CN221303645U - Optical communication device - Google Patents

Abstract

The utility model relates to an optical communication device, including a housing, a wiring board, an optical fiber and a laser, wherein the housing includes a side plate and a bottom plate. The bottom plate is connected to the bottom of the inner wall of the side plate, and the laser is connected to the bottom plate so that the heat of the laser is transferred to the bottom plate. The side plate includes a first side plate and a second side plate, the optical fiber runs through the side plate and is aligned with the laser to transmit the optical signal, and the wiring board is located in the first side plate to connect an external device. A tenon is arranged in the bottom plate, and the width of the tenon ranges from 1mm to 5mm. The bottoms of the first side plate and the second side plate are both provided with grooves corresponding to the tenon, and the tenon is inserted into the groove and welded with the side plate. The utility model arranges a tenon on a bottom plate having a thermal conductivity greater than that of the side plate, and arranges a groove corresponding to the tenon in the side plate, and the tenon is inserted into the groove and welded with the side plate. When the width of the tenon is 1mm to 5mm, the warping generated on the bottom plate can be greatly reduced, thereby reducing cracks at the welding point and improving the airtightness of the optical communication device.

Description

An optical communication device

Technical Field

The utility model relates to the technical field of wireless communications, in particular to an optical communication device.

Background technique

Optical communication devices mainly refer to optoelectronic devices with various functions made by using the photoelectric conversion effect and applied in the field of optical communication. Optical communication is a communication method that uses light waves as information carriers and optical fibers as transmission media. As optical communication has the characteristics of large communication capacity, long transmission distance, small signal crosstalk, and anti-electromagnetic interference, it has brought revolutionary changes to the communication industry and has achieved rapid development. It has become the most important communication network infrastructure in the world today.

With the rapid development of optical communication technology, the requirements for optical communication devices are becoming higher and higher, including the requirements for the heat dissipation and airtightness of optical communication devices. In the prior art, the packaging of optical communication devices is generally carried out by welding. During the welding process, if the linear expansion coefficients of the two welded shells are different, the difference in the linear expansion coefficients between the two shells will cause thermal deformation of the shells, causing permanent warping of the shells. The warping in the shell will not only affect the optical coupling in the optical communication device, but also cause cracks or other abnormalities in the welding place, destroying the airtightness of the optical communication device, causing the performance of the device to deteriorate and lose reliability during subsequent use.

Utility Model Content

In view of the above-mentioned deficiencies in the prior art, the utility model provides an optical communication device, comprising a housing, a wiring board, an optical fiber and a laser, wherein the housing comprises a side plate and a bottom plate;

The bottom plate is connected to the bottom of the inner wall of the side plate, and the laser is connected to the bottom plate so that the heat of the laser is transferred to the bottom plate;

The side panel includes a first side panel and a second side panel, the wiring board is located in the first side panel to connect an external device; the optical fiber runs through the second side panel and is aligned with the laser to transmit an optical signal;

The bottom plate is provided with a tenon, the width of which ranges from 1 mm to 5 mm, the bottom of the first side plate and the bottom of the second side plate are both provided with a groove corresponding to the tenon, and the tenon is inserted into the groove and welded to the side plate.

In the above technical solution, preferably, it also includes an aluminum oxide component;

The top of the first side plate is provided with an opening, the terminal plate is located at the bottom of the opening, and the alumina member is located in the opening and connected to the terminal plate to seal the opening.

In the above technical solution, preferably, a metal coating is provided on the wiring board, and electrodes are also provided on the metal coating, and the wiring board is connected to an external device through the electrodes.

In the above technical solution, preferably, the bottom plate includes a first side and a second side, the first side and the second side are both provided with the tenon, the tenon on the first side is used to be inserted into the groove at the bottom of the first side plate, and the tenon on the second side is used to be inserted into the groove at the bottom of the second side plate;

The tenons on the first side are evenly distributed on the first side, and the tenons on the second side panel are evenly distributed on the second side.

In the above technical solution, preferably, the tenon is located at the edge of the bottom plate, and the tenon is parallel to the bottom plate.

In the above technical solution, preferably, the tenon includes a first side surface and a second side surface, the first side surface faces the bottom of the groove, the second side surface is connected to the first side surface and faces the side wall of the groove, and the first side surface and the second side surface are both provided with a welding coating for combining with solder.

In the above technical solution, preferably, the side plate includes an iron-cobalt-nickel alloy plate, and the bottom plate includes a SiC-based ceramic plate.

In the above technical solution, preferably, it also includes a fixing seat, one side of the tenon is connected to the bottom plate, and the other side is connected to the fixing seat, and the fixing seat is used to fix the shell to an external device.

In the above technical solution, preferably, a lens is further provided between the laser and the optical fiber, and the lens is used to focus the light beam emitted from the laser onto the receiving end of the optical fiber.

In the above technical solution, preferably, the shell also includes a cover plate, and the cover plate is connected to the top of the side plate.

Beneficial effect: The utility model arranges a tenon on a bottom plate whose thermal conductivity is greater than that of the side plate, and arranges a groove corresponding to the tenon in the side plate, and the tenon is inserted into the groove and welded to the side plate. When the width of the tenon is 1mm to 5mm, the warping generated on the bottom plate can be greatly reduced, thereby reducing cracks at the welding point and improving the airtightness of the optical communication device.

BRIEF DESCRIPTION OF THE DRAWINGS

The utility model is further described below in conjunction with the accompanying drawings and embodiments.

FIG1 is a schematic diagram of an explosion structure of the utility model;

Figure 2 is a schematic diagram of the connection structure between the bottom plate and the side plate of the utility model;

FIG3 is a schematic diagram of the connection structure between the cover plate and the side plate of the utility model;

FIG4 is a schematic diagram of a cross-sectional structure.

The reference numerals in the figure are: 1-bottom plate; 2-second side plate; 3-tenon; 4-fixing seat; 5-electrode; 6-metal coating; 7-connection board; 8-groove; 9-alumina component; 10-cover plate; 11-optical fiber; 12-lens; 13-laser; 14-first side plate; 15-side plate; 16-first side edge; 17-second side edge; 18-welding coating; 19-first side surface; 20-second side surface.

Detailed ways

The concept, specific structure and technical effects of the present invention will be clearly and completely described below in combination with the embodiments and drawings to fully understand the purpose, features and effects of the present invention.

In the following, various embodiments of the present invention will be described more fully. The present invention may have various embodiments, and adjustments and changes may be made therein. However, it should be understood that there is no intention to limit the various embodiments of the present invention to the specific embodiments disclosed herein, but rather the present invention should be understood to cover all adjustments, equivalents and/or alternatives that fall within the spirit and scope of the various embodiments of the present invention.

Hereinafter, the terms "include" or "may include" used in various embodiments of the present invention indicate the presence of disclosed functions, operations or elements, and do not limit the addition of one or more functions, operations or elements. In addition, as used in various embodiments of the present invention, the terms "include", "have" and their cognates are intended only to indicate specific features, numbers, steps, operations, elements, components or combinations of the foregoing, and should not be understood as first excluding the presence of one or more other features, numbers, steps, operations, elements, components or combinations of the foregoing or the possibility of adding one or more features, numbers, steps, operations, elements, components or combinations of the foregoing.

In various embodiments of the present invention, the expression "or" or "at least one of A or/and B" includes any combination or all combinations of the words listed at the same time. For example, the expression "A or B" or "at least one of A or/and B" may include A, may include B, or may include both A and B.

The expressions (such as "first", "second", etc.) used in the various embodiments of the present invention may modify the various constituent elements in the various embodiments, but may not limit the corresponding constituent elements. For example, the above expressions do not limit the order and/or importance of the elements. The above expressions are only used for the purpose of distinguishing one element from other elements. For example, the first user device and the second user device indicate different user devices, although both are user devices. For example, without departing from the scope of the various embodiments of the present invention, the first element may be referred to as the second element, and similarly, the second element may also be referred to as the first element.

It should be noted that in the present invention, unless otherwise clearly specified and defined, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

In the present invention, those skilled in the art need to understand that the terms indicating orientation or positional relationship herein are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

The terms used in the various embodiments of the present invention are only used for the purpose of describing specific embodiments and are not intended to limit the various embodiments of the present invention. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise. Unless otherwise defined, all terms used herein (including technical terms and scientific terms) have the same meaning as the meanings commonly understood by ordinary technicians in the field of the various embodiments of the present invention. Terms (such as terms defined in generally used dictionaries) will be interpreted as having the same meaning as the contextual meaning in the relevant technical field and will not be interpreted as having an idealized meaning or an overly formal meaning, unless clearly defined in the various embodiments of the present invention.

Embodiment 1

This embodiment provides an optical communication device, which can reduce the warping generated on the bottom plate 1, thereby reducing the cracks at the welding point and improving the airtightness of the optical communication device. As shown in Figures 1 to 4, it specifically includes a housing, a fixing seat 4, an optical fiber 11 and a laser 13, and the housing includes a side plate 15, a cover plate 10 and a bottom plate 1.

Wherein, as shown in Figures 1 and 2, the bottom plate 1 is connected to the bottom of the inner wall of the side plate 15 and is located in the space enclosed by the side plate 15. The side plate 15 is preferably composed of a high thermal conductivity material, such as an iron-cobalt-nickel alloy plate and a molybdenum plate, and the bottom plate 1 is preferably a SiC-based ceramic plate. Further, the cover plate 10 is welded to the top of the side plate 15, and the cover plate 10 is preferably composed of a material with the same thermal expansion coefficient as the side plate 15 to reduce the occurrence of warping. The thermal conductivity of the bottom plate 1 is greater than that of the side plate 15, the laser 13 is connected to the bottom plate 1, and the optical fiber 11 passes through the side plate 15 and is aligned with the laser 13 to transmit the optical signal. The thermal conductivity of the bottom plate 1 is greater than that of the side plate 15, which can increase the heat dissipation of the bottom plate 1, and the laser 13 is connected to the bottom plate 1 to increase the heat dissipation effect of the laser 13.

Furthermore, the bottom plate 1 is provided with a tenon 3, the width of which is greater than or equal to 1 mm and less than or equal to 5 mm, the bottom of the side plate 15 is provided with a groove 8 corresponding to the tenon 3, and the tenon 3 is inserted into the groove 8 and welded to the bottom plate 1. It should be noted that when the width of the tenon 3 is less than 1 mm, the manufacturing cost and difficulty are high, and when the width of the tenon 3 is greater than 5 mm, the effect of suppressing the warping generated on the bottom plate 1 is poor.

Preferably, the tenon 3 is parallel to the bottom plate 1, and the tenon 3 is integral with the bottom plate 1, that is, the tenon 3 is made of the same material as the bottom plate 1, and the tenon 3 is arranged along the edge of the bottom plate 1 to be evenly distributed on the edge of the bottom plate 1. Specifically, as shown in FIG. 1 and FIG. 5, the side 15 includes two identical first side panels 14 and two identical second side panels 2. The bottom plate 1 includes two first side edges and two second side edges, and a total of six tenons 3 are arranged on the two first side edges of the bottom plate 1 corresponding to the first side panels 14, and three tenons are evenly arranged on each first side edge, and a total of four tenons are arranged on the two second side edges of the bottom plate 1 corresponding to the second side panels 2, and two tenons are evenly arranged on each second side edge, wherein the fixing seat 4 is located on the tenon 3 on the second side edge of the bottom plate 1. Further, the tenon 3 includes a first side surface 19 and a second side surface 20, the first side surface 19 faces the bottom of the groove 8, the second side surface 20 connects the first side surface 19 and faces the side wall of the groove 8, and a welding coating 18 for bonding with solder is disposed on the first side surface 19 and the second side surface 20. Preferably, the welding coating 18 includes a titanium layer with a thickness of 0.1 μm, a platinum layer with a thickness of 0.2 μm, and a gold layer with a thickness of 0.5 μm to increase the bonding strength with the solder.

Preferably, one side of the tenon 3 is connected to the bottom plate 1, and the other side is connected to the fixing seat 4, and the fixing seat 4 is used to fix the housing to an external device. A through hole is provided in the fixing seat 4, and a fastener (screw or bolt, etc.) is provided to pass through the fixing hole to fix the housing to the external device. In this embodiment, the external fixing device can be a radiator, a circuit board or other devices.

Preferably, as shown in FIG. 4 , a lens 12 is further provided between the laser 13 and the optical fiber 11 , and the lens 12 is used to focus the light beam emitted from the laser 13 onto the receiving end of the optical fiber 11 .

Preferably, the side panel 15 includes a first side panel 14 and a second side panel 2, the optical fiber 11 is located in the second side panel 2, and a wiring board 7 is provided in the first side panel 14, and the wiring board 7 is used to connect an external device. A metal coating 6 is provided on the wiring board 7, and an electrode 5 is also provided on the metal coating 6, and the wiring board 7 is connected to the external device through the electrode 5. Further, an opening is provided in the first side panel 14, and the wiring board 7 is provided at the bottom of the opening, and an alumina component 9 is also provided in the opening to seal the opening. At the same time, alumina has good insulation properties, which can isolate the electronic components and optical components inside the device to a certain extent, and avoid affecting the normal operation of the device due to interference from the external environment.

In the first embodiment, the side plate 15 is an iron-cobalt-nickel alloy plate. In this embodiment, the mass proportion of the iron-cobalt-nickel alloy is: 55% iron, 16% cobalt, and 29% nickel. The thermal conductivity of the iron-cobalt-nickel alloy is 17W/(m*K), and the linear expansion coefficient is 5.3* ^10-6 (/K). The iron-cobalt-nickel alloy has good thermal conductivity, corrosion resistance, and structural stability. Further, the bottom plate 1 is a SiC-based ceramic plate, and the thermal conductivity of SiC is 270W/(m*K), which is greater than the thermal conductivity of the side plate 15, and the linear expansion coefficient is 3.7* ^10-6 (/K). In this embodiment, the size of the warpage is measured by placing the bottom plate 1 on the platform facing up (the bottom plate 1 is on the top), and the size is determined by the difference between the maximum height and the minimum height measured by a precision stylus height meter (capable of measuring micrometers). After the tenon 3 is inserted into the groove 8 and welded between the bottom plate 1 and the side plate 15, the warpage on the bottom plate 1 is measured to be 22 microns. After the bottom plate 1 and the side plate 15 are directly welded, the measured warpage on the bottom plate 1 is 50 microns, which is caused by the linear expansion coefficient between SiC and the iron-cobalt-nickel alloy. It should be noted that the heat of the laser 13 is mainly dissipated through the bottom plate 1, so the thermal conductivity of the bottom plate 1 determines the thermal conductivity of the entire shell. In order to improve the heat dissipation effect, a SiC-based ceramic plate is used as the bottom plate 1. However, the linear expansion coefficient of SiC is smaller than that of traditional materials, and there are few materials with a linear expansion coefficient equivalent to that of SiC, and the cost of SiC materials is relatively high, so the side plate 15 is still a traditional material. When the tenon 3 in the bottom plate 1 is inserted into the groove 8 in the side plate 15, the welding part between the bottom plate 1 and the side plate 15 is the part of the tenon 3 facing the bottom of the side plate 15 and the two side parts connected to the part, as shown in the shaded part and the part connected by the dotted line in Figure 1. Compared with the direct welding of the bottom plate 1 and the side plate 15, the welding part can be reduced by more than 50%, and the warpage generated by the bottom plate 1 can be reduced by 56%. Specifically, the bottom plate 1 is produced by machining a SiC-based ceramic plate with a thickness of 0.6 mm by a tool and a laser.

Furthermore, an airtight sealing test is performed using a helium (He) pressurized container and a helium leak detector. First, a shell is placed in a He pressurized container for one hour (the helium atmosphere is 5 atmospheres). Next, the shell is taken out of the He pressurized container. Then, the amount of He gas leaking from the shell is measured by a He leak detector. If the airtight seal of the shell is not complete, there is another detection method: detect the helium that penetrates into the shell when the shell is in a helium pressurized container. Before the airtight sealing test, the shell is subjected to the following thermal cycle process: first, the shell is kept at -65°C for 30 minutes. Next, it is heated to 150°C in 10 minutes and kept at 150°C for 30 minutes. Then, the temperature is dropped to -65°C within 10 minutes. This cycle is repeated 10 times. When the tenon 3 in the bottom plate 1 is inserted into the groove 8 in the side plate 15 and welded, the He gas leakage rate of the shell is less than 1* ^10-8 (atm* ^cm3 /s), while the gas leakage rate after the bottom plate 1 and the side plate 15 are directly welded is about 5* ^10-6 (atm* ^cm3 /s). Inserting the tenon 3 into the groove 8 and welding it to the bottom plate 1 can reduce the warping generated on the bottom plate 1, thereby reducing cracks at the welding point and improving the airtightness of the optical communication device.

In the second embodiment, the side plate 15 is a molybdenum plate, the thermal conductivity of molybdenum is 140W/(m*K), the linear expansion coefficient of molybdenum is 5.1* ^10-6 (/K), and the bottom plate 1 is a SiC-based ceramic plate. In this embodiment, the linear expansion coefficient of molybdenum is closer to the linear expansion coefficient of SiC than the linear expansion coefficient of the iron-cobalt-nickel alloy in the first embodiment. When the tenon 3 in the bottom plate 1 is inserted into the groove 8 in the side plate 15 and welded, the warpage on the bottom plate 1 is measured to be 20 microns.

Beneficial effect: The utility model arranges a tenon on a bottom plate whose thermal conductivity is greater than that of the side plate, and arranges a groove corresponding to the tenon in the side plate, and the tenon is inserted into the groove and welded to the side plate. When the width of the tenon is 1mm to 5mm, the warping generated on the bottom plate can be greatly reduced, thereby reducing cracks at the welding point and improving the airtightness of the optical communication device.

The above is a specific description of the preferred implementation of the utility model, but the invention of the utility model is not limited to the embodiments. Technical personnel familiar with the field can also make various equivalent deformations or substitutions without violating the spirit of the utility model. These equivalent deformations or substitutions are all included in the scope defined by the claims of this application.

Claims (10)

1. An optical communication device, comprising a housing, a patch panel, an optical fiber, and a laser, wherein the housing comprises a side plate and a bottom plate;

The bottom plate is connected to the bottom of the inner wall of the side plate, and the laser is connected to the bottom plate so that heat of the laser is transferred into the bottom plate;

The side plates comprise a first side plate and a second side plate, and the wiring board is positioned in the first side plate to be connected with external equipment; the optical fiber penetrates through the second side plate and is aligned with the laser so as to transmit optical signals;

The bottom plate is internally provided with tenons, the width range of the tenons is 1-5 mm, grooves corresponding to the tenons are formed in the bottoms of the first side plate and the second side plate, and the tenons are inserted into the grooves and welded with the first side plate and the second side plate respectively.

2. An optical communication device according to claim 1, further comprising an alumina member;

The top of the first side plate is provided with an opening, the wiring board is located at the bottom of the opening, and the aluminum oxide member is located in the opening and connected with the wiring board to seal the opening.

3. An optical communication device according to claim 2, wherein the wiring board is provided with a metal plating layer, and an electrode is further provided on the metal plating layer, and the wiring board is connected to an external device through the electrode.

4. The optical communication device of claim 1, wherein the bottom plate includes a first side and a second side, the first side and the second side each having the tongue disposed thereon, the tongue disposed on the first side for insertion into the groove in the bottom of the first side plate, and the tongue disposed on the second side for insertion into the groove in the bottom of the second side plate;

The tenons on the first side are uniformly distributed on the first side, and the tenons on the second side are uniformly distributed on the second side.

5. An optical communication device according to claim 1, wherein the tenons are located at edges of the base plate, the tenons being parallel to the base plate.

6. An optical communication device according to claim 1, wherein the tongue comprises a first side and a second side, the first side facing the bottom of the groove, the second side connecting the first side and facing the side wall of the groove, the first side and the second side each being provided with a solder plating for bonding with solder.

7. An optical communication device according to claim 1, wherein the side plate comprises an iron-cobalt-nickel alloy plate and the bottom plate comprises a SiC-based ceramic plate.

8. The optical communication device according to claim 1, further comprising a fixing base, wherein one side of the tongue is connected to the base plate, and the other side is connected to the fixing base, and the fixing base is used for fixing the housing to an external device.

9. An optical communication device according to claim 1, wherein a lens is further provided between the laser and the optical fiber, the lens being arranged to concentrate the light beam emitted from the laser onto the receiving end of the optical fiber.

10. The optical communication device of claim 1, wherein the housing further comprises a cover plate attached to a top of the side plate.