CN221631930U - Heat radiation structure of server - Google Patents
Heat radiation structure of server Download PDFInfo
- Publication number
- CN221631930U CN221631930U CN202323020585.7U CN202323020585U CN221631930U CN 221631930 U CN221631930 U CN 221631930U CN 202323020585 U CN202323020585 U CN 202323020585U CN 221631930 U CN221631930 U CN 221631930U
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- Prior art keywords
- server
- heat conduction
- conduction fin
- heat dissipation
- heat
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- 230000005855 radiation Effects 0.000 title claims abstract description 9
- 230000017525 heat dissipation Effects 0.000 claims abstract description 30
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 238000005057 refrigeration Methods 0.000 claims abstract description 11
- 238000004891 communication Methods 0.000 claims description 15
- 239000000428 dust Substances 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 8
- 230000005389 magnetism Effects 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 6
- 230000008569 process Effects 0.000 abstract description 6
- 238000009423 ventilation Methods 0.000 abstract description 5
- 238000001816 cooling Methods 0.000 abstract description 3
- 238000002955 isolation Methods 0.000 description 4
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000007613 environmental effect Effects 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 241000883990 Flabellum Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a server heat radiation structure which comprises a first heat conduction fin and a semiconductor refrigeration piece. This server heat radiation structure is equipped with the mounting groove on the shrouding, be equipped with the semiconductor refrigeration piece in the mounting groove, the both sides of mounting groove are equipped with first heat conduction fin and second heat conduction fin respectively, first heat conduction fin, second heat conduction fin and shrouding pass through bolt fixed mounting jointly, semiconductor refrigeration piece centre gripping is between first heat conduction fin and second heat conduction fin, install the second fan on the second heat conduction fin, through the cooperation use between second fan, the second heat conduction fin, first heat conduction fin and the semiconductor refrigeration piece, the other side pipe end position space is cooled down, through the setting of first fan, drive the inside air of server mainframe through first link, the intercommunication groove, square pipe carries out the inner loop, the cooling to the air in the circulation process, thereby realize initiative radiating effect, the effectual external environment influence under the condition of avoiding ventilation and heat dissipation.
Description
Technical Field
The utility model relates to the technical field of heat dissipation, in particular to a server heat dissipation structure.
Background
The server, also called a server, is a device that provides computer services to users in a network, and operates faster than a normal computer, with higher load and higher price. Since the server needs to process the corresponding service request, the server should generally have the capability of bearing the service and guaranteeing the service, and the configuration of the server includes a processor, a hard disk, a memory, and the like, which are similar to those of a general computer architecture, but the server needs to provide highly reliable service, so that the server has high requirements in terms of processing capability, stability, and the like. The radiator mainly comprises two main types, namely active heat radiation and passive heat radiation.
The patent document with the bulletin number of CN219456823U discloses a server radiating structure, which comprises a server mainframe box, the middle fixedly connected with bellows of server mainframe box one side, the bellows is close to the middle fixedly connected with isolation frame of server mainframe box one side, the centre through connection that isolation frame kept away from server mainframe box one side has the axis of rotation, the axis of rotation is close to the first retainer plate of one side fixedly connected with of isolation frame outer wall, the centre rotation of isolation frame outer wall is connected with circular bearing, the even fixedly connected with flabellum of outer wall of circular bearing, one side outer wall fixedly connected with guard circle of first retainer plate is kept away from to the axis of rotation. The server heat dissipation mechanism has the relevant advantages of high operation efficiency, high heat dissipation speed, simple device structure, convenience in maintenance and disassembly and the like.
However, in the prior art, only the fan is arranged to perform blowing and heat dissipation, so that the heat dissipation effect is poor when the external environment temperature is high, and therefore, a new server heat dissipation structure is proposed to optimize the prior art.
Disclosure of utility model
The present utility model is directed to a server heat dissipation structure, which solves the above-mentioned problems of the related art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a server heat radiation structure, includes the server mainframe box, one side symmetry of server mainframe box is equipped with first intercommunication mouth, server mainframe box corresponds first intercommunication mouth department and runs through and have the second intercommunication mouth, first intercommunication mouth and second intercommunication mouth side are equipped with the casing outward, the inside of casing corresponds first intercommunication mouth department and is equipped with the intercommunication groove, the middle part of casing corresponds second intercommunication mouth department and runs through fixedly connected with side pipe, the inboard fixed mounting of side pipe has first fan, the opening part of casing is equipped with the shrouding, be equipped with the mounting groove on the shrouding, be equipped with the semiconductor refrigeration piece in the mounting groove, the both sides of mounting groove are equipped with first heat conduction fin and second heat conduction fin respectively, first heat conduction fin, second heat conduction fin and shrouding are jointly through bolt fixed mounting, the perforation that is used for the bolt to run through has been seted up on the first heat conduction fin, be used for bolt insertion and threaded connection's screw hole, the centre gripping of semiconductor refrigeration piece is between first heat conduction fin and second heat conduction fin, install the second fan on the second heat conduction fin.
As a further scheme of the utility model: the front side lower part of server mainframe box evenly is equipped with the louvre, and server mainframe box corresponds louvre department and is equipped with the recess, is equipped with the magnetism dust suction filter net that is connected with server mainframe box magnetism in the recess, keeps apart the louvre through setting up of magnetism dust suction filter net, avoids the dust diffusion to get into in the server mainframe box, plays dustproof effect.
As still further aspects of the utility model: the four corners of the bottom of the server mainframe box are fixedly connected with supporting blocks, and the server mainframe box is supported through the supporting blocks.
As still further aspects of the utility model: the front side upper portion fixed mounting of server mainframe box has control panel, is equipped with control button on the control panel, and control panel is used for carrying out simple button control to the server, and first fan, second fan and semiconductor refrigeration piece are all connected on control panel through the wire, can carry out the control of switch to each accessory of inside server through installation control panel and control button.
As still further aspects of the utility model: the opening part four corners of casing all fixedly connected with connecting block, and the shrouding passes through bolt fixed mounting on the connecting block, has offered the perforation that is used for the bolt to run through on the shrouding, has offered the screw hole that is used for bolt insertion and threaded connection on the connecting block.
As still further aspects of the utility model: the tip fixedly connected with U-shaped board of side pipe, the U-shaped board passes through the second intercommunication mouth and inserts the server mainframe incasement, and the both sides opening of U-shaped board sets up from top to bottom to the intraductal air of side blows to the U-shaped board, discharges from the top and the bottom of U-shaped board, thereby forms the effect of keeping out the wind, the effectual wind-force of avoiding first fan is to the influence of the inside electronic component of server mainframe.
As still further aspects of the utility model: the shell is fixedly installed with the server mainframe box through bolts, through holes for the bolts to penetrate are formed in the shell, and threaded holes for threaded connection of the bolts are formed in the server mainframe box.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the utility model, through the cooperation among the second fans, the second heat conducting fins, the first heat conducting fins and the semiconductor refrigerating fins, the position space at the end of the opposite side is cooled, and through the arrangement of the first fans, the air in the server mainframe is driven to circulate through the first communication port, the communication groove and the square pipe, and the air is cooled in the circulation process, so that the active heat dissipation effect is realized, and the external environmental influence under the ventilation and heat dissipation condition is effectively avoided.
2. The sealing plate and the shell are detachably arranged, the shell and the server mainframe box are detachably arranged, and the first heat conduction fins, the second heat conduction fins, the semiconductor refrigerating sheets and the sealing plate are detachably arranged, so that the whole mountain heat mechanism can be conveniently disassembled, assembled and maintained.
3. The arrangement of the U-shaped plate of the utility model forms a wind shielding effect, and effectively avoids the influence of the wind power of the first fan on the electronic elements in the server mainframe.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation structure of a server.
Fig. 2 is a display diagram of a server mainframe in a server heat dissipation structure.
Fig. 3 is a view showing a case in a server heat dissipation structure.
Fig. 4 is a cross-sectional view of a housing in a server heat dissipation structure.
Fig. 5 is an exploded view of a housing in a server heat dissipation structure.
In the figure: 1. a server mainframe box; 2. a heat radiation hole; 3. a first communication port; 4. a second communication port; 5. a housing; 6. a communication groove; 7. square tubes; 8. a first fan; 9. a sealing plate; 10. a mounting groove; 11. a semiconductor refrigeration sheet; 12. a first heat conduction fin; 13. a second heat conduction fin; 14. a second fan; 15. a magnetic dust filtering net; 16. a support block; 17. a control panel; 18. a control key; 19. a connecting block; 20. a U-shaped plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1 to 5, in an embodiment of the present utility model, a server heat dissipation structure includes a server mainframe 1, a first communication port 3 is symmetrically disposed at one side of the server mainframe 1, a second communication port 4 is penetrated at a position of the server mainframe 1 corresponding to the first communication port 3, a housing 5 is disposed outside a side of the server mainframe 1, the first communication port 3 and the second communication port 4 are provided with a communication slot 6, a position of the housing 5 corresponding to the first communication port 3 is provided with a square tube 7, a first fan 8 is fixedly disposed at an inner side of the square tube 7, a sealing plate 9 is disposed at an opening of the housing 5, a mounting slot 10 is disposed on the sealing plate 9, a semiconductor cooling fin 11 is disposed in the mounting slot 10, a first heat conduction fin 12 and a second heat conduction fin 13 are disposed at two sides of the mounting slot 10, the first heat conduction fin 12, the second heat conduction fin 13 and the sealing plate 9 are fixedly disposed together by bolts, through holes for bolts are disposed on the second heat conduction fin 13 and the sealing plate 9, a square tube 7 is fixedly connected at a position corresponding to the second communication port 4, a first heat conduction fin 12 is disposed on the first heat conduction fin 12 and a threaded hole for inserting and is disposed between the second heat conduction fin 11 and the second heat conduction fin 13.
Through the cooperation use between second fan 14, second heat conduction fin 13, first heat conduction fin 12 and the semiconductor refrigeration piece 11, the side's pipe 7 tip position space cools down, through the setting of first fan 8, drive the inside air of server mainframe 1 and carry out the inner loop through first intercommunication mouth 3, intercommunication groove 6, side's pipe 7, cool down the cooling to the air in the circulation process to realize initiative radiating effect, the effectual external environment influence under the ventilation heat dissipation condition that avoids.
The front side lower part of the server mainframe box 1 is uniformly provided with the heat dissipation holes 2, the position of the server mainframe box 1 corresponding to the heat dissipation holes 2 is provided with a groove, a magnetic dust suction filter net 15 magnetically connected with the server mainframe box 1 is arranged in the groove, the heat dissipation holes 2 are isolated through the arrangement of the magnetic dust suction filter net 15, dust is prevented from diffusing into the server mainframe box 1, and a dustproof effect is achieved.
Support blocks 16 are fixedly connected to four corners of the bottom of the server main case 1, and the server main case 1 is supported through the support blocks 16.
The front upper part of the server mainframe box 1 is fixedly provided with a control panel 17, the control panel 17 is provided with a control key 18, the control panel is used for simply controlling buttons of the server, the first fan 8, the second fan 14 and the semiconductor refrigerating sheet 11 are connected to the control panel 17 through wires, and each accessory of the internal server can be controlled to be switched through installing the control panel 17 and the control key 18.
The opening part four corners of casing 5 all fixedly connected with connecting block 19, and shrouding 9 passes through bolt fixed mounting on connecting block 19, has offered the perforation that is used for the bolt to run through on the shrouding 9, has offered the screw hole that is used for bolt insertion and threaded connection on the connecting block 19.
The tip fixedly connected with U-shaped board 20 of side pipe 7, U-shaped board 20 inserts in the server mainframe box 1 through second intercommunication mouth 4, and the both sides opening of U-shaped board 20 sets up from top to bottom to the air in the side pipe 7 blows U-shaped board 20, discharges from the top and the bottom of U-shaped board 20, thereby forms the effect of keeping out the wind, the effectual wind-force of avoiding first fan 8 is to the influence of the inside electronic component of server mainframe box 1.
The shell 5 is fixedly installed with the server mainframe box 1 through bolts, through holes for the bolts to penetrate are formed in the shell 5, and threaded holes for threaded connection of the bolts are formed in the server mainframe box 1.
The shrouding 9 is detachable with casing 5, and casing 5 and server mainframe box 1 are detachable setting, and first heat conduction fin 12, second heat conduction fin 13, semiconductor refrigeration piece 11 and shrouding 9 are detachable setting to make this mountain thermal mechanism wholly can convenient dismantlement, equipment, maintenance.
The working principle of the utility model is as follows:
When the air conditioner is used, natural ventilation can be performed through the radiating holes 2, natural heat dissipation can be performed from the server mainframe box 1, the first fan 8, the second fan 14 and the semiconductor refrigerating sheet 11 can be controlled to work in the use process, so that the space at the end part of the square pipe 7 is cooled through the cooperation among the second fan 14, the second heat conducting fins 13, the first heat conducting fins 12 and the semiconductor refrigerating sheet 11, the air inside the server mainframe box 1 is driven to be cooled through the arrangement of the first fan 8, the communication groove 6 and the square pipe 7, the air is cooled and cooled in the circulation process, the active heat dissipation effect is achieved, the external environmental influence under the ventilation and heat dissipation conditions is effectively avoided, the air in the square pipe 7 is blown to the U-shaped plate 20, and is discharged from the top and the bottom of the U-shaped plate 20, and accordingly the wind shielding effect is formed.
Although the present utility model has been described with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments described, or equivalents may be substituted for elements thereof, and any modifications, equivalents, improvements and changes may be made without departing from the spirit and principles of the present utility model.
Claims (7)
1. The utility model provides a server heat radiation structure, includes server mainframe (1), its characterized in that: one side symmetry of server mainframe box (1) is equipped with first intercommunication mouth (3), server mainframe box (1) corresponds first intercommunication mouth (3) department and runs through there is second intercommunication mouth (4), first intercommunication mouth (3) and second intercommunication mouth (4) side are equipped with casing (5) outward to server mainframe box (1), the inside of casing (5) corresponds first intercommunication mouth (3) department and is equipped with intercommunication groove (6), the middle part of casing (5) corresponds second intercommunication mouth (4) department and runs through fixedly connected with side pipe (7), the inboard fixed mounting of side pipe (7) has first fan (8), the opening part of casing (5) is equipped with shrouding (9), be equipped with mounting groove (10) on shrouding (9), be equipped with semiconductor refrigeration piece (11) in mounting groove (10), both sides of mounting groove (10) are equipped with first heat conduction fin (12) and second heat conduction fin (13) respectively, first heat conduction fin (12), second heat conduction fin (13) and shrouding (9) pass through bolt fixed mounting jointly, semiconductor piece (11) centre gripping is equipped with on first heat conduction fin (13) between second heat conduction fin (13).
2. A server heat dissipation structure as defined in claim 1, wherein: the front side lower part of server mainframe (1) evenly is equipped with louvre (2), and server mainframe (1) corresponds louvre (2) department and is equipped with the recess, is equipped with in the recess and inhales dust screen (15) with server mainframe (1) magnetism connection.
3. A server heat dissipation structure as defined in claim 1, wherein: support blocks (16) are fixedly connected to four corners of the bottom of the server mainframe (1).
4. A server heat dissipation structure as defined in claim 1, wherein: the front upper part of the server mainframe (1) is fixedly provided with a control panel (17), and the control panel (17) is provided with control keys (18).
5. A server heat dissipation structure as defined in claim 1, wherein: connecting blocks (19) are fixedly connected to four corners of the opening of the shell (5), and the sealing plate (9) is fixedly installed on the connecting blocks (19) through bolts.
6. A server heat dissipation structure as defined in claim 1, wherein: the end part of the square tube (7) is fixedly connected with a U-shaped plate (20), the U-shaped plate (20) is inserted into the server mainframe box (1) through the second communication port (4), and openings on two sides of the U-shaped plate (20) are arranged up and down.
7. A server heat dissipation structure as defined in claim 1, wherein: the shell (5) is fixedly arranged with the server mainframe box (1) through bolts.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323020585.7U CN221631930U (en) | 2023-11-08 | 2023-11-08 | Heat radiation structure of server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323020585.7U CN221631930U (en) | 2023-11-08 | 2023-11-08 | Heat radiation structure of server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221631930U true CN221631930U (en) | 2024-08-30 |
Family
ID=92488874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323020585.7U Active CN221631930U (en) | 2023-11-08 | 2023-11-08 | Heat radiation structure of server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221631930U (en) |
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2023
- 2023-11-08 CN CN202323020585.7U patent/CN221631930U/en active Active
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