CN221176172U - Wafer polishing and washing device - Google Patents
Wafer polishing and washing device Download PDFInfo
- Publication number
- CN221176172U CN221176172U CN202323154639.9U CN202323154639U CN221176172U CN 221176172 U CN221176172 U CN 221176172U CN 202323154639 U CN202323154639 U CN 202323154639U CN 221176172 U CN221176172 U CN 221176172U
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- CN
- China
- Prior art keywords
- cylindrical cam
- wafer polishing
- washing apparatus
- wafer
- output shaft
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- 238000005406 washing Methods 0.000 title claims abstract description 41
- 238000005498 polishing Methods 0.000 title claims abstract description 29
- 235000012431 wafers Nutrition 0.000 claims description 49
- 238000004140 cleaning Methods 0.000 claims description 36
- 238000005096 rolling process Methods 0.000 claims description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 16
- 230000003749 cleanliness Effects 0.000 description 9
- 239000002904 solvent Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 7
- 238000010276 construction Methods 0.000 description 6
- 230000001105 regulatory effect Effects 0.000 description 3
- 239000012459 cleaning agent Substances 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The utility model provides a wafer polishing and washing device which comprises a water tank and a washing basket arranged in the water tank in a sliding way, wherein the outer side of the water tank is connected with a fixing structure, the fixing structure comprises a fixing frame and a supporting frame, the fixing frame is connected to the outer side of the water tank, the fixing frame is provided with a sliding structure connected with the washing basket in a sliding way, the supporting frame is provided with a variable-frequency driving structure, the variable-frequency driving structure comprises a driving mechanism connected with the supporting frame and a cylindrical cam rotatably arranged on the driving mechanism, the bottom of the sliding structure is abutted against the top of the cylindrical cam, the variable-frequency driving structure is connected with the bottom of the supporting frame through a fixing piece, an output shaft of the driving mechanism penetrates through the fixing piece and the supporting frame, the cylindrical cam is sleeved on the output shaft, the bottom of the sliding structure is abutted against the cylindrical cam, and the driving mechanism drives the cylindrical cam to rotate, so that the sliding structure abutted against the top of the cylindrical cam drives the washing basket to controllably move up and down in the water tank.
Description
Technical Field
The utility model relates to the technical field of semiconductor processes, in particular to a wafer polishing and washing device.
Background
The wafer cleaning is a process for cleaning pollutants generated by contacting various organic matters, particles and metals on the wafer, generally four to ten cleaning water tanks are needed, and each water tank is matched with different chemical cleaning agents to improve the cleaning effect.
The polishing and washing device is suitable for wafer washing, the product workpieces are loaded to the washing jig in a vertical inserting sheet mode, gaps are reserved among products, all chemical cleaning agents are arranged around the product workpieces during washing operation, the polishing and washing device is used under the condition, friction between the surfaces of the product workpieces and a washing solvent is increased, greasy dirt and impurities on the surfaces can be effectively stripped, and the cleanliness of the surfaces of the products is improved.
In the prior art, the existing polishing and washing device is generally provided with a cylinder corresponding to a water tank, four to ten polishing and washing devices are needed for completing the whole wafer cleaning process, different cleaning solvents are used for polishing and washing, the wafer cleaning efficiency is low, the polishing and washing speed cannot be adjusted in the polishing and washing process by using the cylinder, and the cleaning cleanliness of the wafer cannot be guaranteed.
Disclosure of utility model
Based on the above, the utility model aims to provide a wafer polishing and washing device, which can effectively solve the problems that the existing polishing and washing device is low in wafer washing efficiency, the polishing and washing speed cannot be adjusted in the polishing and washing process by using an air cylinder, and the wafer washing cleanliness cannot be guaranteed.
The utility model provides a wafer throwing washes device, includes the basin and is in the washing basket that slides in the basin and set up be connected with fixed knot constructs on the outside of basin, fixed knot constructs including mount and support frame, the mount is connected the outside of basin the slip structure that is provided with on the mount with wash the basket and be connected be provided with variable frequency drive structure on the support frame, variable frequency drive structure include with the actuating mechanism that the support frame is connected and rotate the cylindrical cam that sets up on the actuating mechanism, the upper surface of cylindrical cam is hollow cylinder's inclined section, just the bottom of sliding structure supports and leans on the top of cylindrical cam, variable frequency drive structure passes through the bottom of mounting at the support frame, just actuating mechanism's output shaft runs through mounting and the support frame, cylindrical cam cover is established on the output shaft, sliding structure's bottom supports and leans on the cylindrical cam, drives through actuating mechanism the cylindrical cam rotates, so that supports and leans on cylindrical cam's on the sliding structure at the cylindrical cam top drives wash and be in the basin can regulate and control the basket and control down.
Further, the sliding structure comprises a T-shaped plate and a connecting plate, one end of the connecting plate is connected to the T-shaped plate, a cross beam is connected to the other end of the connecting plate, and a plurality of connecting pieces used for connecting the cleaning basket are arranged on the cross beam.
Further, a rolling element is arranged at the bottom end of the T-shaped plate, and the rolling element abuts against the top of the cylindrical cam to roll.
Further, a plurality of limit posts are arranged on the fixing frame, and the limit posts are arranged around the T-shaped plate.
Further, a sliding rail and a sliding block sliding on the sliding rail are arranged on the fixing frame, and the sliding rail and the sliding block are arranged on two sides of the limiting column.
Further, the sliding blocks are connected to bottoms of two ends of the T-shaped plate.
Further, a wafer box for fixing wafers is arranged in the cleaning basket.
Further, a square key is connected between the cylindrical cam and the output shaft.
Furthermore, a key groove matched with the square key is formed in the inner hole of the cylindrical cam and the outer side of the output shaft.
Further, a threaded hole for installing a fixing bolt is formed in the center of the top of the output shaft.
Compared with the prior art, the utility model has the beneficial effects that: the variable frequency driving structure is arranged on the fixed structure, so that the speed of up-down throwing of the cleaning basket in the water tank filled with the cleaning solvent can be regulated through the variable frequency driving structure, and the cleanliness of wafer cleaning is improved; specifically, through establishing the cylinder cam cover on the output shaft of drive structure, it is rotatory to drive the cylinder cam through drive structure, so that the speed of throwing at the wafer throwing in-process can be regulated and control through drive structure, through supporting sliding construction and leaning on the upper surface of cylinder cam, through setting the upper surface of cylinder cam to hollow cylinder's sloping section, so that cylinder cam can slide from top to bottom in rotatory in-process sliding construction, so that drive through sliding construction and wash the basket and throw from top to bottom in the basin of filling with cleaning solvent adjustable and controllable, thereby improve wafer abluent cleanliness factor and wafer abluent efficiency.
Drawings
FIG. 1 is a schematic view of an overall structure of a wafer polishing and washing apparatus according to an embodiment of the present utility model;
FIG. 2 is a schematic diagram of the overall structure of a sliding device according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of the overall structure of a variable frequency driving structure according to an embodiment of the present utility model;
description of main reference numerals:
| Water tank | 100 | Rolling element | 143 |
| Cleaning basket | 110 | Spacing post | 144 |
| Cassette | 111 | Sliding rail | 145 |
| Wafer with a plurality of wafers | 112 | Sliding block | 146 |
| Connecting piece | 113 | Variable frequency driving structure | 150 |
| Cross beam | 120 | Cylindrical cam | 151 |
| Fixing structure | 130 | Fixing piece | 152 |
| Fixing frame | 131 | Driving mechanism | 153 |
| Supporting frame | 132 | Output shaft | 154 |
| Sliding structure | 140 | Square key | 155 |
| Connecting plate | 141 | Fixing bolt | 156 |
| T-shaped plate | 142 |
The utility model will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. Several embodiments of the utility model are presented in the figures. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "mounted" on another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 to 3, a wafer polishing and washing apparatus according to an embodiment of the present utility model includes two water tanks 100 closely disposed and a cleaning basket 110 respectively disposed in the water tanks 100 for sliding, six cassettes 111 for fixing wafers 112 are disposed in the cleaning basket 110, a fixing structure 130 is connected to the same side of the two water tanks 100, the fixing structure 130 includes a fixing frame 131 and a supporting frame 132, a variable frequency driving structure 150 for driving the sliding structure 140 to slide up and down is disposed on the supporting frame 132, the sliding structure 140 is slidably disposed on the fixing frame 131, a cross beam 120 is connected to the sliding structure 140, four connecting members 113 for connecting the cleaning basket 110 are disposed on the cross beam 120, the variable frequency driving structure 150 includes a fixing member 152 connected to a bottom of the supporting frame 132, a driving mechanism 153 connected to a bottom of the fixing member 152, and a cylindrical cam 151 sleeved on an output shaft 154 of the driving mechanism 153 for rotating, the driving shaft 154 of the driving mechanism 153 penetrates through the fixing member 152 and the supporting frame 132, the sliding structure 140 is connected to the cross beam 120, and the connecting member 113 is disposed on the cross beam 120.
It can be understood that by arranging the adjustable driving mechanism 153, the wafer polishing and washing device can adjust the polishing and washing speed, so as to ensure the cleanliness of wafer cleaning; specifically, the rotation speed of the cylindrical cam 151 is adjusted by the driving mechanism 153 to adjust the sliding speed of the sliding structure 140 on the supporting frame 132, so as to adjust the speed of the cleaning basket 110 that throws up and down in the water tank 100, so that the wafer throwing and cleaning device can adjust the throwing speed, and further ensure the cleanliness of wafer cleaning.
It can be appreciated that by providing four connectors 113 for connecting the cleaning basket 110 to the cross beam 120, the wafer polishing apparatus can simultaneously polish two kinds of wafers 112 using different cleaning solvents; specifically, by fixing the wafer 112 in the wafer box 111, pouring the corresponding cleaning solvents into each cleaning basket 110, and starting the driving mechanism 153, the cylindrical cam 151 is rotated to drive the sliding structure 140 to slide up and down on the fixing frame 131, so that the two cleaning baskets 110 connected to the beam 120 reciprocate up and down in the corresponding water tanks 100, and the wafer polishing device is further enabled to polish and clean two wafers 112 using different cleaning solvents.
In this embodiment, the highest point and the lowest point of the upper surface of the cylindrical cam 151 are calculated lengths, which satisfy the shape stroke required for the up-and-down throwing of the entire cleaning basket 110.
In this embodiment, four connecting members 113 for connecting the cleaning basket 110 are disposed on the cross beam 120, but in actual situations, a plurality of connecting members 113 may be disposed according to actual requirements.
It should be noted that, in this embodiment, the sliding structure 140 includes a connecting plate 141, a T-shaped plate 142, a rolling member 143, a limiting post 144, a sliding rail 145 and a sliding block 146, two ends of the connecting plate 141 are respectively connected with the T-shaped plate 142 and the cross beam 120, the rolling member 143 is disposed at the bottom end of the T-shaped plate 142 and is disposed on the upper surface of the cylindrical cam 151 in a rolling manner, the limiting post 144 is disposed on the fixing frame 131 around the T-shaped plate, the sliding rail 145 is disposed on two sides of the limiting post 144, the sliding block 146 is slidably disposed on the sliding rail 145 and is connected with the bottoms of two ends of the T-shaped plate 142, and when the cylindrical cam 151 rotates, the sliding structure 140 drives the cross beam 120 connected to the connecting plate 141 to slide up and down through the T-shaped plate 142.
Further, the square key 155 is connected between the cylindrical cam 151 and the output shaft 154, and a key slot adapted to the square key 155 is provided in the inner hole of the cylindrical cam 151 and the outer side of the output shaft 154.
It will be appreciated that by providing the square key 155 and a key slot adapted to the square key 155, the output shaft 154 and the cylindrical cam 151 can be kept rotated synchronously, enhancing the torque transmitted by the output shaft 154.
Further, a screw hole for mounting a fixing bolt 156 is formed at the center of the top of the output shaft 154.
It will be appreciated that the cylindrical cam 151 is fastened to the output shaft by the fixing bolt 156 by providing a screw hole for installing the fixing bolt 156 in the center of the top of the output shaft 154.
In summary, in the wafer polishing and washing device in the above embodiment of the present utility model, by setting the variable frequency driving structure on the fixing structure, the speed of the cleaning basket in the water tank filled with the cleaning solvent can be adjusted by the variable frequency driving structure, so as to improve the cleanliness of wafer cleaning; specifically, through establishing the cylinder cam cover on the output shaft of drive structure, it is rotatory to drive the cylinder cam through drive structure, so that the speed of throwing at the wafer throwing in-process can be regulated and control through drive structure, through supporting sliding construction and leaning on the upper surface of cylinder cam, through setting the upper surface of cylinder cam to hollow cylinder's sloping section, so that cylinder cam can slide from top to bottom in rotatory in-process sliding construction, so that drive through sliding construction and wash the basket and throw from top to bottom in the basin of filling with cleaning solvent adjustable and controllable, thereby improve wafer abluent cleanliness factor and wafer abluent efficiency.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The foregoing examples illustrate only a few embodiments of the utility model and are described in detail herein without thereby limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.
Claims (10)
1. The utility model provides a wafer throwing washing device, its characterized in that includes the basin and is in the washing basket that the slip set up in the basin be connected with fixed knot constructs on the outside of basin, fixed knot constructs including mount and support frame, the mount is connected the outside of basin the slip structure that is provided with on the mount with wash the basket and be connected be provided with variable frequency drive structure on the support frame, variable frequency drive structure include with the actuating mechanism that the support frame is connected and rotate the cylindrical cam that sets up on the actuating mechanism, the upper surface of cylindrical cam is hollow cylinder's inclined section, just the bottom of sliding structure supports and leans on the top of cylindrical cam, variable frequency drive structure passes through the mounting and the support frame, cylindrical cam cover is established on the output shaft, the bottom of sliding structure supports and leans on the cylindrical cam, through actuating mechanism drives cylindrical cam rotates, so that supports and lean on the sliding structure at cylindrical cam top the basin drives the regulation and control that washs in the interior.
2. The wafer polishing and washing apparatus as claimed in claim 1, wherein the sliding structure comprises a T-shaped plate and a connection plate having one end connected to the T-shaped plate, a cross beam connected to the other end of the connection plate, and a plurality of connection members for connecting the cleaning basket provided on the cross beam.
3. The wafer polishing and washing apparatus as claimed in claim 2, wherein a rolling member is provided at a bottom end of the T-shaped plate, the rolling member rolling against a top of the cylindrical cam.
4. A wafer polishing and washing apparatus according to claim 3 wherein a plurality of stopper posts are provided on the holder, the stopper posts being provided around the T-shaped plate.
5. The wafer polishing and washing apparatus according to claim 4, wherein a slide rail and a slider that slides on the slide rail are provided on the fixing frame, the slide rail and the slider being provided on both sides of the stopper post.
6. The wafer polishing and washing apparatus as claimed in claim 5, wherein the slider is connected to bottoms of both ends of the T-shaped plate.
7. The wafer polishing and washing apparatus as claimed in claim 1, wherein a cassette for holding wafers is provided in the cleaning basket.
8. The wafer polishing and washing apparatus as recited in claim 1 wherein a square key is connected between the cylindrical cam and the output shaft.
9. The wafer polishing and washing apparatus according to claim 8, wherein a key groove adapted to the square key is provided in an inner hole of the cylindrical cam and an outer side of the output shaft.
10. The wafer polishing and washing apparatus as claimed in claim 1, wherein a screw hole for mounting a fixing bolt is provided at a center of a top of the output shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323154639.9U CN221176172U (en) | 2023-11-22 | 2023-11-22 | Wafer polishing and washing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323154639.9U CN221176172U (en) | 2023-11-22 | 2023-11-22 | Wafer polishing and washing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221176172U true CN221176172U (en) | 2024-06-18 |
Family
ID=91438943
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323154639.9U Active CN221176172U (en) | 2023-11-22 | 2023-11-22 | Wafer polishing and washing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221176172U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120221461A (en) * | 2025-03-26 | 2025-06-27 | 常州华茂电气科技有限公司 | A semiconductor wafer surface pretreatment device |
-
2023
- 2023-11-22 CN CN202323154639.9U patent/CN221176172U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN120221461A (en) * | 2025-03-26 | 2025-06-27 | 常州华茂电气科技有限公司 | A semiconductor wafer surface pretreatment device |
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