CN221429225U - Circuit board dust adhering device - Google Patents
Circuit board dust adhering device Download PDFInfo
- Publication number
- CN221429225U CN221429225U CN202323412469.XU CN202323412469U CN221429225U CN 221429225 U CN221429225 U CN 221429225U CN 202323412469 U CN202323412469 U CN 202323412469U CN 221429225 U CN221429225 U CN 221429225U
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- dust
- frame
- circuit board
- cleaning
- lifting
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- 239000000428 dust Substances 0.000 title claims abstract description 132
- 238000004140 cleaning Methods 0.000 claims abstract description 47
- 238000004806 packaging method and process Methods 0.000 claims description 12
- 238000013461 design Methods 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 6
- 230000003068 static effect Effects 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 4
- 239000003292 glue Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims 2
- 238000000034 method Methods 0.000 abstract description 9
- 238000012545 processing Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 description 3
- 230000001680 brushing effect Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000005686 electrostatic field Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Cleaning In General (AREA)
Abstract
The circuit board dust adhering device comprises a mounting frame, a fixed feeding assembly and an electrostatic dust adhering assembly, wherein the fixed feeding assembly and the electrostatic dust adhering assembly are arranged on the mounting frame, the mounting frame comprises a longitudinal frame and a transverse frame, the transverse frame is horizontally arranged on the longitudinal frame, a horizontal chute is further formed in the inner side of the transverse frame, the fixed feeding assembly is clamped and arranged in the horizontal chute and can slide left and right, and the electrostatic dust adhering assembly is arranged on the longitudinal frame; the electrostatic dust-binding assembly comprises a first lifting frame, an insulating mounting plate and an electrostatic dust-binding plate. According to the utility model, the electrostatic dust-binding component is designed to carry out dust-binding and dust-removing on the surface of the circuit board, so that the circuit board is more reliable and efficient compared with the conventional dust-cleaning brush; the fixed feeding component is designed to automatically feed and discharge the circuit board, so that the processing efficiency is further improved, and the dust sticking and removing process is safer; the utility model has strong practicability and has stronger popularization significance.
Description
Technical Field
The utility model relates to a circuit board processing device, in particular to a circuit board dust-sticking device.
Background
The circuit board is also called a circuit board or a PCB, is an important electronic component, is a support body of an electronic component, and is a carrier for electrically connecting the electronic component with each other. Almost every electronic device, as small as an electronic watch, a calculator, as large as a computer, a communication electronic device, a military weapon system, and as long as there are electronic components such as an integrated circuit, a wiring board is used for electrically interconnecting the respective components. The circuit board consists of an insulating bottom plate, connecting wires and bonding pads for assembling and welding electronic elements, and has the dual functions of a conductive circuit and the insulating bottom plate.
In the process of producing the circuit board, if dust adheres to the outer surface, the printed circuits are affected, short circuits among the circuits are possibly caused, and even the circuit board is damaged in use, so that dust removal processing is required for the circuit board. The conventional circuit board dust removal mostly adopts manual cleaning, or the surface of the circuit board is cleaned by driving a roller brush tool through automatic equipment. But the scraping and brushing of the circuit board is easy to cause the surface abrasion, so that the quality of the circuit board product is greatly reduced.
Disclosure of utility model
Based on the above, it is necessary to provide a dust-sticking device for circuit boards in order to solve the drawbacks of the prior art.
The utility model provides a circuit board glues dirt device, its includes the mounting bracket and installs fixed pay-off subassembly, static on the mounting bracket and glue dirt subassembly, the mounting bracket includes vertical frame and horizontal frame, wherein horizontal frame level is installed on vertical frame, and this horizontal frame inboard still is equipped with horizontal spout, but fixed pay-off subassembly block is installed in horizontal spout and can slide side to side, static glues dirt subassembly and installs on vertical frame. The electrostatic dust adhering assembly comprises a first lifting frame, an insulating mounting plate and an electrostatic dust adhering plate, wherein the first lifting frame is of an n-shaped design, a first lifting sliding groove is formed in the outer side of the first lifting frame, lifting clamping blocks are correspondingly arranged on the longitudinal frame, the lifting clamping blocks are clamped in the first lifting sliding groove and can drive the first lifting frame to movably lift, the insulating mounting plate is arranged at the lower end of the first lifting frame, and the electrostatic dust adhering plate is arranged on the insulating mounting plate.
Further, the insulating mounting plate is connected to the lower end of the first lifting frame in a shaft mode, and the insulating mounting plate can rotate movably. The electrostatic dust adhering assembly comprises two electrostatic dust adhering plates which are respectively arranged on the upper surface and the lower surface of the insulating mounting plate.
Further, the fixed feeding assembly comprises two groups of fixed feeding clamps which are symmetrically arranged, and each fixed feeding clamp comprises a sliding rod, a lower clamp and an upper clamp. One end of the sliding rod is clamped and arranged in the horizontal sliding groove and can slide left and right, the lower clamp is fixedly arranged at the other end of the sliding rod, and the upper clamp is hinged on the lower clamp and can rotate movably.
Further, the sliding rod is of a movable telescopic structure design.
Further, the circuit board dust-sticking device further comprises a cleaning dust collection assembly, the cleaning dust collection assembly comprises a telescopic cylinder, a second lifting frame, a dust collector and a cleaning roller, and a second lifting chute is further formed in the inner side of the first lifting frame. The upper end of the telescopic cylinder is fixedly arranged on the first lifting frame, the second lifting frame is fixedly arranged at the lower end of the telescopic cylinder, two ends of the second lifting frame are respectively clamped in the second lifting sliding groove, a cleaning sliding groove is further formed in the bottom of the second lifting frame, the cleaner is designed to be provided with a lower end opening, the upper end of the cleaner is clamped and arranged in the cleaning sliding groove, and the cleaning roller is arranged in the lower end opening of the cleaner and can movably rotate.
Further, a dust collecting bag is arranged on the dust collector, and the dust collecting bag is clamped and arranged in the dust collector from one side of the dust collector.
Further, the circuit board dust-binding device further comprises an encapsulation shell, wherein the encapsulation shell is of a hollow structure design, and is sleeved outside the mounting frame, the fixed feeding component, the electrostatic dust-binding component and the cleaning dust-absorbing component. The left side and the right side of the packaging shell are also provided with feeding through holes communicated with the inside and the outside, and the two ends of the transverse frame extend to the outer side of the packaging shell from the feeding through holes respectively.
Further, the front side of the packaging shell is also provided with a cleaning opening and a sealing plate, the cleaning opening is communicated with the inside and the outside, and the sealing plate is clamped and arranged on the cleaning opening and can be lifted in an adjustable mode.
In summary, the circuit board dust-binding device has the following beneficial effects: the electrostatic dust-binding component is designed to carry out dust-binding and dust-removing on the surface of the circuit board, so that the dust-binding and dust-removing device is more reliable and efficient compared with the conventional dust-brushing and dust-removing device; the fixed feeding component is designed to automatically feed and discharge the circuit board, so that the processing efficiency is further improved, and the dust sticking and removing process is safer; the cleaning dust collection assembly is designed to automatically clean the electrostatic dust collection assembly, so that the circuit board cannot be polluted by dust in the dust collection process, and the dust collection effect of the circuit board is improved; the packaging shell is designed to avoid environmental pollution caused by dust splashing in the dust sticking and removing process; the utility model has strong practicability and has stronger popularization significance.
Drawings
FIG. 1 is a schematic diagram of a dust-sticking device for circuit board according to the present utility model;
FIG. 2 is a schematic cross-sectional view of FIG. 1
FIG. 3 is an exploded view of FIG. 2;
FIG. 4 is a schematic view of the mounting bracket of FIG. 3;
FIG. 5 is an exploded view of the stationary feed assembly of FIG. 3;
FIG. 6 is an exploded view of the electrostatic dust assembly of FIG. 3;
FIG. 7 is an exploded view of the cleaning and dust extraction assembly of FIG. 3;
Fig. 8 is an exploded view of the package of fig. 3.
Detailed Description
In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be described in further detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1 to 8, the present utility model provides a circuit board dust-binding device 100, which includes a mounting frame 10, a fixed feeding assembly 20 and an electrostatic dust-binding assembly 30 mounted on the mounting frame 10, wherein the mounting frame 10 includes a longitudinal frame 11 and a transverse frame 12, the transverse frame 12 is horizontally mounted on the longitudinal frame 11, a horizontal chute 121 is further disposed on the inner side of the transverse frame 12, and the fixed feeding assembly 20 is mounted in the horizontal chute 121 in a clamping manner and can slide left and right.
The fixed feeding assembly 20 includes two groups of symmetrically arranged fixed feeding clamps 21, and the fixed feeding clamps 21 include a sliding rod 211, a lower clamp 212 and an upper clamp 213. One end of the sliding rod 211 is mounted in the horizontal chute 121 in a clamping manner and can slide left and right, the lower clamp 212 is fixedly mounted at the other end of the sliding rod 211, and the upper clamp 213 is hinged on the lower clamp 212 and can rotate movably. Specifically, in this embodiment, the sliding rod 211 is designed as a movable telescopic structure.
The lower clamp 212 and the upper clamp 213 can clamp two opposite edges of the fixed circuit board, so that the circuit board is fixed, and the sliding rod 211 drives the lower clamp 212, the upper clamp 213 and the circuit board fixed by clamping to slide left and right, so that the circuit board and the electrostatic dust-binding assembly 30 are aligned up and down for dust-binding processing. The feeding and discharging processes of the circuit board are automatically carried out without manual intervention, so that the processing efficiency is greatly improved. The movable telescopic sliding rod 211 can adjust the interval between the fixed feeding clamps 21 at two sides, so that the fixed feeding assembly 20 can fix circuit boards with different widths for feeding.
The electrostatic dust-binding assembly 30 is mounted on the longitudinal frame 11. The electrostatic dust-binding assembly 30 comprises a first lifting frame 31, an insulating mounting plate 32 and an electrostatic dust-binding plate 33, wherein the first lifting frame 31 is of an n-shaped design, a first lifting sliding groove 311 is arranged on the outer side of the first lifting frame 31, lifting clamping blocks 111 are correspondingly arranged on the longitudinal frame 11, the lifting clamping blocks 111 are clamped in the first lifting sliding groove 311 and can drive the first lifting frame 31 to movably lift, the insulating mounting plate 32 is arranged at the lower end of the first lifting frame 31, and the electrostatic dust-binding plate 33 is arranged on the insulating mounting plate 32. Specifically, in this embodiment, the insulating mounting plate 32 is pivotally connected to the lower end of the first lifting frame 31, and the insulating mounting plate 32 is movably rotatable. The electrostatic dust-binding assembly 30 includes two electrostatic dust-binding plates 33, and the two electrostatic dust-binding plates 33 are respectively mounted on the upper and lower surfaces of the insulating mounting plate 32.
When the circuit board needs to be subjected to dust-binding operation, the first lifting frame 31 is utilized to drive the insulating mounting plate 32 and the electrostatic dust-binding plate 33 to descend, so that the surface of the electrostatic dust-binding plate 33 is as close as possible to the surface of the circuit board, and then the electrostatic dust-binding plate 33 is started, and the electrostatic field generated by the electrostatic dust-binding plate adsorbs dust and the like on the surface of the circuit board. When the dust on the surface of the circuit board is too much, the power of the single electrostatic dust-binding plate 33 is insufficient to fully absorb and clean, the first lifting frame 31 is lifted, and the insulating mounting plate 32 is rotated so as to switch the electrostatic dust-binding plate 33 on the other side to work. The electrostatic dust-sticking mode is adopted to replace the traditional brushing dust-removing mode, so that the circuit board can be furthest protected from being scratched.
The circuit board dust-sticking device 100 further comprises a cleaning and dust-absorbing assembly 40, the cleaning and dust-absorbing assembly 40 comprises a telescopic cylinder 41, a second lifting frame 42, a dust collector 43 and a cleaning roller 44, and a second lifting chute 312 is further arranged on the inner side of the first lifting frame 31. The upper end of the telescopic cylinder 41 is fixedly arranged on the first lifting frame 31, the second lifting frame 42 is fixedly arranged at the lower end of the telescopic cylinder 41, two ends of the second lifting frame are respectively clamped in the second lifting sliding groove 312, a cleaning sliding groove 421 is further formed in the bottom of the second lifting frame 42, the cleaner 43 is designed to be opened at the lower end, the upper end of the cleaner is clamped in the cleaning sliding groove 421, and the cleaning roller 44 is arranged in the opening at the lower end of the cleaner 43 and can rotate movably. Specifically, in this embodiment, the dust collector 43 is further provided with a dust collecting bag 45, and the dust collecting bag 45 is mounted in the dust collector 43 by being engaged with one side of the dust collector 43.
When a large amount of dust is adsorbed on the surface of the electrostatic dust-binding plate 33, only the insulating mounting plate 32 is required to be rotated to enable the dust surface of the accurate dust-binding plate to be vertically opposite to the dust collector 43, then the telescopic cylinder 41 drives the second lifting frame 42, the dust collector 43 and the cleaning roller 44 to descend until the cleaning roller 44 abuts against the surface of the electrostatic dust-binding plate 33, then the dust collector 43 and the cleaning roller 44 are started, the surface of the electrostatic dust-binding plate 33 is brushed through rotation of the cleaning roller 44, and the brushed dust is sucked and collected in the dust collecting bag 45 by the dust collector 43. The cleaning dust collection assembly 40 can keep the electrostatic dust-binding plate 33 clean, and prevent dust absorbed by the electrostatic dust-binding plate from scattering to cause secondary pollution to the circuit board. The removable design of the dust bag 45 facilitates cleaning of the cleaning assembly 40.
The circuit board dust-binding device 100 further comprises a packaging shell 50, wherein the packaging shell 50 is of a hollow structure design, and is sleeved outside the mounting frame 10, the fixed feeding component 20, the electrostatic dust-binding component 30 and the cleaning dust-absorbing component 40. The left and right sides of the package housing 50 are further provided with feeding through holes 51 which are communicated with each other, and two ends of the transverse frame 12 extend from the feeding through holes 51 to the outer side of the package housing 50. Specifically, in this embodiment, the front side of the package housing 50 is further provided with a cleaning opening 52 and a sealing plate 53, the cleaning opening 52 is internally and externally communicated, and the sealing plate 53 is mounted on the cleaning opening 52 in a clamping manner and can be lifted and lowered in an adjustable manner.
The packaging shell 50 is covered outside each component, and can separate the environment of dust-binding processing from the outside environment, so that the problem that dust generated by unexpected factors in dust-binding processing drifts outside and brings pressure to the production environment can be avoided. And the cleaning opening 52 formed on the packaging shell 50 is convenient for cleaning the internal components when the device is stopped, so that dust accumulation in the device is prevented from being excessive to influence the dust-sticking and dust-removing effects of the circuit board.
In summary, the circuit board dust-binding device 100 of the present utility model has the following advantages: the electrostatic dust-binding assembly 30 is designed to carry out dust-binding and dust-removing on the surface of the circuit board, so that the dust-binding and dust-removing device is more reliable and efficient compared with the conventional dust-brushing and dust-removing device; the fixed feeding component 20 is designed to automatically feed and discharge the circuit board, so that the processing efficiency is further improved, and the dust sticking and removing process is safer; the cleaning dust collection assembly 40 is designed to automatically clean the electrostatic dust collection assembly 30, so that dust can be prevented from secondary pollution to the circuit board in the dust collection process, and the dust collection effect of the circuit board is improved; the packaging shell 50 is designed to avoid environmental pollution caused by dust splashing in the dust-sticking and dust-removing process; the utility model has strong practicability and has stronger popularization significance.
The above examples illustrate only one embodiment of the utility model, which is described in more detail and is not to be construed as limiting the scope of the utility model. It should be noted that variations and modifications can be made by those skilled in the art without departing from the inventive concept, which fall within the scope of the utility model. Accordingly, the scope of the utility model should be determined from the following claims.
Claims (8)
1. A circuit board glues dirt device, its characterized in that: the static dust-binding device comprises a mounting frame, a fixed feeding component and a static dust-binding component, wherein the fixed feeding component and the static dust-binding component are arranged on the mounting frame, the mounting frame comprises a longitudinal frame and a transverse frame, the transverse frame is horizontally arranged on the longitudinal frame, a horizontal chute is further formed in the inner side of the transverse frame, the fixed feeding component is clamped and arranged in the horizontal chute and can slide left and right, and the static dust-binding component is arranged on the longitudinal frame; the electrostatic dust adhering assembly comprises a first lifting frame, an insulating mounting plate and an electrostatic dust adhering plate, wherein the first lifting frame is of an n-shaped design, a first lifting sliding groove is formed in the outer side of the first lifting frame, lifting clamping blocks are correspondingly arranged on the longitudinal frame, the lifting clamping blocks are clamped in the first lifting sliding groove and can drive the first lifting frame to movably lift, the insulating mounting plate is arranged at the lower end of the first lifting frame, and the electrostatic dust adhering plate is arranged on the insulating mounting plate.
2. The circuit board dust-binding apparatus of claim 1, wherein: the insulation mounting plate is connected to the lower end of the first lifting frame in a shaft way, and the insulation mounting plate can rotate movably; the electrostatic dust adhering assembly comprises two electrostatic dust adhering plates which are respectively arranged on the upper surface and the lower surface of the insulating mounting plate.
3. The circuit board dust-binding apparatus of claim 1, wherein: the fixed feeding assembly comprises two groups of symmetrically arranged fixed feeding clamps, and each fixed feeding clamp comprises a sliding rod, a lower clamp and an upper clamp; one end of the sliding rod is clamped and arranged in the horizontal sliding groove and can slide left and right, the lower clamp is fixedly arranged at the other end of the sliding rod, and the upper clamp is hinged on the lower clamp and can rotate movably.
4. A circuit board dust-binding apparatus as claimed in claim 3, wherein: the sliding rod is of a movable telescopic structure design.
5. The circuit board dust-binding apparatus of claim 1, wherein: the cleaning and dust collection device comprises a cleaning and dust collection assembly, a cleaning and dust collection device and a cleaning device, wherein the cleaning and dust collection assembly comprises a telescopic cylinder, a second lifting frame, a dust collector and a cleaning roller, and a second lifting chute is arranged on the inner side of the first lifting frame; the upper end of the telescopic cylinder is fixedly arranged on the first lifting frame, the second lifting frame is fixedly arranged at the lower end of the telescopic cylinder, two ends of the second lifting frame are respectively clamped in the second lifting sliding groove, a cleaning sliding groove is further formed in the bottom of the second lifting frame, the cleaner is designed to be provided with a lower end opening, the upper end of the cleaner is clamped and arranged in the cleaning sliding groove, and the cleaning roller is arranged in the lower end opening of the cleaner and can movably rotate.
6. The circuit board dust-binding apparatus of claim 5, wherein: the dust collector is also provided with a dust collecting bag, and one side of the dust collecting bag, which is from the dust collector, is clamped and arranged in the dust collector.
7. The circuit board dust-binding apparatus of claim 5, wherein: the electrostatic dust collection device also comprises an encapsulation shell, wherein the encapsulation shell is of a hollow structure design and is sleeved outside the mounting frame, the fixed feeding assembly, the electrostatic dust collection assembly and the cleaning dust collection assembly; the left side and the right side of the packaging shell are also provided with feeding through holes communicated with the inside and the outside, and the two ends of the transverse frame extend to the outer side of the packaging shell from the feeding through holes respectively.
8. The circuit board dust-binding apparatus of claim 7, wherein: the front side of the packaging shell is also provided with a cleaning opening and a sealing plate, the cleaning opening is communicated with the inside and the outside, and the sealing plate is clamped and arranged on the cleaning opening and can be lifted in an adjustable mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323412469.XU CN221429225U (en) | 2023-12-14 | 2023-12-14 | Circuit board dust adhering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323412469.XU CN221429225U (en) | 2023-12-14 | 2023-12-14 | Circuit board dust adhering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221429225U true CN221429225U (en) | 2024-07-26 |
Family
ID=91980137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323412469.XU Active CN221429225U (en) | 2023-12-14 | 2023-12-14 | Circuit board dust adhering device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221429225U (en) |
-
2023
- 2023-12-14 CN CN202323412469.XU patent/CN221429225U/en active Active
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| GR01 | Patent grant | ||
| GR01 | Patent grant |