CN221632513U - Full-automatic wafer trimmer - Google Patents
Full-automatic wafer trimmer Download PDFInfo
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- CN221632513U CN221632513U CN202322241783.XU CN202322241783U CN221632513U CN 221632513 U CN221632513 U CN 221632513U CN 202322241783 U CN202322241783 U CN 202322241783U CN 221632513 U CN221632513 U CN 221632513U
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- 230000007246 mechanism Effects 0.000 claims abstract description 156
- 238000004140 cleaning Methods 0.000 claims abstract description 84
- 238000001514 detection method Methods 0.000 claims abstract description 20
- 235000012431 wafers Nutrition 0.000 claims description 216
- 238000011010 flushing procedure Methods 0.000 claims description 3
- 238000009966 trimming Methods 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 7
- 230000007306 turnover Effects 0.000 abstract description 4
- 238000007599 discharging Methods 0.000 abstract description 2
- 230000009286 beneficial effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 3
- 238000005406 washing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- FGRBYDKOBBBPOI-UHFFFAOYSA-N 10,10-dioxo-2-[4-(N-phenylanilino)phenyl]thioxanthen-9-one Chemical compound O=C1c2ccccc2S(=O)(=O)c2ccc(cc12)-c1ccc(cc1)N(c1ccccc1)c1ccccc1 FGRBYDKOBBBPOI-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000036544 posture Effects 0.000 description 1
- 230000007723 transport mechanism Effects 0.000 description 1
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Abstract
The utility model discloses a full-automatic wafer trimming machine which comprises an equipment shell and an equipment machine table arranged in the equipment shell, wherein a feeding mechanism is arranged on one side of the equipment machine table, and a wafer conveying mechanism, a pre-positioning platform mechanism, a wafer positioning conveying mechanism, a wafer cutting mechanism, a wafer rotary conveying mechanism, a wafer cleaning conveying mechanism, a wafer back cleaning mechanism, a wafer front cleaning mechanism and a wafer size detection mechanism are sequentially arranged on the end face of the equipment machine table. The utility model has the beneficial effects that: the automatic die cutting device solves the problem of die cutting, improves the degree of automation, automatically cuts, automatically cleans and automatically detects, saves the manual turnover time and the risk of the turnover on products, realizes the full-automatic feeding and discharging of the wafer, completes the cleaning process of the wafer trimming process, and improves the size detection, the efficiency and the stability and the precision.
Description
Technical Field
The utility model relates to the technical field of wafer trimming equipment, in particular to a full-automatic wafer trimmer.
Background
The existing equipment does not support the bare wafer trimming process, single-machine operation is more, cut products need to be transferred to the next single-machine equipment for cleaning, detection is lower in automation degree, the number of people needing manual operation is more, and after cutting is completed, people need to manually transfer to the next process equipment, so that the efficiency is low and wafer breakage is easy to cause;
The utility model discloses a "cleaning tube structure and wafer trimmer platform" as disclosed in publication No. CN207282463U, cleaning jet pipe sets up around the trimming area of cutter, and set up a plurality of nozzles towards the trimming area on cleaning jet pipe, make the center of washing liquid back wafer jet to the trimming area, can more efficient washing wafer's edge, avoid the wafer bits that the trimming produced to be washed the wafer surface by the washing liquid after simultaneously and adhere to the wafer surface, reduce the probability that the wafer causes the defect because of the trimming edge, in this technical scheme, can only realize the clean effect after the trimmer of wafer is trimmed, and can not realize the clean of the front and back of wafer and the size detection after the wafer deburring is accomplished.
Disclosure of utility model
The present utility model is directed to a full-automatic wafer edge trimmer, which solves the above-mentioned problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a full-automatic wafer trimmer is characterized in that: the device comprises a device shell and a device machine table arranged in the device shell, wherein a feeding mechanism is arranged on one side of the device machine table, and a wafer conveying mechanism, a pre-positioning platform mechanism, a wafer positioning conveying mechanism, a wafer cutting mechanism, a wafer rotary conveying mechanism, a wafer cleaning conveying mechanism, a wafer back cleaning mechanism, a wafer front cleaning mechanism and a wafer size detection mechanism are sequentially arranged on the end face of the device machine table;
the feeding mechanism comprises a loading table, and the upper end and the lower end of the loading table are respectively provided with a storage bin and a first lifting servo module;
The wafer positioning device comprises a wafer conveying mechanism, a wafer positioning mechanism and a positioning platform mechanism, wherein the wafer conveying mechanism is arranged at the other end of the wafer conveying mechanism, which is far away from the feeding mechanism, and comprises a support frame fixedly arranged at the end face of the equipment platform;
The wafer positioning and conveying mechanism is arranged on one side of the support frame and comprises a first transverse movement servo module fixedly arranged on one side of the support frame, a first longitudinal movement servo module connected with the first transverse movement servo module is arranged on the first transverse movement servo module, and a third wafer clamping mechanism fixedly connected with the first longitudinal movement servo module is arranged on the longitudinal movement servo module;
The wafer cutting mechanism is arranged at the lower part of the supporting frame and comprises a linear conveying mechanism, a conveying frame fixedly connected with the linear conveying mechanism is arranged on the linear conveying mechanism, and a cutting loading table is arranged on the conveying frame;
The wafer rotary conveying mechanism is arranged at the lower end of the pre-positioning platform mechanism and comprises a fixed frame and a rotating shaft arranged in the fixed frame, and a first wafer clamping mechanism is arranged at one side of the top of the rotating shaft;
the wafer cleaning and conveying mechanism is arranged on one side of the wafer rotating and conveying mechanism and comprises a second transverse movement servo module arranged at the lower part of the equipment platform, a second longitudinal movement servo module connected with the second transverse movement servo module is arranged on the second transverse movement servo module, a supporting rod connected with the second longitudinal movement servo module is arranged on the second longitudinal movement servo module, and a second wafer clamping mechanism is arranged on one side of the supporting rod;
The wafer back cleaning mechanism is arranged on one side of the wafer cleaning conveying mechanism and comprises a jacking mechanism and a clamping mechanism which are arranged at the lower part of the equipment platform;
the wafer front cleaning mechanism is arranged on the other side, far away from the wafer cleaning conveying mechanism, of the wafer back cleaning mechanism and comprises a cleaning box, a fixed table is arranged at the lower end of the cleaning box, a wafer front cleaning loading table is arranged in the cleaning box, a plurality of guide rods are arranged on one side of the wafer front cleaning loading table, and a second lifting servo module connected with the wafer front cleaning loading table is arranged at the lower part of the wafer front cleaning loading table;
The wafer size detection mechanism is arranged on the other side of the equipment shell and comprises a wafer placing table and a wafer size detection device on one side of the placing table.
Further preferably, a limiting seat for limiting the wafers is arranged at the lower end of the storage bin, and a plurality of wafers are stacked in the storage bin.
Further preferably, a plurality of wafer limiting points and limiting grooves are arranged around the wafer positioning ring.
Further preferably, the first wafer clamping mechanism, the second wafer clamping mechanism and the third wafer clamping mechanism have the same structure and comprise a plurality of air source blocks, a plurality of air source interfaces are arranged in the air source blocks, a plurality of suction nozzles are arranged at the lower parts of the air source interfaces, and anti-falling hooks are arranged on the outer sides of the air source blocks.
Further preferably, the other end of the rotating shaft, which is far away from the first wafer clamping mechanism, is fixedly connected with a rotating motor arranged in the fixed frame.
Further preferably, a limiting frame is arranged at the upper end of the clean wafer conveying mechanism, and a sliding groove for limiting the supporting rod is formed in one side of the limiting frame.
Further preferably, the jacking mechanism comprises a jacking frame, a first jacking air cylinder is arranged in the jacking frame, a cleaning roller fixedly connected with the first jacking air cylinder is arranged at the top of the first jacking air cylinder, a driving motor connected with the cleaning roller is arranged at one end of the cleaning roller, the clamping mechanism comprises rotating motors symmetrically arranged around the jacking frame, wafer clamping blocks are arranged at the tops of the four rotating motors, and a second jacking air cylinder is respectively arranged between every two rotating motors.
Further preferably, a rotating rod is arranged at one side of the wafer front cleaning loading table, and a flushing head corresponding to the wafer front cleaning loading table is arranged at one end of the rotating rod;
Further preferably, the lower end of the wafer placing table is provided with a rotating motor in driving connection with the wafer placing table, and the wafer size detection device is arranged on the mounting frame on one side of the wafer placing table.
Advantageous effects
The full-automatic wafer trimming machine solves the problem of bare wafer cutting, improves the degree of automation, automatically cuts, automatically cleans and automatically detects, saves the manual turnover time and the risk of turnover on products, realizes full-automatic loading and unloading of wafers, completes the cleaning process of the wafer trimming process, and improves the size detection, the efficiency and the stability and the precision.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic illustration of the overall structure of the present utility model with the housing removed;
FIG. 3 is a schematic view of another angle structure of the whole structure of the present utility model;
FIG. 4 is a schematic diagram of a feeding mechanism according to the present utility model;
FIG. 5 is a schematic view of a wafer dicing mechanism according to the present utility model;
FIG. 6 is a schematic view of a wafer rotation mechanism according to the present utility model;
FIG. 7 is a schematic view of a wafer cleaning and transporting mechanism according to the present utility model;
FIG. 8 is a schematic view of a front side cleaning mechanism of the wafer of the present utility model;
FIG. 9 is a schematic view of a wafer backside cleaning mechanism according to the present utility model;
fig. 10 is a schematic view of a lifting mechanism of a wafer back surface cleaning mechanism according to the present utility model.
Detailed Description
The following are specific embodiments of the present utility model and the technical solutions of the present utility model will be further described with reference to the accompanying drawings, but the present utility model is not limited to these embodiments.
Examples
As shown in fig. 1-10, a full-automatic wafer edge trimmer comprises an equipment shell 1 and an equipment machine table 3 arranged in the equipment shell, wherein a feeding mechanism 2 is arranged on one side of the equipment machine table 3, and a wafer conveying mechanism 4, a pre-positioning platform mechanism 5, a wafer positioning conveying mechanism 6, a wafer cutting mechanism 7, a wafer rotary conveying mechanism 12, a wafer cleaning conveying mechanism 9, a wafer back cleaning mechanism 8, a wafer front cleaning mechanism 10 and a wafer size detection mechanism 11 are sequentially arranged on the end surface of the equipment machine table 3;
the feeding mechanism 2 comprises a loading table 13, and the upper end and the lower end of the loading table are respectively provided with a stock bin and a first lifting servo module 14;
the pre-positioning platform mechanism 5 is arranged at the other end of the wafer conveying mechanism 4 far away from the feeding mechanism 2 and comprises a support frame fixedly arranged on the end face of the equipment machine table 3, one side of the support frame is provided with a platform fixing table top, and the end face of the platform fixing table top is provided with a wafer positioning ring;
The wafer positioning and conveying mechanism 6 is arranged on one side of the support frame and comprises a first transverse movement servo module fixedly arranged on one side of the support frame, a first longitudinal movement servo module connected with the first transverse movement servo module is arranged on the first transverse movement servo module, and a third wafer clamping mechanism fixedly connected with the first longitudinal movement servo module is arranged on the longitudinal movement servo module;
The wafer cutting mechanism 7 is arranged at the lower part of the supporting frame and comprises a linear conveying mechanism 17, a conveying frame 18 fixedly connected with the linear conveying mechanism 17 is arranged on the linear conveying mechanism 17, and a cutting loading table 19 is arranged on the conveying frame 18;
The wafer rotary conveying mechanism 12 is arranged at the lower end of the preset positioning platform mechanism 5 and comprises a fixed frame 20 and a rotating shaft 21 arranged in the fixed frame, and a first wafer clamping mechanism 22 is arranged at one side of the top of the rotating shaft 21;
The wafer cleaning and conveying mechanism 9 is arranged on one side of the wafer rotating and conveying mechanism 12 and comprises a second transverse movement servo module 23 arranged at the lower part of the equipment machine 3, a second longitudinal movement servo module 24 connected with the second transverse movement servo module is arranged on the second transverse movement servo module, a supporting rod 26 connected with the second longitudinal movement servo module 24 is arranged on the second longitudinal movement servo module, and a second wafer clamping mechanism 27 is arranged on one side of the supporting rod 26;
The wafer back cleaning mechanism 8 is arranged on one side of the wafer cleaning conveying mechanism 9 and comprises a jacking mechanism and a clamping mechanism which are arranged at the lower part of the equipment machine table 3;
The wafer front cleaning mechanism 10 is arranged on the other side of the wafer back cleaning mechanism 8, far away from the wafer cleaning conveying mechanism 9, and comprises a cleaning box, wherein the lower end of the cleaning box is provided with a fixed table 29, a wafer front cleaning loading table 32 is arranged in the cleaning box, one side of the wafer front cleaning loading table 32 is provided with a plurality of guide rods 31, and the lower part of the wafer front cleaning loading table 32 is provided with a second lifting servo module 30 connected with the second lifting servo module;
The wafer size detection mechanism 11 is disposed on the other side of the equipment housing 1, and includes a wafer placement table and a wafer size detection device disposed on one side of the placement table.
In this embodiment, the feed bin lower extreme is equipped with the spacing seat 15 that is used for spacing wafer, has piled up many wafers 16 in the feed bin, through the setting of spacing seat 15, makes the wafer put in its upper end in order, when wafer transport mechanism takes out the wafer, more accurate.
The wafer positioning ring is provided with a plurality of wafer limiting points and limiting grooves, the wafer can be limited or positioned into the wafer positioning ring through the arrangement of the limiting points and the grooves, and the wafer can be clamped into a corresponding mechanism or a corresponding process more quickly and conveniently through the wafer clamping mechanism.
The first wafer clamping mechanism 22, the second wafer clamping mechanism 27 and the third wafer clamping mechanism have the same structure and all comprise a plurality of air source blocks, a plurality of air source interfaces are arranged in the air source blocks, a plurality of suction nozzles are arranged at the lower parts of the air source blocks, anti-falling hooks are arranged at the outer sides of the air source blocks, and the wafer is adsorbed into the clamping mechanism through the air source blocks and the suction nozzles to ensure that the wafer does not fall.
The other end of the rotating shaft 21, which is far away from the first wafer clamping mechanism 22, is fixedly connected with a rotating motor arranged in the fixed frame 20.
The upper end of the clean conveying mechanism 9 of wafer is equipped with the spacing, and the sliding tray 25 that is used for spacing bracing piece 26 has been seted up to spacing 9 one side, and the sliding tray 25 guarantees that bracing piece 26 is located its inside slip, carries out the transport of wafer.
The lifting mechanism comprises a lifting frame 35, a first lifting air cylinder 36 is arranged in the lifting frame 35, a cleaning roller 37 fixedly connected with the first lifting air cylinder 36 is arranged at the top of the first lifting air cylinder 36, a driving motor 40 connected with the cleaning roller 37 is arranged at one end of the cleaning roller 37, the clamping mechanism comprises rotating motors 38 symmetrically arranged around the lifting frame 35, wafer clamping blocks 39 are arranged at the tops of the four rotating motors 38, a second lifting air cylinder 41 is respectively arranged between every two rotating motors 38, a rotating rod 33 is arranged at one side of the wafer front cleaning loading table 32, and a flushing head 34 corresponding to the wafer front cleaning loading table 32 is arranged at one end of the rotating rod 33;
The lower end of the wafer placing table is provided with a rotating motor in driving connection with the wafer placing table, and the wafer size detection device is arranged on the mounting frame at one side of the wafer placing table.
The operator puts the magazine on the loading platform (the loading platform can be switched according to the sample of magazine), and the three-point reference column on the platform is used for accurately positioning, and when the sensors on the platform sense the magazine, the accurate placement of the magazine is indicated. The phenomenon that the anti-slip sensor in front of the material box does not detect that the product slips out indicates that the feeding and discharging actions can be performed.
And scanning sensors on the robot arm sweep the postures and the existence of each layer of wafer in the material taking box from bottom to top in sequence, and the feeding action is performed after confirming that no abnormality is finished. The robot arm clamps the wafer and places the wafer on the positioning platform.
The pre-positioning platform is used for detecting whether the wafer exists or not.
The clamping jaw on the wafer positioning and conveying mechanism takes out the wafer positioned in advance and moves the wafer to the station of the cutting disc.
And a cutting mechanism: firstly, products on a cutting disc are visually detected, then the cutting disc rotates, and an air main shaft drives a cutter Z shaft to descend so as to cut the edge of a wafer.
And the wafer rotating and conveying mechanism clamps and places the cut product into the back cleaning cavity.
The back surface cleaning mechanism of the wafer is provided with a wafer supporting carrier, a back surface sponge roller cleaning lifting device is arranged on the back surface of the wafer, the back surface sponge roller is lifted to contact the back surface of the wafer after the wafer is in place, the wafer rotates, and the roller rotates to complete the back surface cleaning of the wafer.
And the wafer cleaning type conveying mechanism clamps and places the wafer with the back surface cleaned into the front surface cleaning cavity.
The wafer front cleaning mechanism is provided with a wafer supporting platform, and the platform rotates and is matched with two fluid nozzles to clean the front of the wafer after the two fluid nozzles are used.
The wafer size detection structure clamps and conveys the wafer with the front surface cleaned to a size detection station, records and stores wafer detection data, and clamps and places the detected wafer into a wafer material box.
Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the summary of the present utility model within the scope of the present utility model.
Claims (9)
1. A full-automatic wafer trimmer is characterized in that: the device comprises a device shell (1) and a device table (3) arranged in the device shell, wherein a feeding mechanism (2) is arranged on one side of the device table (3), and a wafer conveying mechanism (4), a preset platform mechanism (5), a wafer positioning conveying mechanism (6), a wafer cutting mechanism (7), a wafer rotary conveying mechanism (12), a wafer cleaning conveying mechanism (9), a wafer back cleaning mechanism (8), a wafer front cleaning mechanism (10) and a wafer size detection mechanism (11) are sequentially arranged on the end surface of the device table (3);
The feeding mechanism (2) comprises a loading table (13), and the upper end and the lower end of the loading table are respectively provided with a storage bin and a first lifting servo module (14);
The wafer positioning device comprises a wafer conveying mechanism (4), a wafer loading mechanism (2) and a preset platform mechanism (5), wherein the preset platform mechanism (5) is arranged at the other end of the wafer conveying mechanism (4) far away from the loading mechanism (2) and comprises a support frame fixedly arranged at the end face of the equipment machine table (3), one side of the support frame is provided with a platform fixing table top, and the end face of the platform fixing table top is provided with a wafer positioning ring;
The wafer positioning and conveying mechanism (6) is arranged on one side of the support frame and comprises a first transverse movement servo module fixedly arranged on one side of the support frame, a first longitudinal movement servo module connected with the first transverse movement servo module is arranged on the first transverse movement servo module, and a third wafer clamping mechanism fixedly connected with the first longitudinal movement servo module is arranged on the longitudinal movement servo module;
The wafer cutting mechanism (7) is arranged at the lower part of the supporting frame and comprises a linear conveying mechanism (17), a conveying frame (18) fixedly connected with the linear conveying mechanism (17) is arranged on the linear conveying mechanism (17), and a cutting loading table (19) is arranged on the conveying frame (18);
The wafer rotary conveying mechanism (12) is arranged at the lower end of the pre-positioning platform mechanism (5) and comprises a fixed frame (20) and a rotating shaft (21) arranged in the fixed frame, and a first wafer clamping mechanism (22) is arranged at one side of the top of the rotating shaft (21);
The wafer cleaning and conveying mechanism (9) is arranged on one side of the wafer rotating and conveying mechanism (12) and comprises a second transverse movement servo module (23) arranged at the lower part of the equipment platform (3), a second longitudinal movement servo module (24) connected with the second transverse movement servo module is arranged on the second transverse movement servo module, a supporting rod (26) connected with the second longitudinal movement servo module (24) is arranged on the second longitudinal movement servo module, and a second wafer clamping mechanism (27) is arranged on one side of the supporting rod (26);
The wafer back cleaning mechanism (8) is arranged on one side of the wafer cleaning conveying mechanism (9) and comprises a jacking mechanism and a clamping mechanism which are arranged at the lower part of the equipment machine (3);
The wafer front cleaning mechanism (10) is arranged on the other side, far away from the wafer cleaning conveying mechanism (9), of the wafer back cleaning mechanism (8), and comprises a cleaning box, a fixed table (29) is arranged at the lower end of the cleaning box, a wafer front cleaning loading table (32) is arranged in the cleaning box, a plurality of guide rods (31) are arranged on one side of the wafer front cleaning loading table (32), and a second lifting servo module (30) connected with the wafer front cleaning loading table (32) is arranged at the lower part of the wafer front cleaning loading table;
The wafer size detection mechanism (11) is arranged on the other side of the equipment shell (1) and comprises a wafer placing table and a wafer size detection device on one side of the placing table.
2. The fully automatic wafer edge trimmer of claim 1, wherein: the lower end of the storage bin is provided with a limiting seat (15) for limiting the wafers, and a plurality of wafers (16) are stacked in the storage bin.
3. The fully automatic wafer edge trimmer of claim 1, wherein: the wafer positioning ring is provided with a plurality of wafer limiting points and limiting grooves around.
4. The fully automatic wafer edge trimmer of claim 1, wherein: the first wafer clamping mechanism (22), the second wafer clamping mechanism (27) and the third wafer clamping mechanism are identical in structure and comprise a plurality of air source blocks, a plurality of air source interfaces are arranged in the air source blocks, a plurality of suction nozzles are arranged at the lower parts of the air source interfaces, and anti-falling hooks are arranged on the outer sides of the air source blocks.
5. The fully automatic wafer edge trimmer of claim 1, wherein: the other end of the rotating shaft (21) far away from the first wafer clamping mechanism (22) is fixedly connected with a rotating motor arranged in the fixed frame (20).
6. The fully automatic wafer edge trimmer of claim 1, wherein: the upper end of the wafer cleaning and conveying mechanism (9) is provided with a limiting frame, and one side of the limiting frame is provided with a sliding groove (25) for limiting the supporting rod (26).
7. The fully automatic wafer edge trimmer of claim 1, wherein: the lifting mechanism comprises a lifting frame (35), a first lifting air cylinder (36) is arranged in the lifting frame (35), a cleaning roller (37) fixedly connected with the first lifting air cylinder (36) is arranged at the top of the cleaning roller, a driving motor (40) connected with the cleaning roller is arranged at one end of the cleaning roller (37), the clamping mechanism comprises rotating motors (38) symmetrically arranged around the lifting frame (35), wafer clamping blocks (39) are arranged at the tops of the four rotating motors (38), and second lifting air cylinders (41) are respectively arranged between every two rotating motors (38).
8. The fully automatic wafer edge trimmer of claim 1, wherein: a rotating rod (33) is arranged on one side of the wafer front surface cleaning loading table (32), and a flushing head (34) corresponding to the wafer front surface cleaning loading table (32) is arranged at one end of the rotating rod (33).
9. The fully automatic wafer edge trimmer of claim 1, wherein: the lower end of the wafer placing table is provided with a rotating motor in driving connection with the wafer placing table, and the wafer size detection device is arranged on the mounting frame on one side of the wafer placing table.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322241783.XU CN221632513U (en) | 2023-08-21 | 2023-08-21 | Full-automatic wafer trimmer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322241783.XU CN221632513U (en) | 2023-08-21 | 2023-08-21 | Full-automatic wafer trimmer |
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| Publication Number | Publication Date |
|---|---|
| CN221632513U true CN221632513U (en) | 2024-08-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322241783.XU Active CN221632513U (en) | 2023-08-21 | 2023-08-21 | Full-automatic wafer trimmer |
Country Status (1)
| Country | Link |
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| CN (1) | CN221632513U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118866792A (en) * | 2024-09-25 | 2024-10-29 | 天津环博科技有限责任公司 | A docking and transfer device for silicon wafer edge removal |
-
2023
- 2023-08-21 CN CN202322241783.XU patent/CN221632513U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118866792A (en) * | 2024-09-25 | 2024-10-29 | 天津环博科技有限责任公司 | A docking and transfer device for silicon wafer edge removal |
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