CN221302382U - Fold material detection mechanism and chip detection device - Google Patents
Fold material detection mechanism and chip detection device Download PDFInfo
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- CN221302382U CN221302382U CN202323262042.6U CN202323262042U CN221302382U CN 221302382 U CN221302382 U CN 221302382U CN 202323262042 U CN202323262042 U CN 202323262042U CN 221302382 U CN221302382 U CN 221302382U
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Abstract
The utility model discloses a stacking detection mechanism, which comprises: a base; the first sensor and the second sensor are arranged on the base at intervals, the first sensor and the second sensor are obliquely arranged, and the first sensor (20) and the second sensor (30) respectively detect two adjacent rows of chips. According to the stacking detection mechanism disclosed by the utility model, the first sensor and the second sensor are arranged on the base at intervals, and the first sensor and the second sensor are obliquely arranged, so that detection light paths of the first sensor and the second sensor can reach two rows of chip positions respectively to detect two rows of chips simultaneously, and the stacked chips can be accurately identified by the oblique structure, and the detection accuracy and the detection efficiency are improved. The utility model also discloses a chip detection device comprising the stacking detection mechanism.
Description
Technical Field
The utility model relates to the technical field of signal chip production equipment, in particular to a stacking detection mechanism and a chip detection device.
Background
The chip needs to be regularly placed on the tray after production is completed and transported to a later process along with the tray, but due to the fact that the size of a finished product of part of chips is smaller, certain stacking risks exist when the chips are placed on the tray, and the chips are difficult to accurately identify by naked eyes, and further the subsequent chip arrangement and the smooth proceeding of a packaging process are affected, so that the chip stacking prevention detection is an indispensable process, the chip stacking state detection is carried out on the tray through a camera in the prior art, the efficiency is low when the chip stacking detection is carried out on the single camera, the detection accuracy is poor, and the abnormal chip stacking detection is difficult to carry out rapidly and efficiently.
Therefore, how to perform rapid and accurate stacking detection on the chips in the tray is a problem that needs to be solved by those skilled in the art.
Disclosure of utility model
Therefore, the present utility model is directed to a stacking detection mechanism for fast and accurate stacking detection of chips in a tray.
Another object of the present utility model is to provide a chip testing device including the above stacking testing mechanism.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
fold material detection mechanism includes:
a base;
the first sensor and the second sensor are arranged on the base at intervals, the first sensor and the second sensor are obliquely arranged, and the first sensor and the second sensor respectively detect two adjacent rows of chips.
Preferably, in the above stacking detection mechanism, the stacking detection mechanism further comprises an electric actuator, wherein the electric actuator is in transmission connection with the first sensor and/or the second sensor, and the electric actuator is used for adjusting the interval between the first sensor and the second sensor.
Preferably, in the above stacking detection mechanism, the first sensor is fixedly disposed on the base, and the electric actuator drives the second sensor to move close to or away from the first sensor.
Preferably, in the above stacking detection mechanism, the stacking detection mechanism further comprises a driving unit, and the driving unit is in transmission connection with the first sensor and the second sensor to drive the first sensor and the second sensor to move so as to detect the chip. Preferably, in the above stacking detection mechanism, the first sensor and the second sensor are arranged in a first direction, the driving unit drives the first sensor and the second sensor to move in a second direction, and the first direction and the second direction are two directions perpendicular to each other on a horizontal plane.
Preferably, in the above stacking detection mechanism, the driving unit includes an electric cylinder and a motor for driving the electric cylinder.
Preferably, in the above stacking detection mechanism, an included angle between the first sensor and the second sensor is 10 degrees to 25 degrees.
A chip detection device comprises the stacking detection mechanism provided by any one of the embodiments.
Preferably, in the above chip detection device, the chip detection device further includes a rechecking camera, where the rechecking camera and the stacking detection mechanism are mounted on a same track, and perform stacking rechecking on the chips detected by the first sensor and the second sensor.
Preferably, in the above chip detection device, the chip detection device further includes a driving portion for driving the stacking detection mechanism to linearly move along a plane parallel to the chip placement tray.
According to the technical scheme, the stacking detection mechanism comprises the base, the first sensor and the second sensor, wherein the base is arranged right above the tray for placing chips as the bearing component, the sensors are used for carrying out chip state identification for accurately and efficiently detecting the chips, the first sensor and the second sensor are arranged on the base at intervals, the first sensor and the second sensor are obliquely arranged, and it is required to be noted that the first sensor and the second sensor are obliquely arranged, the arrangement states of the first sensor and the second sensor are non-parallel, so that the detection light paths of the first sensor and the second sensor are non-parallel, the detection light paths of the first sensor and the second sensor can reach the positions of two rows of chips, the detection light paths of the first sensor and the second sensor are preferably used for respectively detecting two adjacent rows of chips for detecting the accuracy, and meanwhile, the obliquely arranged sensors can be used for more accurately carrying out chip stacking detection, and therefore, the problem that whether the chips are stacked singly or not can be detected in a mode that the chips are stacked singly or in a front face is detected is solved. According to the stacking detection mechanism provided by the utility model, the chip states are identified through the sensors, the first sensors and the second sensors are arranged at intervals to cooperate with the chips at two adjacent rows to simultaneously perform stacking detection, and in order to improve the detection accuracy, the first sensors and the second sensors are obliquely arranged, so that the stacking detection effect of the sensors on the chips is more accurate through an oblique light path while the detection efficiency is improved, and the detection efficiency and the detection accuracy of chip stacking detection are improved.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a stacking detection mechanism according to an embodiment of the present utility model;
Wherein 10 is a base, 20 is a first sensor, 30 is a second sensor, and 40 is a driving unit.
Detailed Description
The core of the utility model is to disclose a stacking detection mechanism for rapidly and accurately stacking chips in a tray.
Another object of the present utility model is to disclose a chip inspection apparatus including the above stacking inspection mechanism.
In order to make the solution of the utility model better understood by a person skilled in the art, embodiments of the utility model are described below with reference to the accompanying drawings, and furthermore the embodiments shown below do not have any limiting effect on the inventive content described in the claims. The whole contents of the constitution shown in the following examples are not limited to the solution of the utility model described in the claims.
As shown in fig. 1, the stacking detection mechanism provided in the embodiment of the present utility model includes a base 10, a first sensor 20 and a second sensor 30, where the base 10 is disposed as a bearing component directly above a tray on which chips are placed, and in order to accurately and efficiently perform chip stacking detection, the sensors are used to perform chip state identification, the first sensor 20 and the second sensor 30 are disposed on the base 10 at intervals, and the first sensor 20 and the second sensor 30 are disposed obliquely, where the arrangement states of the first sensor 20 and the second sensor 30 are non-parallel, so that the detection light paths of the first sensor 20 and the second sensor 30 are non-parallel, and in order to detect accuracy, it is preferable that the detection light paths of the first sensor 20 and the second sensor 30 respectively detect adjacent chips, and whether the chips are stacked from the front face or not accurately and rapidly.
It should be noted that, the stacking detection mechanism provided by the embodiment of the utility model can be additionally provided with the sensor for auxiliary detection, and only the sensors which are arranged in other ways are required to be obliquely arranged to detect the chips from other angles, so that the detection accuracy of the stacking state of the chips is improved.
According to the stacking detection mechanism provided by the embodiment of the utility model, the chip state is identified through the sensors, the first sensor 20 and the second sensor 30 are arranged at intervals to cooperate with the chips in two adjacent rows to perform stacking detection at the same time, and in order to improve detection accuracy, the first sensor 20 and the second sensor 30 are obliquely arranged, so that the stacking detection effect of the sensors on the chips is more accurate through an oblique light path while the detection efficiency is improved, and the detection efficiency and the detection accuracy of chip stacking detection are improved.
Further, an electric actuator is further arranged in the stacking detection mechanism provided by the embodiment of the utility model, and the electric actuator is in transmission connection with the first sensor 20 and/or the second sensor 30 so as to drive and adjust the distance between the first sensor 20 and the second sensor 30, so that the first sensor 20 and the second sensor 30 can be suitable for multiple groups of adjacent chips with different intervals, and the universalization degree of equipment is improved.
On the basis of the above embodiment, in order to reduce the adjustment difficulty, it is preferable that the first sensor 20 is fixedly disposed on the base 10, and the electric actuator is separately in transmission connection with the second sensor 30, so as to drive the second sensor 30 to perform a movement close to or far from the first sensor 20, so as to achieve the adjustment of the distance between the first sensor 20 and the second sensor 30.
Further, the stacking detection mechanism provided by the embodiment of the utility model further comprises a driving unit 40, and the driving unit 40 is in transmission connection with the first sensor 20 and the second sensor 30 so as to drive the first sensor 20 and the second sensor 30 to move along the arrangement direction of chips to smoothly detect the chips.
On the basis of the above embodiment, in order to standardize the detection of the chips by the stacking detection mechanism, in the stacking detection mechanism provided by the embodiment of the present utility model, the first sensor 20 and the second sensor 30 are arranged at intervals in the first direction, and the driving unit 40 drives the first sensor 20 and the second sensor 30 to move in the second direction, where the first direction and the second direction are two directions perpendicular to each other on the horizontal plane, that is, the first sensor 20 and the second sensor 30 cover a plurality of rows of chips when being arranged, and move along the column under the driving of the driving unit 40, so that the first sensor 20 and the second sensor 30 sequentially detect the chips at any position on the tray, thereby avoiding missing detection.
Further, in an embodiment of the present utility model, the driving unit 40 is electrically driven, and the driving unit 40 includes an electric cylinder and a motor for driving the electric cylinder.
Further, in a preferred embodiment of the present utility model, the included angle between the first sensor 20 and the second sensor 30 is 10 degrees to 25 degrees, so that the requirement of angle inclination detection between the first sensor 20 and the second sensor 30 is met, and meanwhile, the area of the detection overlapping area is large, so that the detection requirement of multiple chips can be met at the same time, and the detection efficiency is improved.
The embodiment of the utility model also provides a chip detection device, which comprises the stacking detection mechanism provided by any embodiment, so as to detect the stacking state of chips on the tray.
Further, on the basis of the above embodiment, the chip detection device further includes a rechecking camera, where the rechecking camera and the stacking detection mechanism are mounted on the same track to move synchronously with the first sensor 20 and the second sensor 30, and perform stacking rechecking on the chips detected by the first sensor 20 and the second sensor 30, so as to avoid the problem of missed detection of the stacked chips, and improve the accuracy of chip detection.
Further, on the basis of the above embodiment, the device further includes a driving portion, the driving portion is configured to drive the stacking detection mechanism to move linearly along a plane parallel to the plane where the chip is placed, and the driving portion drives the stacking detection mechanism to move integrally, so as to drive the first sensor 20 and the second sensor 30 to detect the chip, and the driving portion sets a driving path of the stacking detection mechanism according to a placement position of the chip on the tray by an operator.
The terms first, second, left and right in the description and the claims of the present utility model and in the above-described drawings, etc. are used for distinguishing between different objects and not for describing a particular sequential order. Furthermore, the terms "comprise" and "have," as well as any variations thereof, are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to the listed steps or elements but may include steps or elements not expressly listed.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
1. Fold material detection mechanism, characterized in that includes:
a base (10);
The sensor comprises a first sensor (20) and a second sensor (30), wherein the first sensor (20) and the second sensor (30) are arranged on a base (10) at intervals, the first sensor (20) and the second sensor (30) are obliquely arranged, and the first sensor (20) and the second sensor (30) respectively detect two adjacent rows of chips.
2. The stack detection mechanism according to claim 1, further comprising an electric actuator in driving connection with the first sensor (20) and/or the second sensor (30), the electric actuator being adapted to adjust the spacing of the first sensor (20) from the second sensor (30).
3. The stacking detection mechanism according to claim 2, wherein the first sensor (20) is fixedly arranged on the base (10), and the electric actuator drives the second sensor (30) to move close to or away from the first sensor (20).
4. The stacking detection mechanism as recited in claim 1, further comprising a drive unit (40), wherein the drive unit (40) is in driving connection with the first sensor (20) and the second sensor (30) to drive the first sensor (20) and the second sensor (30) to move for chip detection.
5. The stacking detection mechanism as recited in claim 4, wherein the first sensor (20) and the second sensor (30) are arranged in a first direction, and the driving unit (40) drives the first sensor (20) and the second sensor (30) to move in a second direction, and the first direction and the second direction are two directions perpendicular to each other in a horizontal plane.
6. The stack detection mechanism according to claim 4, characterized in that the drive unit (40) comprises an electric cylinder and a motor for driving the electric cylinder.
7. The stack inspection mechanism of claim 1, characterized in that the angle between the first sensor (20) and the second sensor (30) is 10 degrees to 25 degrees.
8. A chip testing device comprising a stack testing mechanism according to any one of claims 1-7.
9. The chip inspection apparatus according to claim 8, further comprising a review camera mounted on the same rail as the stacking inspection mechanism and performing stacking review on the chips inspected by the first sensor (20) and the second sensor (30).
10. The chip inspection apparatus of claim 8, further comprising a driving portion for driving the stacking inspection mechanism to move linearly along a plane parallel to the chip placement tray.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323262042.6U CN221302382U (en) | 2023-11-30 | 2023-11-30 | Fold material detection mechanism and chip detection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323262042.6U CN221302382U (en) | 2023-11-30 | 2023-11-30 | Fold material detection mechanism and chip detection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221302382U true CN221302382U (en) | 2024-07-09 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323262042.6U Active CN221302382U (en) | 2023-11-30 | 2023-11-30 | Fold material detection mechanism and chip detection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221302382U (en) |
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2023
- 2023-11-30 CN CN202323262042.6U patent/CN221302382U/en active Active
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