CN221516529U - Wafer lug electroforming template processing device - Google Patents
Wafer lug electroforming template processing device Download PDFInfo
- Publication number
- CN221516529U CN221516529U CN202323231141.8U CN202323231141U CN221516529U CN 221516529 U CN221516529 U CN 221516529U CN 202323231141 U CN202323231141 U CN 202323231141U CN 221516529 U CN221516529 U CN 221516529U
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- Prior art keywords
- cutting table
- electroforming
- cutting
- electric telescopic
- face
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- 238000005323 electroforming Methods 0.000 title claims abstract description 40
- 238000005520 cutting process Methods 0.000 claims abstract description 66
- 239000012535 impurity Substances 0.000 claims abstract description 24
- 230000000149 penetrating effect Effects 0.000 claims abstract description 12
- 239000000428 dust Substances 0.000 claims description 44
- 238000003698 laser cutting Methods 0.000 claims description 14
- 235000012431 wafers Nutrition 0.000 description 44
- 238000005457 optimization Methods 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
Landscapes
- Laser Beam Processing (AREA)
Abstract
The utility model relates to the technical field of wafer bump electroforming stencil processing, in particular to a wafer bump electroforming stencil processing device, which comprises a cutting table, wherein a connecting plate and a vertical plate which are distributed left and right are fixedly connected to the upper end surface of the cutting table, two first electric telescopic rods are connected to the right side of the vertical plate in a penetrating way, the left ends of the two first electric telescopic rods penetrate and extend to the left side of the vertical plate in a penetrating way and are provided with connecting frames, and bristles closely attached to the upper end surface of the cutting table are fixedly connected to the lower end surface of the connecting frames; an impurity collecting cavity positioned between the vertical plate and the connecting plate is formed in the cutting table, a collecting drawing box is movably connected in the impurity collecting cavity, and an opening communicated with the impurity collecting cavity is formed in the upper end face of the cutting table; and then the device is convenient for clear up the collection to the piece impurity automatic clearance of cutting bench upper end after the cutting is finished, prevents to remain the piece impurity to the cutting bench upper end and cause wearing and tearing to the wafer lug electroforming stencil outer wall of waiting to cut next.
Description
Technical Field
The utility model relates to the technical field of processing of wafer bump electroforming templates, in particular to a processing device of a wafer bump electroforming template.
Background
The wafer laser cutting device is a special laser cutting device for integrated circuits, LED wafers, gallium arsenide wafers and other semiconductor wafers, and in recent years, along with the rapid development of the photoelectric industry, the requirements of high-integration and high-performance semiconductor wafers are also increasing, wafer bumps are simply referred to as bumps, gold bumps are processed and manufactured after the wafers, and in the processing process of a wafer bump electroforming template, laser cutting is needed for the wafer bump electroforming template.
The existing device for laser cutting of the wafer bump electroforming template is inconvenient to clean the chip residue remained on the upper end of the cutting table after cutting the wafer bump electroforming template, and the chip residue is easy to abrade the outer wall of the wafer bump electroforming template when cutting the next wafer bump electroforming template, so that a wafer bump electroforming template processing device is needed to solve the above-mentioned problems.
Disclosure of utility model
The utility model aims to provide a wafer bump electroforming template processing device which has the characteristics of being convenient for automatically cleaning and collecting the scrap impurities at the upper end of a cutting table after cutting is finished and preventing the scrap impurities remained at the upper end of the cutting table from wearing the outer wall of a next wafer bump electroforming template to be cut.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the wafer bump electroforming stencil processing device comprises a cutting table, wherein the upper end surface of the cutting table is fixedly connected with a connecting plate and a vertical plate which are distributed left and right, the right side of the vertical plate is connected with two first electric telescopic rods in a penetrating manner, the left ends of the two first electric telescopic rods penetrate through and extend to the left side of the vertical plate and are provided with connecting frames, and the lower end surface of each connecting frame is fixedly connected with bristles closely attached to the upper end surface of the cutting table;
An impurity collecting cavity positioned between the vertical plate and the connecting plate is formed in the cutting table, a collecting drawing box is movably connected in the impurity collecting cavity, and an opening communicated with the impurity collecting cavity is formed in the upper end face of the cutting table;
The hydraulic rod is arranged on the upper end face of the cutting table and located between the two first electric telescopic rods, the connecting column is arranged at the output end of the hydraulic rod, the outer shell is arranged on the upper end face of the connecting column, the lower end face of the outer shell is provided with a groove in a penetrating mode, the right side of the outer shell is provided with a motor, the output end of the motor is detachably connected with a threaded rod, the left end of the threaded rod penetrates through the outer shell and is movably connected with the left side of the inner portion of the outer shell through a bearing, the outer wall of the threaded rod is connected with a threaded seat, and the lower end of the threaded seat penetrates through the groove and is provided with a laser cutting head.
In order to facilitate dust collection and treatment generated in the cutting process and avoid polluting the processing environment, the utility model provides a preferable processing device for a wafer bump electroformed stencil, wherein a dust collecting box is arranged on the left side of a cutting table, a suction fan is connected with the upper end surface of the dust collecting box in a penetrating way, a filter screen is arranged in the dust collecting box, a connecting pipe positioned below the filter screen is communicated with the left side of the dust collecting box, and the other end of the connecting pipe penetrates and extends to the right side of a connecting plate and is communicated with a dust suction hood.
In order to clamp and fix the wafer bump electroformed stencil to the upper end of the cutting table, as a preferred wafer bump electroformed stencil processing device of the utility model, the front side and the rear side of the upper end surface of the cutting table are fixedly connected with fixing plates between a vertical plate and a connecting plate, the outer walls of the two fixing plates are respectively connected with a second electric telescopic rod in a penetrating way, and the opposite ends of the two second electric telescopic rods are respectively provided with a clamping plate.
In order to facilitate the discharge of dust in the dust collection box, the processing device of the wafer bump electroforming stencil is preferable, wherein the lower end surface of the dust collection box is communicated with a calandria with a valve arranged on the outer wall.
In order to prevent the two clamping plates from damaging the outer wall of the wafer bump electroformed stencil, the wafer bump electroformed stencil processing device is preferably provided with rubber pads fixedly connected to opposite sides of the two clamping plates.
In order to control the operation and closing of the device conveniently, the front end face of the cutting table is preferably provided with a control panel positioned on the right side of the collecting box as a processing device of the wafer bump electroforming template.
Compared with the prior art, the utility model has the following beneficial effects:
When the wafer bump electroforming stencil is cut, the utility model is convenient for automatically cleaning and collecting the scraps and impurities at the upper end of the cutting table after the cutting is finished, and prevents the scraps and impurities remained at the upper end of the cutting table from wearing the outer wall of the wafer bump electroforming stencil to be cut next.
Drawings
FIG. 1 is an overall cross-sectional view of the present utility model;
FIG. 2 is a block diagram of a cutting table according to the present utility model;
Fig. 3 is a structural diagram of a connector of the present utility model.
In the figure: 1. a cutting table; 101. an impurity collection chamber; 102. an opening; 103. collecting a drawing box; 104. a connecting plate; 2. a hydraulic rod; 201. a connecting column; 202. a housing; 203. a motor; 204. a threaded rod; 205. a screw seat; 206. a laser cutting head; 3. a riser; 301. a first electric telescopic rod; 302. a connecting frame; 303. brushing; 4. a fixing plate; 401. a second electric telescopic rod; 402. a clamping plate; 5. a dust collection box; 501. a connecting pipe; 502. a dust hood; 503. a suction fan; 504. a filter screen; 505. a calandria; 6. and a control panel.
Detailed Description
Referring to fig. 1 to 3, a processing device for a wafer bump electroforming stencil includes a cutting table 1, wherein a connecting plate 104 and a riser 3 distributed left and right are fixedly connected to an upper end surface of the cutting table 1, two first electric telescopic rods 301 are connected to a right side of the riser 3 in a penetrating manner, left ends of the two first electric telescopic rods 301 penetrate and extend to a left side of the riser 3 and are provided with a connecting frame 302, and bristles 303 closely attached to the upper end surface of the cutting table 1 are fixedly connected to a lower end surface of the connecting frame 302;
An impurity collecting cavity 101 positioned between the vertical plate 3 and the connecting plate 104 is formed in the cutting table 1, a collecting drawer 103 is movably connected in the impurity collecting cavity 101, and an opening 102 communicated with the impurity collecting cavity 101 is formed in the upper end surface of the cutting table 1;
The hydraulic rod 2 that is located between two first electric telescopic rods 301 is installed to cutting table 1's up end, spliced pole 201 is installed to hydraulic rod 2's output, shell 202 is installed to spliced pole 201's up end, the fluting has been seted up in shell 202's lower terminal surface penetration, motor 203 is installed on shell 202's right side, motor 203's output can be dismantled and be connected with threaded rod 204, threaded rod 204's left end runs through shell 202 and through bearing and shell 202's inside left side swing joint, threaded rod 204's outer wall threaded connection has screw thread seat 205, the lower extreme of screw thread seat 205 passes the fluting and installs laser cutting head 206.
In this embodiment: when the wafer bump electroforming stencil is cut, the wafer bump electroforming stencil is fixed at the upper end of the cutting table 1, then the hydraulic rod 2 is started to drive the connecting column 201, the shell 202 and the laser cutting head 206 to descend, then the laser cutting head 206 and the motor 203 are started, the motor 203 drives the threaded rod 204 to rotate, the threaded seat 205 moves leftwards to drive the laser cutting head 206 to move leftwards to cut the wafer bump electroforming stencil, after the cutting is finished, the wafer bump electroforming stencil is taken down, the two first electric telescopic rods 301 are started, the two first electric telescopic rods 301 drive the connecting frame 302 to move leftwards, the bristles 303 brush the debris impurities remained at the upper end of the cutting table 1 leftwards and enter the collecting suction box 103 in the impurity collecting cavity 101 through the opening 102, and the device is convenient for automatically cleaning and collecting the debris impurities remained at the upper end of the cutting table 1 after the cutting is finished, and abrasion of the outer wall of the wafer bump electroforming stencil to be cut is prevented.
As a technical optimization scheme of the utility model, a dust collection box 5 is arranged on the left side of the cutting table 1, a suction fan 503 is connected to the upper end surface of the dust collection box 5 in a penetrating manner, a filter screen 504 is arranged in the dust collection box 5, a connecting pipe 501 positioned below the filter screen 504 is communicated with the left side of the dust collection box 5, and the other end of the connecting pipe 501 penetrates and extends to the right side of the connecting plate 104 and is communicated with a dust collection cover 502.
In this embodiment: in the cutting process, the suction fan 503 is started, generated dust enters the dust hood 502, then enters the dust collection box 5 through the connecting pipe 501, the dust is filtered through the filter screen 504, and filtered gas is discharged through the suction fan 503, so that dust generated in the cutting process is conveniently collected and treated, and pollution to the processing environment is avoided.
As a technical optimization scheme of the utility model, the front side and the rear side of the upper end surface of the cutting table 1 are fixedly connected with the fixing plates 4 positioned between the vertical plates 3 and the connecting plates 104, the outer walls of the two fixing plates 4 are respectively connected with the second electric telescopic rods 401 in a penetrating way, and the opposite ends of the two second electric telescopic rods 401 are respectively provided with the clamping plates 402.
In this embodiment: after the wafer bump electroforming stencil is placed on the upper end of the cutting table 1, the two second electric telescopic rods 401 are started, and the two second electric telescopic rods 401 drive the two clamping plates 402 to clamp and fix the wafer bump electroforming stencil on the upper end of the cutting table 1.
As a technical optimization scheme of the utility model, the lower end face of the dust collection box 5 is communicated with a calandria 505 with a valve arranged on the outer wall.
In this embodiment: the dust in the dust collection box 5 is discharged through the discharge pipe 505 by opening the valve, so that the dust in the dust collection box 5 is discharged conveniently.
As a technical optimization scheme of the present utility model, rubber pads are fixedly connected to opposite sides of the two clamping plates 402.
In this embodiment: the two clamping plates 402 fasten the wafer bump electroformed mold plate, and the two clamping plates 402 are prevented from damaging the outer wall of the wafer bump electroformed mold plate by a rubber pad.
As a technical optimization scheme of the utility model, the front end surface of the cutting table 1 is provided with a control panel 6 positioned on the right side of the collecting drawer 103.
In this embodiment: the operation and closing of the device are conveniently controlled by the control panel 6.
Working principle: when the wafer bump electroforming stencil is cut, after the wafer bump electroforming stencil is placed at the upper end of the cutting table 1, two second electric telescopic rods 401 are started, the two second electric telescopic rods 401 drive two clamping plates 402 to clamp and fix the wafer bump electroforming stencil at the upper end of the cutting table 1, then the hydraulic rod 2 is started to drive the connecting column 201, the shell 202 and the laser cutting head 206 to descend, then the laser cutting head 206 and the motor 203 are started, the motor 203 drives the threaded rod 204 to rotate, the threaded seat 205 moves leftwards to drive the laser cutting head 206 to move leftwards, the wafer bump electroforming stencil is cut, after the cutting is finished, the wafer bump electroforming stencil is taken down, the two first electric telescopic rods 301 are started, the two first electric telescopic rods 301 drive the connecting frame 302 to move leftwards, the bristles 303 brush debris impurities remained at the upper end of the cutting table 1 into the collecting suction box 103 in the impurity collecting cavity 101 through the opening 102, in the cutting process, the generated dust enters into the dust suction hood 502 through the dust collecting box 501, then enters the dust collecting box 5 through the dust collecting hood 504, the dust is filtered through the dust filtering pipe 504, the dust is discharged through the filter screen 505, and the dust collecting box is discharged through the dust collecting box 5 through the dust collecting fan 5.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (6)
1. The utility model provides a wafer lug electroforming stencil processingequipment, includes cutting table (1), its characterized in that: the cutting machine comprises a cutting table (1), wherein a connecting plate (104) and a vertical plate (3) which are distributed left and right are fixedly connected to the upper end face of the cutting table (1), two first electric telescopic rods (301) are connected to the right side of the vertical plate (3) in a penetrating manner, the left ends of the two first electric telescopic rods (301) penetrate through and extend to the left side of the vertical plate (3) and are provided with connecting frames (302), and bristles (303) which are tightly attached to the upper end face of the cutting table (1) are fixedly connected to the lower end face of the connecting frames (302);
An impurity collecting cavity (101) positioned between the vertical plate (3) and the connecting plate (104) is formed in the cutting table (1), a collecting drawing box (103) is movably connected in the impurity collecting cavity (101), and an opening (102) communicated with the impurity collecting cavity (101) is formed in the upper end face of the cutting table (1);
The utility model discloses a cutting table, including cutting platform (1), connecting column (201) is installed to the up end of cutting platform (1), hydraulic rod (2) that is located between two first electric telescopic handle (301), spliced pole (201) are installed to the output of hydraulic rod (2), shell (202) are installed to the up end of spliced pole (201), the lower terminal surface of shell (202) runs through and has seted up fluting, motor (203) are installed on the right side of shell (202), the output of motor (203) can be dismantled and be connected with threaded rod (204), the left end of threaded rod (204) runs through shell (202) and through the inside left side swing joint of bearing and shell (202), the outer wall threaded connection of threaded rod (204) has screw thread seat (205), the lower extreme of screw thread seat (205) passes fluting and installs laser cutting head (206).
2. The wafer bump electroforming stencil processing apparatus of claim 1, wherein: the dust collection device is characterized in that a dust collection box (5) is arranged on the left side of the cutting table (1), a suction fan (503) is connected to the upper end face of the dust collection box (5) in a penetrating mode, a filter screen (504) is arranged in the dust collection box (5), a connecting pipe (501) located below the filter screen (504) is communicated with the left side of the dust collection box (5), and the other end of the connecting pipe (501) penetrates through and extends to the right side of the connecting plate (104) and is communicated with a dust collection cover (502).
3. The wafer bump electroforming stencil processing apparatus of claim 1, wherein: the front side and the rear side of the upper end face of the cutting table (1) are fixedly connected with fixing plates (4) located between the vertical plates (3) and the connecting plates (104), the outer walls of the two fixing plates (4) are all connected with second electric telescopic rods (401) in a penetrating mode, and clamping plates (402) are installed at the opposite ends of the two second electric telescopic rods (401).
4. The wafer bump electroforming stencil processing apparatus of claim 2, wherein: the lower end face of the dust collection box (5) is communicated with a calandria (505) with a valve arranged on the outer wall.
5. A wafer bump electroforming stencil processing apparatus as recited in claim 3, wherein: rubber pads are fixedly connected to the opposite sides of the two clamping plates (402).
6. The wafer bump electroforming stencil processing apparatus of claim 1, wherein: the front end face of the cutting table (1) is provided with a control panel (6) positioned on the right side of the collecting drawer (103).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202323231141.8U CN221516529U (en) | 2023-11-29 | 2023-11-29 | Wafer lug electroforming template processing device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202323231141.8U CN221516529U (en) | 2023-11-29 | 2023-11-29 | Wafer lug electroforming template processing device |
Publications (1)
Publication Number | Publication Date |
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CN221516529U true CN221516529U (en) | 2024-08-13 |
Family
ID=92209895
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN202323231141.8U Active CN221516529U (en) | 2023-11-29 | 2023-11-29 | Wafer lug electroforming template processing device |
Country Status (1)
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CN (1) | CN221516529U (en) |
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2023
- 2023-11-29 CN CN202323231141.8U patent/CN221516529U/en active Active
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