CN221660062U - A plastic pallet blow molding mold - Google Patents

Abstract

The utility model provides a plastic pallet blow molding mold, which relates to the technical field of molding molds, including a buffer base, the upper surface of the buffer base is fixedly connected to a chassis, a top plate is arranged above the surface of the chassis, the upper surface of the top plate is fixedly connected to an injection tube, the bottom of the buffer base is fixedly connected to a buffer mechanism, the upper surface of the chassis is fixedly connected to a cooling mechanism, and the lower surface of the chassis is fixedly connected to a demoulding mechanism. The utility model utilizes the cooperation between a coolant tank and a semiconductor refrigeration component to keep the temperature of the coolant constant, and then uses a pumping pump to cooperate with a liquid infusion pipeline to pump the coolant into the interior of a diverter, and the diverter is diverted to flow into the interior of a circulating water pipe, and then uses a cooling nozzle to spray the coolant onto the outer surface of the molding mold to cool it and improve the cooling effect.

Description

A plastic pallet blow molding mold

Technical Field

The utility model relates to the technical field of molding molds, in particular to a blow molding mold for a plastic pallet.

Background Art

Blow molding, mainly refers to hollow blow molding, is a method of using gas pressure to inflate the hot melt parison closed in the mold to form a hollow product. It is the most commonly used plastic processing method and also a rapidly developing plastic molding method. The mold used for blow molding is only a female mold (concave mold). Compared with injection molding, the equipment cost is lower, the adaptability is stronger, the molding performance is good (such as low stress), and the products with complex undulating curves (shapes) can be molded.

However, in the prior art, the existing blow molding mold needs to heat the raw materials before blow molding, which results in the need to wait for the blow molded parts to cool before taking them out, which consumes a lot of time and is more difficult to demold at the later stage, thus affecting the molding efficiency and demolding effect of the product.

Utility Model Content

The purpose of the utility model is to solve the shortcomings existing in the prior art. When the blow molding mold is used, the raw materials need to be heated before blow molding, which results in the need to wait for the blow molded parts to cool before taking them out, and then it takes a lot of time, thereby affecting the molding efficiency and demoulding effect of the product. A plastic pallet blow molding mold is provided.

In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a plastic pallet blow molding mold, comprising a buffer base, the upper surface of the buffer base is fixedly connected to a chassis, a top plate is arranged above the surface of the chassis, the upper surface of the top plate is fixedly connected to an injection tube, the bottom of the buffer base is fixedly connected to a buffer mechanism, the upper surface of the chassis is fixedly connected to a cooling mechanism, and the lower surface of the chassis is fixedly connected to a demolding mechanism.

As a preferred embodiment, the buffer mechanism includes a buffer rod fixedly connected to the bottom of the buffer base, a buffer spring is fixedly connected to the surface of the buffer rod, and a lower mold is fixedly connected to the upper surface of the chassis.

As a preferred embodiment, an upper mold is arranged above the lower mold, and heat dissipation fins are fixedly connected to both sides of the lower mold, the upper mold is fixedly connected to the lower surface of the top plate, and a hydraulic rod is fixedly connected to the lower surface of the top plate, and the bottom end of the hydraulic rod is fixedly connected to the upper surface of the chassis.

As a preferred embodiment, the cooling mechanism includes a cooling liquid tank fixedly connected to the upper surface of the chassis, a semiconductor refrigeration component is fixedly connected to the interior of the cooling liquid tank, and a liquid extraction pump is fixedly connected to the top of the cooling liquid tank.

As a preferred embodiment, the output end of the liquid pump is fixedly connected to an infusion pipeline, one end of the infusion pipeline is fixedly connected to a diverter, both output ends of the diverter are fixedly connected to a circulating water pipe, the circulating water pipe is fixedly connected to the inside of the lower mold, and the inner surface of the circulating water pipe is fixedly connected to a cooling nozzle.

As a preferred embodiment, the demoulding mechanism includes a demoulding base fixedly connected to the upper surface of the buffer base, a hydraulic cylinder is fixedly connected to the interior of the demoulding base, and an auxiliary top piece is fixedly connected to the upper surface of the demoulding base.

As a preferred embodiment, the auxiliary push piece is movably connected to an auxiliary push rod inside, and the bottom end of the auxiliary push rod is fixedly connected to a telescopic spring, the hydraulic end of the hydraulic cylinder is fixedly connected to a lifting plate, one end of the auxiliary push rod is fixedly connected to the bottom of the lifting plate, the bottom of the lifting plate is movably connected to the top of the auxiliary push piece, and the upper surface of the lifting plate is fixedly connected to a demolding push piece, and one end of the demolding push piece extends to the interior of the lower mold.

Compared with the prior art, the advantages and positive effects of the utility model are:

1. The utility model sets a cooling mechanism, utilizes the cooperation between the coolant tank and the semiconductor refrigeration element, so as to keep the temperature of the coolant unchanged, and then uses a liquid pump to cooperate with the infusion pipeline to draw the coolant into the inside of the diverter, and the diverter is used to divert the coolant into the inside of the circulating water pipe, and then uses a cooling nozzle to spray the coolant onto the outer surface of the molding die to cool it and improve the cooling effect.

2. The utility model sets up a demoulding mechanism and utilizes a hydraulic cylinder installed inside the demoulding base to push the lifting plate to an upward state. When the lifting plate is in an upward trend, the auxiliary ejector rod located inside the auxiliary ejector piece rises with it, thereby making the telescopic spring in a stretched state. Then, the demoulding ejector piece is used to push the molded product to create looseness between the product and the mold, thereby improving the demoulding effect.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of a blow molding mold for a plastic pallet provided by the utility model.

FIG. 2 is a schematic diagram of the structural decomposition of a blow molding mold for a plastic pallet provided by the present invention.

FIG. 3 is a three-dimensional schematic diagram of a cooling structure of a plastic pallet blow molding mold provided by the utility model.

FIG. 4 is a three-dimensional schematic diagram of a demoulding structure of a blow molding mold for a plastic pallet provided by the utility model.

Legend:

1. Buffer base; 101. Buffer rod; 102. Buffer spring; 2. Chassis; 201. Lower mold; 202. Heat dissipation fins; 3. Top plate; 301. Injection tube; 302. Upper mold; 303. Hydraulic rod; 4. Cooling mechanism; 401. Coolant tank; 402. Semiconductor refrigeration component; 403. Liquid pump; 404. Liquid infusion pipeline; 405. Diverter; 406. Circulating water pipe; 407. Cooling nozzle; 5. Demolding mechanism; 501. Demolding base; 502. Hydraulic cylinder; 503. Auxiliary ejector; 504. Auxiliary ejector rod; 505. Telescopic spring; 506. Lifting plate; 507. Demolding ejector.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

As shown in Figures 1-4, the utility model provides a technical solution: a plastic pallet blow molding mold, including a buffer base 1, the upper surface of the buffer base 1 is fixedly connected to a chassis 2, a top plate 3 is arranged above the surface of the chassis 2, an injection tube 301 is fixedly connected to the upper surface of the top plate 3, a buffer mechanism is fixedly connected to the bottom of the buffer base 1, a cooling mechanism 4 is fixedly connected to the upper surface of the chassis 2, and a demoulding mechanism 5 is fixedly connected to the lower surface of the chassis 2, the buffer mechanism includes a buffer rod 101 fixedly connected to the bottom of the buffer base 1, and a buffer spring 102 is fixedly connected to the surface of the buffer rod 101. The upper surface of the chassis 2 is fixedly connected to a lower mold 201, an upper mold 302 is arranged above the lower mold 201, and heat dissipation fins 202 are fixedly connected to both sides of the lower mold 201, the upper mold 302 is fixedly connected to the lower surface of the top plate 3, and a hydraulic rod 303 is fixedly connected to the lower surface of the top plate 3, and the bottom end of the hydraulic rod 303 is fixedly connected to the upper surface of the chassis 2, and the buffering effect is improved by utilizing the cooperation between the buffer rod 101 and the buffer spring 102, and then the molding work is completed by utilizing the lower mold 201 and the upper mold 302, and then the heat dissipation fins 202 are utilized for heat dissipation.

As shown in Fig. 1-4, the cooling mechanism 4 includes a cooling liquid tank 401 fixedly connected to the upper surface of the chassis 2, a semiconductor refrigeration component 402 is fixedly connected to the interior of the cooling liquid tank 401, and a liquid pump 403 is fixedly connected to the top of the cooling liquid tank 401, and the output end of the liquid pump 403 is fixedly connected to a liquid infusion pipeline 404, one end of the liquid infusion pipeline 404 is fixedly connected to a diverter 405, and both ends of the output of the diverter 405 are fixedly connected to a circulating water pipe 406, the circulating water pipe 406 is fixedly connected to the interior of the lower mold 201, and the inner surface of the circulating water pipe 406 is fixedly connected to a cooling nozzle 407, and the demoulding The mechanism 5 includes a demoulding base 501 fixedly connected to the upper surface of the buffer base 1, a hydraulic cylinder 502 is fixedly connected inside the demoulding base 501, and an auxiliary top piece 503 is fixedly connected to the upper surface of the demoulding base 501. The demoulding mechanism 5 includes a demoulding base 501 fixedly connected to the upper surface of the buffer base 1, a hydraulic cylinder 502 is fixedly connected inside the demoulding base 501, and an auxiliary top piece 503 is fixedly connected to the upper surface of the demoulding base 501, an auxiliary top piece 504 is movably connected inside the auxiliary top piece 503, and a telescopic spring 505 is fixedly connected to the bottom end of the auxiliary top piece 504, and the hydraulic cylinder 50 2 is fixedly connected with a lifting plate 506, one end of the auxiliary push rod 504 is fixedly connected with the bottom of the lifting plate 506, the bottom of the lifting plate 506 is movably connected with the top of the auxiliary push piece 503, and the upper surface of the lifting plate 506 is fixedly connected with a demoulding push piece 507, one end of the demoulding push piece 507 extends to the inside of the lower mold 201, by utilizing the cooperation between the coolant tank 401 and the semiconductor refrigeration element 402, so as to keep the temperature of the coolant unchanged, and then by utilizing the pumping pump 403 to cooperate with the infusion pipeline 404, the coolant is pumped into the inside of the diverter 405, and the diverter 40 5 is divided and flows into the inside of the circulating water pipe 406, and then the cooling liquid is sprayed onto the outer surface of the molding mold by the cooling nozzle 407 to cool it down, and then the hydraulic cylinder 502 installed in the demoulding base 501 is used to push the lifting plate 506 to rise. When the lifting plate 506 is in an upward trend, the auxiliary ejector rod 504 located in the auxiliary ejector 503 rises with it, so that the telescopic spring 505 is in a stretched state, and then the demoulding ejector 507 is used to push the molded product to loosen it from the mold and complete the demoulding work.

Working principle: First, by utilizing the cooperation between the coolant tank 401 and the semiconductor refrigeration component 402, the temperature of the coolant is kept constant, and then the coolant is pumped into the diverter 405 by utilizing the liquid pump 403 to cooperate with the infusion pipe 404, and the diverter 405 is used to divert the coolant into the circulating water pipe 406, and then the cooling nozzle 407 is used to spray the coolant onto the outer surface of the molding mold to cool it, and then the hydraulic cylinder 502 installed inside the demolding base 501 is used to push the lifting plate 506 to an upward state. When the lifting plate 506 is in an upward trend, the auxiliary ejector rod 504 located inside the auxiliary ejector 503 rises with it, thereby making the telescopic spring 505 in a stretched state, and then the demolding ejector 507 is used to push the molded product to loosen it from the mold to complete the demolding work.

The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any technician familiar with the profession may use the technical contents disclosed above to change or modify them into equivalent embodiments with equivalent changes and apply them to other fields. However, any simple modification, equivalent change and modification made to the above embodiments based on the technical essence of the present invention without departing from the technical solution of the present invention still falls within the protection scope of the technical solution of the present invention.

Claims (7)

1. A plastic pallet blow molding mold, comprising a buffer base (1), characterized in that: the upper surface of the buffer base (1) is fixedly connected to a chassis (2), a top plate (3) is arranged above the surface of the chassis (2), an injection tube (301) is fixedly connected to the upper surface of the top plate (3), a buffer mechanism is fixedly connected to the bottom of the buffer base (1), a cooling mechanism (4) is fixedly connected to the upper surface of the chassis (2), and a demoulding mechanism (5) is fixedly connected to the lower surface of the chassis (2). 2. A plastic pallet blow molding mold according to claim 1, characterized in that: the buffer mechanism includes a buffer rod (101) fixedly connected to the bottom of the buffer base (1), the surface of the buffer rod (101) is fixedly connected to a buffer spring (102), and the upper surface of the chassis (2) is fixedly connected to a lower mold (201). 3. A plastic pallet blow molding mold according to claim 2, characterized in that: an upper mold (302) is arranged above the lower mold (201), and heat dissipation fins (202) are fixedly connected to both sides of the lower mold (201), the upper mold (302) is fixedly connected to the lower surface of the top plate (3), and the lower surface of the top plate (3) is fixedly connected to a hydraulic rod (303), and the bottom end of the hydraulic rod (303) is fixedly connected to the upper surface of the chassis (2). 4. A plastic pallet blow molding mold according to claim 1, characterized in that: the cooling mechanism (4) includes a coolant tank (401) fixedly connected to the upper surface of the chassis (2), a semiconductor refrigeration component (402) is fixedly connected to the interior of the coolant tank (401), and a liquid extraction pump (403) is fixedly connected to the top of the coolant tank (401). 5. A plastic pallet blow molding mold according to claim 4, characterized in that: the output end of the liquid pump (403) is fixedly connected to an infusion pipeline (404), one end of the infusion pipeline (404) is fixedly connected to a diverter (405), both output ends of the diverter (405) are fixedly connected to a circulating water pipe (406), the circulating water pipe (406) is fixedly connected to the inside of the lower mold (201), and the inner surface of the circulating water pipe (406) is fixedly connected to a cooling nozzle (407). 6. A plastic pallet blow molding mold according to claim 1, characterized in that: the demoulding mechanism (5) includes a demoulding base (501) fixedly connected to the upper surface of the buffer base (1), a hydraulic cylinder (502) is fixedly connected to the interior of the demoulding base (501), and an auxiliary top piece (503) is fixedly connected to the upper surface of the demoulding base (501). 7. A plastic pallet blow molding mold according to claim 6, characterized in that: the auxiliary ejector (503) is movably connected inside with an auxiliary ejector rod (504), and the bottom end of the auxiliary ejector rod (504) is fixedly connected with a telescopic spring (505), the hydraulic end of the hydraulic cylinder (502) is fixedly connected with a lifting plate (506), one end of the auxiliary ejector rod (504) is fixedly connected to the bottom of the lifting plate (506), the bottom of the lifting plate (506) is movably connected to the top of the auxiliary ejector (503), and the upper surface of the lifting plate (506) is fixedly connected with a demoulding ejector (507), and one end of the demoulding ejector (507) extends to the inside of the lower mold (201).