CN221621861U

CN221621861U - Wafer grinding device for processing electronic chip

Info

Publication number: CN221621861U
Application number: CN202323358639.0U
Authority: CN
Inventors: 车通升
Original assignee: Suzhou Qinyan Integrated Circuit Co ltd
Current assignee: Suzhou Qinyan Integrated Circuit Co ltd
Priority date: 2023-12-11
Filing date: 2023-12-11
Publication date: 2024-08-30
Anticipated expiration: 2033-12-11

Abstract

The utility model discloses a wafer grinding device for processing electronic chips, which comprises: a workbench, in which an operation box is installed; the fixed plate is arranged in the operation box, the protective cover and the first pneumatic cylinder are arranged on the fixed plate, the connecting block is fixed on the inner side of the first pneumatic cylinder, the rubber block is fixed on the inner side of the connecting block, and the connecting block and the rubber block are movably connected with the protective cover; a cleaning mechanism arranged inside the workbench; the cleaning mechanism comprises a first motor, an output shaft of the first motor is connected with a rotating shaft, the rotating shaft is sleeved with a rotating rod, the rotating rod is hinged with a push-pull rod, the push-pull rod is hinged with a movable plate, the movable plate is movably connected with the operation box, the movement of the push-pull rod can push the movable plate to move, and a rubber scraping plate is fixed at the bottom of the movable plate. The utility model can clean the wafer in time, avoid the damage of the wafer particles to the surface of the wafer, and improve the protection of the wafer.

Description

Wafer grinding device for processing electronic chip

Technical Field

The utility model relates to the technical field of electronic chip processing devices, in particular to a wafer grinding device for electronic chip processing.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor circuit, and a silicon wafer, that is, a wafer, is formed after a silicon wafer rod is ground, polished and sliced.

In the process of manufacturing and processing a wafer, grinding and polishing are an important process, and a chemical mechanical polishing device is generally used for grinding and polishing, so that a large number of wafer particles are adsorbed on the surface of the wafer in the grinding process, and therefore, the surface of the wafer is damaged in the grinding process, the existing wafer grinding device can grind the wafer, but only after the grinding is finished, the particles on the surface of the wafer can be cleaned after the wafer is taken out, the quality of a finished product of the wafer is affected, and therefore, the wafer grinding device needs to be improved.

Disclosure of utility model

In order to overcome the defects of the prior art, the utility model provides the wafer grinding device for processing the electronic chip, which has the advantage of timely cleaning the wafer.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a wafer grinding device for processing electronic chips comprises:

the workbench is internally and fixedly provided with an operation box;

The two ends of the fixed plate are fixedly connected with the inner surface of the operation box, the left side and the right side of the upper surface of the fixed plate are fixedly provided with protective covers, the two sides of the upper surface of the fixed plate are fixedly provided with first pneumatic cylinders, the inner sides of the first pneumatic cylinders are fixedly provided with connecting blocks, the inner sides of the connecting blocks are fixedly connected with rubber blocks, and the outer surfaces of the connecting blocks and the rubber blocks are movably connected with the inner surface of the protective covers;

the cleaning mechanism is arranged in the workbench;

The cleaning mechanism comprises a first motor, the outer surface of the first motor is fixedly connected with the inner surface of the workbench, the other end of the output shaft of the first motor is fixedly connected with a rotating shaft, the outer surface of the rotating shaft is fixedly sleeved with a rotating rod, the other end of the rotating rod is hinged with a push-pull rod, the other end of the push-pull rod is hinged with a movable plate, the outer surface of the movable plate is movably connected with the inner wall of the operation box, the movable plate is pushed to move by movement of the push-pull rod, and a rubber scraper is fixedly connected to the bottom of the movable plate.

As a preferable technical scheme of the utility model, a support is fixedly arranged on the upper surface of the workbench, a second pneumatic cylinder is fixedly arranged at the top of the support, the bottom end of the second pneumatic cylinder penetrates through the support and extends to the outside of the support and is movably sleeved with the inner wall of the support, and the bottom end of the second pneumatic cylinder is fixedly connected with a mounting plate.

As a preferable technical scheme of the utility model, the bottom of the mounting plate is fixedly provided with a second motor, the other end of the output shaft of the second motor is fixedly connected with a round shaft, and the outer surface of the round shaft is fixedly sleeved with a grinding block.

As a preferable technical scheme of the utility model, a connecting pipe is fixedly sleeved in the left side of the bracket, and the bottom end of the connecting pipe is fixedly connected with a spray pipe.

As a preferable technical scheme of the utility model, a water outlet is formed in the bottom of the operation box, a collecting box is movably mounted at the bottom of the inner cavity of the workbench, a filter screen is fixedly sleeved in the collecting box, and a handle is fixedly mounted on the right side of the collecting box.

As a preferable technical scheme of the utility model, the front surface of the workbench is fixedly provided with a water pump, and the bottom of the water pump is fixedly connected with a water inlet pipe.

As a preferable technical scheme of the utility model, the back of the water pump is fixedly provided with the water outlet pipe, the other end of the water outlet pipe penetrates through the workbench and the operation box and extends into the operation box and is fixedly sleeved with the inner walls of the workbench and the operation box respectively, and the rear end of the water outlet pipe is fixedly provided with the spray head.

Compared with the prior art, the utility model has the following beneficial effects:

1. According to the utility model, when an operator grinds a wafer, after grinding for a period of time, the second pneumatic cylinder is started, so that the second pneumatic cylinder drives the mounting plate to move upwards, the grinding block is separated from contact with the wafer, at the moment, the first motor is started, the rotating shaft drives the rotating rod to rotate, and the push-pull rod drives the movable plate and the rubber scraper to move, so that the rubber scraper can scrape away wafer particles mixed with grinding liquid on the surface of the wafer, damage to the surface of the wafer caused by the wafer particles is avoided, and the protection of the wafer is improved.

2. According to the utility model, the filter screen, the handle, the water pump and the spray head are arranged, after grinding is finished, an operator can start the water pump to enable the water inlet pipe to suck clean water source and then spray the water from the spray head through the water outlet pipe, so that the residual grinding liquid on the surface of the wafer can be cleaned, the phenomenon that the grinding liquid drops fall on the outer surface of the device to pollute the device when the operator takes the wafer is avoided, the filter screen can filter out wafer particles in the grinding liquid, and the operator can conveniently recycle the wafer particles.

Drawings

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic cross-sectional view of the front face of the present utility model;

FIG. 3 is a schematic cross-sectional view of a side face of the present utility model;

FIG. 4 is a schematic cross-sectional view of the operator's compartment of the present utility model;

Fig. 5 is a schematic view of a partial enlarged structure at a in fig. 3.

In the figure: 1.a work table; 2. an operation box; 3. a fixing plate; 4. a first pneumatic cylinder; 5. a connecting block; 6. a rubber block; 7. a protective cover; 8. a movable plate; 9. a rubber scraper; 10. a first motor; 11.a rotating shaft; 12. a rotating rod; 13. a push-pull rod; 14. a bracket; 15. a second pneumatic cylinder; 16. a mounting plate; 17. a second motor; 18. a circular shaft; 19. grinding the blocks; 20. a connecting pipe; 21. a spray pipe; 22. a water outlet; 23. a collection box; 24. a filter screen; 25. a handle; 26. a water pump; 27. a water inlet pipe; 28. a water outlet pipe; 29. a spray head.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

As shown in fig. 1 to 5, the present utility model provides a wafer polishing apparatus for processing electronic chips, comprising:

The workbench 1, the interior of the workbench 1 is fixedly provided with an operation box 2;

The fixed plate 3, both ends of the fixed plate 3 are fixedly connected with the inner surface of the operation box 2, the left and right sides of the upper surface of the fixed plate 3 are fixedly provided with the protective cover 7, both sides of the upper surface of the fixed plate 3 are fixedly provided with the first pneumatic cylinder 4, the inner side of the first pneumatic cylinder 4 is fixedly provided with the connecting block 5, the inner side of the connecting block 5 is fixedly connected with the rubber block 6, and the outer surfaces of the connecting block 5 and the rubber block 6 are movably connected with the inner surface of the protective cover 7;

The cleaning mechanism is arranged in the workbench 1;

The cleaning mechanism comprises a first motor 10, the outer surface of the first motor 10 is fixedly connected with the inner surface of the workbench 1, the other end of an output shaft of the first motor 10 is fixedly connected with a rotating shaft 11, the outer surface of the rotating shaft 11 is fixedly sleeved with a rotating rod 12, the other end of the rotating rod 12 is hinged with a push-pull rod 13, the other end of the push-pull rod 13 is hinged with a movable plate 8, the outer surface of the movable plate 8 is movably connected with the inner wall of the operation box 2, the movable plate 8 is pushed to move by the movement of the push-pull rod 13, and the bottom of the movable plate 8 is fixedly connected with a rubber scraping plate 9.

The operating personnel place the wafer on the upper surface of fixed plate 3, then through starting first pneumatic cylinder 4, make first pneumatic cylinder 4 promote connecting block 5 and rubber piece 6 take place the motion, thereby make two rubber pieces 6 can fix the wafer, thereby can grind the wafer, after grinding a period of time, operating personnel can drive rotary rod 12 through starting first motor 10, make pivot 11 take place the rotation, and then make rotary rod 12 drive push-pull rod 13 take place the motion, thereby make push-pull rod 13 promote fly leaf 8 and rubber scraper 9 take place the motion, make rubber scraper 9 can clear up the granule that the wafer surface ground out, avoided the granule to adsorb the problem that causes the surface damage of wafer at the surface of wafer.

Wherein, workstation 1 upper surface fixed mounting has support 14, and the top fixed mounting of support 14 has second pneumatic cylinder 15, and the bottom of second pneumatic cylinder 15 runs through support 14 and extends to the outside of support 14 and cup joints with the inner wall activity of support 14, and the bottom fixedly connected with mounting panel 16 of second pneumatic cylinder 15.

The operator may cause the second pneumatic cylinder 15 to push the mounting plate 16 downward by activating the second pneumatic cylinder 15.

The bottom of the mounting plate 16 is fixedly provided with a second motor 17, the other end of the output shaft of the second motor 17 is fixedly connected with a circular shaft 18, and the outer surface of the circular shaft 18 is fixedly sleeved with a grinding block 19.

An operator can start the second motor 17 to enable the round shaft 18 to drive the grinding block 19 to rotate, so that the wafer can be ground.

Wherein, the inside of support 14 left side has fixedly cup jointed connecting pipe 20, and the bottom fixedly connected with spray tube 21 of connecting pipe 20.

By providing the nozzle 21, the operator can spray the polishing liquid through the nozzle 21 when polishing the wafer.

Wherein, delivery port 22 has been seted up to the bottom of control box 2, and the bottom movable mounting of workstation 1 inner chamber has collected box 23, and the inside fixed filter screen 24 that has cup jointed of collection box 23, and the right side fixed mounting of collection box 23 has handle 25.

Through setting up filter screen 24 for the grinding fluid can flow into the inside of collecting box 23 through delivery port 22, and filter screen 24 can filter out the wafer granule in the grinding fluid.

The front surface of the workbench 1 is fixedly provided with a water pump 26, and the bottom of the water pump 26 is fixedly connected with a water inlet pipe 27.

The operator activates the water pump 26 so that the inlet pipe 27 is able to draw in a clean water source.

Wherein, the back fixed mounting of water pump 26 has outlet pipe 28, and the other end of outlet pipe 28 runs through workstation 1 and operation box 2 and extends to the inside of operation box 2 and fixedly cup joints with the inner wall of workstation 1 and operation box 2 respectively, and the rear end fixed mounting of outlet pipe 28 has shower nozzle 29.

Clean water will be sprayed from the spray head 29 through the water outlet pipe 28 to clean the outer surface of the wafer, thereby avoiding the drop of abrasive liquid from falling on the outer surface of the device when the operator takes the wafer.

The working principle and the using flow of the utility model are as follows:

Firstly, the wafer is placed on the upper surface of the fixed plate 3 by an operator, then two first pneumatic cylinders 4 are started, the first pneumatic cylinders 4 push the connecting block 5 and the rubber blocks 6 to move, so that the two rubber blocks 6 can fix the wafer, then the second motor 17 is started, the wafer shaft 18 drives the grinding block 19 to rotate, the second pneumatic cylinders 15 are started, the second pneumatic cylinders 15 push the mounting plate 16 to move downwards, so that the wafer can be ground, the operator can spray grinding liquid to the surface of the wafer through the spraying pipe 21, after a period of grinding, the operator can start the second pneumatic cylinders 15, the second pneumatic cylinders 15 pull the mounting plate 16 to move upwards, so that the grinding block 19 is separated from the surface of the wafer, at the moment, the rotating shaft 11 drives the rotating rod 12 to rotate, so that the movable plate 8 and the rubber scraper 9 are pushed to move, the wafer particles mixed by the rubber scraper 9 can scrape the wafer surface and the wafer particles mixed by the grinding liquid, the quality of the wafer is improved, and the quality of the wafer particles is prevented from being damaged.

After finishing grinding, operating personnel can be through starting the water pump 26 for inlet tube 27 can be with clean water suction, then spouted by shower nozzle 29 through outlet pipe 28, thereby clear up the wafer, avoid operating personnel to lead to the lapping liquid drop on wafer surface to fall on the surface of device when taking the wafer, cause the pollution to the device, made things convenient for operating personnel to use, liquid will fall into the inside of collecting box 23 through delivery port 22, and the wafer granule then can be filtered out by filter screen 24, thereby made things convenient for operating personnel to carry out recycle, avoid the waste of material.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer grinder for electronic chip processing which characterized in that includes:

The workbench (1), wherein an operation box (2) is fixedly arranged in the workbench (1);

The device comprises a fixed plate (3), wherein both ends of the fixed plate (3) are fixedly connected with the inner surface of an operation box (2), a protective cover (7) is fixedly installed on the left side and the right side of the upper surface of the fixed plate (3), a first pneumatic cylinder (4) is fixedly installed on both sides of the upper surface of the fixed plate (3), a connecting block (5) is fixedly installed on the inner side of the first pneumatic cylinder (4), a rubber block (6) is fixedly connected on the inner side of the connecting block (5), and the outer surfaces of the connecting block (5) and the rubber block (6) are movably connected with the inner surface of the protective cover (7);

the cleaning mechanism is arranged in the workbench (1);

The cleaning mechanism comprises a first motor (10), the outer surface of the first motor (10) is fixedly connected with the inner surface of the workbench (1), the other end of the output shaft of the first motor (10) is fixedly connected with a rotating shaft (11), the outer surface of the rotating shaft (11) is fixedly sleeved with a rotating rod (12), the other end of the rotating rod (12) is hinged with a push-pull rod (13), the other end of the push-pull rod (13) is hinged with a movable plate (8), the outer surface of the movable plate (8) is movably connected with the inner wall of the operation box (2), the movable plate (8) is pushed to move by the movement of the push-pull rod (13), and a rubber scraper (9) is fixedly connected with the bottom of the movable plate (8).

2. The wafer polishing apparatus for electronic chip processing according to claim 1, wherein: the workbench is characterized in that a support (14) is fixedly arranged on the upper surface of the workbench (1), a second pneumatic cylinder (15) is fixedly arranged at the top of the support (14), the bottom end of the second pneumatic cylinder (15) penetrates through the support (14) and extends to the outside of the support (14) and is movably sleeved with the inner wall of the support (14), and a mounting plate (16) is fixedly connected with the bottom end of the second pneumatic cylinder (15).

3. The wafer polishing apparatus for electronic chip processing according to claim 2, wherein: the bottom of mounting panel (16) fixed mounting has second motor (17), the other end fixedly connected with circle axle (18) of second motor (17) output shaft, the surface fixed sleeve of circle axle (18) has ground piece (19).

4. The wafer polishing apparatus for electronic chip processing according to claim 2, wherein: the inside of support (14) left side has fixedly cup jointed connecting pipe (20), the bottom fixedly connected with spray tube (21) of connecting pipe (20).

5. The wafer polishing apparatus for electronic chip processing according to claim 1, wherein: the bottom of operation box (2) has seted up delivery port (22), the bottom movable mounting of workstation (1) inner chamber has collection box (23), the inside fixed filter screen (24) that has cup jointed of collection box (23), the right side fixed mounting of collection box (23) has handle (25).

6. The wafer polishing apparatus for electronic chip processing according to claim 1, wherein: the front of the workbench (1) is fixedly provided with a water pump (26), and the bottom of the water pump (26) is fixedly connected with a water inlet pipe (27).

7. The wafer polishing apparatus for electronic chip processing according to claim 6, wherein: the back fixed mounting of water pump (26) has outlet pipe (28), the other end of outlet pipe (28) runs through workstation (1) and control box (2) and extends to the inside of control box (2) and fixedly cup joints with the inner wall of workstation (1) and control box (2) respectively, the rear end fixed mounting of outlet pipe (28) has shower nozzle (29).