CN221407280U - Wafer lifting structure of semiconductor equipment process chamber - Google Patents

Abstract

The utility model relates to the technical field of wafer processing and discloses a wafer lifting structure of a semiconductor equipment process cavity, which comprises an equipment main body, wherein a placing cavity is formed in the upper end face of the equipment main body, two U-shaped blocks are symmetrically and slidably arranged in the placing cavity of the equipment main body, limiting plates are fixedly arranged on the outer sides of the U-shaped blocks, the limiting plates are slidably arranged on the inner wall of the equipment main body, reset springs are fixedly arranged on the sides, away from each other, of the two limiting plates, the other ends of the reset springs are fixedly connected with the inner wall of the equipment main body, and an electric telescopic rod is fixedly arranged at the bottom of the inner side of the equipment main body.

Description

Wafer lifting structure of semiconductor equipment process chamber

Technical Field

The utility model relates to the technical field of wafer processing, in particular to a wafer lifting structure of a process chamber of semiconductor equipment.

Background

Wafers are wafers used in the manufacture of semiconductor circuits and are widely used in a variety of fields, and when the wafers are processed, the wafers need to be fixed to avoid shaking during the processing process, which leads to processing errors.

For example, patent of publication number CN204725306U discloses a crystal processing is with carrying device, including carrying tray, crystal standing groove, fixed plate, operation hole and fixed block, be equipped with a plurality of matrix arrangement's crystal standing groove on the carrying tray, carrying tray bilateral symmetry is provided with multiunit draw-in groove, and the bottom of draw-in groove is equipped with the separation button, carrying tray corresponds and is provided with the fixed plate that the size is the same, and the fixed plate both sides are equipped with the joint knot that corresponds with the draw-in groove, correspond on the fixed plate to be equipped with the operation hole the same with crystal standing groove size, and the asymmetry is provided with the protruding portion on the operation hole inward flange, is equipped with the cavity in the protruding portion, is provided with the spring in the cavity, and the fixed block surface is equipped with the slipmat.

Above-mentioned patent promotes the fixed block through the spring and carries out the centre gripping to the material and fix to improve the precision to material processing, but above-mentioned patent is when in actual use, needs manual to promote the fixed block to both sides, just can remove the fixed to the material, and the standing groove of the last material of device is generally all less simultaneously, leads to the staff to take out comparatively difficultly to the material.

Accordingly, in view of the above, the present invention provides a wafer lifting structure for a process chamber of a semiconductor device, which is improved with respect to the existing structure and the defects, so as to achieve the purpose of having more practical value.

Disclosure of utility model

In order to overcome the above-mentioned drawbacks of the prior art, the present utility model provides a wafer lifting structure of a process chamber of a semiconductor device, so as to solve the above-mentioned problems in the prior art.

The utility model provides the following technical scheme: the utility model provides a wafer of semiconductor equipment process chamber plays to rise structure, includes the equipment main part, the equipment main part up end has been seted up and has been placed the chamber, the equipment main part is placed intracavity symmetry slip and is run through and install two U-shaped pieces, all fixed mounting has the limiting plate in the U-shaped piece outside, the limiting plate all slides and sets up at equipment main part inner wall, two the side is all fixed mounting to the limiting plate mutual keeping away from, reset spring other end all fixed connection equipment main part inner wall, the inboard bottom fixed mounting of equipment main part has electric telescopic handle, electric telescopic handle slides and runs through the equipment main part and place the chamber, electric telescopic handle outside fixed mounting has isosceles trapezoid piece, isosceles trapezoid piece hypotenuse and two U-shaped piece one end slip conflict.

Further, the electric telescopic rod is fixedly provided with the pushing block in a penetrating mode, the bottom of the equipment main body placing cavity is provided with a placing groove corresponding to the pushing block, and the stability of placing the material on the pushing block is improved through the contact area of the pushing block lifting device when the material is ejected out.

Further, the upper end face fixed mounting of ejector pad has a rubber pad, a rubber pad surface is provided with the anti-skidding line, carries out flexible buffering for the material of placing on the ejector pad through a rubber pad, and the stability of material when placing can be improved to the setting of anti-skidding line simultaneously.

Further, the U-shaped block penetrates through the end of the equipment main body placing groove and is fixedly provided with two rubber pads, flexible contact is provided for clamping materials of the device through the two rubber pads, and damage to the materials possibly caused during clamping of the device is reduced.

Further, guide rods are fixedly arranged on the inner wall of the equipment main body, the guide rods penetrate through the two U-shaped blocks in a sliding mode, the guide rods are penetrated through the telescopic ends of the electric telescopic rods in a sliding mode, the U-shaped blocks are moved through the guide rods to guide, and therefore stability of the U-shaped blocks in clamping materials is improved.

Further, the inclined plane ends of the U-shaped blocks, which are abutted against the isosceles trapezoid blocks, are provided with corresponding wedges, and the inclined plane ends of the U-shaped blocks, which are abutted against the isosceles trapezoid blocks, are provided with the corresponding wedges, so that the isosceles trapezoid blocks can push the U-shaped blocks more stably.

The utility model has the technical effects and advantages that:

1. According to the utility model, the U-shaped block, the limiting plate, the reset spring, the electric telescopic rod and the isosceles trapezoid block are arranged, so that when the device is used, materials are clamped and fixed through movement of the U-shaped block, and when the materials are required to be taken out, the materials can be fixed by contacting only by controlling the lifting of the electric telescopic rod, and the practicability of the device is greatly improved.

2. According to the utility model, the guide rod is arranged, and when the device is used, the guide rod guides the movement of the U-shaped block, so that the stability of the U-shaped block when clamping materials is improved, and the practicability of the device is greatly improved.

Drawings

Fig. 1 is a schematic cross-sectional structure of the present utility model.

Fig. 2 is a schematic top view of the present utility model.

Fig. 3 is a schematic view of a partial enlarged structure at a in fig. 1 according to the present utility model.

Fig. 4 is a schematic view of a partial enlarged structure at B in fig. 1 according to the present utility model.

The reference numerals are: 100. an apparatus main body; 110. a U-shaped block; 111. a limiting plate; 112. a return spring; 113. an electric telescopic rod; 114. an isosceles trapezoid block; 120. a pushing block; 121. a rubber pad; 123. a second rubber pad; 124. a guide rod.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

Embodiment one: referring to fig. 1-4, the wafer lifting structure of a semiconductor device process chamber provided by the utility model comprises a device main body 100, a placing chamber is formed in the upper end surface of the device main body 100, two U-shaped blocks 110 are symmetrically and slidably installed in the placing chamber of the device main body 100, limiting plates 111 are fixedly installed on the outer sides of the U-shaped blocks 110, the limiting plates 111 are slidably arranged on the inner wall of the device main body 100, return springs 112 are fixedly installed on the sides, away from each other, of the two limiting plates 111, the other ends of the return springs 112 are fixedly connected with the inner wall of the device main body 100, an electric telescopic rod 113 is fixedly installed at the bottom of the inner side of the device main body 100, the telescopic end of the electric telescopic rod 113 slidably penetrates through the placing chamber of the device main body 100, an isosceles trapezoid block 114 is fixedly installed on the outer side of the telescopic rod of the electric telescopic rod 113, and the oblique sides of the isosceles trapezoid block 114 slidably abut against one ends of the two U-shaped blocks 110.

Working principle: when the device is used, the isosceles trapezoid block 114 at the outer side of the electric telescopic rod 113 is abutted against the wedge-shaped end of the U-shaped block 110 by controlling the lifting of the electric telescopic rod 113, so that the U-shaped block 110 is pushed to two sides, the U-shaped block 110 can move towards the inner wall of a placing cavity of the device main body 100 at the moment, the outer limiting plate 111 is driven to push and compress the reset spring 112, then the material is placed on the pushing block 120 on the ejected electric telescopic rod 113, the electric telescopic rod 113 is controlled to descend, the isosceles trapezoid block 114 is gradually far away from the U-shaped block 110, at the moment, the reset force of the reset spring 112 pushes the U-shaped block 110 through the limiting plate 111, so that the material in the placing cavity of the device main body 100 is clamped and fixed, and when the material is required to be taken out, the electric telescopic rod 113 is controlled to ascend, the fixing of the material by the U-shaped block 110 can be released, and the material ejection device can be used

Embodiment two:

The second embodiment differs from the first embodiment in that: the electric telescopic rod 113 fixedly installs the ejector pad 120 throughout the end, the standing groove that corresponds ejector pad 120 has been seted up to equipment main part 100 placement chamber bottom, the up end fixed mounting of ejector pad 120 has a rubber pad 121, a rubber pad 121 surface is provided with anti-skidding line, U-shaped piece 110 runs through equipment main part 100 standing groove end all fixed mounting has two rubber pads 123, equipment main part 100 inner wall fixed mounting has guide bar 124, guide bar 124 slip runs through two U-shaped pieces 110, and guide bar 124 is run through by electric telescopic rod 113 telescopic end slip, U-shaped piece 110 is contradicted isosceles trapezoid piece 114 inclined plane end and all is provided with corresponding wedge, during the use, promote the relief area to the material through ejector pad 120, provide the flexible contact with the material for U-shaped piece 110 and ejector pad 120 respectively through a rubber pad 121 and two rubber pads 123, when U-shaped piece 110 moves, provide the direction for the removal of U-shaped piece 110 through the guide bar 124 that runs through the U-shaped piece 110.

Finally: the foregoing is only illustrative of the preferred embodiments of the present utility model and is not to be construed as limiting the utility model, but rather as various modifications, equivalent arrangements, improvements, etc., within the spirit and principles of the present utility model.

Claims (6)

1. The utility model provides a wafer of semiconductor equipment process chamber plays to rise structure, includes equipment main part (100), place the chamber, its characterized in that has been seted up to equipment main part (100) up end: the device comprises a device body (100), wherein two U-shaped blocks (110) are symmetrically arranged in a placing cavity in a sliding and penetrating mode, limiting plates (111) are fixedly arranged on the outer sides of the U-shaped blocks (110), the limiting plates (111) are arranged on the inner wall of the device body (100) in a sliding mode, return springs (112) are fixedly arranged on the mutually far away sides of the limiting plates (111), the other ends of the return springs (112) are fixedly connected with the inner wall of the device body (100), an electric telescopic rod (113) is fixedly arranged at the bottom of the inner side of the device body (100), the telescopic ends of the electric telescopic rod (113) slide and penetrate through the placing cavity of the device body (100), isosceles trapezoid blocks (114) are fixedly arranged on the outer sides of the telescopic rods of the electric telescopic rod (113), and oblique sides of the isosceles trapezoid blocks (114) are in sliding and abutting with one ends of the two U-shaped blocks (110).

2. The wafer lifting structure of a process chamber of a semiconductor device of claim 1, wherein: the push block (120) is fixedly arranged at the penetrating end of the electric telescopic rod (113), and a placing groove corresponding to the push block (120) is formed in the bottom of the placing cavity of the equipment main body (100).

3. The wafer lifting structure of a process chamber of a semiconductor device of claim 2, wherein: the upper end face of the pushing block (120) is fixedly provided with a rubber pad (121), and the surface of the rubber pad (121) is provided with anti-skid patterns.

4. The wafer lifting structure of a process chamber of a semiconductor device of claim 1, wherein: two rubber pads (123) are fixedly arranged at the ends of the U-shaped blocks (110) penetrating through the placing grooves of the equipment main body (100).

5. The wafer lifting structure of a process chamber of a semiconductor device of claim 1, wherein: the guide rod (124) is fixedly arranged on the inner wall of the equipment main body (100), the guide rod (124) penetrates through the two U-shaped blocks (110) in a sliding mode, and the guide rod (124) is penetrated through the telescopic end of the electric telescopic rod (113) in a sliding mode.

6. The wafer lifting structure of a process chamber of a semiconductor device of claim 1, wherein: the inclined surface ends of the U-shaped blocks (110) which are abutted against the isosceles trapezoid blocks (114) are provided with corresponding wedges.