CN221304592U - Automatic wafer slicing mechanism - Google Patents
Automatic wafer slicing mechanism Download PDFInfo
- Publication number
- CN221304592U CN221304592U CN202322745657.8U CN202322745657U CN221304592U CN 221304592 U CN221304592 U CN 221304592U CN 202322745657 U CN202322745657 U CN 202322745657U CN 221304592 U CN221304592 U CN 221304592U
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- wafer
- base
- rotating motor
- roller
- fixing frame
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- 238000004140 cleaning Methods 0.000 claims abstract description 9
- 235000012431 wafers Nutrition 0.000 claims description 69
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 6
- 229910052710 silicon Inorganic materials 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- 239000013078 crystal Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model provides an automatic wafer slicing mechanism which comprises a base, wherein the upper surface of the bottom of the base is connected with a rotating device and a plurality of wafer lifting devices, the base is connected with a cleaning device, the base is connected with a plurality of separating devices, and one side of the top of the base is connected with a carrying device and a wafer box; the separating device comprises a fixing frame, a first rotating motor, a first roller and a second roller, and the fixing frame is connected with the third roller. The utility model pushes the uppermost wafer to be parallel to the second roller through the first pneumatic cylinder, the belt rotates through the first rotating motor, the belt contacts the uppermost wafer to separate the wafer from the wafer below, the wafer is sucked out through the second pneumatic cylinder and the air pump, and the wafer is placed in the wafer box, so that the wafer slicing is automated, manual slicing is not needed, the manual labor intensity is greatly saved, and the working efficiency is improved; the air knife is driven to work by the driving air cylinder, and the wafer is cleaned, so that automatic cleaning and carrying are realized.
Description
Technical Field
The utility model mainly relates to the technical field of wafer slicing, in particular to an automatic wafer slicing mechanism.
Background
Wafer refers to a silicon wafer used for manufacturing silicon semiconductor circuits, the original material of which is silicon. The high-purity polycrystalline silicon is dissolved and then doped with silicon crystal seed, and then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing the silicon crystal bar, forming a silicon wafer, namely a wafer, wherein the wafer has wafer shape and Fang Pianzhuang;
However, most of the existing wafer slicing operations are completed manually, the wafers are easy to cause secondary pollution by manual slicing, wafer slicing is easy to cause, manual slicing is time-consuming and labor-consuming, efficiency is low, and quality of products cannot be guaranteed.
Disclosure of utility model
The utility model mainly provides an automatic wafer slicing mechanism which is used for solving the technical problems in the background technology.
The technical scheme adopted for solving the technical problems is as follows: the automatic wafer slicing mechanism comprises a base, wherein the upper surface of the bottom of the base is connected with a rotating device, the upper surface of the bottom of the base is connected with a plurality of wafer lifting devices in a rotating mode, the top of the base is connected with a cleaning device, the outer side of the top of the base is connected with a plurality of separating devices, one side of the top of the base is connected with a carrying device, and one side of the carrying device is connected with a wafer box;
The separating device comprises a fixing frame connected to the top of the base, a first rotating motor connected to one side of the bottom of the fixing frame, a first roller connected to the driving end of the first rotating motor, and a second roller rotatably connected to the top of the fixing frame, wherein one side of the middle of the fixing frame is rotatably connected with a third roller, and the third roller, the second roller and the first roller are connected with a belt.
Further, the rotating device comprises a second rotating motor connected to the inside of the base and a fixed disc connected to the driving end of the second rotating motor.
Further, the wafer lifting device comprises a plurality of first pneumatic cylinders connected to the upper surface of the bottom of the base, a tray connected to the top of the first pneumatic cylinders and a plurality of wafers connected to the top of the tray.
Further, the cleaning device comprises a driving cylinder connected to the top of the base, a third rotating motor connected to the top of the driving cylinder and a fixed shell connected to the driving end of the third rotating motor, wherein one side inside the fixed shell is connected with a fourth rotating motor, the driving end of the fourth rotating motor is connected with a screw rod, the outer surface of the screw rod is connected with a moving block, one side of the moving block is connected with an air knife, and the air knife is connected with the driving cylinder through a hose.
Further, the handling device comprises a fifth rotating motor connected to the upper surface of the bottom of the base, a second pneumatic cylinder connected to the driving end of the fifth rotating motor, a fixing rod connected to the top of the second pneumatic cylinder and an air pump connected to one side of the top of the fixing rod, and a sucker is connected to one side of the bottom of the fixing rod.
Further, an annular groove is formed in the top of the base;
the top of the fixed disk is provided with an annular convex body which is connected with a groove body of the annular groove.
Further, a plurality of positioning barrels are arranged at the top of the fixed disc, and the positioning barrels correspond to the tray.
Compared with the prior art, the utility model has the beneficial effects that:
Firstly, the wafer is pushed to rise by the first pneumatic cylinder, the uppermost wafer is parallel to the second roller, the first roller is driven by the first rotating motor, so that the belt and the second roller are driven, the belt contacts the uppermost wafer to separate the wafer from the wafer below, at the moment, the wafer is sucked out by the second pneumatic cylinder and the air pump and is placed in the wafer box, the wafer slicing is automated by the device, manual slicing is not needed, the manual labor intensity is greatly saved, and the working efficiency is improved;
Secondly, the air knife is driven to work by the driving air cylinder to clean the wafer, after the wafer in one wafer lifting device is completely conveyed, the second rotating motor rotates the fixed disc, and the third rotating motor rotates the air knife to clean and convey other wafers, so that automatic conveying is realized.
The utility model will be explained in detail below with reference to the drawings and specific embodiments.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a cross-sectional view of a portion of the apparatus of the present utility model;
FIG. 3 is a schematic diagram of the structure of the separation device of the present utility model.
In the figure: 10. a base; 11. an annular groove; 20. a rotating device; 21. a second rotating motor; 22. a fixed plate; 221. positioning a barrel; 222. an annular convex body; 30. a separation device; 31. a first rotating motor; 32. a fixing frame; 33. a first roller; 34. a third roller; 35. a second roller; 36. a belt; 40. a wafer lifting device; 41. a first pneumatic cylinder; 42. a tray; 43. a wafer; 50. a cleaning device; 51. a driving cylinder; 52. a third rotary motor; 53. a fixed case; 54. a fourth rotating motor; 55. a screw rod; 56. a moving block; 57. an air knife; 60. a carrying device; 61. a fifth rotating motor; 62. a second pneumatic cylinder; 63. a fixed rod; 64. an air pump; 65. a suction cup; 70. a wafer cassette.
Detailed Description
In order that the utility model may be more fully understood, a more particular description of the utility model will be rendered by reference to the appended drawings, in which several embodiments of the utility model are illustrated, but which may be embodied in different forms and are not limited to the embodiments described herein, which are, on the contrary, provided to provide a more thorough and complete disclosure of the utility model.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may be present, and when an element is referred to as being "connected" to the other element, it may be directly connected to the other element or intervening elements may also be present, the terms "vertical", "horizontal", "left", "right" and the like are used herein for the purpose of illustration only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs, and the terms used herein in this description of the utility model are for the purpose of describing particular embodiments only and are not intended to be limiting of the utility model, with the term "and/or" as used herein including any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, an automatic wafer slicing mechanism includes a base 10, wherein an upper surface of a bottom of the base 10 is connected with a rotating device 20, an upper surface of a bottom of the base 10 is rotatably connected with a plurality of wafer lifting devices 40, a top of the base 10 is connected with a cleaning device 50, an outer side of a top of the base 10 is connected with a plurality of separating devices 30, a top side of the base 10 is connected with a carrying device 60, and a side of the carrying device 60 is connected with a wafer box 70;
The separating device 30 comprises a fixing frame 32 connected to the top of the base 10, a first rotating motor 31 connected to one side of the bottom of the fixing frame 32, a first roller 33 connected to the driving end of the first rotating motor 31, and a second roller 35 rotatably connected to the top of the fixing frame 32, wherein one side of the middle of the fixing frame 32 is rotatably connected with a third roller 34, and the third roller 34, the second roller 35 and the first roller 33 are connected with a belt 36.
In the embodiment, the first rotating motor 31 rotates the first roller 33, so as to rotate the belt 36, and further rotate the second roller 35 and the third roller 34, and the third roller 34 provides tension to the belt 36.
Referring to fig. 1-2, the rotating device 20 includes a second rotating motor 21 connected to the inside of the base 10, and a fixed disc 22 connected to the driving end of the second rotating motor 21.
In the embodiment, the second rotating motor 21 drives the fixed disc 22 to rotate.
Referring to fig. 1-2, the wafer lifting device 40 includes a plurality of first pneumatic cylinders 41 connected to the upper surface of the bottom of the base 10, a tray 42 connected to the top of the first pneumatic cylinders 41, and a plurality of wafers 43 connected to the top of the tray 42.
In the embodiment, the first pneumatic cylinder 41 is extended to drive the tray 42 to rise, so as to drive the wafer 43 to rise, and the uppermost wafer 43 is parallel to the second roller 35.
Referring to fig. 1-2, the cleaning device 50 includes a driving cylinder 51 connected to the top of the base 10, a third rotating motor 52 connected to the top of the driving cylinder 51, and a fixed housing 53 connected to the driving end of the third rotating motor 52, wherein one side of the inside of the fixed housing 53 is connected to a fourth rotating motor 54, the driving end of the fourth rotating motor 54 is connected to a screw rod 55, the outer surface of the screw rod 55 is connected to a moving block 56, one side of the moving block 56 is connected to an air knife 57, and the air knife 57 is connected to the driving cylinder 51 through a hose.
It should be noted that, in the embodiment, the third rotating motor 52 drives the fixed housing 53 to rotate, the fourth rotating motor 54 drives the screw rod 55 to rotate, so as to drive the moving block 56 to move, so as to move the air knife 57, and the driving cylinder 51 provides power for the air knife 57, so that the air knife 57 can clean the wafer 43.
Referring to fig. 1-2, the carrying device 60 includes a fifth rotating motor 61 connected to the upper surface of the bottom of the base 10, a second pneumatic cylinder 62 connected to the driving end of the fifth rotating motor 61, a fixing rod 63 connected to the top of the second pneumatic cylinder 62, and an air pump 64 connected to one side of the top of the fixing rod 63, and a suction cup 65 connected to one side of the bottom of the fixing rod 63.
In the embodiment, the fifth rotating motor 61 drives the second air cylinder 62 to rotate, the second air cylinder 62 stretches to drive the fixing rod 63 to move, so that the suction cup 65 is lifted, and the air pump 64 provides power for the suction cup 65, so that the suction cup 65 can carry the wafer 43 and place the wafer in the wafer box 70.
In an embodiment, referring to fig. 2, an annular groove 11 is formed at the top of the base 10;
The top of the fixed disc 22 is provided with an annular convex body 222, and the annular convex body 222 is connected with the groove body of the annular groove 11.
It should be noted that, in the embodiment, the annular convex body 222 is used for reinforcing and supporting the fixed disk 22.
In the embodiment, referring to fig. 2, a plurality of positioning barrels 221 are disposed on the top of the fixed tray 22, and the positioning barrels 221 correspond to the trays 42.
In the embodiment, the positioning barrel 221 is used to position the tray 42, and the wafer 43.
The specific operation mode of the utility model is as follows:
The utility model starts the first pneumatic cylinder 41 near one side of the air knife 57 at first, the first pneumatic cylinder 41 stretches and contracts to make the uppermost wafer 43 parallel to the second roller 35, at this time, the fourth rotary motor 54 drives the screw rod 55 to rotate to make the air knife 57 close to the wafer 43, then the driving cylinder 51 provides power for the air knife 57 to clean the wafer 43, at the same time, the first rotary motor 31 drives the first roller 33 to rotate to make the belt 36 rotate, and then the second roller 35 and the third roller 34 rotate, the belt 36 contacts the wafer 43 to separate the uppermost wafer 43 from the other wafers 43, at this time, the fifth rotary motor 61 drives the second pneumatic cylinder 62 to rotate, the second pneumatic cylinder 62 stretches and contracts to drive the fixed rod 63 to move to make the sucking disc 65 close to the wafer 43, the air pump 64 provides power for the sucking disc 65 to suck the wafer 43 and place the sucking disc 65 into the wafer box 70, and then the next wafer 43 is carried;
After the wafer 43 on one side is carried, the second rotating motor 21 drives the fixed disc 22 to rotate, and the third rotating motor 52 rotates at the same time, so that the next wafer lifting device 40 and the air knife 57 are aligned to the carrying device 60, and the previous operation is repeated to clean and carry the wafer 43.
While the utility model has been described above with reference to the accompanying drawings, it will be apparent that the utility model is not limited to the embodiments described above, but is intended to be within the scope of the utility model, as long as such insubstantial modifications are made by the method concepts and technical solutions of the utility model, or the concepts and technical solutions of the utility model are applied directly to other occasions without any modifications.
Claims (7)
1. The utility model provides an automatic wafer slicing machine constructs, includes base (10), its characterized in that: the upper surface of the bottom of the base (10) is connected with a rotating device (20), the upper surface of the bottom of the base (10) is rotationally connected with a plurality of wafer lifting devices (40), the top of the base (10) is connected with a cleaning device (50), the outer side of the top of the base (10) is connected with a plurality of separating devices (30), one side of the top of the base (10) is connected with a carrying device (60), and one side of the carrying device (60) is connected with a wafer box (70);
The separating device (30) comprises a fixing frame (32) connected to the top of the base (10), a first rotating motor (31) connected to one side of the bottom of the fixing frame (32), a first roller (33) connected to the driving end of the first rotating motor (31) and a second roller (35) rotatably connected to the top of the fixing frame (32), a third roller (34) is rotatably connected to one side of the middle of the fixing frame (32), and the third roller (34), the second roller (35) and the first roller (33) are connected with a belt (36).
2. An automatic wafer dicing apparatus according to claim 1, wherein: the rotating device (20) comprises a second rotating motor (21) connected to the inside of the base (10), and a fixed disc (22) connected to the driving end of the second rotating motor (21).
3. An automatic wafer dicing apparatus according to claim 1, wherein: the wafer lifting device (40) comprises a plurality of first pneumatic cylinders (41) connected to the upper surface of the bottom of the base (10), a tray (42) connected to the top of the first pneumatic cylinders (41) and a plurality of wafers (43) connected to the top of the tray (42).
4. An automatic wafer dicing apparatus according to claim 1, wherein: the cleaning device (50) comprises a driving cylinder (51) connected to the top of the base (10), a third rotating motor (52) connected to the top of the driving cylinder (51) and a fixed shell (53) connected to the driving end of the third rotating motor (52), a fourth rotating motor (54) is connected to one side of the inside of the fixed shell (53), a screw rod (55) is connected to the driving end of the fourth rotating motor (54), a moving block (56) is connected to the outer surface of the screw rod (55), an air knife (57) is connected to one side of the moving block (56), and the air knife (57) is connected with the driving cylinder (51) through a hose.
5. An automatic wafer dicing apparatus according to claim 1, wherein: the carrying device (60) comprises a fifth rotating motor (61) connected to the upper surface of the bottom of the base (10), a second pneumatic cylinder (62) connected to the driving end of the fifth rotating motor (61), a fixed rod (63) connected to the top of the second pneumatic cylinder (62) and an air pump (64) connected to one side of the top of the fixed rod (63), and a sucker (65) connected to one side of the bottom of the fixed rod (63).
6. An automatic wafer dicing mechanism according to claim 2, wherein: an annular groove (11) is formed in the top of the base (10);
The top of the fixed disc (22) is provided with an annular convex body (222), and the annular convex body (222) is connected with the groove body of the annular groove (11).
7. An automatic wafer dicing mechanism according to claim 2, wherein: the top of the fixed disc (22) is provided with a plurality of positioning barrels (221), and the positioning barrels (221) correspond to the tray (42).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322745657.8U CN221304592U (en) | 2023-10-13 | 2023-10-13 | Automatic wafer slicing mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322745657.8U CN221304592U (en) | 2023-10-13 | 2023-10-13 | Automatic wafer slicing mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221304592U true CN221304592U (en) | 2024-07-09 |
Family
ID=91750952
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322745657.8U Active CN221304592U (en) | 2023-10-13 | 2023-10-13 | Automatic wafer slicing mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221304592U (en) |
-
2023
- 2023-10-13 CN CN202322745657.8U patent/CN221304592U/en active Active
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