CN221310092U - Surface cooler and dehumidifier with heating function - Google Patents

Abstract

The utility model relates to the technical field of dehumidifiers, in particular to a surface cooler with a heating function and a dehumidifier. The utility model comprises a shell, wherein the inner cavity of the shell is divided into a phase-change condensation chamber and a surface-cooling chamber through a partition plate, a reheating air pipe is arranged in the phase-change condensation chamber in a gap, a semiconductor refrigerating sheet is arranged on the reheating air pipe, the heating surface of the semiconductor refrigerating sheet faces inwards, the refrigerating surface faces outwards, a heat pipe heat exchanger with a phase-change material in the inner cavity is fixed on the partition plate, one end of the heat pipe heat exchanger extends into the surface-cooling chamber, and the other end of the heat pipe heat exchanger extends into the phase-change condensation chamber and is attached to the outer wall of the reheating air pipe. According to the utility model, the structure of the surface cooler is optimized, and the surface cooler has the dual functions of heating and cooling on the premise of not improving the energy consumption, so that the energy consumption in the whole operation process of the dehumidifier is reduced.

Description

Surface cooler and dehumidifier with heating function

Technical Field

The utility model relates to the technical field of dehumidifiers, in particular to a surface cooler and a dehumidifier with heating functions.

Background technique

Rotary dehumidifiers are often used in the industrial field for dehumidification operations. Rotary dehumidifiers are a type of dehumidifier, and their main principle is: after cooling the gas through a surface cooler, one or two dehumidification wheels are used to absorb moisture from the humid air. In order to maintain the continuous dehumidification capacity of the dehumidification wheel, a heater is often installed in the dehumidifier to evaporate the moisture on the dehumidification wheel. As recorded in the text of the pipeline rotary dehumidifier with the Chinese publication number CN204254784U, a surface cooler for cooling the gas and a heater for evaporating the moisture on the dehumidification wheel are provided. However, in the cited patent, the surface cooler and the heater are two independent mechanisms, which consume a lot of energy, especially in a dehumidifier with two dehumidification wheels, more surface coolers and heaters are needed, which further increases the energy consumption, so it needs to be solved urgently.

Utility Model Content

In order to avoid and overcome the technical problems existing in the prior art, the utility model provides a surface cooler and a dehumidifier with heating function, and optimizes the structure of the surface cooler so that the surface cooler has the dual functions of heating and cooling without increasing energy consumption, thereby reducing the energy consumption during the overall operation of the dehumidifier.

In order to achieve the above purpose, the utility model provides the following technical solutions:

A surface cooler with a heating function comprises a shell, the inner cavity of the shell is divided into a phase change condensation chamber and a surface cooling chamber by a partition, a reheat air duct is arranged in the gap in the phase change condensation chamber, a semiconductor refrigeration plate is installed on the reheat air duct, and the heating surface of the semiconductor refrigeration plate faces inward and the cooling surface faces outward, a heat pipe heat exchanger with a phase change material in the inner cavity is fixed on the partition, one end of the heat pipe heat exchanger extends into the surface cooling chamber, and the other end extends to the gap between the cooling chamber and the reheat air duct.

As a further solution of the utility model: the refrigeration chamber and the surface cooling chamber are distributed up and down, and a section of the heat pipe heat exchanger located in the phase change condensation chamber is a phase change condensation section, and the end of the phase change condensation section is in contact with the refrigeration surface of the semiconductor refrigeration sheet.

As a further solution of the utility model: a section of the heat pipe heat exchanger located in the surface cooling chamber is used as the heat exchange section, and the heat pipe heat exchanger is at least two distributed on the partition in a dot matrix, and the heat exchange sections of the heat pipe heat exchanger are distributed along the vertical direction, and channels are formed between adjacent heat exchange sections for gas circulation.

As a further solution of the utility model: heat exchange fins are arranged on the heat exchange section.

As a further solution of the utility model: the heat exchange fins are spiral fins, and the heat exchange fins are distributed throughout the heat exchange section along the axial direction of the heat exchange section.

A dehumidifier, which uses a surface cooler with a heating function, includes a dehumidification wheel. The dehumidifier also includes a dehumidification circuit for conveying the airflow to the dehumidification wheel after cooling and a drying circuit for conveying the airflow to the dehumidification wheel after reheating. The surface cooling chamber is connected to the dehumidification circuit, and the reheating air duct is connected to the drying circuit.

As a further solution of the present invention: the dehumidification wheel includes a front dehumidification wheel and a rear dehumidification wheel, the dehumidification line passes through the front dehumidification wheel and the rear dehumidification wheel in sequence, the drying line passes through the rear dehumidification wheel and the front dehumidification wheel in sequence, the surface cooler is located between the front dehumidification wheel and the rear dehumidification wheel, and the reheat air duct and the surface cooling chamber are respectively connected to the drying line and the surface cooling line between the front dehumidification wheel and the rear dehumidification wheel.

As a further solution of the utility model: the dehumidification circuit also includes a front surface cooler located on the front side of the front dehumidification wheel and a front fan for conveying the airflow in the dehumidification circuit. The end of the dehumidification circuit is connected to the starting end of the drying circuit. The end of the dehumidification circuit is also connected to the workshop building through the surface cooler or the rear heater.

As a further solution of the utility model: the drying circuit also includes a main heater and an auxiliary heater, the main heater is located at the starting end of the drying circuit, the auxiliary heater is located between the front dehumidification wheel and the rear dehumidification wheel, and the end of the drying circuit is discharged to the outside.

As a further solution of the utility model: a rear fan for conveying airflow in the drying line is installed on the drying line.

Compared with the prior art, the beneficial effects of the utility model are:

1. The shell is divided into a phase change condensation chamber and a surface cooling chamber by a partition. A reheat air duct is arranged in the gap in the phase change condensation chamber. A semiconductor refrigeration plate is installed on the reheat air duct, and the heating surface of the semiconductor refrigeration plate is used to heat the inner cavity of the hot air duct. A heat pipe heat exchanger is connected to the gap between the surface cooling chamber, the phase change condensation chamber and the reheat air duct, and a phase change material is arranged in the heat pipe heat exchanger. After the surface cooling chamber cools the airflow, the liquid phase change material vaporizes and absorbs heat. The vaporized phase change material flows to the condensation end, cools down through the semiconductor refrigeration surface, condenses into liquid, and then flows back to the surface cooling chamber, thereby ensuring the cooling effect of the surface cooling chamber cycle. The heat generated by the heating surface of the semiconductor refrigeration plate continuously heats the inner cavity of the reheat air duct, so that the surface cooler has the dual effects of cooling and heating without additional energy consumption, which is beneficial to energy saving for devices or production lines that need to cool and heat at the same time.

2. The phase change condensation chamber and the surface cooling chamber are distributed up and down, so that the liquid phase change material in the heat pipe heat exchanger is in the surface cooling chamber, and the vaporized phase change material is in the phase change condensation chamber. The end of the phase change condensation section of the heat pipe heat exchanger located in the phase change condensation chamber is in contact with the cooling surface of the semiconductor refrigeration sheet, which is conducive to the rapid condensation of the vaporized phase change material in the heat pipe heat exchanger into liquid, thereby ensuring the good cooling effect of the heat pipe heat exchanger on the airflow.

3. The heat pipe heat exchangers are distributed on the partition in a dot matrix, and the heat exchange sections of the heat pipe heat exchangers extending to the surface cooling cavity are distributed in the vertical direction. At the same time, channels are formed between adjacent heat exchange sections for gas circulation, so that the air flow flows between the channels and cools down, ensuring the cooling effect of the air flow.

4. Heat exchange fins are arranged on the heat exchange section to increase the heat exchange area of the heat exchange section, further ensuring the cooling effect on the airflow.

5. The heat exchange fins are spiral fins and are distributed along the axial direction of the heat exchange section, which can disturb the flow of the airflow and further ensure the cooling effect of the airflow.

6. Apply the surface cooler to the dehumidifier. Without increasing the extra energy consumption, the surface cooler can achieve the dual functions of cooling the air flow and drying the dehumidification wheel.

7. Place the surface cooler between the front dehumidification wheel and the rear dehumidification wheel. Reasonable layout will not take up extra space.

8. Connect the end of the dehumidification circuit to the starting end of the drying circuit, and use the dried airflow to dry the dehumidification wheel, further ensuring the drying effect.

9. In the drying circuit, an auxiliary heater is set between the front dehumidification wheel and the rear dehumidification wheel to heat the reheat air duct synchronously. Compared with the traditional high-power heater, this section of auxiliary heater does not need high-power operation, which effectively reduces the energy consumption of the dehumidifier.

10. The setting of the rear fan facilitates the flow of air in the drying circuit.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG1 is a schematic structural diagram of the utility model.

FIG. 2 is a schematic diagram of the three-dimensional structure of the surface cooler in the present invention.

FIG3 is a schematic diagram of the partial structure of the reheat air duct in the utility model.

FIG. 4 is a diagram showing the working principle of the dehumidifier in the present utility model.

In the figure: 10, shell; 11, phase change condensation chamber; 12, surface cooling chamber; 13, partition; 20, reheat air duct; 21, semiconductor refrigeration plate; 30, heat pipe heat exchanger; 31, heat exchange fins; 40, front dehumidification wheel; 50, rear dehumidification wheel; 61, front surface cooler; 62, front fan; 71, auxiliary heater; 72, rear fan; 73, main heater.

Detailed ways

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

For ease of understanding, the specific structure and working mode of the utility model are further described below in conjunction with the accompanying drawings:

The specific structure of the surface cooler with heating function in the present invention is shown in Figures 1-3, and its main structure includes a shell 10 and a reheat air duct 20 with heating in the inner cavity and cooling in the outer periphery. Among them, the shell 10 is divided into a phase change condensation chamber 11 and a surface cooling chamber 12 by a partition 13, and the gap of the reheat air duct 20 is distributed in the phase change condensation chamber 11. A heat pipe heat exchanger 30 is installed on the partition 13. The heat exchange section of the heat pipe heat exchanger 30 extends into the surface cooling chamber 12, and the phase change condensation section of the heat pipe heat exchanger 30 extends to the gap between the phase change condensation chamber 11 and the reheat air duct 20. A phase change material is provided in the heat pipe heat exchanger 30 to realize heat conduction between the cooling surface of the semiconductor refrigeration plate 21 and the surface cooling chamber 12. The inner cavity of the reheat air duct 20 is heated and the outer periphery is cooled by a semiconductor refrigeration plate 21 installed on the reheat air duct 20. The heating surface of the semiconductor refrigeration plate 21 faces inward and the cooling surface faces outward, so that the inner cavity of the semiconductor refrigeration plate 21 is heated by the heating surface of the semiconductor refrigeration plate 21, and the cooling surface cools the gap between the outer periphery of the refrigeration chamber 11 and the reheat air duct 20.

In actual use, the airflow to be cooled flows through the surface cooling chamber 12, and exchanges heat with the liquid phase change material in the heat pipe heat exchanger 30, and the liquid vaporizes and continuously absorbs heat from the surface cooling chamber 12; the vaporized phase change material will flow into the phase change condensation section of the heat pipe heat exchanger 30, and after cooling and condensing to a liquid state through the cooling surface of the semiconductor refrigeration plate 21, it will flow back to the surface cooling chamber 12 to absorb heat and vaporize, thereby ensuring the continuous cooling effect on the airflow in the surface cooling chamber 12; and during the cooling process of the cooling surface of the semiconductor refrigeration plate 21, the heat generated by its heating surface continuously heats the airflow to be heated in the inner cavity of the reheat air duct 20, thereby achieving the cooling and heating functions of the airflow without generating additional energy consumption.

It is worth mentioning that since the surface cooler has the dual functions of cooling and heating, it can be used in a dehumidifier in actual application, by cooling the airflow through the surface cooling chamber 12, and drying the dehumidification wheel after heating through the inner cavity of the reheat air duct 20; it can also be used in a drying device, the water vapor generated by drying enters the surface cooling chamber 12, and the airflow of the high-temperature and high-humidity water vapor is cooled by the surface cooling chamber 12, so that the water vapor condenses into water droplets, and then the condensed airflow is introduced into the inner cavity of the reheat air duct 20 for heating and then reintroduced into the drying device, to prevent the temperature of the airflow reintroduced into the drying device from being too low and affecting the temperature uniformity in the drying device, and at the same time, to prevent the humidity of the airflow reintroduced into the drying device from being too high, which will cause the humidity in the drying device to increase again; it can also be used in production lines that need to be heated and then cooled, and then cooled and then heated; or the cooling and heating of the surface cooler can be used respectively in two devices that need cooling and heating respectively.

On the basis of the above, as shown in FIG1 , the phase change condensation chamber 11 and the surface cooling chamber 12 are distributed up and down, so that in the phase change material in the heat pipe heat exchanger 30, the liquid phase change material will flow to the heat exchange section under the action of gravity, and the gaseous phase change material will be concentrated in the phase change condensation section, thereby stably achieving heat exchange with the airflow in the surface cooling chamber 12. At the same time, the end of the phase change condensation section is in contact with the cooling surface of the semiconductor cooling sheet 21, which can quickly and efficiently cool and condense the gaseous phase change material, and the condensed phase change material flows to the heat exchange section again to ensure that the surface cooling chamber 12 has a continuous cooling effect on the airflow.

Further, the heat pipe heat exchangers 30 are distributed on the partition 13 in a dot matrix as shown in FIG2 , and different numbers of heat pipe heat exchangers 30 are provided according to the size of the partition 13, preferably covering the partition 13. The heat exchange sections of the heat pipe heat exchangers 30 are distributed along the vertical direction, and channels are formed between adjacent heat exchange sections for gas circulation, so that a cooling channel is formed at each channel, ensuring the cooling effect and efficiency of the airflow in the surface cooling chamber 12.

In addition, heat exchange fins 31 are provided on the heat exchange section of the heat pipe heat exchanger 30, which further increases the contact area between the heat exchange section and the airflow, so that the heat exchange section has a better cooling effect on the airflow. The heat exchange fins 31 are spiral heat exchange fins 31 as shown in FIG. 2, and the heat exchange fins 31 are distributed along the axial direction of the heat exchange section, so that there is a turbulent flow when the airflow flows on the heat exchange fins 31, thereby increasing the flow distance of the airflow in the surface cooling chamber 12, and further ensuring the cooling effect of the airflow.

The specific structure of the dehumidifier using the surface cooler with heating function is shown in FIG4 . The dehumidifier also includes a dehumidification circuit for conveying the airflow to the dehumidification wheel after cooling; and a drying circuit for conveying the airflow to the dehumidification wheel after reheating. The surface cooling chamber 12 is connected to the dehumidification circuit for cooling the airflow in the dehumidification circuit, and the reheating air duct 20 is connected to the drying circuit for heating the airflow in the drying circuit.

For a dehumidifier having two dehumidification wheels, the front dehumidification wheel 40 and the rear dehumidification wheel 50, the surface cooling route and the drying route of the dehumidifier are as follows:

The orientations described below are all based on the perspective shown in FIG. 4. The drying circuit of the dehumidifier includes a main heater 73 arranged on the right side of the upper surface of the rear dehumidification wheel 50, and an auxiliary heater 71 and a reheating air duct 20 of the surface cooler arranged between the upper surface of the front dehumidification wheel 40 and the upper surface of the rear dehumidification wheel 50. In the drying circuit, the air inlet end of the main heater 73 is the starting end of the drying circuit. After being heated by the main heater 73, the airflow passes through the upper surface of the rear dehumidification wheel 50 to dry the rear dehumidification wheel 50. The airflow passing through the upper surface of the rear dehumidification wheel 50 enters the reheating air duct 20 and the auxiliary heater 71 of the surface cooler, and then passes through the upper surface of the front dehumidification wheel 40 to dry the front dehumidification wheel 40. After passing through the front dehumidification wheel 40, the air passes through the left side of the front dehumidification wheel 40 as the end of the drying circuit, and the end of the drying circuit is discharged to the outside. During the drying process, the front dehumidification wheel 40 and the rear dehumidification wheel 50 continue to rotate, thereby continuously drying the outer surfaces of the front dehumidification wheel 40 and the rear dehumidification wheel 50.

The surface cooling circuit of the dehumidifier includes a front surface cooler 61 on the left side of the lower surface of the front dehumidification wheel 40 and a surface cooler arranged between the front dehumidification wheel 40 and the rear dehumidification wheel 50, and the surface cooling chamber 12 of the surface cooler is respectively connected between the lower surfaces of the front dehumidification wheel 40 and the rear dehumidification wheel 50. In the surface cooling circuit, the air inlet end of the front surface cooler 61 is the starting end of the surface cooling circuit, the airflow is first cooled by the front surface cooler 61, then passes through the lower surface of the front dehumidification wheel 40 to absorb moisture, then passes through the surface cooling chamber 12 to cool, and then passes through the lower surface of the rear dehumidification wheel 50 to absorb moisture again, so as to achieve a better dehumidification effect on the airflow, and after passing through the lower surface of the rear dehumidification wheel 50, the right side of the lower surface of the rear dehumidification wheel 50 is the end of the surface cooling circuit after passing through the lower surface of the rear dehumidification wheel 50. By rotating the front dehumidification wheel 40 and the rear dehumidification wheel 50, after the front dehumidification wheel 40 and the rear dehumidification wheel 50 are continuously dried, moisture can be absorbed through the continuously dried parts, thereby ensuring the moisture absorption effect.

With the above structure, the cooler is directly placed between the front dehumidification wheel 40 and the rear dehumidification wheel 50. The upper surface of the front dehumidification wheel 40 is dried by the reheat air duct 20 located at the upper part of the cooler, and the lower surface of the rear dehumidification wheel 50 is cooled by the cooler chamber 12 located at the lower part of the cooler. The layout is reasonable and no additional space in the dehumidifier is required. Moreover, since the reheat air duct 20 heats the waste heat recovered from the cooler, the synchronous operation of the reheat air duct 20 and the auxiliary heater 71 can reduce the power of the auxiliary heater 71, thereby reducing the overall energy consumption of the dehumidifier.

In addition, the end of the dehumidification circuit is connected to the workshop building and the initial end of the drying circuit, so that the airflow in the drying circuit is dehumidified airflow to ensure the dryness of the gas in the drying circuit and the drying effect of the dehumidification wheel. In order to ensure the circulation of airflow in the dehumidification circuit and the drying circuit, the front fan 62 and the rear fan 72 are respectively connected to the dehumidification circuit and the drying circuit. By adjusting the power ratio of the front fan 62 and the rear fan 72, the distribution of the air discharged from the end of the dehumidification circuit to the drying circuit and the workshop building can be controlled to ensure the demand for dry air in the workshop building.

In actual implementation, according to the temperature requirements of the workshop building, the dehumidified airflow passes through the end of the surface cooling route, is cooled by the surface cooler or heated by the post-heater, and then discharged into the workshop building. If the end of the surface cooling route is connected to the surface cooler, the air inlet and exhaust ends of the surface cooling chamber 12 of the surface cooler are respectively connected to the end of the surface cooling route and the workshop building. At the same time, the exhaust end of the surface cooling chamber 12 is also connected to the air inlet end of the reheat air duct 20, and the exhaust end of the reheat air duct 20 is connected to the starting end of the drying line, which can further reduce the power required by the main heater 73.

Of course, for those skilled in the art, the present invention is not limited to the details of the exemplary embodiments described above, but also includes the same or similar structures that can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, so it is intended to include all changes that fall within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This narrative method of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

The technology, shape and structure parts not described in detail in the present invention are all known technologies.

Claims (10)

1. A surface cooler with a heating function, characterized in that it comprises a shell (10), the inner cavity of the shell (10) is divided into a phase change condensation chamber (11) and a surface cooling chamber (12) by a partition (13), a reheat air duct (20) is arranged in the gap in the phase change condensation chamber (11), a semiconductor refrigeration plate (21) is installed on the reheat air duct (20), and the heating surface of the semiconductor refrigeration plate (21) faces inward and the cooling surface faces outward, a heat pipe heat exchanger (30) with a phase change material in the inner cavity is fixed on the partition (13), one end of the heat pipe heat exchanger (30) extends into the surface cooling chamber (12), and the other end extends to the gap between the phase change condensation chamber (11) and the reheat air duct (20). 2. A surface cooler with heating function according to claim 1, characterized in that the phase change condensation chamber (11) and the surface cooling chamber (12) are distributed up and down, and a section of the heat pipe heat exchanger (30) located in the phase change condensation chamber (11) is the phase change condensation section, and the end of the phase change condensation section is in contact with the cooling surface of the semiconductor refrigeration sheet (21). 3. A surface cooler with a heating function according to claim 1, characterized in that a section of the heat pipe heat exchanger (30) located in the surface cooling chamber (12) is a heat exchange section, and the heat pipe heat exchanger (30) is at least two distributed in a dot matrix on the partition (13), and the heat exchange sections of the heat pipe heat exchanger (30) are distributed along the vertical direction, and channels are formed between adjacent heat exchange sections for gas circulation. 4. A surface cooler with heating function according to claim 3, characterized in that heat exchange fins (31) are provided on the heat exchange section. 5. A surface cooler with heating function according to claim 4, characterized in that the heat exchange fins (31) are spiral fins, and the heat exchange fins (31) are distributed throughout the heat exchange section along the axial direction of the heat exchange section. 6. A dehumidifier, which uses a surface cooler with a heating function as described in any one of claims 1 to 5, characterized in that it includes a dehumidification wheel, and the dehumidifier also includes a dehumidification circuit for conveying the airflow to the dehumidification wheel after cooling and a drying circuit for conveying the airflow to the dehumidification wheel after reheating, the surface cooling chamber (12) is connected to the dehumidification circuit, and the reheating air duct (20) is connected to the drying circuit. 7. The dehumidifier according to claim 6 is characterized in that the dehumidification wheel includes a front dehumidification wheel (40) and a rear dehumidification wheel (50), the dehumidification line passes through the front dehumidification wheel (40) and the rear dehumidification wheel (50) in sequence, the drying line passes through the rear dehumidification wheel (50) and the front dehumidification wheel (40) in sequence, the surface cooler is located between the front dehumidification wheel (40) and the rear dehumidification wheel (50), and the reheat air duct (20) and the surface cooling chamber (12) are respectively connected to the drying line and the surface cooling line between the front dehumidification wheel (40) and the rear dehumidification wheel (50). 8. The dehumidifier according to claim 7 is characterized in that the dehumidification circuit also includes a front surface cooler (61) located on the front side of the front dehumidification wheel (40) and a front fan (62) for conveying the airflow in the dehumidification circuit, and the end of the dehumidification circuit is connected to the starting end of the drying circuit, and the end of the dehumidification circuit is also connected to the workshop building through the surface cooler or the rear heater. 9. The dehumidifier according to claim 8 is characterized in that the drying circuit also includes a main heater (73) and an auxiliary heater (71), the main heater (73) is located at the starting end of the drying circuit, the auxiliary heater (71) is located between the front dehumidification wheel (40) and the rear dehumidification wheel (50), and the end of the drying circuit is discharged outdoors. 10. The dehumidifier according to claim 9, characterized in that a rear fan (72) for conveying airflow in the drying line is installed on the drying line.