CN221708017U - Singlechip heat abstractor convenient to installation - Google Patents

Abstract

The utility model relates to the field of single-chip microcomputer heat dissipation technology, and specifically to a single-chip microcomputer heat dissipation device that is easy to install, including: a single-chip microcomputer heat dissipation mechanism; the single-chip microcomputer heat dissipation mechanism includes a ventilation inner cylinder, a heat dissipation outer cylinder is sealed and installed outside the ventilation inner cylinder, a sealed space is formed between the heat dissipation outer cylinder and the ventilation inner cylinder, and the inner wall of the ventilation inner cylinder is annularly sealed and fixedly installed with a plurality of heat dissipation fins. In the utility model, after the fan is started, the air outside the ventilation inner cylinder is compressed and blown into the ventilation inner cylinder, and the heat dissipation fins passing through the ventilation inner cylinder are blown out from the air outlet to the components of the single-chip microcomputer that need heat dissipation, and the circulating pump draws the coolant inside the coolant tank into the coolant inlet pipe, and discharges it into the inner side of the heat dissipation outer cylinder through the coolant inlet pipe, passes through the space between the heat dissipation outer cylinder and the ventilation inner cylinder, and contacts the heat dissipation fins, absorbs heat and cools the heat dissipation fins, and then discharges through the coolant outlet pipe and flows into the coolant tank, which has coolant circulation cooling.

Description

A single chip microcomputer heat dissipation device that is easy to install

Technical Field

The utility model relates to the technical field of single-chip computer heat dissipation, in particular to a single-chip computer heat dissipation device which is easy to install.

Background Art

A single-chip microcomputer is an integrated circuit chip that uses very large-scale integrated circuit technology to integrate a central processing unit CPU with data processing capabilities, random access memory RAM, read-only memory ROM, multiple I/O port interrupt systems, timer/counters and other functions onto a silicon chip to form a small and complete microcomputer system. It is widely used in the field of industrial control. Since the single-chip computer generates a lot of heat, a cooling fan is provided in the prior art for heat dissipation. A Chinese patent discloses a single-chip computer heat dissipation device that is easy to install (authorization announcement number CN217134357U). The patent technology discloses a single-chip computer heat dissipation device that is easy to install, including a mounting plate and a detachable cover plate with a cooling fan installed. The two ends of the detachable cover plate are fixed to the upper end surface of the mounting plate by fastening bolts, and the detachable cover plate is provided with at least one elastic positioning mechanism; the upper end surface of the mounting plate is provided with a positioning groove arranged opposite to the detachable cover plate, and a heat dissipation bin is provided in the middle of the mounting plate. A heat dissipation plate is provided in the heat dissipation bin through an elastic connection mechanism, and a plurality of heat conducting sheets are provided on the bottom surface of the heat dissipation plate. A plurality of heat dissipation holes are provided at the bottom of the heat dissipation bin, and an exhaust mechanism is fixed in the middle of the heat dissipation bin. A single-chip computer heat dissipation device that is easy to install using the above structure has a simple structure, is easy to install, and has a good heat dissipation effect. This patented technology solves the problem that existing heat dissipation devices are inconvenient to install and have poor heat dissipation effect, which makes the use environment of the microcontroller unable to meet the use requirements and causes the microcontroller to fail to work normally. Therefore, there is an urgent need to improve the heat dissipation device.

However, in the prior art, air cooling is also used for heat dissipation of the single-chip microcomputer. However, the prior art air cooling compresses the air and then blows it out, which will affect the heat dissipation efficiency according to the outside air temperature. Therefore, it is necessary to solve the problem of increasing the heat dissipation efficiency of air cooling in the prior art.

Therefore, those skilled in the art provide a single chip microcomputer heat dissipation device that is easy to install to solve the problems raised in the above background technology.

Utility Model Content

In order to solve the above technical problems, the utility model provides:

A single-chip microcomputer heat dissipation device that is easy to install, comprising: a single-chip microcomputer heat dissipation mechanism; the single-chip microcomputer heat dissipation mechanism comprises a ventilation inner cylinder, a heat dissipation outer cylinder is sealed and installed on the outside of the ventilation inner cylinder, a sealed space is formed between the heat dissipation outer cylinder and the ventilation inner cylinder, and the inner wall of the ventilation inner cylinder is annularly sealed and fixedly installed with a plurality of heat dissipation fins; a coolant inlet pipe is connected through one end of the heat dissipation outer cylinder, a circulation pump is connected to one end of the coolant inlet pipe, and a coolant outlet pipe is connected through the other end of the heat dissipation outer cylinder; the single-chip microcomputer heat dissipation mechanism is installed with a heat dissipation device installation mechanism.

Preferably, the coolant inlet pipe and the coolant outlet pipe are commonly connected to a coolant tank.

The coolant tank forms a circulation channel through the coolant inlet pipe, the coolant outlet pipe, and the sealed space between the ventilation inner cylinder and the heat dissipation outer cylinder.

Preferably: a semiconductor refrigerator is installed on the inner wall of one side of the coolant tank, and a heat dissipation fan is installed on the outer side of the semiconductor refrigerator.

One end of the semiconductor refrigerator is located inside the cooling liquid tank, and one end of the semiconductor refrigerator for heat dissipation is located inside the heat dissipation fan.

Preferably: a controller is installed on the outer wall of the other side of the coolant tank.

The controller is electrically connected to and controls a circulation pump, a cooling fan and a semiconductor refrigerator of a single chip microcomputer cooling mechanism.

Preferably: the heat dissipation device installation mechanism includes an air outlet scoop sealed and connected to the ventilation inner tube, and a positioning frame is fixedly provided at one end of the air outlet scoop and the inner wall of the ventilation inner tube, and adjustment grooves are opened at both upper and lower ends of the positioning frame.

The number of the adjustment slots is two in total, and they are symmetrically arranged up and down with respect to the positioning frame.

Preferably: a bidirectional lead screw is rotatably mounted inside the adjusting groove, a worm wheel is fixedly mounted in the middle of the bidirectional lead screw, and the worm wheel is meshed with the worm.

The worm wheel is meshed on one side of the worm.

Preferably: the worm is vertically fixedly equipped with a transmission rod, the top end of the transmission rod rotates through the positioning frame and is fixedly equipped with a hand lever.

The hand lever is used to actively rotate the transmission rod manually.

Preferably: both ends of the bidirectional screw rod are provided with a screw-shifting frame on the outside of the screw-shifting frame, and a clamping plate is fixedly mounted on the screw-shifting frame.

The screw shifting frame is movably installed inside the adjusting groove.

Technical effects and advantages of the utility model:

The utility model compresses the air outside the ventilation inner cylinder and blows it into the ventilation inner cylinder after the fan is started, and then blows it out from the air outlet hopper onto the components of the single-chip computer that need heat dissipation through the heat dissipation fins of the ventilation inner cylinder. The circulation pump draws the coolant inside the coolant tank into the coolant inlet pipe, and discharges it into the inner side of the heat dissipation outer cylinder through the coolant inlet pipe, passes through the space between the heat dissipation outer cylinder and the ventilation inner cylinder, and contacts the heat dissipation fins, absorbs heat and cools the heat dissipation fins, and then is discharged through the coolant outlet pipe into the coolant tank, thereby achieving coolant circulation cooling.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of a single-chip microcomputer heat dissipation device that is easy to install provided in an embodiment of the present application;

FIG2 is a schematic structural diagram of an air outlet scoop in a single-chip microcomputer heat dissipation device that is easy to install provided in an embodiment of the present application;

3 is a schematic diagram of the structure of a clamping plate in a single-chip microcomputer heat dissipation device that is easy to install provided by an embodiment of the present application;

FIG4 is a schematic structural diagram of a heat dissipation outer cylinder in a single-chip microcomputer heat dissipation device that is easy to install provided in an embodiment of the present application;

FIG5 is a schematic diagram of the structure of a heat dissipation device for a single-chip computer that is easy to install provided in an embodiment of the present application at position A;

In the figure:

1. MCU heat dissipation mechanism; 101. Ventilation inner tube; 102. Heat dissipation fins; 103. Heat dissipation outer tube; 104. Coolant inlet pipe; 105. Circulation pump; 106. Coolant outlet pipe; 107. Coolant tank; 108. Semiconductor refrigerator; 109. Cooling fan; 110. Controller;

2. Heat dissipation device installation mechanism; 201. Air outlet scoop; 202. Positioning frame; 203. Adjustment slot; 204. Bidirectional screw; 205. Worm gear; 206. Worm; 207. Transmission rod; 208. Hand lever; 209. Screw shifting frame; 210. Clamping plate.

DETAILED DESCRIPTION

The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The embodiments of the present invention are provided for the purpose of illustration and description, and are not intended to be exhaustive or to limit the present invention to the disclosed forms. Many modifications and variations are obvious to those of ordinary skill in the art. The embodiments are selected and described in order to better illustrate the principles and practical applications of the present invention, and to enable those of ordinary skill in the art to understand the present invention and thereby design various embodiments with various modifications suitable for specific purposes.

Example:

Referring to FIGS. 1 to 5 , in this embodiment, a single-chip microcomputer heat dissipation device that is easy to install is provided, comprising: a single-chip microcomputer heat dissipation mechanism 1; the single-chip microcomputer heat dissipation mechanism 1 comprises a ventilation inner cylinder 101, a heat dissipation outer cylinder 103 is sealed and installed on the outside of the ventilation inner cylinder 101, a sealed space is formed between the heat dissipation outer cylinder 103 and the ventilation inner cylinder 101, and a plurality of heat dissipation fins 102 are fixedly and sealedly installed on the inner wall of the ventilation inner cylinder 101 in an annular shape;

One end of the heat dissipation outer cylinder 103 is connected to a coolant inlet pipe 104, one end of the coolant inlet pipe 104 is connected to a circulation pump 105, and the other end of the heat dissipation outer cylinder 103 is connected to a coolant outlet pipe 106; the single chip heat dissipation mechanism 1 is installed with a heat dissipation device installation mechanism 2;

The cooling liquid inlet pipe 104 and the cooling liquid outlet pipe 106 are connected to a cooling liquid tank 107; the cooling liquid tank 107 forms a circulation channel through the cooling liquid inlet pipe 104, the cooling liquid outlet pipe 106, the sealed space between the ventilation inner cylinder 101 and the heat dissipation outer cylinder 103; a semiconductor refrigerator 108 is installed on the inner wall of one side of the cooling liquid tank 107, and a heat dissipation fan 109 is installed on the outer side of the semiconductor refrigerator 108;

The cooling end of the semiconductor refrigerator 108 is located inside the cooling liquid tank 107, and the heat dissipation end of the semiconductor refrigerator 108 is located inside the cooling fan 109; a controller 110 is installed on the outer wall of the other side of the cooling liquid tank 107; the controller 110 is electrically connected to and controls the circulation pump 105, the cooling fan 109, and the semiconductor refrigerator 108 of the single-chip microcomputer heat dissipation mechanism 1;

The heat dissipation device installation mechanism 2 includes an air outlet scoop 201 sealed and docked with the ventilation inner tube 101, and a positioning frame 202 is fixedly provided at one end of the air outlet scoop 201 and the inner wall of the ventilation inner tube 101 is provided with adjustment grooves 203 at both ends of the positioning frame 202; there are two adjustment grooves 203 in total, and they are symmetrically arranged in the upper and lower parts of the positioning frame 202; a bidirectional screw rod 204 is rotatably installed inside the adjustment groove 203, and a worm wheel 205 is fixedly installed in the middle of the bidirectional screw rod 204, and a worm 206 is meshed with the worm wheel 205;

The worm wheel 205 is meshed on one side of the worm 206; the worm 206 is vertically fixedly equipped with a transmission rod 207, the top end of the transmission rod 207 rotates through the positioning frame 202, and is fixedly equipped with a hand lever 208; the hand lever 208 is used to actively rotate the transmission rod 207 manually; both ends of the bidirectional screw 204 are externally spirally sleeved with a screw shift frame 209, and a clamping plate 210 is fixedly assembled on the screw shift frame 209; the screw shift frame 209 is movably installed on the inner side of the adjustment slot 203.

Working principle:

When the single-chip microcomputer heat dissipation mechanism 1 is installed on the single-chip microcomputer for heat dissipation treatment, the single-chip microcomputer heat dissipation mechanism 1 is installed on the single-chip microcomputer through the heat dissipation device installation mechanism 2;

The hand lever 208 is manually rotated, and the hand lever 208 drives the transmission rod 207 to rotate. The transmission rod 207 drives the worm 206 to rotate, and the worm 206 rotates to engage with the worm wheel 205. The worm wheel 205 drives the bidirectional screw 204 to rotate, so that the bidirectional screw 204 drives the screw shifting frame 209 in a spiral manner. The screw shifting frame 209 drives the clamping plate 210 to move along the adjustment groove 203, and the heat dissipation mechanism 1 of the single-chip microcomputer can be positioned and installed at the corresponding heat dissipation position of the single-chip microcomputer.

A fan is installed at one end of the ventilation inner cylinder 101 away from the air outlet 201;

When heat is dissipated, the fan is started. After the fan is started, the air outside the ventilation inner cylinder 101 is compressed and blown into the ventilation inner cylinder 101, and then blown out from the air outlet 201 to the components of the single-chip computer that need heat dissipation through the heat dissipation fins 102 of the ventilation inner cylinder 101;

After the circulation pump 105 is started, the circulation pump 105 draws the coolant in the coolant tank 107 into the coolant inlet pipe 104, and is discharged into the inner side of the heat dissipation outer cylinder 103 through the coolant inlet pipe 104, passes through the space between the heat dissipation outer cylinder 103 and the ventilation inner cylinder 101, and contacts the heat dissipation fins 102, absorbs heat and cools the heat dissipation fins 102, and then is discharged into the coolant tank 107 through the coolant outlet pipe 106, so as to achieve the coolant circulation cooling;

The semiconductor refrigerator 108 cools the coolant in the coolant tank 107 , and the heat dissipation fan 109 is started to perform air cooling on the heat dissipation end of the semiconductor refrigerator 108 .

In the present invention, unless otherwise clearly specified and limited, for example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. Unless otherwise clearly specified and limited, for ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field and related fields without creative work should fall within the scope of protection of the present invention. Structures, devices and operating methods not specifically described and explained in the present invention shall be implemented according to conventional means in the field unless otherwise specified and limited.

Claims (8)

1. A single chip microcomputer heat dissipation device that is easy to install, characterized in that it includes: A single-chip microcomputer heat dissipation mechanism (1); the single-chip microcomputer heat dissipation mechanism (1) comprises a ventilation inner cylinder (101), a heat dissipation outer cylinder (103) is installed on the outside of the ventilation inner cylinder (101) in a sealed manner, a sealed space is formed between the heat dissipation outer cylinder (103) and the ventilation inner cylinder (101), and a plurality of heat dissipation fins (102) are fixedly installed on the inner wall of the ventilation inner cylinder (101) in an annular manner in a sealed manner; One end of the heat dissipation outer cylinder (103) is connected to a coolant inlet pipe (104), one end of the coolant inlet pipe (104) is connected to a circulation pump (105), and the other end of the heat dissipation outer cylinder (103) is connected to a coolant outlet pipe (106); The single-chip microcomputer heat dissipation mechanism (1) is provided with a heat dissipation device installation mechanism (2). 2. The single chip microcomputer heat dissipation device that is easy to install according to claim 1 is characterized in that the coolant inlet pipe (104) and the coolant outlet pipe (106) are commonly connected to a coolant tank (107). 3. According to the easy-to-install single-chip microcomputer heat dissipation device described in claim 2, it is characterized in that a semiconductor refrigerator (108) is installed on the inner wall of one side of the coolant tank (107), and a heat dissipation fan (109) is installed on the outside of the semiconductor refrigerator (108). 4. The easy-to-install single-chip microcomputer heat dissipation device according to claim 3 is characterized in that a controller (110) is installed on the outer wall of the other side of the coolant tank (107). 5. According to claim 1, a single-chip microcomputer heat dissipation device that is easy to install is characterized in that the heat dissipation device installation mechanism (2) includes an air outlet scoop (201) that is sealed and connected to the ventilation inner cylinder (101), and a positioning frame (202) is fixedly provided on one end of the air outlet scoop (201) and the ventilation inner cylinder (101), and the inner walls of the positioning frame (202) are provided with adjustment grooves (203) at both upper and lower ends. 6. A single-chip microcomputer heat dissipation device that is easy to install according to claim 5, characterized in that a bidirectional screw rod (204) is rotatably installed inside the adjustment groove (203), a worm wheel (205) is fixedly installed in the middle of the bidirectional screw rod (204), and the worm wheel (205) is meshed with a worm (206). 7. A single-chip microcomputer heat dissipation device that is easy to install according to claim 6, characterized in that the worm (206) is vertically fixedly equipped with a transmission rod (207), the top end of the transmission rod (207) rotates through the positioning frame (202) and is fixedly equipped with a hand lever (208). 8. A single-chip microcomputer heat dissipation device that is easy to install according to claim 7, characterized in that both ends of the bidirectional screw rod (204) are externally provided with a screw shifting frame (209) with a spiral transmission sleeve, and a clamping plate (210) is fixedly mounted on the screw shifting frame (209).