CN221529920U - MOS tube parallel packaging device - Google Patents
MOS tube parallel packaging device Download PDFInfo
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- CN221529920U CN221529920U CN202322831123.7U CN202322831123U CN221529920U CN 221529920 U CN221529920 U CN 221529920U CN 202322831123 U CN202322831123 U CN 202322831123U CN 221529920 U CN221529920 U CN 221529920U
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 230000017525 heat dissipation Effects 0.000 claims description 21
- 230000008093 supporting effect Effects 0.000 claims description 19
- 239000000428 dust Substances 0.000 abstract description 17
- 230000000694 effects Effects 0.000 abstract description 16
- 239000012535 impurity Substances 0.000 abstract description 6
- 230000009471 action Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 210000001503 joint Anatomy 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model discloses a MOS tube parallel packaging device, which belongs to the technical field of MOS tubes and comprises a bottom plate, wherein MOS tube parallel modules are arranged on two sides of the bottom plate; the utility model sets up the dustproof assembly, moves the stop lever to make it take in the recess, the stop lever moves and extrudes the connecting spring, make it take place deformation, then insert the spliced pole on the mounting frame into the spliced groove on the roof, then loosen the stop lever, the connecting spring loses the external force effect and resumes the original appearance, drive the stop lever to insert into the stop groove, under the function of stop lever and stop groove, can carry on the spacing fixation to the spliced pole, thus can mount the mounting frame on the roof, thus can mount the dust screen above the radiating element of the radiating mechanism, under the function of the dust screen, can prevent the impurity such as dust in the external environment from falling onto the radiating element of the radiating mechanism, influence the radiating effect of the radiating element of the radiating mechanism.
Description
Technical Field
The utility model belongs to the technical field of MOS (metal oxide semiconductor) tubes, and particularly relates to a MOS tube parallel packaging device.
Background
Mos transistors are metal-oxide-semiconductor field effect transistors, or referred to as metal-insulator-semiconductors.
Chinese patent application number 202320290576.0 discloses a parallelly connected packaging hardware of MOS transistor, includes: a bottom plate; the top plate is arranged at the top of the bottom plate, and butt holes are formed in the front and the back of the top of the bottom plate and the front and the back of the bottom of the top plate; the MOS pipe parallel connection module, the back fixedly connected with stitch of MOS pipe parallel connection module, the top of roof is provided with the fin, the equal fixedly connected with spacing ring in both sides of fin, the inboard of spacing ring just is located the outside fixedly connected with joint piece of roof, the equal fixed mounting in both sides of fin has a book shape heat-conducting plate, spacing hole has all been seted up to the both sides of butt joint hole, the fixed surface of stitch is connected with the stopper. According to the MOS tube parallel packaging device provided by the utility model, the radiating fin and other structures can be selected to be used according to actual conditions, and part of the structures can be detached without using the device, so that the use cost can be reduced.
In the above patent, a folded heat-conducting plate and a heat-radiating fin for radiating are arranged between the MOS tube parallel module and the top plate, and in the subsequent use process, impurities such as dust in the external environment easily fall onto the heat-radiating fin, so that the heat-radiating effect of the heat-radiating fin is affected; in addition, pins on the MOS tube parallel module are directly inserted into the butt joint holes on the bottom plate, the pins bear the weight of the MOS tube parallel module, and the pins are easy to damage.
Disclosure of utility model
To solve the problems set forth in the background art. The utility model provides a MOS tube parallel packaging device which has the characteristics of ensuring heat dissipation effect and supporting stability.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a parallelly connected packaging hardware of MOS pipe, includes the bottom plate, the both sides of bottom plate all are provided with parallelly connected module of MOS pipe, and the below that just is located parallelly connected module of MOS pipe on the lateral wall of bottom plate is provided with supporting component, and the top of bottom plate is provided with the roof, is provided with cooling mechanism between roof and the parallelly connected module of MOS pipe, and cooling mechanism's top is provided with dustproof subassembly.
Preferably, the dustproof assembly comprises a mounting frame and a dustproof net, wherein the mounting frame is arranged above the top plate and above the heat dissipation mechanism, and one end, far away from the top plate, of the mounting frame is connected with the dustproof net.
Preferably, the dustproof assembly further comprises a plugging groove, a plugging rod, a limiting groove, a groove and a connecting spring, wherein the plugging rod is connected to two ends of one side of the mounting frame, which is close to the top plate, of the mounting frame, the plugging groove is formed in the side wall of the top plate and corresponds to the position of the plugging rod, the groove is formed in the side wall of the plugging groove, the limiting rod is connected to the inside of the groove, the limiting groove is formed in the side wall of the plugging rod and corresponds to the position of the limiting rod, and the connecting spring is connected between the limiting rod and the groove.
Preferably, the side wall of the limiting rod is connected with a limiting sliding block, and a limiting sliding groove is formed in the inner side wall of the groove and corresponds to the position of the limiting sliding block.
Preferably, one end of the limiting rod is provided with a pull groove, and the inner side wall of the pull groove is connected with an anti-slip pad.
Preferably, the supporting component comprises a fixing screw, a cavity, a sliding block, a connecting cylinder, a rotating ring and a supporting plate, wherein the cavity is formed in the side wall of the bottom plate, the fixing screw is connected to the inner side wall of the cavity, the sliding block is sleeved on the outer side wall of the fixing screw, one end of the sliding block is connected with the supporting plate, the connecting cylinder is connected to the lower portion of the sliding block, and the rotating ring is connected to the outer side wall of the fixing screw and located below the connecting cylinder.
Compared with the prior art, the utility model has the beneficial effects that:
1. The utility model sets up the dustproof assembly, moves the stop lever to make it take in the recess, the stop lever moves and extrudes the connecting spring, make it take place deformation, then insert the spliced pole on the mounting frame into the spliced groove on the roof, then loosen the stop lever, the connecting spring loses the external force effect and resumes the original appearance, drive the stop lever to insert into the stop groove, under the function of stop lever and stop groove, can carry on the spacing fixation to the spliced pole, thus can mount the mounting frame on the roof, thus can mount the dust screen above the radiating element of the radiating mechanism, under the function of the dust screen, can prevent the impurity such as dust in the external environment from falling onto the radiating element of the radiating mechanism, influence the radiating effect of the radiating element of the radiating mechanism.
2. According to the MOS tube parallel connection module, the support assembly is arranged, the MOS tube parallel connection module is inserted into the two side walls of the bottom plate, then the rotating ring is rotated to enable the MOS tube parallel connection module to rotate along the fixed screw rod, the rotating ring moves upwards to drive the connecting cylinder to move upwards, the connecting cylinder moves upwards to drive the sliding block to move along the cavity, the sliding block moves to drive the support plate to move, after the support plate is attached to the bottom wall of the MOS tube parallel connection module, the rotating ring stops rotating, under the action of the support plate, the support effect can be provided for the inserted MOS tube parallel connection module, and the inserting stability of the MOS tube parallel connection module is improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a cross-sectional view of the present utility model;
FIG. 3 is a cross-sectional view taken along the direction A-A in FIG. 2 in accordance with the present utility model;
FIG. 4 is an enlarged view of the utility model at B in FIG. 2;
FIG. 5 is a partial cross-sectional view of a connection state of a bottom plate and a MOS tube parallel module of the present utility model;
fig. 6 is an enlarged view of fig. 5C in accordance with the present utility model.
In the figure: 1. a heat dissipation mechanism; 2. a dust-proof assembly; 21. a mounting frame; 22. a dust screen; 23. a plug-in groove; 24. inserting a connecting rod; 25. a limit rod; 26. a limit groove; 27. a groove; 28. a connecting spring; 3. a bottom plate; 4. a top plate; 5. the MOS tube parallel connection module; 6. a support assembly; 61. a fixed screw; 62. a cavity; 63. a sliding block; 64. a connecting cylinder; 65. a rotating ring; 66. and a support plate.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1
Referring to fig. 1-6, the present utility model provides the following technical solutions: the utility model provides a parallelly connected packaging hardware of MOS pipe, includes bottom plate 3, and the both sides of bottom plate 3 all are provided with parallelly connected module 5 of MOS pipe, and the below that just is located parallelly connected module 5 of MOS pipe on the lateral wall of bottom plate 3 is provided with supporting component 6, and the top of bottom plate 3 is provided with roof 4, is provided with cooling mechanism 1 between roof 4 and parallelly connected module 5 of MOS pipe, and cooling mechanism 1's top is provided with dustproof subassembly 2.
Specifically, the dustproof assembly 2 comprises a mounting frame 21 and a dustproof net 22, the mounting frame 21 is arranged above the top plate 4 and above the heat dissipation mechanism 1, one end of the mounting frame 21 far away from the top plate 4 is connected with the dustproof net 22,
Through adopting above-mentioned technical scheme, install the roof 4 with the installing frame 21 to can install the dust screen 22 to the radiating part top of radiating mechanism 1, under the effect of dust screen 22, can prevent impurity such as dust in the external environment to fall to the radiating part of radiating mechanism 1 on, influence the radiating effect of the radiating part of radiating mechanism 1.
Specifically, the dustproof assembly 2 further comprises a plugging groove 23, a plugging rod 24, a limiting rod 25, a limiting groove 26, a groove 27 and a connecting spring 28, wherein the plugging rod 24 is connected to two ends of one side of the mounting frame 21 close to the top plate 4, the plugging groove 23 is arranged on the side wall of the top plate 4 and corresponds to the position of the plugging rod 24, the groove 27 is arranged on the side wall of the plugging groove 23, the limiting rod 25 is connected to the inside of the groove 27, the limiting groove 26 is arranged on the side wall of the plugging rod 24 and corresponds to the position of the limiting rod 25, the connecting spring 28 is connected between the limiting rod 25 and the groove 27,
Through adopting above-mentioned technical scheme, pulling gag lever post 25 makes its income to recess 27 inside, and gag lever post 25 removes extrusion coupling spring 28, makes its deformation, again with the grafting pole 24 on the installing frame 21 peg graft to the grafting groove 23 on the top board 4 inside, then loosen gag lever post 25, coupling spring 28 loses external force effect and resumes the original appearance, drives gag lever post 25 peg graft to the inside of spacing groove 26, under the effect of gag lever post 25 and spacing groove 26, can carry out spacing fixed to the grafting pole 24, and then be convenient for realize the dismouting operation of installing frame 21.
Specifically, the side wall of the limit rod 25 is connected with a limit slide block, the inner side wall of the groove 27 is provided with a limit slide groove at the position corresponding to the limit slide block,
Through adopting above-mentioned technical scheme, gag lever post 25 removes and drives the slider and move in the inside of spacing spout, under the sliding fit of slider and spacing spout, can provide the guide effect for the removal of gag lever post 25, improves the stability that gag lever post 25 removed.
Specifically, one end of the limiting rod 25 is provided with a pull groove, the inner side wall of the pull groove is connected with an anti-slip pad,
Through adopting above-mentioned technical scheme, when operating personnel need stimulate gag lever post 25, insert the draw inslot portion with the hand, the application of force drives gag lever post 25 and removes again, and the hand is pegged graft at the in-process of the inside application of force of draw inslot, and the slipmat can avoid operating personnel's hand to take place to skid the phenomenon, influences the pulling operation of gag lever post 25.
When the MOS parallel connection module is used, an operator inserts hands into the pull grooves, applies force to drive the limiting rods 25 to move so that the limiting rods 25 are retracted into the grooves 27, the limiting rods 25 move to squeeze the connecting springs 28 to deform, then the plugging rods 24 on the mounting frame 21 are plugged into the plugging grooves 23 on the top plate 4, then the limiting rods 25 are loosened, the connecting springs 28 lose the external force effect and restore the original appearance, the limiting rods 25 are driven to plug into the limiting grooves 26, under the action of the limiting rods 25 and the limiting grooves 26, the plugging rods 24 can be limited and fixed, the mounting frame 21 can be mounted on the top plate 4, the dust screen 22 can be mounted above the heat dissipation parts of the heat dissipation mechanism 1, under the action of the dust screen 22, impurities such as dust in the external environment can be prevented from falling onto the heat dissipation parts of the heat dissipation mechanism 1, the heat dissipation effect of the heat dissipation mechanism 1 is affected, then the MOS parallel connection module 5 is plugged onto the two side walls of the bottom plate 3, the MOS parallel connection module is attached to the side walls of the heat dissipation mechanism 1, and then the MOS parallel connection module is packaged, and the MOS parallel connection module is used in the peripheral heat dissipation mechanism 5 can be used in the process;
Example 2
This embodiment differs from embodiment 1 in that: the support component 6 comprises a fixed screw 61, a cavity 62, a sliding block 63, a connecting cylinder 64, a rotating ring 65 and a supporting plate 66, the side wall of the bottom plate 3 is provided with the cavity 62, the inside of the cavity 62 is connected with the fixed screw 61, the outer side wall of the fixed screw 61 is sleeved with the sliding block 63, one end of the sliding block 63 is connected with the supporting plate 66, the lower part of the sliding block 63 is connected with the connecting cylinder 64, the outer side wall of the fixed screw 61 is connected with the rotating ring 65 below the connecting cylinder 64,
When the MOS tube parallel connection module 5 is used, after the MOS tube parallel connection module 5 is inserted onto two side walls of the bottom plate 3, the rotating ring 65 is rotated to enable the MOS tube parallel connection module 5 to move along the fixed screw 61 in a rotating mode, the rotating ring 65 moves upwards to drive the connecting cylinder 64 to move upwards, the connecting cylinder 64 moves upwards to drive the sliding block 63 to move along the cavity 62, the sliding block 63 moves to drive the supporting plate 66 to move, after the supporting plate 66 is attached to the bottom wall of the MOS tube parallel connection module 5, the rotating ring 65 is stopped, under the action of the supporting plate 66, a supporting effect can be provided for the inserted MOS tube parallel connection module 5, and the inserting stability of the MOS tube parallel connection module 5 is improved.
The utility model discloses a structure and a principle of a heat dissipation mechanism 1 consisting of heat dissipation fins and a folded heat conduction plate in a parallel packaging device of MOS tubes, which is disclosed in China patent application No. 202320290576.0, and the working principle is as follows: the top of roof 4 is provided with the fin, the both sides of fin are all fixed mounting has a shape heat conduction board of rolling over, and in the follow-up use, under the effect of shape heat conduction board of rolling over, can be with the heat transfer on the parallelly connected module of MOS pipe 5 on the fin, reuse fin diffuses in the surrounding environment.
The working principle and the using flow of the utility model are as follows: the operator inserts the hand into the pull groove, then applies force to drive the limiting rod 25 to move so as to enable the limiting rod 25 to be retracted into the groove 27, the limiting rod 25 moves to squeeze the connecting spring 28 to deform, then the inserting rod 24 on the installation frame 21 is inserted into the inserting groove 23 on the top plate 4, then the limiting rod 25 is loosened, the connecting spring 28 loses the external force effect to restore the original appearance, the limiting rod 25 is driven to be inserted into the limiting groove 26, the inserting rod 24 can be limited and fixed under the action of the limiting rod 25 and the limiting groove 26, the installation frame 21 can be installed on the top plate 4, the dust screen 22 can be installed above the heat dissipation part of the heat dissipation mechanism 1, impurities such as dust in the external environment can be prevented from falling onto the heat dissipation part of the heat dissipation mechanism 1 under the action of the dust screen 22, the heat radiation effect of the heat radiation component of the heat radiation mechanism 1 is affected, the MOS tube parallel module 5 is inserted onto two side walls of the bottom plate 3, and is attached to the side wall of the heat radiation mechanism 1, the rotating ring 65 is rotated to enable the MOS tube parallel module 5 to rotate along the fixed screw 61, the rotating ring 65 moves upwards to drive the connecting cylinder 64 to move upwards, the connecting cylinder 64 moves upwards to drive the sliding block 63 to move along the cavity 62, the sliding block 63 moves to drive the supporting plate 66 to move, after the supporting plate 66 is attached to the bottom wall of the MOS tube parallel module 5, the rotating ring 65 stops rotating, under the action of the supporting plate 66, the supporting effect can be provided for the inserted MOS tube parallel module 5, the stability of the MOS tube parallel module 5 is improved, then the packaging work is carried out, and the MOS tube parallel module 5 is subjected to parallel packaging work, the heat generated by the operation of the MOS tube parallel connection module 5 can be diffused into the surrounding environment.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a parallelly connected packaging hardware of MOS pipe, includes bottom plate, its characterized in that: the MOS tube parallel connection module is arranged on two sides of the bottom plate, the supporting component is arranged on the side wall of the bottom plate and located below the MOS tube parallel connection module, the top plate is arranged above the bottom plate, the heat dissipation mechanism is arranged between the top plate and the MOS tube parallel connection module, and the dustproof component is arranged above the heat dissipation mechanism.
2. The MOS transistor parallel packaging apparatus of claim 1, wherein: the dustproof assembly comprises a mounting frame and a dustproof net, wherein the mounting frame is arranged above the top plate and above the heat dissipation mechanism, and one end, far away from the top plate, of the mounting frame is connected with the dustproof net.
3. The MOS transistor parallel packaging apparatus of claim 2, wherein: the dustproof assembly further comprises a plugging groove, a plugging rod, a limiting rod, limiting grooves, grooves and connecting springs, wherein the plugging rods are connected to two ends of one side of the mounting frame, which is close to the top plate, of the mounting frame, the plugging grooves are formed in the side walls of the top plate and correspond to the plugging rods, the grooves are formed in the side walls of the plugging grooves, the limiting rods are connected to the inner portions of the grooves, the limiting grooves are formed in the side walls of the plugging rods and correspond to the limiting rods, and the connecting springs are connected between the limiting rods and the grooves.
4. A MOS transistor parallel package according to claim 3, wherein: the side wall of the limiting rod is connected with a limiting sliding block, and a limiting sliding groove is formed in the inner side wall of the groove and corresponds to the position of the limiting sliding block.
5. A MOS transistor parallel package according to claim 3, wherein: one end of the limiting rod is provided with a pull groove, and the inner side wall of the pull groove is connected with an anti-slip pad.
6. The MOS transistor parallel packaging apparatus of claim 1, wherein: the support assembly comprises a fixing screw, a cavity, a sliding block, a connecting cylinder, a rotating ring and a supporting plate, wherein the cavity is formed in the side wall of the bottom plate, the fixing screw is connected to the inner side wall of the cavity, the sliding block is sleeved on the outer side wall of the fixing screw, one end of the sliding block is connected with the supporting plate, the connecting cylinder is connected to the lower portion of the sliding block, and the rotating ring is connected to the outer side wall of the fixing screw and located below the connecting cylinder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322831123.7U CN221529920U (en) | 2023-10-20 | 2023-10-20 | MOS tube parallel packaging device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322831123.7U CN221529920U (en) | 2023-10-20 | 2023-10-20 | MOS tube parallel packaging device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221529920U true CN221529920U (en) | 2024-08-13 |
Family
ID=92185537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322831123.7U Active CN221529920U (en) | 2023-10-20 | 2023-10-20 | MOS tube parallel packaging device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221529920U (en) |
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2023
- 2023-10-20 CN CN202322831123.7U patent/CN221529920U/en active Active
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