CN221081674U - Surface mounting device of LED surface mounting machine - Google Patents
Surface mounting device of LED surface mounting machine Download PDFInfo
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- CN221081674U CN221081674U CN202322741735.7U CN202322741735U CN221081674U CN 221081674 U CN221081674 U CN 221081674U CN 202322741735 U CN202322741735 U CN 202322741735U CN 221081674 U CN221081674 U CN 221081674U
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- 229910000639 Spring steel Inorganic materials 0.000 claims description 8
- 230000000712 assembly Effects 0.000 claims description 8
- 238000000429 assembly Methods 0.000 claims description 8
- 238000009434 installation Methods 0.000 claims description 5
- 230000005540 biological transmission Effects 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 5
- 238000005286 illumination Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a surface mounting device of an LED surface mounting machine, which comprises a device body, wherein the device body comprises a first mounting frame, a second mounting frame, a station mechanism movably arranged on the first mounting frame and a surface mounting mechanism connected with the first mounting frame, the second mounting frame is connected with the station mechanism, the second mounting frame also comprises a longitudinal pushing module, a transverse pushing module and a rotating module, the station mechanism moves along the length direction of the second mounting frame through the longitudinal pushing module, the station mechanism moves along the X-axis direction of the second mounting frame through the transverse pushing module, and the rotating module is connected with the station mechanism. The integrated structure is convenient to disassemble and assemble, can adjust the distance of the patch mechanism according to the model, is more widely applicable, and can synchronously carry out processing operation in the patch process, thereby greatly improving the working efficiency.
Description
Technical Field
The utility model relates to the technical field of chip mounters, in particular to a chip mounter of an LED chip mounter.
Background
The LED lamp has high light conversion efficiency, has the advantages of low power consumption, small volume, light weight, long service life, no mercury and no radiation, has wide application range, and comprises local illumination, panel backlight source, building (scenic spot) illumination, traffic illumination, medical treatment, agriculture, fishing and animal husbandry equipment light sources and the like, so as to drive the rapid development of the production of Chinese semiconductor LED illumination along with the increase of demands, various LED illumination lamps are required to meet huge market demands, single-hand operation and processing cannot meet the huge market demands, and higher-efficiency automatic production equipment and a whole set of production schemes are required.
The multi-station efficient LED patch mechanism comprises a substrate (4), a servo motor (3), a swing arm device and a patch head (2), wherein the servo motor (3) is arranged at the rear end of the substrate (4), the swing arm device is arranged at the front end of the substrate (4), an output shaft (9) of the servo motor (3) is connected with the swing arm device, and the patch head (2) is arranged on a sliding rail (5) of the substrate (4) and can move up and down along the sliding rail (5). The scheme is guided by the linear guide rail, downward movement power is provided by the motor through the swing arm, upward restoring force is provided by spring tension, and the device is reasonable in structural design and high in efficiency. This solution also has the following drawbacks: the synchronous paster cannot be carried out, the paster efficiency is low, the shock absorbing effect is poor, the paster precision is low, the distance of the mechanism cannot be adjusted, and the applicability is low.
Disclosure of utility model
In order to overcome the defects of the prior art, the utility model provides a surface mounting device of an LED surface mounting machine, which can effectively solve the problems of the background art.
The technical scheme adopted for solving the technical problems is as follows:
The utility model provides a chip mounter of LED chip mounter, includes the device body, the device body includes first mounting bracket, second mounting bracket, the activity locates the station mechanism on the first mounting bracket and connects the paster mechanism of first mounting bracket, the second mounting bracket is connected with station mechanism, the second mounting bracket still includes vertical pushing module, horizontal pushing module and rotatory module, station mechanism moves along the length direction of second mounting bracket through vertical pushing module, station mechanism moves along the X axis direction of second mounting bracket through horizontal pushing module, wherein rotatory module is connected with station mechanism;
The patch mechanism comprises a plurality of patch assemblies and a driving assembly, wherein the patch assemblies are connected with the driving assembly and distributed along the circle center array of the first mounting frame, and each patch assembly comprises a mounting plate and a plurality of patch heads, and the mounting plate is detachably mounted on the first mounting frame.
Optionally, the first mounting bracket comprises fixed plate and a plurality of curb plate, the fixed plate is equipped with the module of moving away to avoid possible earthquakes, the module of moving away to avoid possible earthquakes includes the spring steel sheet more than one set of, the upper and lower symmetry welding of spring steel sheet is on the fixed plate.
Optionally, the second mounting bracket is by first fixed ring frame, second fixed ring frame and a plurality of erection column, the erection column passes through the bolt and is connected with the mounting panel respectively, wherein have hollow structure between first fixed ring frame and the second fixed ring frame.
Optionally, the longitudinal pushing module is connected with the transverse pushing module, the longitudinal pushing module comprises a first cylinder, and the transverse pushing module comprises a second cylinder.
Optionally, the rotary module comprises a stepper motor and a mounting shaft connected with the station mechanism, wherein a mounting groove is formed in the mounting shaft, and the mounting shaft is in transmission connection with the stepper motor.
Optionally, the second fixed link frame has bracing piece and is used for the fixed pole frame of fixed first mounting bracket, the one end and the second fixed link frame fixed connection of bracing piece, the other end pass the fixed pole frame to the bracing piece has the clearance that moves about with the junction of fixed pole frame.
Optionally, the station mechanism includes a carrying disc, the position that corresponds paster mechanism on the carrying disc is equipped with the paster station to this paster station still is equipped with the centre gripping module, the centre gripping module includes a plurality of vacuum suction arms.
Optionally, a positioning wheel is further arranged at the joint of the mounting shaft and the stepping motor, and the positioning wheel is provided with a plurality of raised positioning blocks.
Compared with the prior art, the utility model has the beneficial effects that:
The surface mounting device of the LED surface mounting machine has at least one of the following beneficial effects in the using process:
Overall structure easy dismounting can adjust the distance of paster mechanism according to the model, is suitable for more extensively, carries out processing operation in step at the paster in-process, improves work efficiency by a wide margin to, still can correspond the workstation mechanism of installing different quantity stations and the paster mechanism that corresponds the station quantity according to actual production demand, further raise the efficiency, still have the effect of moving away to avoid possible earthquakes simultaneously, reduce the vibrations of equipment, and then improve the precision of processing, it is more reliable.
Drawings
Fig. 1 is a schematic diagram of a first overall structure of a chip mounter of an LED chip mounter according to the present utility model;
fig. 2 is a schematic diagram of a second overall structure of a chip mounter of the LED chip mounter according to the present utility model;
FIG. 3 is a schematic view of the first side structure of FIG. 1 according to the present utility model;
FIG. 4 is a schematic top view of the structure of FIG. 2 according to the present utility model;
fig. 5 is a schematic view of a second side structure of fig. 1 according to the present utility model.
Reference numerals in the drawings:
1. A first mounting frame; 101. a first fixed ring frame; 102. a mounting column; 103. a second fixed ring frame; 104. a fixed rod frame; 105. a support rod; 2. a second mounting frame; 201. a fixing plate; 202. a longitudinal pushing module; 203. a transverse pushing module; 204. a shock absorbing module; 205. a rotating module; 206. a spring steel plate; 207. a first cylinder; 208. a stepping motor; 209. a positioning wheel; 210. a second cylinder; 3. a patch mechanism; 301. a mounting plate; 302. a patch assembly; 303. a drive assembly; 4. a station mechanism; 401. a carrier plate; 402. a clamping module; 403. a vacuum suction arm; 404. and (5) mounting a shaft.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
As shown in fig. 1-5, the utility model provides a surface mounting device of an LED surface mounting machine, which comprises a device body, wherein the device body comprises a first mounting frame 1, a second mounting frame 2, a station mechanism 4 movably arranged on the first mounting frame 1, and a surface mounting mechanism 3 connected with the first mounting frame 1, the second mounting frame 2 is connected with the station mechanism 4, the second mounting frame 2 further comprises a longitudinal pushing module 202, a transverse pushing module 203 and a rotating module 205, the station mechanism 4 moves along the length direction of the second mounting frame 2 through the longitudinal pushing module 202, the station mechanism 4 moves along the X-axis direction of the second mounting frame 2 through the transverse pushing module 203, and the rotating module 205 is connected with the station mechanism 4.
The LED chip mounter belongs to one of the SMT chip mounters, along with the development of LED technology, the traditional SMT chip mounter can not meet the production requirements of the LED industry, and the LED chip mounter is generated at the moment.
The visual recognition technology is adopted, an AOI detection function is built in, the quality of the printed solder paste is checked before mounting, and the accuracy and the error of the mounted components are checked after mounting.
The flexible jacking and pressing method is adopted, and the PCB is clamped by the method of jacking and pressing back and forth, so that the PCB is ensured not to deform after being clamped.
Two sets of high-resolution imaging systems are arranged to respectively position the PCB, the CHIP and the IC.
The device can be used for mounting 0402-40mmIC components, and can optimally realize 15000CPH patch speed, and a four-side feeder seat can be used for placing 80 8mm feeders at most on four sides.
Can be attached with various components, such as various resistors, capacitors, IC, BGA, QFP, CFP and uBGA.
The motor uses the light design concept, so that the weight of the moving part of the machine can be greatly reduced, the power consumed during the operation of the machine is also greatly reduced to only 1/4 of that consumed by a common chip mounter, and the power consumption can be lower than 1/4 of that of the common chip mounter.
The patch mechanism 3 comprises a plurality of patch assemblies 302 and a driving assembly 303, wherein the patch assemblies 302 are connected with the driving assembly 303, the patch assemblies 302 are distributed along the circle center array of the first mounting frame 1, and the patch assemblies 302 comprise a mounting plate 301 and a plurality of patch heads, and the mounting plate 301 is detachably mounted on the first mounting frame 1.
After the longitudinal pushing module 202 in this embodiment moves the transverse pushing module 203 along the length direction of the first mounting frame 1 through the air cylinder, the transverse pushing module 203 pushes the rotating module 205 along the X-axis direction of the second mounting frame 2 through the air cylinder, the transverse pushing module 203 moves the station mechanism 4 along the central axis of the first mounting frame 1, the structure corresponds to the position sensing movement of the patch mechanism 3, the patch operation is completed in a matched manner, the patch mechanism 3 is correspondingly installed at a station on the station mechanism 4, and the patch mechanism 3 can synchronously perform the patch operation.
Further, the first mounting frame 1 is composed of a fixing plate 201 and a plurality of side plates, the fixing plate 201 is provided with a shock absorbing module 204, the shock absorbing module 204 includes more than one group of spring steel plates 206, and the spring steel plates 206 are welded on the fixing plate 201 in an up-down symmetry manner.
The spring steel plate 206 is made of 60Si2Mn material, and when in operation, the steel plate is deformed by vibration, so that the effects of buffering and vibration reduction are achieved.
Further, the second mounting frame 2 is composed of a first fixing ring frame 101, a second fixing ring frame 103 and a plurality of mounting posts 102, wherein the mounting posts 102 are respectively connected with the mounting plate 301 through bolts, and a hollow structure is arranged between the first fixing ring frame 101 and the second fixing ring frame 103.
Screw holes are formed in the first fixing ring frame 101 and the second fixing ring frame 103, the first fixing ring frame 101 is used for installing the patch mechanism 3, and the second fixing ring frame 103 is connected to the second installation frame 2 through a fixing rod frame 104 and a supporting rod 105.
Further illustratively, the longitudinal pushing module 202 is coupled to the lateral pushing module 203, the longitudinal pushing module 202 includes a first cylinder 207, and the lateral pushing module 203 includes a second cylinder 210.
Further, the rotary module 205 includes a stepper motor 208 and a mounting shaft 404 connected to the station mechanism 4, where the mounting shaft 404 is provided with a mounting groove, and the mounting shaft 404 is in transmission connection with the stepper motor 208.
The mounting groove is used for mounting the feeding mechanism and corresponds to each station respectively.
Further, the second fixing ring frame 103 is provided with a supporting rod 105 and a fixing rod frame 104 for fixing the first installation frame 1, one end of the supporting rod 105 is fixedly connected with the second fixing ring frame 103, the other end of the supporting rod passes through the fixing rod frame 104, and a movable gap is formed at the joint of the supporting rod 105 and the fixing rod frame 104.
Further, the station mechanism 4 includes a carrier plate 401, a patch station is disposed on the carrier plate 401 corresponding to the position of the patch mechanism 3, and a clamping module 402 is further disposed on the patch station, and the clamping module 402 includes a plurality of vacuum suction arms 403.
Further illustratively, a positioning wheel 209 is further disposed at a connection between the mounting shaft 404 and the stepper motor 208, and the positioning wheel 209 is provided with a plurality of protruding positioning blocks. The number of the protruding blocks on the positioning wheels 209 corresponds to the number of the stations on the station mechanism 4, and is used for adjusting the installation angle of the stations.
To sum up, overall structure easy dismounting can adjust the distance of paster mechanism according to the model, is suitable for more extensively, carries out processing operation in step at the paster in-process, improves work efficiency by a wide margin to, still can correspond the station mechanism of installing different quantity stations and correspond the paster mechanism of station quantity according to actual production demand, further raise the efficiency, still have the effect of moving away to avoid possible earthquakes simultaneously, reduce equipment's vibrations, and then improve the precision of processing, more reliably.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a paster device of LED chip mounter which characterized in that: the device comprises a device body, wherein the device body comprises a first mounting frame, a second mounting frame, a station mechanism movably arranged on the first mounting frame and a patch mechanism connected with the first mounting frame, the second mounting frame is connected with the station mechanism, the second mounting frame further comprises a longitudinal pushing module, a transverse pushing module and a rotary module, the station mechanism moves along the length direction of the second mounting frame through the longitudinal pushing module, and the station mechanism moves along the X-axis direction of the second mounting frame through the transverse pushing module, wherein the rotary module is connected with the station mechanism;
The patch mechanism comprises a plurality of patch assemblies and a driving assembly, wherein the patch assemblies are connected with the driving assembly and distributed along the circle center array of the first mounting frame, and each patch assembly comprises a mounting plate and a plurality of patch heads, and the mounting plate is detachably mounted on the first mounting frame.
2. The LED chip mounter according to claim 1, wherein: the first mounting frame comprises fixed plate and a plurality of curb plate, the fixed plate is equipped with the module of moving away to avoid possible earthquakes, the module of moving away to avoid possible earthquakes includes the spring steel sheet more than one set of, the upper and lower symmetry welding of spring steel sheet is on the fixed plate.
3. The LED chip mounter according to claim 1, wherein: the second mounting frame is composed of a first fixed ring frame, a second fixed ring frame and a plurality of mounting columns, wherein the mounting columns are respectively connected with the mounting plate through bolts, and a hollow structure is arranged between the first fixed ring frame and the second fixed ring frame.
4. The LED chip mounter according to claim 1, wherein: the longitudinal pushing module is connected with the transverse pushing module, the longitudinal pushing module comprises a first air cylinder, and the transverse pushing module comprises a second air cylinder.
5. The LED chip mounter according to claim 1, wherein: the rotary module comprises a stepping motor and a mounting shaft connected with the station mechanism, wherein a mounting groove is formed in the mounting shaft, and the mounting shaft is in transmission connection with the stepping motor.
6. A die attach device for an LED die attach machine according to claim 3, wherein: the second fixed ring frame is provided with a supporting rod and a fixed rod frame for fixing the first installation frame, one end of the supporting rod is fixedly connected with the second fixed ring frame, the other end of the supporting rod penetrates through the fixed rod frame, and a movable gap is formed at the joint of the supporting rod and the fixed rod frame.
7. The LED chip mounter according to claim 1, wherein: the station mechanism comprises a carrying disc, a patch station is arranged at the position, corresponding to the patch mechanism, on the carrying disc, and a clamping module is further arranged at the patch station and comprises a plurality of vacuum suction arms.
8. The LED chip mounter according to claim 5, wherein: the junction of installation axle and step motor still is equipped with the locating wheel, the locating wheel is equipped with a plurality of bellied locating pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322741735.7U CN221081674U (en) | 2023-10-12 | 2023-10-12 | Surface mounting device of LED surface mounting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322741735.7U CN221081674U (en) | 2023-10-12 | 2023-10-12 | Surface mounting device of LED surface mounting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221081674U true CN221081674U (en) | 2024-06-04 |
Family
ID=91261289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322741735.7U Active CN221081674U (en) | 2023-10-12 | 2023-10-12 | Surface mounting device of LED surface mounting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221081674U (en) |
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2023
- 2023-10-12 CN CN202322741735.7U patent/CN221081674U/en active Active
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