CN221329458U

CN221329458U - Cabinet power supply heat radiation structure

Info

Publication number: CN221329458U
Application number: CN202323263389.2U
Authority: CN
Inventors: 周新意
Original assignee: Nanjing Newhope Power Technology Co ltd
Current assignee: Nanjing Newhope Power Technology Co ltd
Priority date: 2023-11-30
Filing date: 2023-11-30
Publication date: 2024-07-12
Anticipated expiration: 2033-11-30

Abstract

The utility model provides a case power supply heat radiation structure, which relates to the technical field of power supply heat radiation, and comprises a heat radiation device arranged on the surface of a power supply, wherein the heat radiation device comprises a cover covered above the power supply, the upper end of the power supply is downwards sunken, metal heat radiation fins are uniformly arranged at the downwards sunken part of the power supply, a blowing mechanism is clamped on the inner wall of the cover and blows wind towards the metal heat radiation fins, and the metal heat radiation fins uniformly arranged on the surface of the power supply can rapidly transfer heat.

Description

Cabinet power supply heat radiation structure

Technical Field

The utility model relates to a chassis power supply heat dissipation structure, and belongs to the technical field of heat dissipation.

Background

The power supply case is an important component of electronic equipment in the electronic industry, and electronic components such as a transformer, a circuit board and the like are arranged in the power supply case.

Because the power supply has current passing through the internal electronic element in the power supply process, the current passes through the electronic element and can generate heat due to the current thermal effect, and the internal electronic element of the power supply is relatively concentrated, so that heat is easy to accumulate, thereby causing temperature rise, the resistance of the electronic element in a high-temperature environment is mostly increased, and the resistance is increased to further improve the heating of the electronic element.

Disclosure of utility model

The utility model aims to solve the defects in the prior art and provides a chassis power supply heat dissipation structure.

In order to achieve the above purpose, the present utility model adopts the following technical scheme: the utility model provides a quick-witted case power heat radiation structure, includes the heat abstractor of installing on the power surface, heat abstractor includes the lid of cover in the power top, the upper end undercut of power, the position of power undercut evenly is provided with metal radiating fin, the inner wall card of lid has the mechanism of blowing, the mechanism of blowing blows off wind towards metal radiating fin.

The effects achieved by the components are as follows: the metal radiating fins uniformly arranged on the surface of the power supply can transfer heat quickly, the heat can be transferred to the air quickly because the contact area between the metal radiating fins and the air is large, so that the radiating effect of the power supply is accelerated, the metal radiating fins can be better close to the internal electronic element for transferring heat because the upper end of the power supply is sunken downwards, and the air blowing mechanism is utilized to blow air to the metal radiating fins to transfer heat quickly, so that the heat emitted by the power supply is transferred as far as possible.

Preferably, the blowing mechanism mainly drives the fan blades to rotate by a motor so as to achieve a blowing effect.

The effects achieved by the components are as follows: the blowing mechanism is preferably driven by a motor to rotate the fan blades to blow air, and can also be driven by other driving units capable of rotationally driving the fan to rotate.

Preferably, the heat dissipating device further comprises vertical rails, a refrigerating semiconductor is clamped between the vertical rails, the refrigerating semiconductor is electrified to refrigerate on one side, and cold air is sucked by the air blowing mechanism through the radiating holes above the cover and blown to the surfaces of the metal radiating fins and is discharged from the radiating holes on the side face of the cover.

The effects achieved by the components are as follows: the air temperature is reduced by utilizing the refrigeration semiconductor to electrify and refrigerate (the power supply is suitable for the condition that the power supply is in an external environment and is high, such as hot summer), and then the air blowing mechanism sucks cold air generated by the refrigeration semiconductor from the upper part and blows the cold air to the surfaces of the radiating fins to reduce the temperature of the power supply more quickly.

Preferably, the inner wall of the vertical rail is fixedly connected with a clamping piece, the clamping piece is a metal elastic piece, and the refrigeration semiconductor is inserted into the vertical rail to extrude the clamping piece for fixing.

The effects achieved by the components are as follows: when the refrigerating semiconductor is inserted into the vertical rail, the metal spring sheet is extruded to deform so as to extrude the refrigerating semiconductor into the vertical rail for fixing, and the shaking of the refrigerating semiconductor caused by loosening is avoided.

Preferably, the position of the refrigerating semiconductor facing the outer side of the power supply is a heating surface which is uniformly and fixedly connected with a metal sheet.

The effects achieved by the components are as follows: the heat generating surface of the refrigeration semiconductor utilizes a metal sheet to conduct heat away rapidly.

Preferably, one surface of the refrigerating semiconductor far away from the metal sheet is a refrigerating surface, and the position, close to the bottom, of the refrigerating surface of the refrigerating semiconductor is fixedly connected with a later storage groove, and the storage groove is used for containing condensed water on the surface of the refrigerating semiconductor.

Preferably, a cotton core is arranged in the storage groove.

The effects achieved by the components are as follows: the function of cotton core is the comdenstion water in the absorption storage tank, avoids the comdenstion water to spill, and wherein change cotton core just can be quick get rid of the comdenstion water.

Preferably, the cover and the power supply are assembled by means of a connecting device, screws are arranged at four corners of the power supply, one end of the connecting device is clamped on the screws, and the other end of the connecting device is buckled on the cover.

Preferably, the connecting device comprises a mounting seat fixed on the cover, a connecting shaft is inserted in the mounting seat, a spring is fixedly connected to one end of the connecting shaft penetrating through the mounting seat, a clamping block is fixedly connected to the other end of the spring, the clamping block is clamped on the surface of the screw, and a baffle is fixedly connected to the other end of the connecting shaft.

The effects achieved by the components are as follows: the clamping block is pulled to draw the spring, and then the clamping block is clamped at the port of the screw, so that the cover is tightly buckled on the surface of the power supply by the spring of the pull rope.

Preferably, the side wall of the power supply is provided with a socket, and the socket is used for externally connecting a cable to charge the power supply.

Compared with the prior art, the utility model has the advantages and positive effects that,

According to the utility model, the metal radiating fins uniformly arranged on the surface of the power supply can rapidly transfer heat, and the contact area between the metal radiating fins and air is large, so that the heat transfer to the air can be rapid, the heat dissipation effect of the power supply is accelerated, and the upper end of the power supply is recessed downwards, so that the metal radiating fins can better approach to the internal electronic components to transfer heat, and then the air blowing mechanism blows air to the metal radiating fins to transfer the heat more rapidly, so that the heat emitted by the power supply is transferred as much as possible.

Drawings

Fig. 1 is a schematic perspective view of a heat dissipation structure of a chassis power supply according to the present utility model;

FIG. 2 is a schematic diagram of a power supply in a heat dissipation structure of a chassis power supply according to the present utility model;

FIG. 3 is a schematic diagram illustrating the inside of a cover in a heat dissipation structure for a power supply of a chassis according to the present utility model;

Fig. 4 is a schematic diagram showing a neutral rail in a heat dissipation structure of a chassis power supply according to the present utility model;

fig. 5 is an enlarged view of a portion a of fig. 1 in a heat dissipation structure of a chassis power supply according to the present utility model.

In the figure: 1. a power supply; 2. a socket; 3. a screw; 4. a heat sink; 41. a cover; 42. a vertical rail; 43. a refrigerating semiconductor; 44. a storage groove; 45. a cotton core; 46. a clamping piece; 47. a blowing mechanism; 5. a connecting device; 51. a mounting base; 52. a connecting shaft; 53. a baffle; 54. a spring; 55. and clamping blocks.

Detailed Description

The utility model is illustrated below by means of specific examples, without however limiting the utility model.

Embodiment 1, as shown in fig. 1 to 5, a heat dissipation structure of a chassis power supply 1 comprises a heat dissipation device 4 installed on the surface of the power supply 1, the heat dissipation device 4 comprises a cover 41 covered above the power supply 1, the upper end of the power supply 1 is sunken downwards, metal heat dissipation fins are uniformly arranged at the sunken part of the power supply 1, a blowing mechanism 47 is clamped on the inner wall of the cover 41, the blowing mechanism 47 blows wind towards the metal heat dissipation fins, the metal heat dissipation fins uniformly installed on the surface of the power supply 1 can rapidly transfer heat, the contact area between the metal heat dissipation fins and air is large, and then the heat can be rapidly transferred into the air, so that the heat dissipation effect of the power supply 1 is accelerated, And because the upper end of the power supply 1 is concave downwards, the metal radiating fins can better approach the internal electronic components to transfer heat, then the air blowing mechanism 47 blows air to the metal radiating fins to transfer heat out more quickly, the heat emitted by the power supply 1 is transferred out as far as possible, the air blowing mechanism 47 mainly rotates by motor driving fan blades to achieve the air blowing effect, the air blowing mechanism 47 preferably rotates by the motor driving fan blades to blow air or can be driven by other driving units capable of rotating to drive the fan to rotate, the heat radiating device 4 also comprises vertical rails 42, a refrigerating semiconductor 43 is clamped between the vertical rails 42, one side of the refrigerating semiconductor 43 is electrified to refrigerate, Cold air is sucked and blown to the surfaces of the metal radiating fins through the radiating holes above the cover 41 by the air blowing mechanism 47 and discharged from the radiating holes on the side face of the cover 41, the temperature of the air is reduced by electrifying and refrigerating the refrigerating semiconductor 43 (the air blowing mechanism 47 is suitable for the condition that the power supply 1 is in an external environment and is higher, such as hot summer), then the air blowing mechanism 47 sucks and blows the cold air generated by the refrigerating semiconductor 43 to the surfaces of the radiating fins from the upper side to cool, thereby reducing the temperature of the power supply 1 more quickly, the clamping pieces 46 are fixedly connected to the inner wall of the vertical rail 42, the clamping pieces 46 are metal elastic sheets, the refrigerating semiconductor 43 is inserted into the vertical rail 42 to extrude the clamping pieces 46 for fixing, When the refrigerating semiconductor 43 is inserted into the vertical rail 42, the metal elastic sheet is extruded to deform so as to extrude the refrigerating semiconductor 43 into the vertical rail 42 for fixing, so that the phenomenon that the refrigerating semiconductor 43 loosens and shakes is avoided, the position of the refrigerating semiconductor 43, which faces the outer side of the power supply 1, is uniformly and fixedly connected with a metal sheet, the heat-generating surface of the refrigerating semiconductor 43 utilizes the metal sheet to quickly conduct heat, the surface of the refrigerating semiconductor 43, which is far away from the metal sheet, is a refrigerating surface, the position, which is close to the bottom, of the refrigerating surface of the refrigerating semiconductor 43 is fixedly connected with a later accommodating groove 44, the accommodating groove 44 is used for accommodating condensed water on the surface of the refrigerating semiconductor 43, a cotton core 45 is arranged in the accommodating groove 44, The cotton core 45 is used for absorbing condensed water in the storage groove 44 and avoiding leakage of the condensed water, wherein the condensed water can be quickly removed by replacing the cotton core 45, the cover 41 and the power supply 1 are assembled by means of the connecting device 5, the screws 3 are arranged at four corners of the power supply 1, one end of the connecting device 5 is clamped on the screws 3, the other end of the connecting device is buckled on the cover 41, the connecting device 5 comprises an installation seat 51 fixed on the cover 41, a connecting shaft 52 is inserted in the installation seat 51, one end of the connecting shaft 52 penetrating through the installation seat 51 is fixedly connected with a spring 54, the other end of the spring 54 is fixedly connected with a clamping block 55, the clamping block 55 is clamped on the surface of the screws 3, The other end of the connecting shaft 52 is fixedly connected with a baffle plate 53, the clamping block 55 is pulled to draw the spring 54, and then the clamping block 55 is clamped at the port of the screw 3, so that the cover 41 is tightly buckled on the surface of the power supply 1 by using the spring 54 of the pull rope, the side wall of the power supply 1 is provided with a socket 2, and the socket 2 is used for externally connecting a cable to charge the power supply 1.

The theory of operation, evenly install the transfer heat that metal fin on power 1 surface can be quick, because metal fin and air's area of contact are big and then can be quick go to the air with heat transfer, thereby the radiating effect of power 1 has been accelerated, and because power 1 upper end is the undercut and then can make the inside electronic component transfer heat that metal fin can be better, reuse mechanism 47 blows the heat transfer that can be faster to metal fin, the heat transfer that the power 1 sent out as far as, mechanism 47 is preferred to be motor drive flabellum rotatory to blow also can be other can rotation drive fan pivoted drive unit drive, utilize refrigeration semiconductor 43 circular telegram refrigeration to reduce air temperature (be applicable to power 1 and be in the circumstances that external environment is also higher such as: in hot summer), then the air blowing mechanism 47 sucks the cool air generated by the refrigeration semiconductor 43 from the upper part and blows the cool air to the surface of the radiating fins for cooling, thereby the temperature of the power supply 1 is reduced more quickly, the refrigeration semiconductor 43 is extruded to be fixed in the vertical rail 42 by extruding the deformation of the metal elastic sheet when being inserted into the vertical rail 42, the loosening of the refrigeration semiconductor 43 is avoided, the heat is quickly conducted by the heating surface of the refrigeration semiconductor 43 through the metal sheet, the cotton core 45 is used for absorbing the condensed water in the storage groove 44, the condensed water is avoided from leaking, the cotton core 45 is replaced, the condensed water can be quickly removed, the clamping block 55 is pulled to draw the spring 54, the clamping block 55 is clamped at the port of the screw 3, and the cover 41 is tightly buckled on the surface of the power supply 1 by the spring 54 of the pull rope.

It should be noted that the power supply of the present invention is disclosed as a power supply module of a conventional host chassis in the market because it is already sold in the market, and therefore, the internal principles and functions thereof will not be described in detail herein.

Finally, it should be noted that the above-mentioned embodiments are only for illustrating the technical solution of the present utility model and not for limiting the technical solution of the present utility model, and although the present utility model has been described in detail with reference to the above-mentioned embodiments, it should be understood by those skilled in the art that the present utility model may be modified or equivalently replaced without departing from the spirit and scope of the present utility model, and any modification or partial replacement thereof should be included in the scope of the claims of the present utility model.

Claims

1. The utility model provides a quick-witted case power heat radiation structure, includes heat abstractor (4) of installing at power (1) surface, its characterized in that: the heat dissipation device (4) comprises a cover (41) covered above the power supply (1), the upper end of the power supply (1) is recessed downwards, metal heat dissipation fins are uniformly arranged at the recessed part of the power supply (1), a blowing mechanism (47) is clamped on the inner wall of the cover (41), and the blowing mechanism (47) blows air towards the metal heat dissipation fins.

2. The chassis power supply heat dissipation structure of claim 1, wherein: the blowing mechanism (47) mainly drives the fan blades to rotate by a motor so as to achieve a blowing effect.

3. The chassis power supply heat dissipation structure of claim 1, wherein: the heat dissipation device (4) further comprises vertical rails (42), a refrigerating semiconductor (43) is clamped between the vertical rails (42), one side of the refrigerating semiconductor (43) is electrified for refrigerating, and cold air is sucked and blown to the surfaces of the metal heat dissipation fins through the heat dissipation holes above the cover (41) by the air blowing mechanism (47) and is discharged from the heat dissipation holes on the side face of the cover (41).

4. A chassis power supply heat dissipation structure as recited in claim 3, wherein: the inner wall of the vertical rail (42) is fixedly connected with a clamping piece (46), the clamping piece (46) is a metal elastic piece, and the refrigeration semiconductor (43) is inserted into the vertical rail (42) to extrude the clamping piece (46) for fixing.

5. The chassis power supply heat dissipation structure of claim 4, wherein: the position of the refrigerating semiconductor (43) facing the outer side of the power supply (1) is uniformly and fixedly connected with a metal sheet on the heating surface.

6. The chassis power supply heat dissipation structure of claim 4, wherein: one surface of the refrigerating semiconductor (43) far away from the metal sheet is a refrigerating surface, the position, close to the bottom, of the refrigerating surface of the refrigerating semiconductor (43) is fixedly connected with a later accommodating groove (44), and the accommodating groove (44) is used for accommodating condensed water on the surface of the refrigerating semiconductor (43).

7. The chassis power supply heat dissipation structure of claim 6, wherein: a cotton core (45) is arranged in the storage groove (44).

8. A chassis power supply heat dissipation structure as recited in claim 3, wherein: the cover (41) and the power supply (1) are assembled by means of the connecting device (5), screws (3) are arranged at four corners of the power supply (1), and one end of the connecting device (5) is clamped on the screws (3) while the other end is buckled on the cover (41).

9. The chassis power supply heat dissipation structure of claim 8, wherein: connecting device (5) are including fixing mount pad (51) on lid (41), the inside of mount pad (51) is interluded and is had connecting axle (52), connecting axle (52) pass one end fixedly connected with spring (54) of mount pad (51), the other end fixedly connected with clamp splice (55) of spring (54), clamp splice (55) clamp is at the surface of screw (3), the other end fixedly connected with separation blade (53) of connecting axle (52).

10. The chassis power supply heat dissipation structure of claim 1, wherein: the side wall of power (1) is provided with socket (2), socket (2) are used for outer cable to charge power (1).