CN221728771U - Polyhedron combined circuit board with heat radiation structure - Google Patents
Polyhedron combined circuit board with heat radiation structure Download PDFInfo
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- CN221728771U CN221728771U CN202323576596.3U CN202323576596U CN221728771U CN 221728771 U CN221728771 U CN 221728771U CN 202323576596 U CN202323576596 U CN 202323576596U CN 221728771 U CN221728771 U CN 221728771U
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- circuit board
- heat dissipation
- frame body
- connecting rod
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Abstract
The utility model belongs to the technical field of circuit boards, in particular to a polyhedral combined circuit board with a heat radiation structure, which comprises a frame main body and a heat radiation assembly arranged in the frame main body, wherein the heat radiation assembly comprises a first circuit board which is connected in a sliding groove formed in the adjacent side of two frame main bodies in a sliding way and a second circuit board which is inserted in a clamping groove formed in the adjacent side of the two frame main bodies in a sliding way, and the fans are arranged on the adjacent side of the two frame main bodies.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to a polyhedral combined circuit board with a heat dissipation structure.
Background
With the development of electronic technology, the scale of integrated circuits is larger and the functions are more powerful, and how to arrange as complex a circuit structure as possible in a limited space, so that the integrated circuits have as complex a function as possible, which is the biggest challenge in design and manufacture, and nowadays, in order to enable a circuit board with a complex integrated circuit to occupy smaller space, a combined circuit board with a polyhedral structure (also called a three-dimensional structure) has larger and larger application;
Through investigation publication (bulletin) number: CN218352816U discloses a polyhedral combined circuit board with a heat dissipation structure, this technology discloses a "polyhedral combined circuit board with a heat dissipation structure, including two risers, two adjacent sides of the risers are close to the upper and lower sides and are equipped with two horizontal circuit boards together, and two adjacent sides of the horizontal circuit boards are close to the center of the front and rear sides and are equipped with two vertical circuit boards together, two the left and right sides of the horizontal circuit boards are close to the center and are fixedly connected with inserted bars, the inner cavities of the inserted bars at the upper and lower sides are close to the center and are provided with technical contents such as slots, and the polyhedral combined circuit board with a heat dissipation structure is disclosed, which can make the two rotating rods at the left and right sides of the polyhedral combined circuit board with a heat dissipation structure rotate through conveniently driving the two rotating rods at the left and right sides to drive the adjacent fan blades to rotate to generate wind power to perform heat dissipation operation on the device, thus achieving the technical effects of preventing the two vertical circuit boards and the horizontal circuit boards from influencing the normal work due to overhigh temperature;
Although this design can make this polyhedral combined circuit board with heat radiation structure, prevents that two vertical circuit boards and horizontal circuit board from influencing the condition of normal work because the high temperature from taking place, but this design can make the heat can produce the gathering when the in-process of polyhedral combined circuit board dispels the heat, makes the cavity inside of polyhedral combined circuit board hotter, and when dispelling the heat to polyhedral combined circuit board, the heat dissipation is slower, is unfavorable for the loss of heat.
In order to solve the above problems, the present application provides a polyhedral combined circuit board with a heat dissipation structure.
Disclosure of utility model
To solve the problems set forth in the background art. The utility model provides a polyhedral combined circuit board with a heat radiation structure, which can radiate heat of a cavity of the polyhedral combined circuit board, reduces heat accumulation and is convenient for maintenance and disassembly of the polyhedral combined circuit board.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a polyhedral combined circuit board with a heat dissipation structure comprises a frame main body and a heat dissipation assembly arranged in the frame main body;
The heat dissipation assembly comprises a first circuit board which is connected to the adjacent side of the frame body in a sliding mode and is arranged in a sliding groove in the adjacent side of the frame body in a plugging mode, a second circuit board which is arranged in a clamping groove in the adjacent side of the frame body in a plugging mode is arranged on the two fans on the adjacent sides of the frame body, the second circuit board is lapped on one side surface of the first circuit board, the two adjacent side surfaces of the first circuit board are provided with a first heat dissipation plate through heat conducting silica gel, the one side surface of one side of the circuit board is abutted with a second heat dissipation plate, the second heat dissipation plate is arranged on one side surface of the second circuit board through heat conducting silica gel, the fans are arranged on one side surface of one side of the heat dissipation plate of the frame body through bolts, and the two side surfaces of the frame body, which are far away from each other, are provided with dust-proof nets.
As the polyhedron combined circuit board with the heat radiation structure, preferably, one side surface of the fan is provided with the fixing plate with the L-shaped structure, one side surface of the fixing plate, which is close to the first heat radiation plate, is provided with the limit rod, and the limit rod is inserted into the concave hole formed in one side surface of the second heat radiation plate.
As a polyhedral combined circuit board having a heat dissipation structure of the present utility model is preferable, the first radiating plate and the second radiating plate are vertically arranged.
The polyhedral combined circuit board with the heat radiation structure preferably further comprises assembly components arranged on the adjacent sides of the two frame bodies, wherein each assembly component comprises a sleeve arranged on one side surface of each frame body, a connecting rod connected in the sleeve in a sliding manner and a positioning rod connected in a sliding manner in a sliding groove formed in the bottom surface of each frame body, and one end of each positioning rod is inserted into a clamping groove formed in the outer surface of each connecting rod.
As the polyhedron combined circuit board with the heat dissipation structure, preferably, two ends of the connecting rod are rectangular, two springs are sleeved on the outer surface of the connecting rod, one ends of the springs are abutted against the inner wall of the sleeve, and the other ends of the springs are connected with the rectangular structure of the connecting rod.
As the polyhedron combined circuit board with the heat dissipation structure, preferably, a tension spring is arranged on the surface of the positioning rod and in a chute formed in the surface of the frame main body, and one end of the tension spring is arranged in the chute formed in the surface of the frame main body.
Compared with the prior art, the utility model has the beneficial effects that:
1. The heat dissipation assembly is added on the basis, and the heat can be conducted out through the first heat dissipation plate and the second heat dissipation plate on the first circuit board and the second circuit board when the heat dissipation assembly is used, and then the heat is blown out through the fan, so that the problem that the heat caused by the combination of the circuit boards cannot be dissipated is solved;
2. Meanwhile, the assembly is further added on the basis, and the plurality of circuit boards can be assembled together through the arranged frame main body, the sleeve and the connecting rod when the assembly is used, so that the structure between the circuit boards is more stable, the shaking and loosening condition can not occur, and the assembly and the maintenance of the heat dissipation structure are facilitated.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of a heat dissipating assembly according to the present utility model;
FIG. 3 is a schematic diagram of a first heat dissipating plate, a second heat dissipating plate and a fan according to the present utility model;
FIG. 4 is a schematic view of the structure of the fixing plate and the stop lever according to the present utility model;
FIG. 5 is a schematic view of the construction of the splice assembly of the present utility model;
FIG. 6 is a schematic view of the structure of the connecting rod, spring and positioning rod of the present utility model.
In the figure:
1. A frame body;
2. A heat dissipation assembly; 201. a first circuit board; 202. a second circuit board; 203. a fan; 204. a first heat dissipation plate; 205. a second heat dissipation plate; 206. a bolt; 207. a fixing plate; 208. a limit rod; 209. a dust screen;
3. Assembling the assembly; 301. a sleeve; 302. a connecting rod; 303. a positioning rod; 304. a spring; 305. and a tension spring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
As shown in fig. 1-6;
a polyhedral combined circuit board with a heat radiation structure comprises a frame body 1.
In this embodiment: through investigation publication (bulletin) number: CN218352816U discloses a polyhedral combined circuit board with a heat dissipation structure, this technology discloses a "polyhedral combined circuit board with a heat dissipation structure, including two risers, two adjacent sides of the risers are close to the upper and lower sides and are equipped with two horizontal circuit boards together, and two adjacent sides of the horizontal circuit boards are close to the center of the front and rear sides and are equipped with two vertical circuit boards together, two the left and right sides of the horizontal circuit boards are close to the center and are fixedly connected with inserted bars, the inner cavities of the inserted bars at the upper and lower sides are close to the center and are provided with technical contents such as slots, and the polyhedral combined circuit board with a heat dissipation structure is disclosed, which can make the two rotating rods at the left and right sides of the polyhedral combined circuit board with a heat dissipation structure rotate through conveniently driving the two rotating rods at the left and right sides to drive the adjacent fan blades to rotate to generate wind power to perform heat dissipation operation on the device, thus achieving the technical effects of preventing the two vertical circuit boards and the horizontal circuit boards from influencing the normal work due to overhigh temperature;
Although the design can enable the polyhedral combined circuit board with the heat dissipation structure to prevent the situation that the normal work is influenced due to the fact that the temperature of the two vertical circuit boards and the temperature of the transverse circuit boards are too high, the heat can be gathered in the heat dissipation process of the polyhedral combined circuit board in actual use, so that the inside of a cavity of the polyhedral combined circuit board is hotter, the heat dissipation is slower in the heat dissipation process of the polyhedral combined circuit board, the heat loss is unfavorable, and the like.
According to the above, in order to enable the circuit board to perform rapid heat dissipation, heat accumulation is reduced, and the heat dissipation assembly 2 is installed in the frame body 1; the heat dissipation assembly 2 comprises a first circuit board 201 which is connected in a sliding way on the adjacent side of the two frame bodies 1 in a sliding way and a second circuit board 202 which is inserted in a clamping groove on the adjacent side of the two frame bodies 1 in a sliding way, wherein the second circuit board 202 is arranged on one side surface of the first circuit board 201, the adjacent side surface of the first circuit board 201 is provided with a first heat dissipation plate 204 through heat conducting silica gel, one side surface of the first circuit board 201 is provided with a second heat dissipation plate 205 in a propping way, the second heat dissipation plate 205 is arranged on one side surface of the second circuit board 202 through heat conducting silica gel, the second circuit board 202 is arranged on one side surface of the first heat dissipation plate 204 of the frame body 1 through a bolt 206, and one side surface of the second frame body 1, which is far away from each other, is provided with a dust screen 209.
In this embodiment: after the first circuit board 201 and the second circuit board 202 are spliced, the fan 203 is mounted on the surface of the first heat dissipation plate 204 on the surface of the first circuit board 201 through the bolts 206, so that the first heat dissipation plate 204 on the surface of the first circuit board 201 and the second heat dissipation plate 205 on the surface of the second circuit board 202 are vertical, an L-shaped structure is formed, the first heat dissipation plate 204 is abutted with the second heat dissipation plate 205, the first heat dissipation plate 204 and the second heat dissipation plate 205 are enabled to be simultaneously cooled by the fan 203, the heat dissipation efficiency is improved, and dust entering is reduced through the dustproof net 209.
In an alternative embodiment: one side surface of the fan 203 is provided with a fixing plate 207 with an L-shaped structure, one side surface of the fixing plate 207, which is close to the first cooling plate 204, is provided with a limiting rod 208, and the limiting rod 208 is inserted into a concave hole formed in one side surface of the second cooling plate 205.
In this embodiment: when the fan 203 is installed, the fixing plate 207 on the fan 203 drives the limit rod 208 to be inserted into the groove formed in the surface of the second cooling plate 205, and the first cooling plate 204 and the second cooling plate 205 are tightly attached through the fixing plate 207 and the limit rod 208, so that heat on the cooling plates can be mutually conducted.
In an alternative embodiment: the first heat sink 204 is perpendicular to the second heat sink 205.
In this embodiment: a fixed heat dissipation area is formed, and heat on a plurality of circuit boards can be conducted out through the fan 203 arranged on the first heat dissipation plate 204 and the second heat dissipation plate 205, so that the heat dissipation effect of the circuit boards is improved.
According to the above, in order to facilitate assembling the circuit board, the assembly 3 is further provided on one side of the two frame bodies 1, the assembly 3 comprises a sleeve 301 installed on one side surface of the frame body 1, a connecting rod 302 slidably connected in the sleeve 301, and a positioning rod 303 slidably connected in a chute formed in the bottom surface of the frame body 1, and one end of the positioning rod 303 is inserted into a clamping groove formed in the outer surface of the connecting rod 302.
In this embodiment: when the first circuit board 201 and the second circuit board 202 are assembled, the first circuit board 201 is inserted into a transverse groove formed in one side surface of the frame body 1, the first circuit board 201 is placed in the center of the transverse groove formed in the specific surface of the frame body 1, the second circuit board 202 is inserted into a vertical groove formed in the frame body 1, the second circuit board 202 is abutted against the first circuit board 201, the two frame bodies 1 are pushed, the two frame bodies 1 slide on the outer side surface of the connecting rod 302 through the sleeve 301, and then the positioning rod 303 can be inserted into a slot formed in the outer surface of the connecting rod 302, so that the separation of the two frame bodies 1 is prevented, the stability of the first circuit board 201 and the assembled circuit board is improved, and the structural stability is higher.
In an alternative embodiment: the both ends of connecting rod 302 are the rectangle setting, and the surface cover of connecting rod 302 is equipped with two springs 304, and the one end butt of spring 304 is at sleeve 301 inner wall, and the other end of spring 304 is connected with the rectangular structure department of connecting rod 302.
In this embodiment: the springs 304 outside the connecting rods 302 can pull the two frame bodies 1 after the first circuit board 201 and the second circuit board 202 are installed, so that the first circuit board 201 and the second circuit board 202 are conveniently installed, and the two ends of the connecting rods 302 are rectangular and cannot rotate during movement.
In an alternative embodiment: a tension spring 305 is installed on the surface of the positioning rod 303 and in a chute formed in the surface of the frame body 1, and one end of the tension spring 305 is installed in the chute formed in the surface of the frame body 1.
In this embodiment: the positioning rod 303 can be pulled through the tension spring 305, so that the positioning rod 303 can be inserted into the insertion hole formed in the surface of the connecting rod 302, and the connecting rod 302 is limited.
The working principle and the using flow of the utility model are as follows: when the first circuit board 201 and the second circuit board 202 are assembled, the first circuit board 201 is inserted into a transverse groove formed on one side surface of the frame main body 1, the first circuit board 201 is arranged at the center of the transverse groove formed on the specific surface of the frame main body 1, the second circuit board 202 is inserted into a vertical groove formed on the frame main body 1, the second circuit board 202 props against the first circuit board 201, then the two frame main bodies 1 are pushed, the two frame main bodies 1 slide on the outer side surface of the connecting rod 302 through the sleeve 301, then the positioning rod 303 can be inserted into a slot formed on the outer surface of the connecting rod 302, thus the separation of the two frame main bodies 1 is prevented, the stability of the assembled circuit board 201 and the assembled circuit board is improved, the structural stability is higher, the first circuit board 201 and the second circuit board 202 can be conveniently installed by pulling the two frame main bodies 1 through the spring 304 on the outer side of the connecting rod 302, and the two ends of the connecting rod 302 are rectangular, and the connecting rod is not rotated when moving, then the positioning rod 303 can be pulled through the tension spring 305, so that the positioning rod 303 can be inserted into the insertion hole formed in the surface of the connecting rod 302, the connecting rod 302 is limited, after the first circuit board 201 and the second circuit board 202 are spliced, the fan 203 is arranged on the surface of the first cooling plate 204 on the surface of the first circuit board 201 through the bolt 206, the first cooling plate 204 and the second cooling plate 205 on the surface of the first circuit board 201 are vertical, an L-shaped structure is formed, a fixed cooling area is formed, the fan 203 arranged on the first cooling plate 204 and the second cooling plate 205 can guide out heat on a plurality of circuit boards, the cooling effect of the first cooling plate 204 and the second cooling plate 205 are abutted, the first cooling plate 204 and the second cooling plate 205 are cooled simultaneously, the cooling efficiency is improved, and reduce the dust entering through the dust screen 209, when installing the fan 203, can drive the fixed plate 207 on the fan 203 and insert in the recess that the heating panel two 205 surface was seted up, can make heating panel one 204 and heating panel two 205 closely laminate through fixed plate 207 and spacing rod 208, make the heat on the heating panel can mutually conduct.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323576596.3U CN221728771U (en) | 2023-12-27 | 2023-12-27 | Polyhedron combined circuit board with heat radiation structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323576596.3U CN221728771U (en) | 2023-12-27 | 2023-12-27 | Polyhedron combined circuit board with heat radiation structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221728771U true CN221728771U (en) | 2024-09-17 |
Family
ID=92693579
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323576596.3U Active CN221728771U (en) | 2023-12-27 | 2023-12-27 | Polyhedron combined circuit board with heat radiation structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221728771U (en) |
-
2023
- 2023-12-27 CN CN202323576596.3U patent/CN221728771U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20251215 Address after: No. 1688 Tiantai Temple Road, North Area of Modern Industrial Port, Pidu District, Chengdu City, Sichuan Province, 610000 Patentee after: Chengdu Xinjingao Electronic Technology Co.,Ltd. Country or region after: China Address before: 422000 Hunan Province Shaoyang City Daxiang District Yingchun Road Yongcuiyingfeng Building 2 Unit 2 Patentee before: Huang Peidong Country or region before: China |