rear end surface of the cleaning box (1), two slide rails (5) are fixed to the lower end surface of the cleaning box (1), the two slide rails (5) are slidably connected to the same slide plate (6), and a second handle (7) is fixed to the front end surface of the slide plate (6); The cleaning mechanism (4) comprises a water tank (401) fixed to the rear end face of the cleaning box (1); a water pump (402) is fixed to the upper end face of the water tank (401); the input end of the water pump (402) is connected to a water inlet pipe (403); the output end of the water pump (402) is connected to a water outlet pipe (404); a connecting rod (405) is hingedly connected to the outer side of the water outlet pipe (404) through a hinge seat; conveying rods (406) are fixed to the left and right end faces of the connecting rod (405); and a plurality of nozzles (407) are installed on the outer sides of the two conveying rods (406). 2. A semiconductor substrate cleaning device according to claim 1, characterized in that: a plurality of filter holes are provided on the inner bottom wall of the cleaning box (1), and the upper end surface of the slide plate (6) is in contact with the lower end surface of the cleaning box (1). 3. A semiconductor substrate cleaning device according to claim 1, characterized in that: a groove having the same height as the slide plate (6) is provided on opposite sides of the two slide rails (5). 4. A semiconductor substrate cleaning device according to claim 1, characterized in that: the two slide rails (5) are symmetrically distributed on the left and right sides of the vertical center axis of the cleaning box (1), and the connection between the slide rail (5) and the cleaning box (1) is welding. 5. A semiconductor substrate cleaning device according to claim 1, characterized in that: a through hole with the same diameter as the water inlet pipe (403) is opened on the upper end surface of the water tank (401). 6. A semiconductor substrate cleaning device according to claim 1, characterized in that: one end of the water inlet pipe (403) away from the water pump (402) is located at the bottom of the water tank (401), and the water inlet pipe (403) is L-shaped. 7. A semiconductor substrate cleaning device according to claim 1, characterized in that: the number of the plurality of nozzles (407) is four, and a plurality of spray holes are provided at one end of the nozzle (407) away from the conveying rod (406). 8. A semiconductor substrate cleaning device according to claim 1, characterized in that the connection between the water pump (402) and the water tank (401) is plug-in, which is easy to disassemble, and the cleaning tank (1) is an ultrasonic cleaning machine.