CN221510127U - Cooling structure for controller - Google Patents

Abstract

The utility model relates to the technical field of cooling, in particular to a cooling structure for a controller, and aims to solve the problem that an existing vehicle-mounted controller is slow in heat dissipation after parking. For this purpose, the cooling structure provided by the utility model comprises a heat conduction assembly, a first heat conduction rubber block and a cooling assembly, wherein one part of the heat conduction assembly is connected with the controller by virtue of the heat conduction rubber block, and the other part of the heat conduction assembly is contacted with the cooling assembly. The cooling structure for the controller provided by the utility model can cool the controller in the running process of the automobile, and can cool the controller when the automobile stops running, so that the controller has a stable cooling effect, and the service life of the controller is greatly prolonged.

Description

Cooling structure for controller

Technical Field

The utility model relates to the technical field of cooling, and particularly provides a cooling structure for a controller.

Background

With the rapid development of economy, new energy automobiles have become a necessary tool for people to go out. New energy automobiles have relatively complex control systems themselves, and therefore require numerous and diverse controllers. In the driving process of the automobile, some controllers are always in a working state, and under the driving working condition of long-distance driving, once the outside higher temperature is met, certain hidden danger exists in the working controllers. The main protection mode for the controller is to perform cooling treatment. Although the controller can generate larger heat in the working state, if the heat dissipation is timely and the heat dissipation effect is good, the controller can continuously work for a longer time.

Currently, most new energy automobiles generally adopt an air cooling mode in terms of heat dissipation of a controller, namely, holes are reserved on a protective shell of the controller. When the automobile is in a running state, external air can be blown to the controller through the holes, and then heat of the controller is taken away in a mode of air flow. However, once the automobile stops running, the heat on the controller can be only slowly emitted, and at the moment, the controller is still affected by high heat.

Accordingly, there is a need in the art for a new cooling structure to address the above-described problems.

Disclosure of utility model

The utility model aims to solve the technical problem that the heat dissipation is slow after the vehicle-mounted controller is stopped. To this end, the utility model provides a cooling structure for a controller, the cooling structure comprising a heat conducting assembly, a first heat conducting glue block and a cooling assembly, a part of the heat conducting assembly being connected to the controller by means of the heat conducting glue block, another part of the heat conducting assembly contacting the cooling assembly.

In a specific embodiment of the above cooling structure for a controller, the heat conducting assembly includes a heat conducting cover and a heat conducting pipe, one end of the heat conducting pipe is connected to the heat conducting cover, the other end is connected to the cooling assembly, and the first heat conducting glue block is simultaneously contacted with the controller and the heat conducting cover.

In a specific embodiment of the above cooling structure for a controller, the upper surface of the heat conducting cover has a recess, and the recess is in contact with the first heat conducting glue block.

In a specific embodiment of the above cooling structure for a controller, the cooling structure further includes a heat dissipating component, the heat dissipating component includes a heat dissipating plate and a fin, the heat dissipating plate is disposed on a bottom wall of the recess, and the fin is disposed on the heat dissipating plate.

In a specific embodiment of the foregoing cooling structure for a controller, the cooling structure further includes a second heat-conducting glue block, and the second heat-conducting glue block is located between the heat dissipation plate and the bottom wall of the recess.

In a specific embodiment of the above cooling structure for a controller, the top ends of the fins are lower than or flush with the upper surface of the heat conducting cover.

In a specific embodiment of the foregoing cooling structure for a controller, the thickness of the second heat-conducting glue block is smaller than the thickness of the heat dissipation plate.

In a specific embodiment of the above cooling structure for a controller, a projection of the heat dissipating plate on the second heat conducting glue block is located in a surface of the second heat conducting glue block.

In a specific embodiment of the above cooling structure for a controller, the cooling assembly includes a cooling plate that is held in contact with the heat pipe, the cooling plate having an inner cavity for containing a cooling medium.

In a specific embodiment of the above cooling structure for a controller, the cooling plate includes a first communication pipe and a second communication pipe, both of which are disposed on the cooling plate and communicate with the inner cavity.

The cooling structure for the controller has the beneficial effects that: the cooling structure includes heat conduction subassembly, first heat conduction glue piece and cooling module, and heat conduction subassembly's a part is with the help of heat conduction glue piece connection director, i.e. one side contact director of first heat conduction glue piece, and opposite side contact heat conduction subassembly because there is the place of pothole on controller surface to heat conduction subassembly adopts the object of the metal material that common thermal conductivity is high generally, consequently, heat conduction subassembly's surface also can exist the place of pothole, places first heat conduction glue piece between heat conduction subassembly and controller. The first heat-conducting glue block can be filled in the hollow places by utilizing the flexibility of the first heat-conducting glue block, so that the heat-conducting surface area of the controller and the heat-conducting component is improved, and the heat on the controller is better transferred to the heat-conducting component; the other part of the heat conduction component is kept in contact with the cooling component, and the cooling component can absorb heat on the heat conduction component, so that heat generated by the controller during operation is reduced. This arrangement greatly improves the efficiency of heat transfer between the thermally conductive assembly and the cooling assembly.

Drawings

Preferred embodiments of the present utility model are described below with reference to the accompanying drawings, in which:

FIG. 1 is a schematic view of a cooling structure provided by the present utility model;

FIG. 2 is a top view of FIG. 1;

FIG. 3 is a cross-sectional view at A-A in FIG. 2;

FIG. 4 is a cross-sectional view at B-B in FIG. 2;

fig. 5 is a partial enlarged view of i in fig. 4.

In the figure: 1. a heat conducting component; 11. a heat conductive cover; 12. a heat conduction pipe; 2. a first heat conducting glue block; 3. a cooling assembly; 31. a cooling plate; 32. a first communication pipe; 33. a second communicating pipe; 4. a heat dissipation assembly; 41. a heat dissipation plate; 42. a fin; 5. the second heat-conducting glue block; 6. and a controller.

Detailed Description

It should be noted that, in the description of the present utility model, terms such as "upper," "lower," "left," "right," "inner," "outer," and the like indicate directional or positional relationships, and are based on the directional or positional relationships shown in the drawings, which are merely for convenience of description, and do not indicate or imply that the relevant devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the ordinal terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Furthermore, it should be noted that, in the description of the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium. The specific meaning of the above terms in the present utility model can be understood by those skilled in the art according to the specific circumstances.

As shown in fig. 1 to 5, the present utility model proposes a cooling structure for a controller, the cooling structure including a heat conduction assembly 1, a first heat conduction rubber block 2 and a cooling assembly 3, a part of the heat conduction assembly 1 is connected to the controller 6 via the heat conduction rubber block, and another part of the heat conduction assembly 1 contacts the cooling assembly 3.

In this embodiment, the cooling structure includes the heat conducting component 1, the first heat conducting glue block 2 and the cooling component 3, where a part of the heat conducting component 1 is connected to the controller 6 by means of the heat conducting glue block, that is, one side of the first heat conducting glue block 2 contacts the controller, and the other side contacts the heat conducting component 1, because there is a pothole on the surface of the controller, and the heat conducting component 1 is usually made of a metal material with a high heat conduction coefficient, there is a pothole on the surface of the heat conducting component 1, and the first heat conducting glue block 2 is placed between the heat conducting component 1 and the controller. By utilizing the flexibility of the heat conducting glue block, the first heat conducting glue block 2 can be filled in the hollow places, so that the heat conducting surface areas of the controller 6 and the heat conducting component 1 are improved, and the heat on the controller 6 is better transferred to the heat conducting component 1; the other part of the heat conducting component 1 is kept in contact with the cooling component 3, and the cooling component 3 can absorb heat on the heat conducting component 1, so that heat generated by the controller 6 during operation is reduced. This arrangement greatly improves the efficiency of heat transfer between the heat conducting assembly 1 and the cooling assembly 3.

The first heat conductive adhesive block 2 and the second heat conductive adhesive block 5 according to the present invention may be blocks or layers. That is, the first heat conductive glue block 2 is the same substance as the first heat conductive glue layer and is identical in structure.

Further, as shown in fig. 1 and 2, the heat conduction assembly 1 includes a heat conduction cover 11 and a heat conduction pipe 12, one end of the heat conduction pipe 12 is connected to the heat conduction cover 11, the other end is connected to the cooling assembly 3, and the first heat conduction glue block 2 is simultaneously in contact with the controller and the heat conduction cover 11.

In this embodiment, the heat conduction assembly 1 includes a heat conduction cover 11 and a heat conduction pipe 12, and the heat conduction cover 11 is covered on the controller and is used for protecting the controller. One end of the heat conducting pipe 12 is connected to the heat conducting cover 11, the other end of the heat conducting pipe 12 is connected to the cooling assembly 3, and the heat conducting pipe 12 is used for transferring heat on the heat conducting cover 11 to the cooling assembly 3. The first heat-conducting glue block 2 is arranged between the heat-conducting cover 11 and the controller, and at this time, the first heat-conducting glue block 2 is filled on the surfaces of the heat-conducting cover 11 and the controller, so that the heat-conducting surface area between the heat-conducting cover and the controller is increased.

It should be noted that the heat conduction pipe 12 may be replaced by another heat conduction body. The heat transfer tube 12 is used here to increase the surface area, and to allow self-heat dissipation when the heat transfer tube 12 transfers heat to the cooling module 3. When a solid heat conductor is used, the solid heat conductor transfers more heat to the cooling module 3. In addition, the physical heat conduction body can increase the weight of the whole equipment, and the applicable working condition range is reduced.

Further, as shown in fig. 4 and 5, the upper surface of the heat conductive cover 11 has a concave portion, and the concave portion is in contact with the first heat conductive paste 2.

In this embodiment, since the first heat-conducting glue block 2 is simultaneously contacted with the heat-conducting cover 11 and the controller, in order to reduce the usage amount of the first heat-conducting glue block 2, and also reserve a better heat dissipation space for the controller, the upper surface of the heat-conducting cover 11 is provided with a concave portion. The controller is located the below of first heat conduction glue piece 2, and first heat conduction glue piece 2 is located the below of depressed part, and the perpendicular distance of the structure of heat conduction lid 11 other parts and controller equals the perpendicular distance of depressed part plus the thickness of first heat conduction glue piece 2. This kind of setting form not only can reduce the quantity of first heat conduction glue piece 2, and then reduces the manufacturing cost of whole equipment, can also guarantee that heat conduction lid 11 reserves sufficient heat dissipation space for the controller to when guaranteeing that the heat transfer of first heat conduction glue piece 2 is not enough, the controller can dispel the heat to the surrounding space.

Further, as shown in fig. 4 and 5, the cooling structure further includes a heat dissipation assembly 4, the heat dissipation assembly 4 including a heat dissipation plate 41 and fins 42, the heat dissipation plate 41 being disposed on the bottom wall of the recess, the fins 42 being disposed on the heat dissipation plate 41.

In this embodiment, in order to further reduce the heat on the heat conducting cover 11, the cooling structure further includes a heat dissipating component 4, where the heat dissipating component 4 includes a heat dissipating plate 41 and fins 42, the heat dissipating plate 41 is disposed on the bottom wall of the recess, the fins 42 are plural and all disposed on the heat dissipating plate 41, and the plural fins 42 are disposed at the same distance. The heat dissipation component 4 and the first heat conduction glue block 2 are respectively arranged at two sides of the heat conduction cover 11. Because the concave part contacts with the first heat conduction glue block 2, therefore, for other positions on the heat conduction cover 11, the heat contained in the concave part is larger, and the heat dissipation component 4 is arranged in the concave part, so that the heat of the heat conduction cover 11 can be dissipated to the outside to the greatest extent in time.

The material of the heat dissipating member 4 may be the same as that of the heat conducting cover 11, and may be a material having high thermal conductivity, such as copper. The heat dissipation member 4 may be selected from a material having high thermal conductivity, and the heat conduction cover 11 may be selected from a material having a slightly poor thermal conductivity.

Further, as shown in fig. 4 and 5, the cooling structure further includes a second heat-conducting glue block 5, and the second heat-conducting glue block 5 is located between the heat dissipation plate 41 and the bottom wall of the recess.

In this embodiment, since the heat dissipating plate 41 is also made of metal, there is a depression on the surface of the heat dissipating plate 41 contacting the recess, and therefore, in order to increase the heat transferred between the heat dissipating plate 41 and the heat conducting cover 11, a second heat conducting glue block 5 is disposed between the heat dissipating plate 41 and the recess. The second heat-conducting glue block 5 fills the hollow on the heat dissipation plate 41, which is equivalent to increasing the contact area between the heat dissipation plate 41 and the heat-conducting cover 11.

Further, as shown in fig. 4 and 5, the tips of the fins 42 are lower than or flush with the upper surface of the heat conductive cover 11.

In this embodiment, in order to avoid the fin 42 from scratching other objects during use of the device, the height of the fin 42 is limited. The tips of the fins 42 do not protrude from the recess, i.e., the height of the fins 42 is lower than the upper surface of the heat conductive cover 11, or the height of the fins 42 is flush with the upper surface of the heat conductive cover 11.

It should be noted that, in order to facilitate the installation and removal of the heat dissipating assembly 4 and to improve the heat dissipating efficiency of the fins 42, a distance between the heat dissipating assembly 4 and the inner wall of the recess is moderate. The interval is not too small, which leads to poor heat dissipation effect; too large is not desirable and would result in an insufficient number of fins 42.

Further, as shown in fig. 4 and 5, the thickness of the second heat conductive paste 5 is smaller than the thickness of the heat dissipation plate 41.

In the present embodiment, in order to reduce the production cost, and the second heat-conducting glue piece 5 mainly serves to fill the depressions on the surface of the heat dissipation plate 41, the thickness of the second heat-conducting glue piece 5 may be smaller than the thickness of the heat dissipation plate 41. When the second heat-conducting glue block 5 is arranged between the heat dissipation plate 41 and the concave part, the second heat-conducting glue block 5 can not generate holes by itself under the gravity action of the heat dissipation plate 41.

In a practical application, the thickness of the second heat-conducting glue block 5 is 0.2mm, or the thickness of the second heat-conducting glue block 5 is 1/10-1/5 of the thickness of the heat dissipation plate 41.

Further, as shown in fig. 4 and 5, the projection of the heat dissipation plate 41 onto the second heat conduction glue block 5 is located in the surface of the second heat conduction glue block 5.

In this embodiment, the projection of the heat dissipating plate 41 on the second heat conducting glue block 5 is located in the surface of the second heat conducting glue block 5, which represents that the second heat conducting glue block 5 completely covers the surface of the heat dissipating plate 41 facing the heat conducting cover 11. This makes it possible to increase the heat conduction area between the heat dissipation plate 41 and the heat conduction cover 11 to the greatest possible extent, thereby improving the heat transfer efficiency.

Further, as shown in fig. 1 to 3, the cooling assembly 3 includes a cooling plate 31, the cooling plate 31 being held in contact with the heat conduction pipe 12, the cooling plate 31 having an inner cavity for accommodating a cooling medium.

In this embodiment, the cooling assembly 3 includes a cooling plate 31, and the cooling plate 31 is in contact with the heat conduction pipe 12, and has an inner cavity in the cooling plate 31, and a low-temperature cooling medium is contained in the inner cavity. The cooling medium may be a gas, a liquid or a solid as long as the temperature is sufficiently low. Because the temperature of the cooling plate 31 is low, heat can be spontaneously transferred to the cooling plate 31 from the heat conducting pipe 12, and then the cooling plate 31 is used for cooling the controller finally by means of the heat conducting cover 11 and the first heat conducting piece adhesive layer.

Further, as shown in fig. 1 to 3, the cooling plate 31 includes a first communicating pipe 32 and a second communicating pipe 33, and the first communicating pipe 32 and the second communicating pipe 33 are both provided on the cooling plate 31 and communicate with the inner cavity.

In this embodiment, in order to ensure that the cooling plate 31 always maintains a lower temperature in the process of cooling the controller, the cooling plate 31 may be provided with the first communication pipe 32 and the second communication pipe 33, the first communication pipe 32 and the second communication pipe 33 are both communicated with the inner cavity of the cooling plate 31, and the cooling medium in the cooling plate 31 is always at a lower temperature by being connected with the source of the external cooling medium, so that the cooling efficiency of the cooling assembly 3 to the controller is improved.

Thus far, the technical solution of the present utility model has been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of protection of the present utility model is not limited to these specific embodiments. Equivalent modifications and substitutions for related technical features may be made by those skilled in the art without departing from the principles of the present utility model, and such modifications and substitutions will fall within the scope of the present utility model.

Claims (10)

1. A cooling structure for a controller, characterized in that the cooling structure comprises a heat conducting component (1), a first heat conducting glue block (2) and a cooling component (3), wherein one part of the heat conducting component (1) is connected with the controller by means of the heat conducting glue block, and the other part of the heat conducting component (1) is contacted with the cooling component (3).

2. The cooling structure for a controller according to claim 1, wherein the heat conducting assembly (1) includes a heat conducting cover (11) and a heat conducting pipe (12), one end of the heat conducting pipe (12) is connected to the heat conducting cover (11), the other end is connected to the cooling assembly (3), and the first heat conducting glue block (2) is simultaneously in contact with the controller and the heat conducting cover (11).

3. The cooling structure for a controller according to claim 2, characterized in that the upper surface of the heat conductive cover (11) has a recess portion, which is in contact with the first heat conductive glue block (2).

4. A cooling structure for a controller according to claim 3, characterized in that the cooling structure further comprises a heat radiation member (4), the heat radiation member (4) comprising a heat radiation plate (41) and fins (42), the heat radiation plate (41) being provided on a bottom wall of the recess, the fins (42) being provided on the heat radiation plate (41).

5. The cooling structure for a controller according to claim 4, further comprising a second heat conductive glue block (5), the second heat conductive glue block (5) being located between the heat dissipation plate (41) and the bottom wall of the recess.

6. The cooling structure for a controller according to claim 5, wherein the tips of the fins (42) are lower than or flush with the upper surface of the heat conductive cover (11).

7. The cooling structure for a controller according to claim 5, wherein the thickness of the second heat conductive paste (5) is smaller than the thickness of the heat dissipation plate (41).

8. The cooling structure for a controller according to claim 5, characterized in that the projection of the heat radiating plate (41) onto the second heat conducting glue block (5) is located within the surface of the second heat conducting glue block (5).

9. The cooling structure for a controller according to any one of claims 3 to 8, characterized in that the cooling assembly (3) comprises a cooling plate (31), the cooling plate (31) being held in contact with the heat conducting tube (12), the cooling plate (31) having an inner cavity for accommodating a cooling medium.

10. The cooling structure for a controller according to claim 9, wherein the cooling plate (31) includes a first communication pipe (32) and a second communication pipe (33), the first communication pipe (32) and the second communication pipe (33) being both provided on the cooling plate (31) and communicating with the inner cavity.