CN221175331U

CN221175331U - Electronic equipment

Info

Publication number: CN221175331U
Application number: CN202322665874.6U
Authority: CN
Inventors: 陈兵; 路雪
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2023-09-28
Filing date: 2023-09-28
Publication date: 2024-06-18
Anticipated expiration: 2033-09-28

Abstract

The application discloses an electronic device, which comprises: the main board is used for installing functional components including the memory module to realize the operation of the electronic equipment; the switching circuit board is positioned in the direction of the memory module, away from the main board, and is used for supplying power to the graphic processing component; the graphic processing component is connected with the main board through the switching circuit board; the graphic processing component and the memory module are positioned on the same side of the main board, and the vertical distance between the bottom of the graphic processing component and the main board is not smaller than the height of the memory module on the main board. The electronic equipment is provided with the switching circuit board, the switching circuit board is used for supplying power to the graphic processing component, and when the switching circuit board is connected with the graphic processing component based on the special power supply cable of the graphic processing component, the special power supply cable of the graphic processing component is connected to the graphic processing component based on the space region above the memory module, so that the problem of passing through the special power supply cable of the graphic processing component is effectively solved.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronics, in particular to electronic equipment.

Background

The model of the graphic processing component is numerous, and the length specification of the component is not larger along with the increase of the operation capability, so that the power supply requirement is also continuously increased; because the length specification of the graphic processing component becomes larger (that is, the component becomes longer), the graphic processing component overlaps with the central processing unit and the power supply module at the bottom, that is, the tail of the graphic processing component extends above the central processing unit module, great design difficulty is brought to the running of the special power supply cable of the graphic processing component, and even the problem that the design scheme is not feasible is caused.

Disclosure of utility model

In view of this, the present application provides an electronic apparatus including:

The main board is used for installing functional components including a memory module to realize the operation of the electronic equipment;

The switching circuit board is positioned in the direction of the memory module, which is away from the main board, and is used for supplying power to the graphic processing component;

The graphic processing component is connected with the main board through the switching circuit board;

The graphics processing component and the memory module are positioned on the same side of the main board, and the vertical distance between the bottom of the graphics processing component and the main board is not smaller than the height of the memory module on the main board.

Preferably, in the electronic device, the motherboard includes a first motherboard region and a second motherboard region sequentially arranged in a first direction; the memory module is fixedly connected to the first main board area; the second main board area is fixedly connected with a first power connector, the first power connector is connected with the switching circuit board through a first power line, and the first direction is parallel to the main board;

The vertical projection of the first power line on the main board and the vertical projection of the memory module on the main board are oppositely and sequentially arranged in a second direction; the second direction is perpendicular to the first direction and parallel to the main board.

Preferably, in the above electronic device, when the second main board area is fixedly connected to a plurality of first power connectors, one first power connector is correspondingly connected to the switching circuit board through one first power line, and a plurality of first power connectors are correspondingly connected to a plurality of first power lines;

And in the second direction, the vertical projection of the memory module on the main board is at least positioned between the vertical projections of two first power lines in the plurality of first power lines on the main board.

Preferably, in the electronic device, in the first direction, a second power connector and a third power connector are sequentially and fixedly connected to the switching circuit board; the second power connector is connected with the graphic processing component through a second power line, and the third power connector is connected with the first power connector through the first power line.

Preferably, in the electronic device, the number of the second power connectors corresponds to the number of the graphics processing components, and the second power connectors are connected with the graphics processing components in a one-to-one correspondence.

Preferably, in the electronic device, the number of the first power connectors on the second motherboard region corresponds to the number of the third power connectors on the switch circuit board.

Preferably, in the electronic apparatus described above, the electronic apparatus has a housing;

The main board is fixed at the bottom of the shell; the switching circuit board is fixed on two opposite side walls of the shell; the graphic processing component is fixedly connected to a sub-circuit board, the sub-circuit board is fixed on the two side walls, and in the direction perpendicular to the main board, the sub-circuit board and the memory module have no overlapping part;

The vertical distance between the sub-circuit board and the main board is smaller than the height of the memory module on the main board; the surface of the sub-circuit board is provided with a plurality of mounting grooves for detachably mounting the graphic processing component.

Preferably, in the above electronic device, the lengths of the graphic processing components mounted in at least two of the mounting grooves are different;

The two side walls are provided with a plurality of first mounting positions for mounting the switching circuit board; and when the transfer circuit board is positioned at different first mounting positions in the length direction of the graphic processing component, the distance between the transfer circuit board and the sub circuit board is different.

Preferably, in the electronic device, the two side walls have a plurality of second mounting positions for mounting the switching circuit board; when the switching circuit board is positioned at different second installation positions, the vertical distance between the switching circuit board and the main board is different.

Preferably, in the above electronic apparatus, the switching circuit board is fixed to the opposite side walls of the housing based on brackets fixed to the opposite side walls of the housing.

Based on the above, the present application provides an electronic device, which includes: the main board is used for installing functional components including a memory module to realize the operation of the electronic equipment; the switching circuit board is positioned in the direction of the memory module, which is away from the main board, and is used for supplying power to the graphic processing component; the graphic processing component is connected with the main board through the switching circuit board; the graphics processing component and the memory module are positioned on the same side of the main board, and the vertical distance between the bottom of the graphics processing component and the main board is not smaller than the height of the memory module on the main board. The electronic equipment is provided with a transfer circuit board which is used for supplying power to the graphic processing component, wherein the transfer circuit board is arranged on the direction of the memory module, which is away from the main board, and the transfer circuit board and the graphic processing component are sequentially arranged in the direction parallel to the main board. When the switching circuit board is connected with the special power supply cable of the graphic processing component, the special power supply cable of the graphic processing component is connected to the graphic processing component based on a space area above the memory module, so that the problem of passing of the special power supply cable of the graphic processing component is effectively solved.

Drawings

In order to more clearly illustrate the embodiments of the present application or the technical solutions in the related art, the drawings required for the description of the embodiments or the prior art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present application, and other drawings may be obtained according to the provided drawings without inventive effort to those skilled in the art.

The structures, proportions, sizes, etc. shown in the drawings are shown only in connection with the present disclosure, and therefore should not be construed as limiting the application, but rather as limiting the scope of the application, so that any structural modifications, proportional changes, or dimensional adjustments should fall within the scope of the application without affecting the efficacy or achievement thereof.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

Fig. 2 is a schematic structural diagram of another electronic device according to an embodiment of the present application;

Fig. 3 is a top view of another electronic device according to an embodiment of the present application;

Fig. 4 is a schematic structural diagram of still another electronic device according to an embodiment of the present application;

FIG. 5 is a top view of an electronic device provided by the embodiment of FIG. 4;

fig. 6 is a schematic structural diagram of still another electronic device according to an embodiment of the present application;

FIG. 7 is a top view of an electronic device provided by the embodiment of FIG. 6;

FIG. 8 is a top view of yet another electronic device provided in an embodiment of the present application;

fig. 9 is a top view of an electronic device provided by the embodiment shown in fig. 8.

Detailed Description

Embodiments of the present application will now be described more fully hereinafter with reference to the accompanying drawings, in which it is shown, however, in which some, but not all embodiments of the application are shown. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

With the continuous development of the related technologies of artificial intelligence and big data, the computing capacity of the computing nodes of the Server is higher and higher, and the high parallel computing capacity of the graphic processing Server (GPU Server) can just greatly improve the data computing capacity of a single node of the Server.

The architecture of the graphics processing unit is generally 4U high in the chassis, the bottom layer 1U is used for placing the motherboard of the central processing unit, and the top layer 3U is used for placing the graphics processing unit. The motherboard fixed on the chassis of the chassis sends signals and power to the bottom board (PCB) of the graphics processing unit fixed at the height of the chassis 1U by means of an insulated cable (cable) or a power supply column connector, and then signals and power are supplied to the graphics processing unit through a standard slot (PCIe). Because the power consumption of a graphics processing unit typically exceeds the 75W power capability of a standard socket, special power connectors are typically reserved to supply additional power to the graphics processing unit's power connectors by way of cables. And with the increase of the operation capability, the length specification of the graphic processing component is larger, that is, the component is longer, the graphic processing component overlaps with the central processor and the power supply module at the bottom, that is, the tail of the graphic processing component extends to the upper part of the central processor module, so that a very large design difficulty challenge is brought to the running of a special power supply cable of the graphic processor, and even the problem that a design scheme is not feasible is caused.

At present, the placement position of a special power connector for a graphic processing component mainly comprises the following two solutions: the first scheme is that the device is fixed on a bottom plate with the height of 1U for fixing the graphic processing component, but the device can only be placed outside a graphic processing area due to the limited high requirement of space below the graphic processing component, so that the expansion of the size of the graphic processing bottom plate causes cost rise and difficult maintenance, and the power position design can only be carried out according to the supported maximum length graphic processor; the second solution is to fix on the motherboard at the bottom, but because the graphics processing unit is numerous, the power cable can only communicate up and down through the gap between the cpu and the memory module and the motherboard for graphics processing unit fixed at the 1U position, so the solution can only support the length of graphics processing unit not exceeding the specifications of the cpu and the memory module at the bottom.

Based on the above-mentioned problems, the present application provides an electronic device, in which a switching circuit board is provided, the switching circuit board is used for supplying power to a graphics processing component, the switching circuit board is disposed in a direction in which a memory module is away from a motherboard, and in a direction parallel to the motherboard, the switching circuit board and the graphics processing component are disposed in sequence. When the switching circuit board is connected with the special power supply cable of the graphic processing component, the special power supply cable of the graphic processing component is connected to the graphic processing component based on a space area above the memory module, so that the problem of passing of the special power supply cable of the graphic processing component is effectively solved.

In order that the above-recited objects, features and advantages of the present application will become more readily apparent, a more particular description of the application will be rendered by reference to the appended drawings and appended detailed description.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application, where the electronic device includes:

the main board 1, the main board 1 is used for installing functional components including the memory module 2 to realize the operation of the electronic equipment;

The switching circuit board 3 is positioned in the direction of the memory module 2 away from the main board 1, and the switching circuit board 3 is used for supplying power to the graphic processing component 4;

The graphic processing component 4 is connected with the main board 1 through the switching circuit board 3;

The graphics processing component 4 and the memory module 2 are located on the same side of the motherboard 1, and the vertical distance between the bottom of the graphics processing component 4 and the motherboard 1 is not less than the height of the memory module 2 on the motherboard 1.

In the electronic device shown in fig. 1, there is a switching circuit board 3, the switching circuit board 3 is used for supplying power to the graphics processing component 4, the switching circuit board 3 is disposed in a direction in which the memory module 2 is away from the motherboard 1, and in a direction parallel to the motherboard 1, the switching circuit board 3 and the graphics processing component 4 are disposed in sequence. When the switching circuit board 3 and the graphics processing component 4 are connected based on the special power supply cable of the graphics processing component 4, the special power supply cable of the graphics processing component 4 is connected to the graphics processing component 4 based on the space region above the memory module 2, so that the problem of passing of the special power supply cable of the graphics processing component 4 is effectively solved.

Referring to fig. 1, the embodiment is described taking the electronic device as a chassis as an example, in the embodiment, the main board 1 is a PCB board, and the main board 1 is used for installing and fixing functional components to implement operation of the electronic device, where the functional components include: the memory module 2 and the static stabilizer (PSS) of the power system, and the main board 1 is electrically connected with a power supply; the memory module 2 is fixedly installed on one side of the motherboard 1, and the memory module 2 includes: the memory chip is provided with a transfer circuit board 3 in the direction that the memory module 2 deviates from the main board 1, a gap is reserved between the memory module 2 and the transfer circuit board 3 in the direction perpendicular to the main board 1, the graphic processing component 4 is connected with the main board 1 based on the transfer circuit board 3, namely, the graphic processing component 4 is powered based on the transfer circuit board 3, in addition, in the direction parallel to the main board 1, the transfer circuit board 3 and the graphic processing component 4 are sequentially arranged, the vertical distance between the bottom of the graphic processing component 4 and the main board 1 is not less than the height of the memory module 2 on the main board 1, and in the direction perpendicular to the main board 1, the graphic processing component 4 and the transfer circuit board 3 are not overlapped.

Referring to fig. 2 and 3, fig. 2 is a schematic structural diagram of another electronic device provided by an embodiment of the present application, and fig. 3 is a top view of another electronic device provided by an embodiment of the present application, in the electronic device of the present embodiment, a motherboard 1 includes a first motherboard region A1 and a second motherboard region A2 sequentially arranged in a first direction; the memory module 2 is fixedly connected to the first main board area A1; the second main board area A2 is fixedly connected with a first power connector 11, the first power connector 11 is connected with the switching circuit board 3 through a first power line L1, and the first direction is parallel to the main board 1;

The vertical projection of the first power line L1 on the main board 1 and the vertical projection of the memory module 2 on the main board 1 are oppositely and sequentially arranged in the second direction; the second direction is perpendicular to the first direction and parallel to the main board 1.

Referring to fig. 2 and 3, in the electronic device of the present embodiment, the motherboard 1 has a first motherboard area A1 and a second motherboard area A2, the first motherboard area A1 is used for fixedly mounting the memory module 2, the first power connector 11 is plugged into the second motherboard area A2, the first power connector 11 is used for delivering the current on the motherboard 1 to the switch circuit board 3 to supply power to the switch circuit board 3, the first power connector 11 is connected to the switch circuit board 3 based on a first power line L1, the first power line L1 is a dedicated power cable of the first power connector 11, and the first power line L1 passes through a gap area at two sides of the memory module 2 to be connected to the switch circuit board 3, that is, the vertical projection of the first power line L1 on the motherboard 1 and the vertical projection of the memory module 2 on the motherboard 1 are sequentially arranged in a second direction, the second direction is a direction indicated by a Y axis in the figure, and the first direction is a direction indicated by an X axis.

Referring to fig. 2 and 3, in the above-mentioned electronic device, when the second main board area A2 is fixedly connected with the plurality of first power connectors 11, one first power connector 11 is correspondingly connected with the switching circuit board 3 through one first power line L1, and the plurality of first power connectors 11 are correspondingly connected with the plurality of first power lines L1;

In the second direction, the vertical projection of the memory module 2 on the motherboard 1 is at least between the vertical projections of two first power lines L1 of the plurality of first power lines L1 on the motherboard 1.

Referring to fig. 2 and 3, as can be seen from the above, the first power connector 11 is mounted and fixed on the second main board area A2, but the current that can be provided by the first power connector 11 is constant, and when the electronic device has a plurality of graphics processing components 4 therein, the current that is required is also greater, so that it is necessary to provide more first power connectors 11 on the second main board area A2 to increase the current that is provided to the switch circuit board 3, and in addition, providing a plurality of first power connectors 11 on the second main board area A2 prevents the switch circuit board 3 from being powered by the remaining first power connectors 11 when a certain first power connector 11 is damaged. Therefore, based on the power supply requirement, a plurality of first power connectors 11 may be disposed on the second motherboard area A2, and when the second motherboard area A2 has a plurality of first power connectors 11, one first power connector 11 is connected to the switch circuit board 3 corresponding to one first power line L1, and the plurality of first power connectors 11 correspondingly have a plurality of first power lines L1, and in the second direction, the vertical projection of the memory module 2 on the motherboard 1 is at least located between the vertical projections of two first power lines L1 on the motherboard 1. In the present embodiment, two first power connectors 11 are provided on the second motherboard area A2, and two first power lines L1 are provided correspondingly. In addition, the number of first power connectors 11 in the electronic device, including but not limited to two, may be set based on the specific requirements in the embodiment.

Referring to fig. 4 and 5, fig. 4 is a schematic structural diagram of another electronic device according to an embodiment of the present application, and fig. 5 is a top view of an electronic device according to an embodiment of fig. 4, in the electronic device according to the present embodiment, in a first direction, a second power connector 31 and a third power connector 32 are sequentially and fixedly connected to a switching circuit board 3; the second power connector 31 is connected to the graphic processing assembly 4 through a second power line L2, and the third power connector 32 is connected to the first power connector 11 through a first power line L1.

Referring to fig. 4 and 5, in the electronic device of the present embodiment, a second power connector 31 and a third power connector 32 are fixedly mounted on a surface of the side of the switch circuit board 3 facing away from the memory module 2, and in the first direction, the second power connector 31 and the third power connector 32 are sequentially disposed, the second power connector 31 is a dedicated power connector for supplying power to the graphics processing module 4, and the third power connector 32 is connected to the first power connector 31 for supplying power to the switch circuit board 3, where the first power connector 11 and the third power connector 32 may be the same kind of power connector. The second power connector 31 is connected with the graphic processing assembly 4 through a second power line L2 to support the normal operation of the graphic processing assembly 4, and the second power connector 31 obtains a required current based on the switching circuit board 3. The distance between the second power connector 31 and the third power connector 32 is not changed, the number of the second power connectors 31 and the third power connectors 32 may be different, and the second power line L2 is a dedicated cable of the graphics processing component 4.

Referring to fig. 5, in the above-described electronic apparatus, the number of the second power connectors 31 corresponds to the number of the graphic processing components 4, and the second power connectors 31 are connected in one-to-one correspondence with the graphic processing components 4.

Referring to fig. 5, in the above-described electronic device, the second power connector 31 is connected to the graphic processing component 4 for supplying power to the graphic processing component 4, and the second power connector 31 is a dedicated power connector of the graphic processing component 4; in addition, when there are a plurality of graphic processing components 4, the lengths of the graphic processing components 4 are different, and the required currents are different, so that each graphic processing component 4 is correspondingly connected with a second power connector 31, respectively, to ensure the normal operation of the graphic processing components 4. Therefore, the number of the second power connectors 31 on the switching circuit board 3 is the same as the number of the graphics processing components 4 in the electronic device, and each second power connector 31 and the corresponding graphics processing component 4 are correspondingly connected through the second power line L2.

In the above-described electronic apparatus, the number of the first power connectors 11 on the second main board area A2 corresponds to the number of the third power connectors 32 on the relay circuit board 3.

In the above electronic device, the second motherboard area A2 has the first power connector 11, the switch circuit board 3 has the third power connector 32 thereon, the first power connector 11 is connected with the third power connector 32 based on the first power line L1, the first power connector 11 supplies power to the third power connector 32 based on the first power line L1, and the plurality of first power connectors 11 may be disposed on the second motherboard area A2 based on the specification of the power connectors and the current required by the plurality of graphics processing components 4, the plurality of third power connectors 32 may be disposed on the switch circuit board 3, and the number of the first power connectors 11 on the second motherboard area A2 is required to be the same as the number of the third power connectors 32 on the switch circuit board 3, if the number is different, the damage and the waste of the power connectors may be easily caused. For example, when the number of the third power connectors 32 is smaller than the number of the first power connectors 11, the third power connectors 32 are easily burned out due to excessive passing current, and the number of the third power connectors 32 is larger than the number of the first power connectors 11, the area occupation ratio of the power connectors is easily increased, and the space and cost are easily wasted.

Referring to fig. 6 and 7, fig. 6 is a schematic structural diagram of still another electronic device according to an embodiment of the present application, and fig. 7 is a top view of an electronic device according to the embodiment shown in fig. 6, where the electronic device has a housing 5;

The main board 1 is fixed at the bottom of the shell 5; the switching circuit board 3 is fixed on two opposite side walls of the shell 5; the graphic processing component 4 is fixedly connected to the sub-circuit board 6, the sub-circuit board 6 is fixed on two side walls, and in the direction perpendicular to the main board 1, the sub-circuit board 6 and the memory module 2 have no overlapping part;

Wherein, the vertical distance between the sub-circuit board 6 and the main board 1 is smaller than the height of the memory module 2 on the main board 1; the sub-circuit board 6 has a plurality of mounting grooves 61 on its surface for detachably mounting the graphic processing assembly 4.

Referring to fig. 6 and 7, this embodiment is described taking the electronic device as a chassis as an example, and the electronic device further includes: a housing 5 and a sub-circuit board 6, the housing 5 comprising: the bottom and two opposite lateral walls, and mainboard 1 sets up in the bottom of casing 5, and switching circuit board 3 and sub-circuit board 6 are installed and are fixed on two opposite lateral walls, have a plurality of mounting grooves 61 that are used for installing graphics processing module 4 on this sub-circuit board 6, and graphics processing module 4 detachable installs on mounting groove 61, in the direction of perpendicular mainboard 1, sub-circuit board 6 and memory module 2 do not overlap the part, and the perpendicular distance between this sub-circuit board 6 and the mainboard 1 is less than the height of memory module 2 on mainboard 1.

Referring to fig. 6, in the above-described electronic apparatus, the graphic processing assemblies 4 mounted in at least two mounting grooves 61 are different in length;

The two side walls are provided with a plurality of first mounting positions for mounting the transfer circuit board 3; the distance from the sub-circuit board 6 is different when the transfer circuit board 3 is at a different first mounting position in the length direction of the graphic processing assembly 4.

In the above-described electronic apparatus, the switch circuit board 3 is mounted on the side wall of the housing 5, and in the length direction of the graphic processing component 4, both side walls have a plurality of first mounting positions for mounting the switch circuit board 3, that is, when the length specification of the graphic processing component 4 mounted in the mounting groove 61 on the sub-circuit board 6 is changed, the switch circuit board 3 is retracted relative to the graphic processing component 4 in the length direction of the graphic processing component 4, that is, the first mounting position of the switch circuit board 3 is made to be away from the graphic processing component 4, and at the same time, the first power connector 11 and the third power connector 32 are connected corresponding to the first power line L1 which requires a longer length, and when the graphic processing components 4 of a plurality of different length specifications are mounted in the plurality of mounting grooves 61, the first position of the switch circuit board 3 can be determined based on the relative position of the graphic processing component 4 of the largest length and the switch circuit board 3, and in addition, the length of the first power line L1 is determined based on the specification of the graphic processing component 4 of the largest length.

In the above electronic apparatus, the two side walls have a plurality of second mounting positions for mounting the transit circuit board 3; when the switching circuit board 3 is at the different second installation positions, the vertical distance between the switching circuit board 3 and the main board 1 is different.

In the above electronic device, in the direction perpendicular to the motherboard 1, the two side walls further have a plurality of second mounting positions for mounting the switch circuit board 3, and when the switch circuit board 3 is at a different second mounting position, the vertical distance between the switch circuit board 3 and the motherboard 1 is different, and the second mounting positions can be determined based on the heat dissipation requirements of the devices such as the graphics processing component 4 and the memory module 2, for example, when the memory module 2 needs to dissipate heat, the second position of the switch circuit board 3 can be moved upwards; when the graphics processing module 4 needs to dissipate heat, the second position of the interposer 3 can be moved downward. That is, in the direction perpendicular to the motherboard 1, the position of the interposer circuit board 3 can be flexibly adjusted based on specific heat dissipation requirements. In addition, as can be seen from the above description, the first mounting position is the mounting position of the switching circuit board 3 in the direction parallel to the main board 1, and the second mounting position is the mounting position of the switching circuit board 3 in the direction perpendicular to the main board 1, so that the second position of the switching circuit board 3 can be determined based on the heat dissipation requirement when the first position of the switching circuit board 3 meets the power supply requirement, so that the switching circuit board 3 meets the heat dissipation requirement while meeting the power supply requirement.

Referring to fig. 8 and 9, fig. 8 is a schematic structural diagram of still another electronic device according to an embodiment of the present application, and fig. 9 is a top view of an electronic device according to an embodiment of fig. 8, in which the patch circuit board 3 is fixed to two opposite side walls of the housing 5 based on brackets 7 fixed to the two opposite side walls of the housing 5.

Referring to fig. 8 and 9, the electronic device of the present embodiment further includes a bracket 7 mounted and fixed on two opposite sidewalls of the housing 5, the bracket 7 is disposed between the two sidewalls of the housing 5, the switching circuit board 3 is fixedly mounted on the bracket 7, and the bracket 7 can be adjusted in position based on the length and the specification of the graphic processing assembly 4 and according to the heat dissipation requirement in the electronic device.

In view of the foregoing, the present application proposes an electronic apparatus having a housing 5, a main board 1 mounted and fixed to a bottom of the housing 5, the main board 1 including: a first main board area A1 and a second main board area A2; the memory module 2 is mounted and fixed on the first main board area A1, the first power connector 11 is mounted and fixed on the second main board area A2, the switching circuit board 3 is mounted and fixed on one side of the memory module 2, which is far away from the main board 1, based on the bracket 7 mounted and fixed on two opposite side walls of the shell 5, the second power connector 31 and the third power connector 32 are sequentially mounted and fixed on the switching circuit board 3 in the first direction, the sub-circuit board 6 is mounted and fixed on two opposite side walls of the shell 5, the plurality of mounting grooves 61 are mounted on the sub-circuit board 6, and the graphic processing component 4 is detachably mounted on the mounting grooves 61. In the electronic device, a first power connector 11 is arranged on a main board 1, and the first power connector 11 is connected with a third power connector 32 on a transfer circuit board 3 based on a first power line L1 to supply power to the transfer circuit board 3, a second power connector 31 on the transfer circuit board 3 is connected with a graphic processing component 4 based on a second power line L2, and the second power connector 31 supplies power to the graphic processing component 4 based on current provided by the transfer circuit board 3, the first power line L1 passes through a gap area between two side walls of a memory module 2 and a shell 5 and is connected to the transfer circuit board 3, in addition, when the length specification of the graphic processing component 4 changes, the transfer circuit board 3 can be backwardly matched with the graphic processing component 4 with different length specifications and models in a flexible way relative to the graphic processing component 4, and at the moment, only the first power line L1 with longer length is required to connect the first power connector 11 and the third power connector 32, so that the additional heat dissipation components are required to be added, the additional heat dissipation components can be saved, and the heat dissipation requirements can be solved, and the electronic device can be further solved.

In the present specification, each embodiment is described in a progressive manner, or a parallel manner, or a combination of progressive and parallel manners, and each embodiment is mainly described as a difference from other embodiments, and identical and similar parts between the embodiments are all enough to refer to each other.

It is to be noted, however, that the description of the drawings and embodiments are illustrative and not restrictive. Like reference numerals refer to like structures throughout the embodiments of the specification. In addition, the drawings may exaggerate the thicknesses of some layers, films, panels, regions, etc. for understanding and ease of description. It will also be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may be present. In addition, "on …" refers to positioning an element on or under another element, but not essentially on the upper side of the other element according to the direction of gravity.

The terms "upper," "lower," "top," "bottom," "inner," "outer," and the like are used for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the application. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.

It is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such article or apparatus. Without further limitation, an element defined by the phrase "comprising one … …" does not exclude the presence of other like elements in an article or device comprising the element.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device, the electronic device comprising:

2. The electronic device of claim 1, wherein the motherboard comprises a first motherboard region and a second motherboard region disposed sequentially in a first direction; the memory module is fixedly connected to the first main board area; the second main board area is fixedly connected with a first power connector, the first power connector is connected with the switching circuit board through a first power line, and the first direction is parallel to the main board;

3. The electronic device of claim 2, wherein when the second motherboard region is fixedly connected to a plurality of the first power connectors, one of the first power connectors is correspondingly connected to the switch circuit board through one of the first power lines, and a plurality of the first power connectors is correspondingly connected to a plurality of the first power lines;

4. The electronic device of claim 2, wherein in the first direction, the second power connector and the third power connector are fixedly connected to the switch circuit board in sequence; the second power connector is connected with the graphic processing component through a second power line, and the third power connector is connected with the first power connector through the first power line.

5. The electronic device of claim 4, wherein the number of second power connectors corresponds to the number of graphics processing components, and wherein the second power connectors are connected in a one-to-one correspondence with the graphics processing components.

6. The electronic device of claim 4, wherein the number of first power connectors on the second motherboard region corresponds to the number of third power connectors on the riser circuit board.

7. The electronic device of claim 1, wherein the electronic device has a housing;

8. The electronic device of claim 7, wherein at least two of the mounting slots mount different lengths of the graphics processing components;

9. The electronic device of claim 7, wherein the two sidewalls have a plurality of second mounting locations thereon for mounting the interposer circuit board; when the switching circuit board is positioned at different second installation positions, the vertical distance between the switching circuit board and the main board is different.

10. The electronic device of claim 7, wherein the interposer circuit board is secured to opposing sidewalls of the housing based on brackets secured to opposing sidewalls of the housing.