CN221631939U - A CPU cooling component - Google Patents

Abstract

The utility model discloses a CPU heat dissipation assembly, which belongs to the technical field of computer parts and comprises a host mainboard, a base fixedly arranged on the top surface of the host mainboard, a CPU chip arranged in the base, an extrusion plate arranged on the top surface of the base and used for extruding the CPU chip, a radiator arranged on the top surface of the extrusion plate and used for dissipating heat of the extrusion plate, and a limiting mechanism arranged in the base and used for extruding the extrusion plate, wherein the outer wall of the extrusion plate is tightly attached to the top surface of the CPU chip, the limiting mechanism comprises a connecting rod penetrating through the extrusion plate and the base, a nut screwed at one end of the connecting rod far away from the extrusion plate and a plug block plugged at one end of the connecting rod far away from the nut, and an arc-shaped opening is formed at one end of the connecting rod close to the plug block; the heat dissipation assembly is simple in structure and convenient to use, can improve the heat conduction efficiency between the extrusion plate and the cpu, and effectively dissipates heat generated by the cpu.

Description

A CPU cooling component

Technical Field

The utility model relates to the technical field of computer parts and components, in particular to a CPU heat dissipation component.

Background Art

The CPU cooling assembly is a hardware device used for heat dissipation, usually composed of a heat sink, a fan, and a heat conductor. The heat sink is usually a metal block with many fins on its surface to increase its surface area, thereby improving the heat dissipation effect. The fan obtains airflow through rotation, allowing the airflow to pass through the fins to further reduce the temperature of the heat sink surface. The heat conductor refers to a substance that transfers the CPU heat to the heat sink well, usually made of copper or aluminum. By placing a heat conductor between the CPU and the heat sink, the heat dissipation speed of the CPU can be accelerated to avoid overheating damage. The CPU chip will continue to generate heat during use. If it cannot be dissipated in time, it will cause the CPU temperature to be too high or even burn the CPU. In the fields of high-performance computers, gaming computers, and industrial control equipment, the CPU cooling assembly is particularly important because these devices need to run at high load for a long time, and the CPU generates more heat and higher temperatures. An efficient and reliable heat dissipation system is needed to protect the CPU chip.

Upon investigation, a Chinese utility model patent discloses a CPU cooling assembly for a microcomputer (publication number: CN203689403U), including a heat dissipating copper sheet, a heat transfer tube, a heat dissipating fin group, a fan and a copper sheet mounting bracket. The copper sheet mounting bracket includes a square plate, a "V"-shaped mounting foot and an "I"-shaped mounting foot. A copper sheet welding area, a copper sheet soldering line and a boundary line are arranged in the middle of the front side of the square plate, a heat transfer tube soldering line is arranged in the middle of the back side of the square plate, and different anti-misinstallation numbers are arranged near the three bracket mounting holes. The heat dissipating fin group is formed by the tail end of the first heat dissipating fin group and the tail end of the second heat dissipating fin group facing each other and buckling together, and a heat transfer tube arrangement space is arranged on one side of the heat dissipating fin group.

The above patent installs a heat sink copper sheet under the CPU, conducts the heat of the CPU through a heat transfer tube, and then dissipates the heat through a heat sink fin group. The fan exchanges heat between the external cold air and the heat sink fin group, thereby cooling the CPU. However, there are slight unevenness and roughness on the surfaces of the CPU chip and the heat sink copper sheet. These unevenness will cause tiny gaps on the contact surface. These air gaps will increase the resistance to heat transfer and affect the heat dissipation effect.

Therefore, the utility model provides a CPU heat dissipation component to solve the above problems.

Utility Model Content

1. Technical issues to be solved

The utility model provides a CPU heat dissipation component, aiming to solve the problem in the background technology that there is an air gap between the existing CPU chip and the heat dissipation copper sheet, which increases the resistance of heat transfer and affects the heat dissipation effect.

(II) Technical solution

To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a CPU heat dissipation component, including a host motherboard, a base fixedly installed on the top surface of the host motherboard, a CPU chip arranged inside the base, an extrusion plate arranged on the top surface of the base for extruding the CPU chip, a radiator arranged on the top surface of the extrusion plate for dissipating heat to the extrusion plate, and a limiting mechanism arranged inside the base for extruding the extrusion plate, wherein the outer wall of the extrusion plate is tightly fitted with the top surface of the CPU chip.

The limiting mechanism includes a connecting rod passing through the extrusion plate and the base, a nut screwed to the end of the connecting rod away from the extrusion plate, and a plug-in block plugged into the end of the connecting rod away from the nut. An arc-shaped opening is provided at the end of the connecting rod close to the plug-in block, so that the extrusion plate fits tightly with the CPU chip under the extrusion of the connecting rod.

As a preferred technical solution of the present application, the limiting mechanism also includes a ring slidably connected to the radial outer wall of the connecting rod and a connecting rope arranged on the outer wall of the ring for connecting the plug-in block. The connecting rope connects the plug-in block to prevent the plug-in block from being lost.

As a preferred technical solution of the present application, the radial outer wall of the connecting rod is slidably connected to a mounting plate, the connecting rod passes through the mounting plate, the top surface of the mounting plate fits with the bottom surface of the host motherboard, isolating the contact between the nut and the host motherboard, thereby reducing the probability of the host motherboard being struck by static electricity.

As a preferred technical solution of the present application, the plug-in block is configured to be an integrally connected cylindrical portion and a conical portion, the end of the conical portion with a larger diameter is connected to one end of the cylindrical portion, the diameter of the conical portion gradually decreases from one end close to the cylindrical portion toward the other end, and a plug-in groove for the plug-in block to be plugged in is provided inside the connecting rod, and the diameter of the cylindrical portion is not less than the inner diameter of the plug-in groove, in order to increase the angle of the arc-shaped opening opened by the plug-in block.

As a preferred technical solution of the present application, a snap-in block is fixedly connected to the outer wall of the radiator, and a snap-in groove for the snap-in block to snap into is provided on the side wall of the base, so as to make the radiator more convenient to install on the extruded plate.

As a preferred technical solution of the present application, a plurality of connecting rods are provided, and the plurality of connecting rods are evenly arranged on the outer wall of the extrusion plate, so that the extrusion plate can be further extruded by the connecting rods.

(III) Beneficial effects

The utility model expels the air between the extruded plate and the CPU chip by extruding the extruded plate, so that a denser contact is formed between the CPU chip and the extruded plate, ensuring better heat conduction, thus improving the heat conduction efficiency between the extruded plate and the CPU, ensuring that as much heat as possible is transferred to the radiator through the extruded plate, improving the heat transfer efficiency of the radiator, and effectively and quickly dissipating the heat generated by the CPU.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic diagram of the structure of a CPU heat dissipation component;

FIG2 is a schematic diagram of the installation of a mounting plate in a CPU heat dissipation assembly;

FIG3 is a schematic diagram of the installation of a radiator in a CPU heat dissipation assembly;

FIG4 is a cross-sectional view of a base in a CPU heat dissipation assembly;

FIG. 5 is a schematic diagram of the structure of a connecting rod in a CPU heat dissipation assembly.

In the figure: 1. host motherboard; 2. radiator; 3. extrusion plate; 4. base; 5. mounting plate; 6. connecting rod; 7. clamping block; 8. plug-in block; 9. ring; 10. connecting rope; 11. nut.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

The utility model provides a CPU heat dissipation component, as shown in Figures 1, 2, 3 and 5, the heat dissipation component comprises a host motherboard 1, a base 4 fixedly mounted on the top surface of the host motherboard 1, a CPU chip arranged inside the base 4, an extrusion plate 3 arranged on the top surface of the base 4 for extruding the CPU chip, a radiator 2 arranged on the top surface of the extrusion plate 3 for dissipating heat for the extrusion plate 3, and a limiting mechanism arranged inside the base 4 for extruding the extrusion plate 3, and the outer wall of the extrusion plate 3 is tightly fitted with the top surface of the CPU chip.

The limiting mechanism includes a connecting rod 6 passing through the extrusion plate 3 and the base 4, a nut 11 screwed to the end of the connecting rod 6 away from the extrusion plate 3, and a plug-in block 8 plugged into the end of the connecting rod 6 away from the nut 11. An arc-shaped opening is provided at the end of the connecting rod 6 close to the plug-in block 8.

It can be understood that in order to improve the thermal conductivity, the material of the extruded plate 3 is preferably brass material which is convenient for heat conduction. The CPU chip is installed in the base 4 and fits with the extruded plate 3. The heat generated by the CPU chip during operation is conducted to the extruded plate 3, and the extruded plate 3 is cooled by the radiator 2. The radiator 2 is a common host CPU chip cooling device, and a common heat dissipation air cooling device is selected. Its specific model can be determined according to actual use requirements, and no further details are given here. A threaded groove is provided at the end of the connecting rod 6 away from the extruded plate 3.

When in use, after the CPU chip is installed on the base 4, take the extrusion plate 3 and press it on the top of the CPU chip, take the connecting rod 6 with the opening facing upward, and penetrate the extrusion plate 3, the base 4 and the host motherboard 1 from top to bottom, then take the nut 11, screw it into the connecting rod 6, limit it with the connecting rod 6, and then take the plug-in block 8 and insert it into the arc-shaped opening. The plug-in block 8 props open the arc-shaped opening, and then squeeze the extrusion plate 3, so that the extrusion plate 3 and the CPU chip fit more closely.

As shown in FIG. 5 , the limiting mechanism further includes a collar 9 slidably connected to the radial outer wall of the connecting rod 6 and a connecting cable 10 arranged on the outer wall of the collar 9 for connecting the plug-in block 8 .

As shown in FIG. 2 , the radial outer wall of the connecting rod 6 is slidably connected with the mounting plate 5 , the connecting rod 6 passes through the mounting plate 5 , and the top surface of the mounting plate 5 is in contact with the bottom surface of the host motherboard 1 .

Among them, the ring 9 is arranged between the extrusion plate 3 and the arc-shaped opening, and the material of the ring 9 is preferably an insulating pad. When the plug-in block 8 is not in use, the connecting cable 10 connects the plug-in block 8 to prevent the plug-in block 8 from being lost. At the same time, the mounting plate 5 is arranged on the bottom surface of the host motherboard 1 to isolate the contact between the nut 11 and the host motherboard 1, thereby reducing the probability of the host motherboard 1 being struck by static electricity, reducing the wear of the host motherboard 1, and extending the service life of the host motherboard 1.

As shown in Figure 5, the plug-in block 8 is configured as a cylindrical portion and a conical portion that are integrally connected. The end of the conical portion with a larger diameter is connected to one end of the cylindrical portion. The diameter of the conical portion gradually decreases from one end close to the cylindrical portion toward the other end. A plug-in groove is provided inside the connecting rod 6 for the plug-in block 8 to be plugged in. The diameter of the cylindrical portion is not less than the inner diameter of the plug-in groove.

Specifically, in order to increase the angle of the arc-shaped opening opened by the plug-in block 8 , when the plug-in block 8 is fully inserted into the connecting rod 6 , the angle of the arc-shaped opening opened is the largest.

The outer wall of the heat sink 2 is fixedly connected with a clamping block 7 , and the side wall of the base 4 is provided with a clamping groove for the clamping block 7 to be clamped.

Specifically, in order to make it easier to install the radiator 2 on the extruded plate 3, the snap-in block 7 is snapped onto the side wall of the base 4. After the connecting rod 6 is installed, the radiator 2 is taken and pressed downward to snap the snap-in block 7 into the snap-in groove. At the same time, the bottom surface of the radiator 2 contacts the extruded plate 3 to complete the installation of the radiator 2.

As shown in FIGS. 1 , 2 , 3 and 4 , a plurality of connecting rods 6 are provided, and the plurality of connecting rods 6 are evenly arranged on the outer wall of the extrusion plate 3 .

Furthermore, in order to make the extrusion plate 3 further extruded by the connecting rod 6, a plurality of connecting rods 6 are arranged on the outer wall of the extrusion plate 3, and the number of the plug-in blocks 8 is consistent with the number of the connecting rods 6 and the installation positions correspond one to one.

The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent substitutions or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims (6)

1. The utility model provides a cpu cooling module, includes host computer mainboard (1), fixed mounting be in base (4) of host computer mainboard (1) top surface, set up the inside cpu chip of base (4), set up base (4) top surface is used for extruding extrusion board (3) of cpu chip, set up the top surface of extrusion board (3) is used for giving extrusion board (3) radiating radiator (2) and setting are in the inside of base (4) is used for the extrusion stop gear of extrusion board (3), its characterized in that: the outer wall of the extrusion plate (3) is tightly attached to the top surface of the cpu chip;

The limiting mechanism comprises a connecting rod (6) penetrating through the extrusion plate (3) and the base (4), a nut (11) screwed on one end of the connecting rod (6) away from the extrusion plate (3), and a plug-in block (8) plugged on one end of the connecting rod (6) away from the nut (11), wherein an arc-shaped opening is formed in one end, close to the plug-in block (8), of the connecting rod (6).

2. The cpu heat sink assembly of claim 1, wherein: the limiting mechanism further comprises a lantern ring (9) which is connected with the radial outer wall of the connecting rod (6) in a sliding mode and a connecting rope (10) which is arranged on the outer wall of the lantern ring (9) and used for connecting the plug-in blocks (8).

3. The cpu heat sink assembly of claim 1, wherein: the radial outer wall sliding connection of connecting rod (6) has mounting panel (5), connecting rod (6) run through mounting panel (5), the top surface of mounting panel (5) with the laminating of the bottom surface of host computer mainboard (1).

4. The cpu heat sink assembly of claim 1, wherein: the utility model discloses a plug-in connection, including spliced block (8), round platform portion, diameter of round platform portion and connecting rod (6), spliced block (8) set up as the cylinder portion and the round platform portion of an organic whole connection, the great one end of round platform portion diameter with the one end of cylinder portion is connected, the diameter of round platform portion by being close to the one end of cylinder portion reduces gradually towards the other end, the inside of connecting rod (6) has been seted up and has been supplied spliced groove that spliced block (8) pegged graft, the diameter of cylinder portion is not less than the internal diameter of spliced groove.

5. The cpu heat sink assembly of claim 1, wherein: the outer wall fixedly connected with joint piece (7) of radiator (2), the lateral wall of base (4) is seted up and is supplied joint groove of joint piece (7) joint.

6. The cpu heat sink assembly of claim 1, wherein: the connecting rods (6) are arranged in a plurality, and the connecting rods (6) are uniformly arranged on the outer wall of the extrusion plate (3).