CN221699503U - A semiconductor chip storage device with fixed functions - Google Patents

Abstract

The utility model discloses semiconductor chip storage equipment with a fixing function, and relates to the technical field of semiconductor storage. The utility model comprises a box body, wherein at least one fixed rod is arranged in the box body, fixed blocks are arranged on two opposite sides of the box body, a threaded rod is arranged between the fixed blocks on two sides, a movable frame is arranged on the threaded rod, a placing plate is in sliding fit on the movable frame, the movable frame is in sliding fit on the fixed rod, and a movable assembly is arranged on one side of the movable frame. According to the utility model, the placing plate is driven to slide on the moving frame through the moving assembly, so that the placing plate moves out of the moving frame to conveniently place the semiconductor chips in the placing grooves of the placing plate, then the placing plate slides into the moving frame to be stored, and the moving frame is driven to slide on the fixed rod through the adjusting assembly, so that the placing plates on the plurality of moving frames in the box body are stacked together, more semiconductor chips are conveniently stored, and the semiconductor chips are conveniently taken out.

Description

A semiconductor chip storage device with fixed functions

Technical Field

The utility model belongs to the technical field of semiconductor storage, and in particular relates to a semiconductor chip storage device with fixed functions.

Background Art

Semiconductors in the prior art refer to materials whose electrical conductivity at room temperature is between that of conductors and insulators. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. In the existing semiconductor product manufacturing process, multiple semiconductor products are placed on ordinary pallets, while the work orders corresponding to the semiconductor products are stored separately in another space and away from the ordinary pallets. At this time, when the operator transfers the semiconductor product, he needs to move to another space to find the corresponding work order, so that the operator needs to transfer the position and re-check the work order with the semiconductor product, which results in a more cumbersome workload for checking the semiconductor products supported by the pallet and the work order.

In view of this, the present utility model is proposed.

Utility Model Content

The technical problem to be solved by the utility model is to overcome the deficiencies of the prior art and provide a semiconductor chip storage device with fixed functions.

In order to solve the above technical problems, the basic concept of the technical solution adopted by the utility model is:

A semiconductor chip storage device with a fixing function, comprising a box body, one side of the box body is rotatably matched with a box door, at least one fixing rod is installed inside the box body, fixing blocks are installed on opposite sides of the box body, and a threaded rod is installed between the fixing blocks on both sides;

A movable frame is arranged on the threaded rod, a placement plate is slidably matched on the movable frame, the movable frame is slidably matched on the fixed rod, a movable component is arranged on one side of the movable frame, the movable component matches with the placement plate, an adjustment component is arranged on the movable frame, the adjustment component matches with the threaded rod, and a plurality of placement slots are opened on the placement plate.

Optionally, a sliding groove is provided on one side of the movable frame, and the placement plate slides in the sliding groove. At least one first slot hole is provided on one side of the movable frame, and the first slot hole slides on the fixed rod. The movable assembly includes an operating shaft rotatably engaged with one side of the movable frame, and a rack installed on one side of the placement plate. The operating shaft passes through one end of the upper side plate of the movable frame and is equipped with a gear, and the rack is meshed with the gear. Blocks are installed on opposite sides of the placement plate. When the semiconductor chip is placed in the placement groove of the placement plate, the movable frame is moved by rotating the operating shaft, thereby reducing the situation where the staff pushes the placement plate to shake and cause the semiconductor chip in the placement groove to collide.

Optionally, a dustproof frame is installed at the bottom of the placement plate, a plurality of pressing blocks are installed at the bottom of the placement plate, a moving block is installed on one side of the moving frame, a second slot hole and a third slot hole are opened on the moving block, and the threaded rod is slidably fitted in the second slot hole; by providing the dustproof frame and pressing blocks at the bottom of the placement plate, when multiple placement plates are stacked together, the dustproof frame of the upper placement plate can prevent dust from entering the placement slot of the lower placement plate, thereby reducing the contamination of the semiconductor chips in the placement slot, and the pressing blocks can squeeze and fix the semiconductor chips in the placement slot.

Optionally, a connecting groove is provided on one side of the moving block, and the adjusting component includes a rotating shaft rotatably fitted in the third slot hole, a threaded sleeve rotatably fitted in the connecting groove, the threaded sleeve is threadedly fitted on the threaded rod, a moving groove is provided on one side of the box body, the moving block is slidably fitted in the moving groove, a first bevel gear is installed on one side of the threaded sleeve, and a second bevel gear is installed on one side of the rotating shaft, and the second bevel gear is meshed with the first bevel gear; the threaded sleeve is driven to rotate on the moving block by rotating the rotating shaft, and the threaded sleeve is threadedly fitted on the threaded rod so that the rotating threaded sleeve drives the moving frame to move up and down in the box body, so that the placement plate on the moving frame is stacked in the box body.

After adopting the above technical solution, the utility model has the following beneficial effects compared with the prior art. Of course, any product implementing the utility model does not necessarily need to achieve all the advantages described below at the same time:

1. The semiconductor chip storage device with a fixing function drives the placement plate to slide on the mobile rack through a moving component, so that the placement plate is moved out of the mobile rack to facilitate placing the semiconductor chip in the placement groove of the placement plate, and then the placement plate is slid into the mobile rack for storage. The mobile rack is driven to slide on the fixed rod through an adjusting component, so that the placement plates on multiple mobile racks inside the box are stacked together, which is convenient for storing more semiconductor chips and also convenient for taking them out.

2. The semiconductor chip storage device with a fixing function has a dustproof frame and a pressing block arranged at the bottom of the placement plate, so that when multiple placement plates are stacked together, the dustproof frame of the upper placement plate can prevent dust from entering the placement groove of the lower placement plate, thereby reducing the contamination of the semiconductor chips in the placement groove. The pressing block can squeeze and fix the semiconductor chips in the placement groove. The pressing block is made of rubber material, which can fix the semiconductor chips without damaging them and avoid static electricity from breaking through the semiconductor chips and causing damage.

The specific implementation of the utility model is further described in detail below in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings described below are only some embodiments. For those skilled in the art, other drawings can be obtained based on these drawings without creative work. In the drawings:

FIG1 is a schematic diagram of the overall structure of an embodiment of the utility model;

FIG2 is a schematic diagram of the structure of the connection between the movable frame and the placement plate according to an embodiment of the utility model;

FIG3 is a schematic structural diagram of a placement plate according to an embodiment of the utility model;

FIG4 is a schematic diagram of the structure of the adjustment assembly of the utility model embodiment;

In the accompanying drawings, the components represented by the reference numerals are listed as follows:

1-box body, 2-box door, 3-fixed rod, 4-fixed block, 5-threaded rod, 6-movable frame, 7-placing plate, 8-sliding groove, 9-first slot hole, 10-operating shaft, 11-gear, 12-rack, 13-moving block, 14-second slot hole, 15-third slot hole, 16-placing groove, 17-stopper, 18-dustproof frame, 19-pressing block, 20-moving groove, 21-threaded sleeve, 22-first bevel gear, 23-rotating shaft, 24-second bevel gear, 25-connecting groove.

It should be noted that these drawings and textual descriptions are not intended to limit the conceptual scope of the present invention in any way, but rather to illustrate the concept of the present invention for those skilled in the art by referring to specific embodiments.

DETAILED DESCRIPTION

The utility model will now be further described in detail with reference to the accompanying drawings.

Referring to FIGS. 1-4 , in this embodiment, a semiconductor chip storage device with a fixing function is provided, comprising a box body 1, a box door 2 is rotatably matched on one side of the box body 1, at least one fixing rod 3 is installed inside the box body 1, fixing blocks 4 are installed on opposite sides of the box body 1, and a threaded rod 5 is installed between the fixing blocks 4 on both sides;

A movable frame 6 is provided on the threaded rod 5, and a placement plate 7 is slidably fitted on the movable frame 6. The movable frame 6 is slidably fitted on the fixed rod 3. A movable component is provided on one side of the movable frame 6, and the movable component cooperates with the placement plate 7. An adjusting component is provided on the movable frame 6, and the adjusting component cooperates with the threaded rod 5. A plurality of placement grooves 16 are provided on the placement plate 7.

One aspect of the application of this embodiment is: when using the semiconductor chip storage device, the placement plate 7 is driven to slide on the mobile rack 6 by the moving component, so that the placement plate 7 is moved out of the mobile rack 6 to facilitate placing the semiconductor chip in the placement groove 16 of the placement plate 7, and then the placement plate 7 is slid into the mobile rack 6 for storage, and the mobile rack 6 is driven to slide on the fixed rod 3 by the adjustment component, so that the placement plates 7 on multiple mobile racks 6 inside the box body 1 are stacked together, which is convenient for storing more semiconductor chips and also convenient for taking them out.

A sliding groove 8 is provided on one side of the mobile frame 6 of the present embodiment, and the placement plate 7 is slidably fitted in the sliding groove 8. At least one first slot hole 9 is provided on one side of the mobile frame 6, and the first slot hole 9 is slidably fitted on the fixed rod 3. The moving component includes an operating shaft 10 rotatably fitted on one side of the mobile frame 6, a rack 12 installed on one side of the placement plate 7, and the operating shaft 10 passes through one end of the upper side plate of the mobile frame 6 and is equipped with a gear 11, and the rack 12 is meshed with the gear 11, and blocks 17 are installed on opposite sides of the placement plate 7; when the semiconductor chip is placed in the placement groove 16 of the placement plate 7, the mobile frame 6 is moved by rotating the operating shaft 10, so as to reduce the situation where the staff pushes the placement plate 7 to cause shaking and cause the semiconductor chip in the placement groove 16 to collide, and a block 17 is provided on one side of the placement plate 7, which plays a role of limiting the placement plate 7 during the removal process in the mobile frame 6, so as to avoid the situation where the placement plate 7 is completely removed from the mobile frame 6 and falls off.

In this embodiment, a dustproof frame 18 is installed at the bottom of the placement plate 7, and a plurality of pressing blocks 19 are installed at the bottom of the placement plate 7. A moving block 13 is installed on one side of the moving frame 6. A second slot 14 and a third slot 15 are opened on the moving block 13, and the threaded rod 5 is slidably fitted in the second slot 14. By providing the dustproof frame 18 and the pressing block 19 at the bottom of the placement plate 7, when a plurality of placement plates 7 are stacked together, the dustproof frame 18 of the upper placement plate 7 plays a dustproof role for the placement slot 16 of the lower placement plate 7, thereby reducing the contamination of the semiconductor chip in the placement slot 16, and the pressing block 19 plays a role of squeezing and fixing the semiconductor chip in the placement slot 16. The pressing block 19 is made of rubber material, which will not damage the semiconductor chip while fixing it, and can avoid the static electricity generated from breaking through the semiconductor chip and causing damage.

A connecting groove 25 is provided on one side of the moving block 13 of the present embodiment, and the adjusting component includes a rotating shaft 23 rotatably fitted in the third slot hole 15, a threaded sleeve 21 rotatably fitted in the connecting groove 25, the threaded sleeve 21 is threadedly fitted on the threaded rod 5, and a moving groove 20 is provided on one side of the box body 1, the moving block 13 is slidably fitted in the moving groove 20, a first bevel gear 22 is installed on one side of the threaded sleeve 21, and a second bevel gear 24 is installed on one side of the rotating shaft 23, and the second bevel gear 24 is meshed with the first bevel gear 22; the threaded sleeve 21 is driven to rotate on the moving block 13 by rotating the rotating shaft 23, and the threaded sleeve 21 is threadedly fitted on the threaded rod 5 so that the rotating threaded sleeve 21 drives the moving frame 6 to move up and down in the box body 1, so that the placement plate 7 on the moving frame 6 is stacked in the box body 1, which is convenient for the staff to take the semiconductor chip in the placement groove 16 of the placement plate 7.

The present invention is not limited to the above-mentioned implementation modes. Anyone should be aware that any structural changes made under the inspiration of the present invention, and any technical solutions that are the same or similar to the present invention, fall within the protection scope of the present invention. The technology, shape, and structure that are not described in detail in the present invention are all known technologies.

Claims (6)

1. A semiconductor chip storage device with a fixing function, characterized in that it comprises: a box body (1), one side of the box body (1) is rotatably matched with a box door (2), at least one fixing rod (3) is installed inside the box body (1), fixing blocks (4) are installed on opposite sides of the box body (1), and a threaded rod (5) is installed between the fixing blocks (4) on both sides; A movable frame (6) is arranged on the threaded rod (5), a placement plate (7) is slidably matched on the movable frame (6), the movable frame (6) is slidably matched on the fixed rod (3), a movable assembly is arranged on one side of the movable frame (6), the movable assembly is matched with the placement plate (7), an adjustment assembly is arranged on the movable frame (6), the adjustment assembly is matched with the threaded rod (5), and a plurality of placement grooves (16) are opened on the placement plate (7). 2. A semiconductor chip storage device with a fixing function according to claim 1, characterized in that a sliding groove (8) is opened on one side of the movable frame (6), the placement plate (7) slides in the sliding groove (8), and at least one first slot hole (9) is opened on one side of the movable frame (6), and the first slot hole (9) slides on the fixing rod (3). 3. A semiconductor chip storage device with a fixing function according to claim 2, characterized in that the moving component includes an operating shaft (10) rotatably engaged on one side of the moving frame (6) and a rack (12) installed on one side of the placement plate (7), the operating shaft (10) passes through one end of the upper side plate of the moving frame (6) and is equipped with a gear (11), the rack (12) is meshed with the gear (11), and blocks (17) are installed on opposite sides of the placement plate (7). 4. A semiconductor chip storage device with a fixing function according to claim 1, characterized in that a dustproof frame (18) is installed at the bottom of the placement plate (7), a plurality of pressure blocks (19) are installed at the bottom of the placement plate (7), a moving block (13) is installed on one side of the moving frame (6), and a second slot hole (14) and a third slot hole (15) are opened on the moving block (13), and the threaded rod (5) is slidably fitted in the second slot hole (14). 5. A semiconductor chip storage device with a fixing function according to claim 4, characterized in that a connecting groove (25) is opened on one side of the moving block (13), and the adjusting component includes a rotating shaft (23) rotatably fitted in the third slot hole (15), and a threaded sleeve (21) rotatably fitted in the connecting groove (25), and the threaded sleeve (21) is threadedly fitted on the threaded rod (5). 6. A semiconductor chip storage device with a fixing function according to claim 5, characterized in that a movable groove (20) is opened on one side of the box body (1), the movable block (13) is slidably fitted in the movable groove (20), a first bevel gear (22) is installed on one side of the threaded sleeve (21), and a second bevel gear (24) is installed on one side of the rotating shaft (23), and the second bevel gear (24) is meshed with the first bevel gear (22).