CN221551170U - Server - Google Patents
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- CN221551170U CN221551170U CN202323624568.4U CN202323624568U CN221551170U CN 221551170 U CN221551170 U CN 221551170U CN 202323624568 U CN202323624568 U CN 202323624568U CN 221551170 U CN221551170 U CN 221551170U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
The utility model relates to the field of servers and discloses a server. The server comprises a chassis, a main board module, a GPU board module, a power module, a middle board module and a fan module, wherein the main board module, the GPU board module, the power module, the middle board module and the fan module are respectively installed in the chassis in a pluggable manner, and connectors on the middle board module are respectively in corresponding plug-in fit with connectors on the GPU board module, the main board module, the power module and the fan module; the internal cavity of the chassis is divided into a region a, a region b and a region c from bottom to top in sequence, the middle plate module divides the interior of the chassis into a front side and a rear side, the main plate module is positioned in the region a of the front side, the GPU board card module is positioned in the region b of the front side, the power supply module is positioned in the region c of the front side, and the fan module is positioned in the region b of the rear side. The server can reduce the consumption of the data cable as much as possible, can conveniently and rapidly carry out independent disassembly and assembly maintenance operation of each module, is convenient for a user to maintain and manage hardware, and effectively improves maintenance efficiency and reduces maintenance cost.
Description
Technical Field
The utility model relates to the technical field of servers, in particular to a server.
Background
Servers are an important component in electronic devices, primarily for providing computing services. The hardware modules inside the high-performance server case are more and need to be regularly maintained and managed, however, in the high-performance server in the prior art, the data cables are commonly connected in pairs in a mode of being adopted among different hardware modules, so that the use amount of the data cables is large, a large amount of installation space is occupied by wiring in the server case, when overhauling and maintaining are carried out, the data cables on the hardware modules need to be detached respectively, so that the disassembly and assembly operation of the hardware modules in the case is complicated, the workload is large, the independent disassembly and assembly maintenance of the hardware modules is difficult, the maintenance and management efficiency is influenced, and the maintenance cost is improved.
Accordingly, there is a need to provide a server to solve the above-mentioned problems.
Disclosure of utility model
The utility model aims to provide a server which can effectively reduce the use amount of cables, is convenient for the maintenance and management of hardware modules, and effectively improves the maintenance efficiency and reduces the maintenance cost.
In order to achieve the purpose, the utility model is realized by the following technical scheme:
The server comprises a chassis, and a main board module, a GPU board module, a power module, a middle board module and a fan module which are respectively and removably arranged in the chassis, wherein connectors on the middle board module are respectively and correspondingly inserted and matched with connectors on the GPU board module, the main board module, the power module and the fan module;
The inside cavity of machine case is divided into region a, region b and region c from bottom to top in proper order, the medium plate module will machine case inside is divided into front side and rear side, the mainboard module is located the front side in region a, the GPU integrated circuit board module is located the front side in region b, the power module is located the front side in region c, the fan module is located the rear side in region b.
As an alternative scheme, one of a guide groove and a guide pin is arranged beside the connector on the middle plate module, and the GPU board card module, the main plate module, the power supply module and the fan module are respectively provided with the other one of the guide groove and the guide pin beside the connector on the middle plate module, and the guide pin is in plug-in fit with the guide groove. Through the grafting cooperation of guide pin and guide way, play the guide effect at the in-process that two connectors were to inserting, ensure the accuracy that two connectors were to inserting.
As an alternative, the motherboard module includes:
the first base is rotatably provided with a first operation handle;
The main board card is arranged at the bottom of the first base;
PCIE SWITCH board cards are arranged in the first base, the PCIE SWITCH board cards are positioned above the main board cards and are connected with the main board cards through cables, and connectors on the PCIE SWITCH board cards are in plug-in fit with corresponding connectors on the middle board modules;
the fan assembly is arranged at the middle position of the first base along the front-rear direction. Above-mentioned setting can realize the signal interconnection between mainboard integrated circuit board and the medium plate module through PCIE SWITCH integrated circuit board, has saved the use amount of data cable, and fan module can dispel the heat to the mainboard module.
As an alternative scheme, the main board module further comprises a mounting piece and a tray, wherein the mounting piece is arranged at the rear side of the first base, the PCIE SWITCH board card is fixed on the tray, and each end of the tray, which is positioned at the left side and the right side, is fixedly connected with the end parts of the first base and the mounting piece respectively;
The side that the mounting extends along left and right directions is equipped with one end open-ended spacing hole, the bottom of tray with the position that spacing hole corresponds is protruding to be equipped with the I-shaped nail, the I-shaped nail with spacing cooperation in spacing hole. The device can avoid the bad height and size of PCIE SWITCH boards caused by accumulated tolerance in the structural processing or assembling process, thereby influencing the signal transmission problem between boards.
As an alternative scheme, the front side of the first base is provided with a plurality of hard disks, a front IO board card and a front PCIe board card;
The two-wide PCIe board module, the IO module, the main board power supply, the two-card PCIe module and the four-card PCIe module are further arranged in the area c at the rear side of the case, the two-wide PCIe board module, the IO module and the connector of the main board power supply are respectively in plug-in fit with the corresponding connector on the main board, and the two-card PCIe module and the connector of the four-card PCIe module are respectively in plug-in fit with the corresponding connector on the PCIE SWITCH board. The arrangement can effectively improve the expansion performance of the server.
As an alternative, the GPU board card module includes:
A second base, on which a second operation handle is rotatably arranged
The plurality of GPU boards are arranged in the second base, and connectors on the GPU boards are in plug-in fit with corresponding connectors on the middle plate module. By the arrangement, the GPU board can be connected with signals of the power supply module and the main board module through the middle board, so that the consumption of the data cable is reduced.
As an alternative scheme, be provided with the direction structure on two lateral walls that the second base is along controlling the direction relatively respectively, be equipped with on the direction structure along the slide that the fore-and-aft direction extends, be equipped with a plurality of rotatable first gyro wheels on the inside wall of quick-witted case, a plurality of first gyro wheels are followed the fore-and-aft direction interval sets up, a plurality of first gyro wheels with slide sliding fit. According to the arrangement, the friction force to the guide structural member is reduced in a rolling friction mode, and the smoothness of movement is improved.
As an alternative, the power module includes:
A plurality of power supplies;
The power supply backboard is electrically connected with the power supplies, and the connector on the power supply backboard is in plug-in fit with the corresponding connector on the middle plate module. By the arrangement, the power supply can be connected with the GPU board card module and the fan module in a signal interconnection mode through the power supply backboard and the middle board module in an opposite inserting mode, so that power is supplied to the GPU board card module and the fan module, and the using amount of a data cable is saved.
As an alternative, the middle board module includes:
The middle plate bracket is arranged on the chassis in a pluggable manner;
The middle plate board card is arranged on the front side of the middle plate bracket, and a plurality of connectors are arranged on the middle plate board card;
The fan power panel module is arranged at the rear side of the middle plate bracket, and the connector on the fan power panel module is respectively in corresponding plug-in fit with the connector at the rear side of the middle plate board card and the connector on the fan module. Above-mentioned setting, medium plate support form stable support as support piece to medium plate integrated circuit board and fan power strip module, and the fan module can form signal interconnection through fan power strip module and medium plate integrated circuit board, has saved the use amount of data cable.
As an alternative scheme, be provided with first baffle and second baffle in the quick-witted incasement, first baffle is located the below of second baffle, first baffle is used for supporting GPU integrated circuit board module, the second baffle is used for supporting power module. Through setting up first baffle and second baffle, effectively improved quick-witted case base's bearing capacity and structural strength, ensured stability and the reliability of equipment when the operation.
The beneficial effects of the utility model are as follows:
According to the server provided by the utility model, the connectors on the middle plate module are respectively in corresponding plug-in fit with the connectors on the GPU board card module, the main plate module, the power supply module and the fan module, so that the GPU board card module, the main plate module and the power supply module are mutually connected through the middle plate module to realize indirect signal interconnection, and the modules are basically not required to be connected through data cables, so that the use amount of the data cables can be reduced as much as possible, and the server is convenient to maintain. On this basis, through set up each module partition in quick-witted incasement portion, and then can conveniently, swiftly carry out the independent dismouting maintenance operation of each module, convenience of customers maintains and manages the hardware, effectively promotes maintenance efficiency and reduces maintenance cost.
Drawings
For a more obvious and understandable description of embodiments of the utility model or solutions according to the prior art, reference will be made to the accompanying drawings, which are used in the description of the embodiments or the prior art and which are examples of the utility model, and from which other drawings can be obtained without inventive effort for a person skilled in the art.
FIG. 1 is an exploded view of a server provided by an embodiment of the present utility model;
FIG. 2 is a schematic diagram of the front side of a server according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a back side of a server according to an embodiment of the present utility model;
Fig. 4 is a schematic structural diagram of a motherboard module according to an embodiment of the present utility model under a first viewing angle;
fig. 5 is a schematic diagram of a partial structure of a motherboard module according to an embodiment of the present utility model;
fig. 6 is a schematic structural diagram of a motherboard module according to an embodiment of the present utility model under a second viewing angle;
FIG. 7 is an isometric cutaway view of a portion of a motherboard module structure provided in accordance with an embodiment of the present utility model;
FIG. 8 is a partial enlarged view at D in FIG. 7;
Fig. 9 is a schematic diagram of cooperation between a motherboard module and a chassis according to an embodiment of the present utility model;
FIG. 10 is an enlarged view of a portion of FIG. 9 at C;
FIG. 11 is a cross-sectional view of a GPU board card module mated with a chassis according to an embodiment of the present utility model;
FIG. 12 is an enlarged view of a portion of FIG. 11 at A;
Fig. 13 is a schematic structural diagram of a GPU board card module according to an embodiment of the present utility model;
fig. 14 is a partial enlarged view at B in fig. 13;
fig. 15 is a schematic structural diagram of a power module according to an embodiment of the present utility model;
fig. 16 is a schematic structural diagram of a middle board module according to an embodiment of the present utility model;
FIG. 17 is an isometric cutaway view of a server with portions removed from the server according to an embodiment of the present utility model;
FIG. 18 is an enlarged partial view at E in FIG. 17;
Fig. 19 is a schematic diagram of cooperation between a middle plate module and a chassis according to an embodiment of the present utility model;
FIG. 20 is a cut-away view of an axle of a chassis mated with a midplane module provided in an embodiment of the utility model;
fig. 21 is a partial enlarged view of F in fig. 20;
fig. 22 is a schematic structural diagram of a middle board module according to a second embodiment of the present utility model;
FIG. 23 is a schematic diagram of a fan module according to an embodiment of the present utility model;
FIG. 24 is a schematic diagram of a dual-width PCIe board card module provided by an embodiment of the utility model;
FIG. 25 is a schematic diagram of an IO module according to an embodiment of the present disclosure;
FIG. 26 is a schematic diagram of a two-card PCIe module provided in an embodiment of the present utility model;
FIG. 27 is a schematic diagram of a four card PCIe module provided in an embodiment of the present utility model;
fig. 28 is a schematic structural diagram of a chassis according to an embodiment of the present utility model.
In the figure:
10. A main board module; 101. 3.5 inch hard disk; 102. 2.5 inch hard disk; 103. front IO board card; 104. a first operating handle; 105. a fan assembly; 106. a motherboard card; 1061. a motherboard cable connector; 10611. a sixth guide pin; 1062. an IO connector; 1063. a motherboard power connector; 107. PCIE SWITCH board cards; 1071. a first PCIe connector; 1072. a first high density connector; 10721. a seventh guide groove; 1073. a second PCIe connector; 1074. a first guide; 10741. a first guide groove; 1075. a tray; 10751. an I-shaped nail; 1076. a fourth guide member; 10761. a fourth guide groove; 1077. a fifth guide; 10771. a fifth guide groove; 108. leading PCIe board card; 109. a first base; 1091. a second limiting piece; 10911. the second limit groove; 10912. the second limit edge folding; 1092. a mounting member; 10921. a limiting hole;
20. A GPU board card module; 201. a second operating handle; 202. a guide structure; 2021. a threaded hole; 2022. a slideway; 203. GPU board card; 2031. a second high density connector; 2032. a second guide; 20321. a second guide groove; 2033. a first power connector; 204. a second base;
30. A power module; 301. a power supply; 302. a power backboard; 3021. a second power connector; 3022. a third power connector; 3023. a third guide member; 30231. a third guide groove; 303. a protective shell;
40. A middle plate module; 401. a middle plate bracket; 4011. a first limit groove; 402. a middle plate board card; 4021. a third high density connector; 40211. a seventh guide pin; 4022. a fourth high density connector; 4023. a fourth power connector; 4024. a fifth power connector; 4025. a sixth power connector; 4026. a first guide pin; 4027. a second guide pin; 4028. a third guide pin; 403. a fan power panel module; 4031. a support frame; 4032. a fan power panel; 4033. a seventh power connector; 4034. a first fan connector;
50. A dual-width PCIe board card module; 501. a first housing; 5011. a third operating handle; 502. a first PCIE RISER board; 5021. a first board card connector; 503. the first PCIe board card;
60. An IO module; 601. a second housing; 602. IO board card; 6021. a first golden finger; 603. OCP board card; 6031. a second golden finger; 604. a wind scooper;
70. A main board power supply;
80. Two-card PCIe module; 801. a third housing; 8011. a fourth operating handle; 802. a second PCIE RISER board; 8021. a second board card connector; 8022. a fourth guide pin; 803. the second PCIe board card;
90. Four-card PCIe module; 901. a fourth housing; 902. a third PCIE RISER board; 9021. a third board card connector; 9022. a fifth guide pin; 903. a third PCIe board card;
100. A fan module; 1001. a support housing; 1002. a second fan connector; 1003. a fan;
110. A chassis; 1101. a chassis base; 11011. a first roller; 11012. a first limit nail; 11013. the second limit nail; 1102. a reinforcing member; 11021. a second roller; 1103. a first separator; 1104. a second separator; 1105. a first limiting member; 11051. a U-shaped member; 11052. a first limit flanging; 1106. a case ear; 1107. a handle; 1108. a chassis upper cover; 1109. a plug.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.
In the description of the present utility model, unless explicitly stated and limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
Further, as shown in fig. 1, the server includes a chassis 110, and a motherboard module 10, a GPU board module 20, a power module 30, a middle board module 40 and a fan module 100, which are respectively and removably installed in the chassis 110, wherein connectors on the middle board module 40 are respectively and correspondingly plugged and matched with connectors on the GPU board module 20, the motherboard module 10, the power module 30 and the fan module 100, so as to realize signal interconnection. The main board module 10 is used for providing sufficient information storage and calculation space, the GPU board module 20 is mainly applied to the scene that a large amount of calculation resources are needed, the power supply module 30 is used for stably supplying power to the GPU board module 20 and the fan module 100, the fan module 100 is mainly used for radiating heat to the GPU board module 20, and the main board module 10 and the power supply module 30 respectively radiate heat through built-in fans. The middle plate module 40 is used for respectively realizing indirect signal interconnection between the GPU board module 20 and the main plate module 10, between the GPU board module 20 and the power supply module 30 and between the power supply module 30 and the fan module 100, so that data cables are not required to be used for interconnection basically between the modules, the use amount of the data cables is reduced, and the maintenance is convenient.
Specifically, as shown in fig. 2 and 3, the cavity inside the chassis 110 is divided into a region a, a region b and a region c from bottom to top, the three regions are relatively independent, the middle board module 40 divides the interior of the chassis 110 into a front side and a rear side, the motherboard module 10 is located in the front side region a, the GPU board module 20 is located in the front side region b, the power module 30 is located in the front side region c, and the fan module 100 is located in the rear side region b. Correspondingly, the connectors on the middle plate module 40 are also vertically distributed from bottom to top, so as to ensure that the connectors can be correctly plugged and matched in a one-to-one correspondence. By partitioning each module in the chassis 110, the independent disassembly, assembly and maintenance operations of each module can be conveniently and rapidly performed, so that a user can conveniently maintain and manage hardware, the maintenance efficiency is effectively improved, and the maintenance cost is reduced.
Typically, the chassis 110 is 8U high, the motherboard module 10 occupies 3U high, the GPU board module 20 occupies 4U high, and the power module 30 occupies 1U high.
Preferably, one of the guide groove and the guide pin is arranged beside the connector on the middle plate module 40, and the other of the guide groove and the guide pin is arranged beside the connector on the GPU board card module 20, the main board module 10, the power supply module 30 and the fan module 100, and the guide pin is in plug-in fit with the guide groove. Through the grafting cooperation of guide pin and guide way, play the guide effect at the in-process that two connectors were to inserting, ensure the accuracy that two connectors were to inserting. The specific structure of the guide slots and guide pins on each module is described in detail below.
Further, as shown in fig. 4 to 5, the motherboard module 10 includes a first base 109, a motherboard board 106 disposed at the bottom of the first base 109, a PCIE SWITCH board 107 disposed in the first base 109, and a fan module 105, where the pcie Switch board 107 is located above the motherboard board 106 and is connected to each other by a cable to implement signal interconnection, and a connector on the PCIE SWITCH board 107 is mated with a corresponding connector on the midplane module 40 in a plugging manner to implement signal interconnection. The fan assembly 105 is disposed at a middle position of the first base 109 along the front-rear direction, and the fan assembly 105 includes four 9256 fans for dissipating heat from the motherboard module 10.
Referring to fig. 1, 3 and 4, in order to improve the expansion performance of the server, 12 3.5 inch hard disks 101, 8 2.5 inch hard disks 102, a front IO board 103 and a front PCIe board 108 are disposed on the front side of the first base 109, and in the area c of the chassis 110 located on the rear side, 1 dual-width PCIe board module 50, 1 IO module 60 (including 1 OCP board 603 and 1 IO board 602), 2 motherboard power supplies 70, 2 two-card PCIe modules 80 and 1 four-card PCIe module 90 are additionally disposed, and connectors of the dual-width PCIe board module 50, the IO module 60 and the motherboard power supply 70 are respectively mated with corresponding connectors on the motherboard board 106, and connectors of the two-card PCIe module 80 and the four-card PCIe module 90 are respectively mated with corresponding connectors on the PCIE SWITCH board 107, so as to implement signal interconnection.
It should be noted that, the GPU board module 20, the motherboard module 10 and the power module 30 are all inserted from the front end of the chassis 110, and the fan module 100, the dual-width PCIe board module 50, the IO module 60, the motherboard power supply 70, the two-card PCIe module 80 and the four-card PCIe module 90 are all inserted from the rear end of the chassis 110, and the middle board module 40 is inserted above the chassis 110.
Further, referring to fig. 5 and 16, a first high-density connector 1072 is disposed at the rear end of the pcie Switch board 107, the midplane module 40 includes a midplane board 402, a third high-density connector 4021 is disposed on an area a of the midplane board 402, and the first high-density connector 1072 is inserted into the third high-density connector 4021, so as to implement PCIE SWITCH signal interconnection between the board 107 and the midplane board 402. The first high density connector 1072 is provided with a first guide 1074 on the side thereof, the first guide 1074 is provided with a first guide groove 10741, the third high density connector 4021 is provided with a first guide pin 4026 on the side thereof, and the first guide pin 4026 is in plug-in fit with the first guide groove 10741. In the process of inserting the first high-density connector 1072 and the third high-density connector 4021, the first guide pin 4026 is simultaneously inserted into the first guide groove 10741 to play a guiding role, so as to ensure the accuracy of inserting the first high-density connector 1072 and the third high-density connector 4021.
Further, as shown in fig. 6 to 8, the motherboard module 10 further includes an installation member 1092 and a tray 1075, the installation member 1092 is disposed at the rear side of the first base 109, the PCIE SWITCH board card 107 is fixed on the tray 1075, the installation member 1092 is disposed at the rear side of the first base 109 and is used for supporting the tray 1075, the installation member 1092 is also a die casting, the structural strength is higher, the tray 1075 is fixedly connected with the first base 109 and the installation member 1092, and the tray 1075 and the PCIE SWITCH board card 107 thereon are disposed in the first base 109 from top to bottom and are matched with the first base 109 and the installation member 1092.
Specifically, each end of the tray 1075 located at the left and right sides is fixedly connected with the first base 109 and the end portion of the mounting member 1092 through screws, so as to limit the position of the PCIE SWITCH board 107, a plurality of limiting holes 10921 with one open end are formed in the side edge of the mounting member 1092 extending along the left and right directions, i-shaped nails 10751 are convexly arranged at positions corresponding to the limiting holes 10921 at the bottom of the tray 1075, and the i-shaped nails 10751 are in limiting fit with the limiting holes 10921. In the above-mentioned setting, only locking screw at tray 1075 both ends, and intermediate position and unlocking screw, aim at when PCIE SWITCH on the integrated circuit board 107 first high density connector 1072 with the integrated circuit board 402 on the high size in middle of the integrated circuit board 107 through the suitable adjustment PCIE SWITCH integrated circuit board 107 in the middle of the high size for first guide pin 4026 and first guide slot 10741 can pinpoint, avoid the PCIE SWITCH integrated circuit board 107 high size bad because of the accumulated tolerance in the structural processing or the equipment process to influence the signal transmission problem between the integrated circuit boards. The middle position of the side edge of the tray 1075 is matched with the limit hole 10921 on the mounting piece 1092 through the i-shaped nail 10751, and in the height direction, the i-shaped nail 10751 has a certain height adjustment allowance relative to the limit hole 10921, so that the height and size of the PCIE SWITCH board 107 in the middle position are allowed to be adjusted, and meanwhile, the height adjustment range of the i-shaped nail 10751 can be limited, so that the adjustment range of the PCIE SWITCH board 107 in a height range is effectively limited.
Further, as shown in fig. 5, 26 and 27, the rear end of PCIE SWITCH boards 107 is further provided with 2 first PCIe connectors 1071 and 1 second PCIe connector 1073, each first PCIe connector 1071 is used for implementing signal interconnection with the corresponding second board connector 8021 on the two-card PCIe module 80, and the second PCIe connector 1073 is used for implementing signal interconnection with the third board connector 9021 on the four-card PCIe module 90. Preferably, a fourth guide 1076 is provided at a side of the first PCIe connector 1071, a fourth guide groove 10761 is provided on the fourth guide 1076, a fourth guide pin 8022 is provided at a side of the second board connector 8021, and the fourth guide pin 8022 is in plug-in fit with the fourth guide groove 10761. In the process of inserting the first PCIe connector 1071 and the second board connector 8021, the fourth guide pin 8022 is simultaneously inserted into the fourth guide groove 10761, so as to play a guiding role, and ensure the accuracy of inserting the first PCIe connector 1071 and the second board connector 8021. A fifth guide piece 1077 is arranged beside the second PCIe connector 1073, a fifth guide groove 10771 is formed in the fifth guide piece 1077, a fifth guide pin 9022 is arranged beside the third board card connector 9021, and the fifth guide pin 9022 is in plug-in fit with the fifth guide groove 10771. In the process of inserting the second PCIe connector 1073 and the third board connector 9021, the fifth guide pin 9022 is simultaneously inserted into the fifth guide groove 10771, so as to play a guiding role, and ensure the accuracy of inserting the second PCIe connector 1073 and the third board connector 9021.
Further, referring to fig. 5, 24 and 25, the back end of the motherboard board 106 has a motherboard cable connector 1061, an IO connector 1062, an OCP connector (not shown) and a motherboard power connector 1063, the motherboard cable connector 1061 is used for implementing signal interconnection with the first board connector 5021 on the dual-width PCIe board module 50, the IO connector 1062 is used for implementing signal interconnection with the first golden finger 6021 of the IO board 602 of the IO module 60, the OCP connector is used for implementing signal interconnection with the second golden finger 6031 of the OCP board 603 of the IO module 60, and the motherboard power connector 1063 is used for implementing signal interconnection with the connector on the motherboard power supply 70, so that the motherboard power supply 70 supplies power to the motherboard module 10, and the motherboard power supply 70 is a standard CRPS power supply of 12V. The sixth guide pin 10611 is provided on the motherboard cable connector 1061, the first board connector 5021 is provided with a sixth guide slot, and the sixth guide pin 10611 is matched with the sixth guide slot in the plugging process of the motherboard cable connector 1061 and the first board connector 5021, so as to play a guiding role and ensure the plugging accuracy of the motherboard cable connector 1061 and the first board connector 5021.
Further, as shown in fig. 9, 10 and 28, the bottom of the two inner side walls of the chassis 110 is further provided with a plurality of rotatable second rollers 11021, the plurality of second rollers 11021 are disposed at intervals along the front-rear direction, and the plurality of second rollers 11021 are slidably engaged with the bottom surface of the first base 109. The above arrangement provides a good position limiting effect for the insertion of the motherboard module 10 into the chassis 110, ensures the position accuracy of the motherboard module 10, and reduces the friction force to the first base 109 by rolling friction during the insertion and extraction of the motherboard module 10 into and from the chassis 110, thereby improving the smoothness of movement.
It should be noted that, firstly, the sliding fit of the two sides of the first base 109 with the second rollers 11021 on the two sides of the chassis 110 is used as the first stage guide during the connector plugging process, secondly, as shown in fig. 17 and 18, the first guide groove 10741 on the side of the first high density connector 1072 is matched with the first guide pin 4026 on the side of the third high density connector 4021 to be used as the second stage guide during the connector plugging process, and finally, the seventh guide groove 10721 of the first high density connector 1072 is matched with the seventh guide pin 40211 of the third high density connector 4021 to be used as the third stage guide during the connector plugging process, so that the position dimensional accuracy and signal integrity after the connector plugging can be ensured.
Preferably, as shown in fig. 10, a first limiting member 1105 is disposed at the inner side of the bottom of the chassis 110, a second limiting member 1091 is disposed at the bottom of the first base 109, the first limiting member 1105 includes a U-shaped member 11051 and first limiting flanges 11052 connected to two ends of the U-shaped member 11051, the second limiting member 1091 is bent inwards to form a second limiting flange 10912 and a second limiting groove 10911, and the first limiting flange 11052 is inserted into the second limiting groove 10911 and is in limiting fit with the second limiting groove 10911, and the U-shaped member 11051 is in limiting fit with the second limiting flange 10912. After the main board module 10 is inserted in place, the movement of the main board module 10 along the left-right direction and the up-down direction can be limited by the cooperation of the first limiting piece 1105 and the second limiting piece 1091, so that the stability of the connector in opposite insertion is ensured.
Further, in order to facilitate the operator to perform the operation of plugging and unplugging the motherboard module 10, as shown in fig. 4, in this embodiment, the left and right ends of the front side of the first base 109 are further provided with first operation handles 104. Specifically, the first operating handle 104 forms a rotational connection with the side edge of the first base 109, such that the first operating handle 104 is capable of rotational movement relative to the first base 109. In a normal state, the first operation handle 104 rotates to be closely attached to the side surface of the first base 109, so that storage is realized; in the plugging operation state, the first operation handle 104 rotates to a position far away from the first base 109, so that a worker can conveniently grasp and apply force by hand, and then insert the whole motherboard module 10 into the chassis 110, or pull the whole motherboard module 10 out of the chassis 110, so that the acting force during hand operation is reduced, and in the process of turning over the handle, the insertion force and the pulling-out force can be uniformly applied to the motherboard module 10, so that damage to the board connector due to excessive force is avoided. The specific structure and working principle of the first operating handle 104 are known in the art, and are not described herein.
Further, as shown in fig. 13 and 16, the GPU board module 20 includes a second base 204 and eight GPU boards 203 disposed in the second base 204, a second high density connector 2031 and a first power connector 2033 are disposed at a rear end of the GPU boards 203, a fourth high density connector 4022 and a fourth power connector 4023 are disposed on an area b of the middle board 402, the second high density connector 2031 and the fourth high density connector 4022 are plugged, so that the GPU boards 203 implement signal interconnection with the PCIE SWITCH boards 107 through the middle board boards 402, the first power connector 2033 and the fourth power connector 4023 are plugged, so that the GPU boards 203 implement signal interconnection with the power module 30 through the middle board 402, and the power module 30 supplies power to the GPU boards 203.
A second guide member 2032 is arranged between connectors on the GPU board 203, a second guide groove 20321 is arranged on the second guide member 2032, a second guide pin 4027 is arranged between connectors in the area b on the middle board 402, and the second guide pin 4027 is in plug-in fit with the second guide groove 20321. In the process of inserting the GPU board card module 20 and the middle board module 40, the second guide pins 4027 are simultaneously inserted into the second guide grooves 20321, so as to play a role in guiding, and ensure the accuracy of inserting each connector.
Further, as shown in fig. 11 to 14, two opposite outer side walls of the second base 204 along the left-right direction are respectively provided with a guiding structure member 202, the guiding structure member 202 is made of a composite material by die casting, for example, a common composite material such as an aluminum alloy, a magnesium alloy, an aluminum-magnesium alloy, etc., a slide 2022 extending along the front-rear direction is provided on the guiding structure member 202, a plurality of rotatable first rollers 11011 are provided on the inner side wall of the chassis 110, a plurality of first rollers 11011 are arranged at intervals along the front-rear direction, and the plurality of first rollers 11011 are in sliding fit with the slide 2022. The above arrangement provides a good position defining effect for the insertion of the GPU board module 20 into the chassis 110, ensures the position accuracy of the GPU board module 20, and reduces the friction force to the guide structural member 202 by rolling friction during the process of inserting and extracting the GPU board module 20 into and from the chassis 110, thereby improving the smoothness of movement. Meanwhile, since the guide structural member 202 is formed by die casting of a composite material, the structural strength is high, the width dimension of the slideway 2022 can be better ensured, and the dimensional accuracy of the installation position, which is affected by the production and processing tolerance and the weight of the whole GPU board card module 20, is reduced as much as possible when the guide structural member is matched with the first roller 11011.
Similarly, the GPU board module 20 and the middle board module 40 have three-stage guiding in the process of inserting, firstly, the sliding fit between the guiding structural members 202 on two sides of the second base 204 and the first rollers 11011 on two sides of the chassis 110 is used as the first-stage guiding in the process of inserting connectors, secondly, the second guiding grooves 20321 and the second guiding pins 4027 are matched to be used as the second-stage guiding in the process of inserting connectors, and finally, the guiding grooves of the connectors on the GPU board 203 and the guiding pins of the connectors in the area b on the middle board 402 are matched to be used as the third-stage guiding in the process of inserting connectors, so that the arrangement can ensure the position dimensional accuracy and the signal integrity after the connectors are inserted.
As shown in fig. 12 and 14, the guide structural member 202 is provided with a threaded hole 2021, a mounting hole is provided in a position on the chassis 110 corresponding to the threaded hole 2021, and a fastener sequentially penetrates through the mounting hole and the threaded hole 2021 to fix the guide structural member 202 and the chassis 110, wherein the fastener is a screw. During installation, the GPU board card module 20 is pushed forward and backward, after the installation is in place, the GPU board card module 20 is threaded with the threaded hole 2021 after penetrating through the installation hole through the fastener, so that the guide structural member 202 is fixed with the chassis 110, the GPU board card module 20 is fixed on the chassis 110, vibration of the GPU board card module 20 in the transportation process is avoided, and further damage of a connector on the GPU board card module 20 due to the influence of the vibration is avoided. Secondly, because the guide structural member 202 is formed by die casting of composite materials, the structural strength of the guide structural member 202 is high, and deformation is not easy to occur, so that the stability of connection can be ensured by connecting the fastener on the guide structural member 202, and damage to the connector is further avoided.
Further, referring to fig. 12, two first limiting pins 11012 are further disposed on two inner side walls of the chassis 110, and the first limiting pins 11012 are located on a moving path of the guide structural member 202 and can abut against a rear end of the guide structural member 202. The first limiting pin 11012 is used for limiting the insertion depth of the GPU board module 20, and when the rear end of the guiding structure 202 abuts against the first limiting pin 11012 during the process of inserting the GPU board module 20, the GPU board module 20 is installed in place.
Preferably, as shown in fig. 13, in order to facilitate the operator to implement the operation of plugging and unplugging the GPU board card module 20, in this embodiment, the left and right ends of the front side of the second base 204 are further provided with second operation handles 201 for facilitating plugging, and the structure and working principle of the second operation handles 201 are the same as those of the first operation handles 104, which are not described herein again.
Further, as shown in fig. 15 and 16, the power module 30 includes six power supplies 301 and a power supply back board 302 electrically connected to the six power supplies 301, a protective shell 303 is provided on the power supply back board 302, a second power connector 3021 is provided in a middle position of a rear end of the power supply back board 302, third power connectors 3022 are provided in two sides of the rear end of the power supply back board 302, and a fifth power connector 4024 and a sixth power connector 4025 are provided in an area c of the middle board 402. The second power connector 3021 is plugged into the fifth power connector 4024 to interconnect the power back plane 302 with the fan module 100 via the midplane board card 402 to power the fan module 100. The third power connector 3022 and the sixth power connector 4025 are plugged to enable the power backplane 302 to be interconnected with the GPU board module 20 through the middle board 402, so as to supply power to the GPU board module 20.
The second power connector 3021 is inserted and matched with the guide pin of the fifth power connector 4024 through the guide groove of the second power connector so as to realize guiding in the inserting process. The third power connector 3022 is provided with a third guide 3023 beside the third guide 3023, the third guide 3023 is provided with a third guide groove 30231, the sixth power connector 4025 on the middle board 402 is provided with a third guide pin 4028 beside the third power connector 4025, and the third guide pin 4028 is in plug-in fit with the third guide groove 30231 to realize guiding function in the plug-in process and ensure accuracy of plug-in of the second power connector 3021 and the fifth power connector 4024.
It should be noted that, referring to fig. 3 and 15, a plug 1109 is disposed on the area C of the rear end of the chassis 110, a plug connector of a C20 type is connected to the plug 1109 through a cable, a row of backboard connectors are further disposed on the power backboard 302 at the position shielded by the protective shell 303, the backboard connectors are plugged with the plug connectors, the plug 1109 is used for plugging an external power supply, and inputting 220V voltage to the power module 30 through the plug connectors, the power supply 301 converts the input 220V voltage into 54V voltage, and provides stable power supply for the GPU board card module 20 through a sixth power connector 4025 on the middle board card 402.
Further, as shown in fig. 16, the middle board module 40 further includes a middle board bracket 401, the middle board card 402 is disposed on the front side of the middle board bracket 401, and a plurality of hollow parts are disposed on the middle board bracket 401 to avoid positions corresponding to the connectors, the middle board bracket 401 is a die casting, so that structural strength is effectively improved, and poor connection caused by deformation of the middle board card 402 in the inserting process is avoided.
Preferably, as shown in fig. 19, the middle board module 40 is inserted into the chassis 110 from top to bottom, and in order to facilitate the insertion and extraction of the middle board module 40, a sliding slot extending along the up-down direction is provided on a side wall of the chassis 110, and the middle board bracket 401 can slide into the chassis 110 along the sliding slot. The above arrangement provides a good position defining effect for the middle plate module 40 to be inserted into the chassis 110, and ensures the position accuracy of the middle plate module 40.
Specifically, as shown in fig. 20 and 21, two rows of second spacing nails 11013 are provided on the side wall of the chassis 110, the two rows of second spacing nails 11013 are arranged at intervals in the front-rear direction to form a chute, the plurality of second spacing nails 11013 in each row are arranged at intervals in the up-down direction, and the middle plate bracket 401 abuts against one row of second spacing nails 11013 located at the rear side and is arranged at intervals with one row of second spacing nails 11013 located at the front side. That is, the width between the two rows of second spacing nails 11013 is slightly larger than the width of the middle plate bracket 401, the width difference is about 0.5mm, so that the insertion of the supporting member is facilitated, and when the GPU board card module 20 and the connectors on the middle plate board card 402 are inserted, the middle plate bracket 401 and the row of second spacing nails 11013 positioned at the front side are arranged at intervals of about 0.5mm, and the middle plate bracket 401 is abutted to the row of second spacing nails 11013 positioned at the rear side, namely the gap is designed to be 0 mm.
Further, as shown in fig. 22, the middle board module 40 further includes two fan power board modules 403, the fan power board modules 403 are plugged on the rear side of the middle board rack 401 from back to front, and connectors on the fan power board modules 403 are respectively plugged with connectors on the rear side of the middle board card 402 and connectors on the fan module 100, and each fan power board module 403 includes a support frame 4031 and a fan power board 4032 disposed on the support frame 4031. The side wall of the middle plate bracket 401 is provided with a first limit groove 4011 extending along the front-rear direction, and two ends of the middle plate bracket 401 can slide into the middle plate bracket 401 along the first limit groove 4011. The above arrangement provides a good position defining effect for inserting the fan power panel module 403 into the middle plate bracket 401, and ensures the position accuracy of the fan power panel module 403.
Specifically, referring to fig. 22 and 23, a seventh power connector 4033 and a plurality of first fan connectors 4034 are disposed on the fan power board 4032, and a fifth power connector 4024 is also disposed on the rear side of the board 402, and the seventh power connector 4033 is plugged into the fifth power connector 4024 on the rear side, so that the fan power board 4032 is interconnected with the power module 30 through the board 402. The fan module 100 specifically includes ten 8080 fan units, each fan unit includes a supporting housing 1001 and a fan 1003 disposed in the supporting housing 1001, a second fan connector 1002 is disposed on the fan 1003, and the second fan connector 1002 of each fan 1003 is plugged with a corresponding first fan connector 4034, so that the fan 1003 is interconnected with the power module 30 through a fan power board 4032 and a middle board card 402, so that the power module 30 supplies power to the fan 1003. It should be noted that, in the plugging process, the connector also has a corresponding guiding pin and a guiding groove to cooperate for guiding, which is not described herein.
Further, as shown in fig. 24, the dual-width PCIe board module 50 disposed in the chassis 110 includes a first housing 501, a first PCIe board 503 and a first PCIE RISER board 502 disposed on the first housing 501, the first PCIe board 503 is a dual-width PCIe board, the first PCIe board 503 is in plug-in fit with the first PCIE RISER board 502, the first PCIE RISER board 502 is provided with the first board connector 5021, and the first board connector 5021 is plugged with the motherboard cable connector 1061 on the motherboard board 106 to implement signal interconnection. In order to facilitate the operator to realize the plugging and unplugging operation of the dual-width PCIe board card module 50, in this embodiment, a third operation handle 5011 for facilitating plugging is further provided on the first housing 501, and the structure and the working principle of the third operation handle 5011 and the first operation handle 104 are the same, which are not described herein again.
Further, as shown in fig. 25, the rear-mounted IO module 60 in the chassis 110 includes a second housing 601, and an IO board 602 and an OCP board 603 disposed in the second housing 601, where a wind scooper 604 is covered on the OCP board 603, which is beneficial to heat dissipation. The edge of the IO board card 602 is provided with a first golden finger 6021, the edge of the OCP board card 603 is provided with a second golden finger 6031, the first golden finger 6021 is inserted with an IO connector 1062 on the motherboard board card 106, and the second golden finger 6031 is inserted with an OCP connector of the motherboard board card 106, so that signal connection between the IO module 60 and the motherboard board card 106 is realized.
Further, as shown in fig. 26, the two-card PCIe module 80 disposed in the chassis 110 includes a third housing 801, a second PCIE RISER board 802 disposed in the third housing 801, and two second PCIe boards 803, where the second PCIe boards 803 are half-height and half-length PCIe boards, the second PCIe boards 803 are in plug-in fit with the second PCIE RISER board 802, the second PCIE RISER board 802 is provided with the second board connector 8021, and the second board connector 8021 is plugged with the first PCIe connector 1071 on the PCIE SWITCH board 107, so as to realize signal connection between the two-card PCIe module 80 and the PCIE SWITCH board 107. In order to facilitate the operator to realize the plugging and disassembling operation of the two-card PCIe module 80, in this embodiment, a fourth operation handle 8011 that facilitates plugging is further provided on the third housing 801, and the structure and the working principle of the fourth operation handle 8011 and the first operation handle 104 are the same, which are not described herein.
Further, as shown in fig. 27, the four-card PCIe module 90 disposed in the chassis 110 includes a fourth housing 901, a third PCIE RISER board 902 disposed in the fourth housing 901, and four third PCIe boards 903, where the third PCIe boards 903 are half-height and half-length PCIe boards, the third PCIe boards 903 are in plug-in fit with the third PCIE RISER board 902, the third PCIE RISER board 902 is provided with the third board connector 9021, and the third board connector 9021 and the second PCIe connector 1073 on the PCIE SWITCH board 107 are plugged in each other, so that signal connection between the four-card PCIe module 90 and the PCIE SWITCH board 107 is achieved. It should be noted that, the four-card PCIe module 90 is similar to the two-card PCIe module 80 in structure, and has an operation handle for facilitating plugging, which is not described herein, and is mainly different in the number of PCIe boards, the four-card PCIe module 90 has four half-height half-length PCIe boards, and the two-card PCIe module 80 has two half-height half-length PCIe boards, that is, at most 8 half-height half-length PCIe boards can be mounted on the PCIE SWITCH boards 107.
Further, as shown in fig. 28, the chassis 110 includes a chassis base 1101 and a chassis upper cover 1108, where the chassis upper cover 1108 is fastened to the chassis base 1101 to form a closed space. The reinforcement 1102 is stacked on the inner side of the chassis 1101, and the reinforcement 1102 is riveted on the inner side of the chassis 1101, thereby improving the structural strength and stability of the chassis 110. The left and right ends of the chassis base 1101 are respectively provided with a case ear 1106, the case ear 1106 is used for fixing the whole server on other structures, and the case ear 1106 can also be used as a handle to carry out drawing operation on the server. The side of the chassis base 1101 is further provided with a handle 1107, and the handle 1107 can perform overturning motion and is stored on the side wall of the chassis base 1101, and when the server is required to be used, the server can be gripped by outwards overturning the server, so that the server can be lifted and carried.
Further, referring to fig. 28, a first partition 1103 and a second partition 1104 are further disposed in the chassis 110, and are specifically connected to side walls on two sides of the chassis base 1101, where the first partition 1103 and the second partition 1104 are respectively formed by die casting a composite material, such as an aluminum alloy, a magnesium alloy, etc., the first partition 1103 is located below the second partition 1104, the first partition 1103 is used for supporting the GPU board card module 20, and the second partition 1104 is used for supporting the power module 30. The first partition 1103 and the second partition 1104 formed by die casting high-strength alloy effectively improve the bearing capacity and the structural strength of the chassis base 1101, and ensure the stability and the reliability of the equipment in operation.
It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (10)
1. The server is characterized by comprising a chassis (110), and a main board module (10), a GPU board module (20), a power supply module (30), a middle board module (40) and a fan module (100) which are respectively installed in the chassis (110) in a pluggable manner, wherein connectors on the middle board module (40) are respectively in corresponding plug-in fit with connectors on the GPU board module (20), the main board module (10), the power supply module (30) and the fan module (100);
the inside cavity of machine case (110) is divided into region a, region b and region c from bottom to top in proper order, medium plate module (40) will machine case (110) inside is divided into front side and rear side, mainboard module (10) are located the front side in region a, GPU integrated circuit board module (20) are located the front side in region b, power module (30) are located the front side in region c, fan module (100) are located the rear side in region b.
2. The server according to claim 1, wherein one of a guide groove and a guide pin is provided at a side of a connector on the middle board module (40), and the other of the guide groove and the guide pin is provided at a side of a connector on the GPU board module (20), the motherboard module (10), the power module (30) and the fan module (100), respectively, and the guide pin is in plug-in fit with the guide groove.
3. The server according to claim 1, wherein the motherboard module (10) comprises:
A first base (109), wherein a first operation handle (104) is rotatably arranged on the first base (109);
a motherboard (106) disposed at the bottom of the first chassis (109);
PCIE SWITCH board cards (107) are arranged in the first base (109), the PCIE SWITCH board cards (107) are located above the main board cards (106) and are connected with the main board cards (106) through cables, and connectors on the PCIE SWITCH board cards (107) are in plug-in fit with corresponding connectors on the middle board modules (40);
and a fan assembly (105) disposed at a middle position of the first base (109) along the front-rear direction.
4. A server according to claim 3, wherein the motherboard module (10) further comprises a mounting member (1092) and a tray (1075), the mounting member (1092) is disposed on the rear side of the first base (109), the PCIE SWITCH board (107) is fixed on the tray (1075), and each end of the tray (1075) on the left and right sides is fixedly connected with the ends of the first base (109) and the mounting member (1092), respectively;
The side that installed part (1092) extended along left and right directions is equipped with one end open-ended spacing hole (10921), the bottom of tray (1075) with the position that spacing hole (10921) corresponds is protruding to be equipped with I-shaped nail (10751), I-shaped nail (10751) with spacing hole (10921) spacing cooperation.
5. A server according to claim 3, wherein the front side of the first base (109) is provided with a plurality of hard disks, a front IO board (103) and a front PCIe board (108);
The novel PCI express device is characterized in that a double-wide PCIe board card module (50), an IO module (60), a main board power supply (70), a two-card PCIe module (80) and a four-card PCIe module (90) are further arranged in the region c at the rear side of the case (110), the connectors of the double-wide PCIe board card module (50), the IO module (60) and the main board power supply (70) are respectively matched with the corresponding connectors on the main board card (106) in a plugging manner, and the connectors of the two-card PCIe module (80) and the four-card PCIe module (90) are respectively matched with the corresponding connectors on the PCIE SWITCH board card (107) in a plugging manner.
6. The server according to claim 1, wherein the GPU board card module (20) comprises:
A second base (204), a second operating handle (201) is rotatably arranged on the second base (204)
The GPU boards (203) are arranged in the second base (204), and connectors on the GPU boards (203) are in plug-in fit with corresponding connectors on the middle plate module (40).
7. The server according to claim 6, wherein two opposite outer side walls of the second base (204) along the left-right direction are respectively provided with a guiding structural member (202), a slideway (2022) extending along the front-rear direction is arranged on the guiding structural member (202), a plurality of rotatable first rollers (11011) are arranged on the inner side wall of the case (110), a plurality of first rollers (11011) are arranged at intervals along the front-rear direction, and a plurality of first rollers (11011) are in sliding fit with the slideway (2022).
8. The server according to claim 1, wherein the power module (30) comprises:
A plurality of power supplies (301);
and the power backboard (302) is electrically connected with the power supplies (301), and connectors on the power backboard (302) are in plug-in fit with corresponding connectors on the middle plate module (40).
9. The server according to claim 1, wherein the midplane module (40) comprises:
A middle plate bracket (401) which is arranged in the chassis (110) in a pluggable manner;
A middle board card (402) arranged on the front side of the middle board bracket (401), wherein a plurality of connectors are arranged on the middle board card (402);
The fan power panel module (403) is arranged at the rear side of the middle plate bracket (401), and connectors on the fan power panel module (403) are respectively in corresponding plug-in fit with connectors at the rear side of the middle plate card (402) and connectors on the fan module (100).
10. The server according to any one of claims 1 to 9, wherein a first partition board (1103) and a second partition board (1104) are disposed in the chassis (110), the first partition board (1103) is located below the second partition board (1104), the first partition board (1103) is used for supporting the GPU board module (20), and the second partition board (1104) is used for supporting the power module (30).
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323624568.4U CN221551170U (en) | 2023-12-28 | 2023-12-28 | Server |
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| CN202323624568.4U CN221551170U (en) | 2023-12-28 | 2023-12-28 | Server |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120371094A (en) * | 2025-06-26 | 2025-07-25 | 苏州元脑智能科技有限公司 | Server architecture |
| CN120390399A (en) * | 2025-06-26 | 2025-07-29 | 苏州元脑智能科技有限公司 | Plug-in mechanism and server architecture |
-
2023
- 2023-12-28 CN CN202323624568.4U patent/CN221551170U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120371094A (en) * | 2025-06-26 | 2025-07-25 | 苏州元脑智能科技有限公司 | Server architecture |
| CN120390399A (en) * | 2025-06-26 | 2025-07-29 | 苏州元脑智能科技有限公司 | Plug-in mechanism and server architecture |
| CN120390399B (en) * | 2025-06-26 | 2025-09-09 | 苏州元脑智能科技有限公司 | Plug-in box mechanism and server architecture |
| CN120371094B (en) * | 2025-06-26 | 2025-09-16 | 苏州元脑智能科技有限公司 | Server architecture |
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