CN221354609U

CN221354609U - PCB single board and multilayer PCB board

Info

Publication number: CN221354609U
Application number: CN202323312443.8U
Authority: CN
Inventors: 陈广; 牛俊杰
Original assignee: APCB Electronics Shenzhen Co Ltd
Current assignee: APCB Electronics Shenzhen Co Ltd
Priority date: 2023-12-05
Filing date: 2023-12-05
Publication date: 2024-07-16
Anticipated expiration: 2033-12-05

Abstract

The embodiment of the utility model discloses a PCB single board and a multilayer PCB board, wherein the PCB single board comprises a substrate, a circuit layer arranged on at least one end face of the substrate and a connecting copper layer arranged on the substrate and surrounding the circuit layer, the end face of the connecting copper layer, which is opposite to the substrate, is provided with a plurality of glue flowing grooves, the connecting copper layer is fully paved with the glue flowing grooves, two ends of one glue flowing groove are directly communicated with at least one other glue flowing groove, so that any two glue flowing grooves can be directly or indirectly communicated, a preset angle is formed between every two adjacent glue flowing grooves, and the end part of each part of glue flowing groove is provided with the edge of the connecting copper layer. Through set up the gumming groove on connecting the copper layer for liquid glue on the connecting the copper layer can distribute more evenly, avoids coming unstuck and produces the bubble, in addition, the gumming groove that can also pass through these intercommunication on the connecting the copper layer transmits to the tip and offer the gumming groove to connecting the copper layer border, makes the board periphery in the pressfitting difficult deformation, guarantees the processingquality.

Description

PCB single board and multilayer PCB board

Technical Field

The utility model relates to the technical field of PCB (printed circuit board), in particular to a PCB single board and a multilayer PCB.

Background

Traditional multilayer PCB (Printed Circuit Board ) only need once pressfitting, along with the continuous development demand of PCB board, customer's product is more and more prone to accurate HDI (HIGH DENSITY Interconnector, high density interconnect board), and although HDI also belongs to the PCB board, the condition of multiple pressfitting production can appear when HDI board is produced. The board limit structure of traditional multilayer PCB board design inlayer board is, spreads holistic copper sheet at the board limit to increase a plurality of spaced gumming mouths at the edge of copper sheet, set up adhesive structure between two adjacent inner panels during the pressfitting, bond the copper sheet on two inlayer boards through adhesive structure, all know in the art, need high temperature high pressure to melt adhesive structure between the copper sheet when pressfitting multiply wood, wait to cool off the back and bond two-layer adjacent copper sheet together. In the pressing process, the glue flowing port is used for radiating heat and flowing out excessive glue.

However, the arrangement of the glue flowing port on the copper sheet in the related art is not reasonable, so that degumming is easily caused between the copper sheets, the lamination quality is affected, the heat dissipation effect of the copper sheet in the center of the related art is poor, and the deformation of the edges of the PCB board due to overheating is easily caused, so that the quality of the board is affected.

Disclosure of utility model

Accordingly, it is necessary to solve the above problems and provide a PCB board and a multi-layer PCB board which are not easy to degum during lamination and have good heat dissipation effect.

The embodiment of the utility model provides a PCB single board, which comprises:

a substrate;

a circuit layer disposed on at least one end surface of the substrate;

And the connecting copper layer is arranged on the substrate and surrounds the circuit layer, a plurality of gumming grooves are formed in the end face, facing away from the substrate, of the connecting copper layer, the gumming grooves are fully paved on the connecting copper layer, two ends of one gumming groove are directly communicated with at least one other gumming groove, so that any two gumming grooves can be directly or indirectly communicated, a preset angle is formed between two adjacent gumming grooves, and the end parts of the gumming grooves are partially formed to the edge of the connecting copper layer.

In some embodiments, a part of the glue flowing grooves are communicated end to end, so that a polygonal bonding block is formed between the part of the glue flowing grooves in a surrounding mode, a plurality of the glue flowing grooves are formed in a surrounding mode, a part of the glue flowing grooves which participate in forming one bonding block participate in forming a plurality of other bonding blocks surrounding the bonding blocks respectively, and the glue flowing grooves are arranged on the connecting copper layer in a net mode.

In some embodiments, a preset included angle is formed between two adjacent glue flowing grooves which form one adhesive block in a surrounding manner, and the preset included angles between every two adjacent glue flowing grooves are equal.

In some embodiments, an included angle between two adjacent glue flowing grooves is 120 °, and each six glue flowing grooves are surrounded to form one bonding block, so that the bonding blocks are arranged in a regular hexagon.

In some embodiments, the included angle between two adjacent glue flowing grooves is 90 °, and each four glue flowing grooves are surrounded to form one bonding block, so that the bonding block is arranged in a regular quadrangle.

In some embodiments, the glue flowing grooves are straight grooves, the width of the glue flowing grooves along the opening path is equal, the width of all the glue flowing grooves is equal, and the width of the glue flowing grooves is 0.15-0.55mm.

In some embodiments, the length of the gumming groove is 5.5-6.5mm.

In some embodiments, a plurality of spaced circuit layers are disposed on the substrate, the connection copper layer includes a peripheral portion and a middle portion, the peripheral portion is surrounded on the edge of the substrate, the middle portion is located at the interval between two adjacent circuit layers, and the glue flowing grooves are formed in the middle portion and the peripheral portion.

The embodiment of the utility model also provides a multi-layer PCB board, which comprises a plurality of the PCB single boards, wherein the PCB single boards are overlapped together, an adhesive layer is arranged between two adjacent PCB single boards, and the connecting copper layers on the two adjacent PCB single boards are connected through the adhesive layer.

In some embodiments, at least part of the structures of the gummosis grooves on the two connected copper layers are arranged opposite to the surfaces of the corresponding connected copper layers.

The embodiment of the utility model has the following beneficial effects:

According to the PCB single board and the multilayer PCB in the embodiment, through setting up the gumming groove on connecting the copper layer, communicate each other between these gumming grooves, through setting up these gumming grooves between the two-layer copper layer of connecting that needs pressfitting, the gumming groove is laid on connecting the copper layer, so that the liquid glue of each position on the copper layer of connecting can be accomodate in the gumming groove, make the liquid glue on the copper layer of connecting more evenly that can distribute, with the condition that does not have glue and cause the connection effect to reduce between the copper layer of avoiding connecting, but also can greatly reduced because of the probability that the surface of connecting the copper layer piles up too much glue and leads to producing the bubble, guarantee the stable pressfitting of each layer PCB.

In addition, the heat on the connecting copper layer can be transferred to the gumming grooves formed in the edges of the connecting copper layer through the communicated gumming grooves, so that the heat which is relatively close to the middle position of the connecting copper layer can flow out from the ends of the gumming grooves, the heat of the connecting copper layer and the whole board is reduced, the periphery of the board in the pressing process is not easy to deform, and the processing quality is guaranteed.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Wherein:

Fig. 1 shows a schematic structural diagram of a PCB veneer provided according to the present utility model;

fig. 2 shows another schematic structure of a PCB veneer provided according to the present utility model;

fig. 3 shows a schematic structural diagram of a multi-layer PCB board provided according to the present utility model.

Description of main reference numerals:

100. A PCB veneer; 110. a substrate; 120. a circuit layer; 130. connecting the copper layer; 131. a gumming groove; 132. an adhesive block; 133. a peripheral portion; 134. an intermediate portion; 200. and an adhesive layer.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Preferred embodiments of the present utility model are shown in the drawings. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The PCB (Printed Circuit Board ) board has a multi-layer board and a single-layer board, and the PCB board of the multi-layer board may be composed of a single-layer board and a double-layer board, or a single-layer board and a multi-layer board. Along with the continuous development demands of PCB circuit boards, customer products tend to precision HDI (HIGH DENSITY Interconnector, high-density interconnection boards), and the PCB boards can also be subjected to repeated lamination production (the traditional circuit boards only need to be laminated once) and are subjected to technological lamination layer by layer.

The multilayer PCB board generally has inlayer and skin, and traditional design inlayer limit structure is, lays holistic copper sheet at the limit to increase a plurality of gummosis mouths of certain width and length on the copper sheet. When the multilayer board is pressed, a rubber plate is required to be arranged between two adjacent layers of copper sheets, the rubber plate is clamped between the two adjacent layers of copper sheets, the rubber plate is melted and flows between the two layers of copper sheets through high temperature and high pressure, and the two layers of copper sheets can be bonded together through resolidification of the melted rubber after cooling.

However, the arrangement of the copper sheets in the related art is not reasonable, the copper sheet design in the related art is more suitable for one-time lamination, and for occasions needing multiple lamination, the glue layers between the copper sheets are easy to be distributed uniformly in the multiple lamination process, so that glue is not easy to be formed between part of the copper sheets, the glue is degummed, the bonding effect is affected, the situation that bubbles are easy to occur in the glue at high temperature and high pressure is caused, the copper sheets in the related art cannot be reasonably radiated, the periphery of the PCB is easy to deform, and the quality of the board is affected.

In view of the foregoing, in one aspect, the present utility model provides a PCB veneer for processing to form a PCB multi-layer board, where it is to be noted that, in the multi-layer PCB board, the processing processes of the outer layer board and the inner layer board are different, but the solution of the present utility model is not affected, and the solution is intended to improve the connection copper layer of the single board for connecting and laminating other single boards, so as to solve the problem in the lamination process.

In one embodiment, referring to fig. 1 and 2, a pcb board 100 includes a substrate 110, a circuit layer 120 disposed on at least one end surface of the substrate 110, and a copper connection layer 130 disposed on the substrate 110 and surrounding the circuit layer 120.

The substrate 110 and the circuit layer 120 are both of the prior art, and no improvement is made in the present solution, so the structures of the substrate 110 and the circuit layer 120 are also shown in the prior art, and are not described herein.

The end face of the copper connecting layer 130, which is opposite to the substrate 110, is provided with a plurality of glue flowing grooves 131, the copper connecting layer 130 is fully paved with the glue flowing grooves 131, two ends of one glue flowing groove 131 are at least directly communicated with one other glue flowing groove 131, and the two glue flowing grooves 131 can be directly or indirectly communicated with each other.

It should be noted that, a predetermined angle is formed between two adjacent glue flowing grooves 131, any two glue flowing grooves 131 cannot be completely overlapped, and an end of a part of the glue flowing grooves 131 is opened to an edge of the connecting copper layer 130, that is, an end of a part of the glue flowing grooves 131 can form a gap at the edge of the connecting copper layer 130, and when a plurality of PCB veneers 100 are pressed together, the gap can be communicated with the outside.

Through set up the gumming groove 131 on connecting copper layer 130, communicate each other between these gumming grooves 131, through setting up these gumming grooves 131 between the two-layer copper layer 130 that connect that need the pressfitting, gumming groove 131 lays on connecting copper layer 130, so that the liquid glue of each position on connecting copper layer 130 can be accomodate in gumming groove 131, make the liquid glue on connecting copper layer 130 more evenly that can distribute, with avoid connecting between copper layer 130 no glue and cause the condition that the connection effect reduces, but also can greatly reduced because of connecting copper layer 130 surface pile up too much glue and lead to the probability of producing the bubble, guarantee the stable pressfitting of each layer PCB board.

In addition, the heat on the connection copper layer 130 can be transferred to the gumming grooves 131 with the ends opened to the edges of the connection copper layer 130 through the communicated gumming grooves 131, so that the heat which is relatively close to the middle position of the connection copper layer 130 can flow out from the ends of the gumming grooves 131, the heat of the connection copper layer 130 and the whole board is reduced, the periphery of the board in the pressing process is not easy to deform, and the processing quality is ensured.

In one embodiment, referring to fig. 1 and 2, the partial glue flow grooves 131 are disposed in end-to-end connection, so that a polygonal bonding block 132 is formed between the partial glue flow grooves 131 and the copper layer 130. All the glue flowing grooves 131 are all involved in enclosing to form at least one bonding block 132, so that the glue flowing grooves 131 can enclose to form a plurality of bonding blocks 132 on the connecting copper layer 130, and those glue flowing grooves 131 involved in forming one bonding block 132 are also respectively involved in forming another bonding block 132, as can be understood by combining the illustration, the periphery of one bonding block 132 is also formed with a plurality of bonding blocks 132 enclosing the bonding block 132, and the bonding blocks 132 in the middle share one glue flowing groove 131 respectively, so that the glue flowing grooves 131 are arranged on the connecting copper layer 130 in a net shape.

The number of sides of the adhesive block 132 is related to the number of the adhesive grooves 131 surrounding the adhesive block 132, and if four adhesive grooves 131 surrounding the adhesive block 132 are provided, the adhesive block 132 is quadrangular, and if one adhesive block 132 is surrounded by six adhesive grooves 131, the adhesive block 132 is hexagonal, and the specific shape of the adhesive block 132 is not limited herein.

In a specific embodiment, in order to connect the glue flowing grooves 131 together, a preset included angle is formed between two adjacent glue flowing grooves 131 that are surrounded to form an adhesive block 132, and the preset included angles between every two adjacent glue flowing grooves 131 are equal. In addition, not only the angles between the adjacent two glue flow grooves 131 forming one adhesive block 132 are equal, but also the angles between the adjacent two glue flow grooves 131 of different adhesive blocks 132 are equal, that is, the shape of each adhesive block 132 is identical. By arranging the glue flowing grooves 131 according to a certain rule, the glue flowing grooves 131 can be communicated better.

For example, in a more specific embodiment, the angle between two adjacent glue grooves 131 is 120 °, where the adjacent glue grooves may be adjacent to form one adhesive block 132, or two glue grooves 131 for forming different adhesive blocks 132 but also adjacent to each other.

Here, in this embodiment, one bonding block 132 is formed between every six glue flowing grooves 131, so that the bonding blocks 132 are arranged in a regular hexagon. Six other adhesive blocks 132 are also relatively enclosed around the periphery of one adhesive block 132, and two adjacent adhesive grooves 131 of one adhesive block 132 participate in forming the adhesive block 132 which shares one adhesive groove 131, and the three adhesive grooves 131 are intersected at one point, namely, every three adhesive grooves 131 can be converged at one point. In this way, the glue flow groove 131 divides the end of the connection copper layer 130 facing away from the substrate 110 into a plurality of regular hexagonal blocks, so that a honeycomb structure is formed on the connection copper layer 130.

In another more specific embodiment, the included angle between two adjacent glue flowing grooves 131 is 90 °, and each four glue flowing grooves 131 are surrounded to form a bonding block 132, so that the bonding blocks 132 are arranged in a regular quadrilateral. At this time, the glue flow groove 131 divides an end of the copper connection layer 130 facing away from the substrate 110 into a plurality of regular tetragonal blocks, so that a honeycomb structure is formed on the copper connection layer 130.

Regardless of the above arrangement, the glue flowing grooves 131 are uniformly distributed on the connecting copper layers 130, when the PCB board is pressed, glue between the two connecting copper layers 130 to be connected can be distributed more uniformly, so that the situation of degumming and bubble generation is not easy to occur, and heat dissipation is also relatively uniform.

It should be noted that, in a specific embodiment, the glue flowing grooves 131 are preferably straight grooves, the width of the glue flowing grooves 131 is set to be equal along the opening path, and the width of all the glue flowing grooves 131 is equal, the minimum width of the glue flowing grooves 131 can be 0.15mm, the maximum width can be 0.55mm, preferably 0.3mm, and of course, the width of the glue flowing grooves 131 can be 0.15-0.55mm according to practical situations.

In addition, the lengths of all the glue flowing grooves 131 are also equal, the minimum length of the glue flowing grooves 131 is 5.5mm, the maximum length is 6.5mm, preferably 6mm, and the length of the glue flowing grooves 131 can be selected from 5.5-6.5mm according to practical situations.

In one embodiment, referring to fig. 1 and 2, the circuit layers 120 on the substrate 110 are generally provided with a plurality of pieces, and the circuit layers 120 are spaced apart from each other, so that the connection copper layer 130 is configured to include a peripheral portion 133 and an intermediate portion 134 for improving adhesion stability. The peripheral portion 133 is disposed around the edge of the substrate 110, the middle portion 134 is located at the interval between two adjacent circuit layers 120, and the glue flowing grooves 131 are formed in the middle portion 134 and the peripheral portion 133. The peripheral portion 133 is used for bonding the position located at the edge of the substrate 110, and the middle portion 134 is used for bonding the position located in the middle of the substrate 110, so as to ensure the stability of transfer.

On the other hand, referring to fig. 3, the present utility model further provides a multi-layer PCB board, which is formed by laminating a plurality of the above-mentioned PCB veneers 100. The plurality of PCB veneers 100 are stacked together, the adhesive layer 200 is disposed between two adjacent PCB veneers 100, and the adhesive layer 200 is melted under high temperature and high pressure during the lamination, so that the connection copper layers 130 on two adjacent PCB veneers 100 can be connected through the adhesive layer 200.

When the adhesive tape grooves 131 on two adjacent copper layers 130 are arranged in a staggered manner, that is, the adhesive tape grooves 131 on two adjacent copper layers 130 may be completely identical but may not be completely overlapped, so that at least part of the adhesive tape grooves 131 on one copper layer 130 is arranged opposite to the surface of the other copper layer 130. Through the offset setting of the gumming grooves 131 of two adjacent connection copper layers 130, the bonding range of the gumming grooves 131 and the opposite connection copper layers 130 can be increased, and then the bonding effect is increased.

The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the claims. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. A PCB veneer, comprising:

a substrate;

a circuit layer disposed on at least one end surface of the substrate;

2. The PCB veneer of claim 1, wherein a portion of the glue flowing grooves are disposed in end-to-end communication, such that a polygonal adhesive block is formed between portions of the glue flowing grooves, a plurality of the adhesive blocks are formed by surrounding a plurality of the glue flowing grooves, and portions of the glue flowing grooves that participate in forming one adhesive block are respectively involved in forming a plurality of other adhesive blocks surrounding the adhesive blocks, such that the glue flowing grooves are arranged in a net shape on the connecting copper layer.

3. The PCB veneer of claim 2, wherein a predetermined angle is formed between two adjacent glue flowing grooves surrounding one adhesive block, and the predetermined angle is equal between each two adjacent glue flowing grooves.

4. The PCB veneer of claim 3, wherein an included angle between two adjacent glue flowing grooves is 120 °, and each six glue flowing grooves are surrounded by one adhesive block, so that the adhesive blocks are arranged in a regular hexagon.

5. A PCB veneer according to claim 3, wherein an included angle between two adjacent glue flowing grooves is 90 °, and each four glue flowing grooves are surrounded to form one adhesive block, so that the adhesive blocks are arranged in a regular quadrilateral.

6. The PCB veneer according to any one of claims 1-5, wherein the glue flow grooves are straight grooves, the width of the glue flow grooves along the opening path is equal, the width of all the glue flow grooves is equal, and the width of the glue flow grooves is 0.15-0.55mm.

7. The PCB veneer of claim 6, wherein the glue flow slot has a length of 5.5-6.5mm.

8. The PCB board of claim 1, wherein a plurality of spaced circuit layers are disposed on the substrate, the copper connecting layer includes a peripheral portion and an intermediate portion, the peripheral portion is disposed around the edge of the substrate, the intermediate portion is disposed at a space between two adjacent circuit layers, and the glue flowing grooves are formed in the intermediate portion and the peripheral portion.

9. A multi-layer PCB board, comprising a plurality of the PCB boards according to any one of claims 1 to 8, wherein the plurality of the PCB boards are stacked together, an adhesive layer is disposed between two adjacent PCB boards, and the copper connection layers on the two adjacent PCB boards are connected by the adhesive layer.

10. The multi-layer PCB of claim 9, wherein at least a portion of the glue grooves on two of the connected copper layers are disposed directly opposite the surface of the corresponding copper layer.