CN221103684U - 一种pcb线路板油墨预烤设备 - Google Patents
一种pcb线路板油墨预烤设备 Download PDFInfo
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- CN221103684U CN221103684U CN202322701405.5U CN202322701405U CN221103684U CN 221103684 U CN221103684 U CN 221103684U CN 202322701405 U CN202322701405 U CN 202322701405U CN 221103684 U CN221103684 U CN 221103684U
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- 238000005192 partition Methods 0.000 claims abstract description 13
- 238000010438 heat treatment Methods 0.000 claims description 14
- 238000001125 extrusion Methods 0.000 claims description 8
- 238000009826 distribution Methods 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims 2
- 239000000428 dust Substances 0.000 claims 1
- 238000010304 firing Methods 0.000 claims 1
- 238000002347 injection Methods 0.000 claims 1
- 239000007924 injection Substances 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 3
- 101100233916 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) KAR5 gene Proteins 0.000 description 2
- 101001121408 Homo sapiens L-amino-acid oxidase Proteins 0.000 description 1
- 101000827703 Homo sapiens Polyphosphoinositide phosphatase Proteins 0.000 description 1
- 102100026388 L-amino-acid oxidase Human genes 0.000 description 1
- 102100023591 Polyphosphoinositide phosphatase Human genes 0.000 description 1
- 101100012902 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) FIG2 gene Proteins 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322701405.5U CN221103684U (zh) | 2023-10-09 | 2023-10-09 | 一种pcb线路板油墨预烤设备 |
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| CN202322701405.5U CN221103684U (zh) | 2023-10-09 | 2023-10-09 | 一种pcb线路板油墨预烤设备 |
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| CN221103684U true CN221103684U (zh) | 2024-06-07 |
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| CN202322701405.5U Active CN221103684U (zh) | 2023-10-09 | 2023-10-09 | 一种pcb线路板油墨预烤设备 |
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Effective date of registration: 20241106 Address after: 518000, Hedong Community, Xixiang Street, Bao'an District, Shenzhen City, Guangdong Province. Haoyunlai Plaza, Bao'an 80 District, Hedong Building F8b-005 Patentee after: Shenzhen Sanqiangxing Technology Co.,Ltd. Country or region after: China Address before: 518105, Building 201, Building A, No. 5 Jiangbian Industrial Fifth Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Aoxunlong Electronics Co.,Ltd. Country or region before: China |