CN220913613U - Heat dissipation device - Google Patents

Abstract

A heat sink includes a fixed substrate, a heat pipe set, a flexible temperature equalizing plate and a rotatable auxiliary heat dissipation fin set. The heat pipe group is fixed on the fixed base plate, the flexible temperature equalizing plate is fixed above the heat pipe group, and the rotatable auxiliary radiating fin group is connected with the flexible temperature equalizing plate to rotate relative to the heat pipe group.

Description

Heat dissipation device

Technical Field

The utility model relates to a heat dissipation device. And more particularly to a heat sink having rotatable fins.

Background

With the progress of technology, electronic products are becoming popular, and the living or working modes of many people are gradually changed. With the increasing computing power of computers, temperature control is increasingly important when electronic devices such as a cpu are operated.

Electronic components such as a cpu generate heat during operation and require proper cooling to achieve optimum performance. In order to keep the electronic components such as the cpu operating at a desired temperature, it is generally performed by liquid cooling or air cooling.

Furthermore, as the number of cores of a cpu is now increasing, the memory capacity is also increasing and fast. As the heat generated by the cpu increases, the volume and performance of the heat sink are also increased. Therefore, the heat dissipation area of the heat dissipation fins required by the computer device is gradually increased.

Generally, the increase of the memory capacity of the computer can effectively improve the overall performance of the computer. Therefore, when the computer is stuck or flashed back, the user often has to upgrade or replace the memory.

The computer memory is generally mounted beside the cpu, so that too large heat dissipation fins will affect the replacement of the memory, while too small heat dissipation fins will affect the heat dissipation efficiency of the cpu.

Therefore, how to improve the heat dissipation efficiency of the central processing unit, and facilitate the user to replace the computer memory, the working temperature of the central processing unit can be reduced, and the working efficiency of the whole computer can be improved.

Disclosure of utility model

This summary is intended to provide a simplified summary of the disclosure so that the reader is a basic understanding of the disclosure. This summary is not an extensive overview of the disclosure and is intended to neither identify key/critical elements of the embodiments of the utility model nor delineate the scope of the utility model.

An objective of the present utility model is to provide a heat dissipating device, which can improve the heat dissipating efficiency of the heat dissipating device, thereby improving the overall heat dissipating efficiency of the computer device.

In order to achieve the above object, according to one embodiment of the present disclosure, a heat dissipating device includes a fixed substrate, a heat pipe set, a flexible temperature equalizing plate, and a rotatable auxiliary heat dissipating fin set. The heat pipe group is fixed on the fixed base plate, the flexible temperature equalizing plate is fixed above the heat pipe group, and the rotatable auxiliary heat radiation fin group is connected with the flexible temperature equalizing plate to rotate relative to the heat pipe group.

In some embodiments, the heat dissipating device further includes a main heat dissipating fin set disposed below the flexible temperature equalizing plate.

In some embodiments, the heat dissipating device further includes a plurality of hinge modules disposed below the flexible temperature equalizing plate and connected to the rotatable auxiliary heat dissipating fin set and the main heat dissipating fin set, and when the rotatable auxiliary heat dissipating fin set rotates through the hinge modules, the flexible temperature equalizing plate is driven to bend.

In some embodiments, the hinge module includes a fixed portion, a movable portion and a rotating shaft, wherein the fixed portion is connected to the main heat dissipation fin set, the movable portion is connected to the rotatable auxiliary heat dissipation fin set, and the rotating shaft is pivoted to the fixed portion and the movable portion to enable the movable portion to rotate relative to the fixed portion.

In some embodiments, the main heat dissipation fin group includes a plurality of accommodating grooves, the heat pipe group includes a first heat pipe and a fourth heat pipe, and a part of the first heat pipe and a part of the fourth heat pipe are disposed in the accommodating grooves of the main heat dissipation fin group and contact the flexible temperature equalizing plate.

In some embodiments, the heat dissipating device further includes a heat conducting block fixed under the fixed substrate.

In some embodiments, the fixing substrate includes a groove and an opening, and the first heat pipe and the fourth heat pipe include a first portion, a second portion and a third portion, respectively. The first part of the first heat pipe and the first part of the fourth heat pipe are fixed in the groove of the fixed substrate, and the first part of the first heat pipe and the first part of the fourth heat pipe are respectively contacted with the heat conduction block through the opening.

In some embodiments, the third portion of the first heat pipe and the third portion of the fourth heat pipe are respectively fixed in the accommodating groove of the main heat dissipation fin group and directly contact the flexible temperature equalizing plate.

In some embodiments, the heat pipe group further comprises a second heat pipe and a third heat pipe. The second heat pipe and the third heat pipe respectively comprise a first part, a second part and a third part. The first part of the second heat pipe and the first part of the third heat pipe are fixed in the groove of the fixed substrate, and the first part of the second heat pipe and the first part of the third heat pipe are respectively contacted with the heat conduction block through the opening of the fixed substrate. In addition, the first portion of the second heat pipe and the first portion of the third heat pipe are located between the first portion of the first heat pipe and the first portion of the fourth heat pipe.

In some embodiments, the main fin set includes a plurality of through holes, and the third portion of the second heat pipe and the third portion of the third heat pipe are respectively fixed in the through holes of the main fin set.

In some embodiments, the third portion of the first heat pipe and the third portion of the fourth heat pipe are located between the third portion of the second heat pipe and the third portion of the third heat pipe.

Therefore, the heat dissipation device can utilize the flexible temperature equalizing plate to transfer heat to the rotatable auxiliary heat dissipation fin group, and the angle of the rotatable auxiliary heat dissipation fin group is adjusted through the flexible temperature equalizing plate and the hinge module, so that the heat dissipation area of the heat dissipation fins is effectively increased, a user can conveniently install a memory, and meanwhile, the heat dissipation efficiency of the central processing unit and the memory is improved, and the overall efficiency of the computer device is further improved.

Drawings

The foregoing and other objects, features, advantages and embodiments of the present disclosure will be apparent from the following description taken in conjunction with the accompanying drawings in which:

Fig. 1 is a schematic perspective view of a heat dissipating device according to an embodiment of the utility model.

Fig. 2 is a schematic perspective view of the heat dissipating device of fig. 1 after the rotatable auxiliary fin set is rotated upward.

Fig. 3 is an exploded schematic view of the heat sink of fig. 1.

Fig. 4 is a schematic view showing an arrangement state of a heat pipe group, a hinge module, and a fixing substrate of the heat dissipating device of fig. 1.

Reference numerals illustrate:

100: heat dissipation device

110: Fixed substrate

112: Groove

114: An opening

116: Partition wall

120: Heat pipe group

130: Main radiating fin group

132: Heat radiation fin

134: Perforation

136: Accommodating groove

140: Flexible temperature equalizing plate

150: Hinge module

160: Rotatable auxiliary radiating fin group

170: Heat conduction block

180: Fixing screw

210: First heat pipe

212: First part

214: Second part

216: Third part

220: Second heat pipe

222: First part

224: Second part

226: Third part

230: Third heat pipe

232: First part

234: Second part

236: Third part

240: Fourth heat pipe

242: First part

244: Second part

246: Third part

410: A first surface

420: A second surface

510: Fixing part

520: Movable part

530: Rotating shaft

Detailed Description

The following examples are presented in conjunction with the drawings of the specification, but the examples are not provided to limit the scope of the disclosure, and the description of the operation of the structures is not intended to limit the order in which they may be performed, any structure in which elements are rearranged to produce a device with equivalent technical results is within the scope of the disclosure. The drawings are for illustration purposes only and are not drawn to scale. For ease of understanding, the same or similar elements will be indicated by the same reference numerals in the following description.

In addition, the words (terms) used throughout the specification and claims have the ordinary meaning of each word used in this field, in the disclosure herein, and in the special context, unless otherwise noted. Certain terms used to describe the disclosure are discussed below, or elsewhere in this specification, to provide additional guidance to those skilled in the art in describing the disclosure.

In the description and claims, unless the context specifically defines the terms "a" and "an" may refer to one or more. The numbers used in the steps are merely used to indicate steps for convenience of description, and are not used to limit the order and implementation.

Second, the terms "comprising," "including," "having," "containing," and the like as used herein are open-ended terms, meaning including, but not limited to.

Fig. 1 is a schematic perspective view of a heat dissipating device according to an embodiment of the present utility model, fig. 2 is a schematic perspective view of a rotatable auxiliary heat dissipating fin set of the heat dissipating device after being rotated upwards, fig. 3 is an exploded schematic view of the heat dissipating device, and fig. 4 is a schematic view of a heat pipe set, a hinge module, and a fixed substrate of the heat dissipating device.

Referring to fig. 1, 2 and 3, the heat dissipating device 100 includes a fixed substrate 110, a heat pipe set 120, a flexible temperature equalizing plate 140, a plurality of hinge modules 150, a rotatable auxiliary heat dissipating fin set 160 and a main heat dissipating fin set 130. The heat pipe group 120 is fixed to the fixed substrate 110, and the flexible soaking plate 140 is fixed above the heat pipe group 120. The rotatable auxiliary heat dissipation fin set 160 is connected to the flexible temperature equalizing plate 140, and when the rotatable auxiliary heat dissipation fin set 160 rotates upwards and inwards, the flexible temperature equalizing plate 140 is driven to bend.

In fig. 1, the rotatable auxiliary heat dissipation fin set 160 of the heat dissipation device 100 is shown to rotate to two sides to dissipate heat of the cpu mounted under the fixed substrate 110.

In addition, fig. 2 is a schematic perspective view of the rotatable auxiliary heat dissipation fin set of the heat dissipation device after being rotated upwards. At this time, since the rotatable radiator fins at both sides are rotated upward, the rotatable auxiliary radiator fin group 160 located above the memories at both sides of the fixed substrate 110 is rotated upward and inward without affecting the mounting and removing operations of the memories. Therefore, the user can conveniently replace the new memory for upgrading without removing the heat dissipating device 100 from the upper side of the cpu, thereby effectively increasing the convenience of upgrading the memory.

The memory may be a double data rate synchronous dynamic random access memory (Double Data Rate Synchronous Dynamic Random Access Memory; DDR SDRAM) to increase data rate, such as DDR4 SDRAM or DDR5 SDRAM, although the utility model is not limited thereto.

In some embodiments, the rotatable fins on both sides may be rotated upward and inward by more than 90 degrees, preferably more than 120 degrees, although the utility model is not limited thereto.

In addition, the heat dissipating device 100 further includes a plurality of hinge modules 150 disposed below the flexible temperature equalizing plate 140 and connected to the rotatable auxiliary heat dissipating fin set 160 and the main heat dissipating fin set 130, so that the rotatable auxiliary heat dissipating fin set 160 can rotate relative to the main heat dissipating fin set 130, i.e. the rotatable auxiliary heat dissipating fin set 160 can rotate relative to the heat pipe set 120. When the rotatable auxiliary fin set 160 rotates through the hinge module 150, the flexible heat spreader 140 can be further driven to bend.

Referring to fig. 3, the main heat dissipation fin set 130 is disposed below the flexible temperature equalizing plate 140 and includes a plurality of heat dissipation fins 132, a plurality of through holes 134 and a plurality of accommodating grooves 136, and a portion of the heat pipe set 120 is disposed in the through holes 134, and a portion of the heat pipe set 120 is disposed in the accommodating grooves 136 for transferring heat generated by the cpu to the main heat dissipation fin set 130 and further to the flexible temperature equalizing plate 140 and the rotatable auxiliary heat dissipation fin set 160 for heat dissipation.

In some embodiments, the heat dissipating device 100 further includes a heat conducting block 170, which is fixed below the fixed substrate 110, for contacting the cpu, and transferring heat generated during operation of the cpu to the heat pipe group 120 and the main heat dissipating fin group 130 via the heat conducting block 170. In some embodiments, the heat transfer block 170 is in contact with the heat pipe stack 120, and the flexible temperature uniformity plate 140 directly contacts a portion of the heat pipe stack 120.

In some embodiments, the fixing substrate 110 includes a recess 112 and an opening 114, and the heat pipe set 120 is fixed in the recess 112 and directly contacts the heat conducting block 170 through the opening 114.

In some embodiments, the fixed substrate 110 further includes partition walls 116 disposed on both sides of the fixed substrate 110 to guide the air flow and enhance the strength of the fixed substrate 110.

Referring also to FIG. 4, in some embodiments, heat pipe assembly 120 includes a first heat pipe 210, a second heat pipe 220, a third heat pipe 230, and a fourth heat pipe 240. The first heat pipe 210 includes a first portion 212, a second portion 214 and a third portion 216, the second heat pipe 220 includes a first portion 222, a second portion 224 and a third portion 226, the third heat pipe 230 includes a first portion 232, a second portion 234 and a third portion 236, and the fourth heat pipe 240 includes a first portion 242, a second portion 244 and a third portion 246.

Generally, the first portion 212, the first portion 222, the first portion 232, and the first portion 242 are used to absorb heat generated by the cpu in the fixed substrate 110 and the heat conducting block 170.

The second portion 214, the second portion 224, the second portion 234 and the second portion 244 are rising sections, and transfer the heat absorbed by the first portions of the first heat pipe 210, the second heat pipe 220, the third heat pipe 230 and the fourth heat pipe 240 upward to the third portion 216 of the first heat pipe 210, the third portion 226 of the second heat pipe 220, the third portion 236 of the third heat pipe 230 and the third portion 246 of the fourth heat pipe 240 located at the upper half of the heat sink 132 of the main heat sink 130, and to the main heat sink 130, so as to remove the heat from the main heat sink 130 by a fan or the like.

In some embodiments, the first portion 212 of the first heat pipe 210, the first portion 222 of the second heat pipe 220, the first portion 232 of the third heat pipe 230, and the first portion 242 of the fourth heat pipe 240 are all fixed in the groove 112 of the fixed substrate 110, and the first portion 222 of the second heat pipe 220 and the first portion 232 of the third heat pipe 230 are located between the first portion 212 of the first heat pipe 210 and the first portion 242 of the fourth heat pipe 240. While at least a portion of first portion 212 of first heat pipe 210, first portion 222 of second heat pipe 220, first portion 232 of third heat pipe 230, and first portion 242 of fourth heat pipe 240 are in direct contact with thermally conductive mass 170 via opening 114.

In addition, the third portion 216 of the first heat pipe 210 and the third portion 246 of the fourth heat pipe 240 are located between the third portion 226 of the second heat pipe 220 and the third portion 236 of the third heat pipe 230 to increase the heat dissipation efficiency of the main fin group 130.

In addition, the third portion 216 of the first heat pipe 210 and the third portion 246 of the fourth heat pipe 240 are disposed in the accommodating groove 136 of the main heat sink fin set 130 and can directly contact the flexible temperature equalizing plate 140, and the third portion 226 of the second heat pipe 220 and the third portion 236 of the third heat pipe 230 are disposed through different through holes 134, so as to further increase the heat dissipation efficiency of the main heat sink fin set 130.

In some embodiments, the flexible platen 140 includes a first surface 410 and a second surface 420 opposite to the first surface.

In some embodiments, the hinge module 150 includes a fixed portion 510, a movable portion 520, and a rotating shaft 530. The fixed portion 510 is connected to the main fin set 130, the movable portion 520 is connected to the rotatable auxiliary fin set 160, and the rotating shaft 530 is pivotally connected to the fixed portion 510 and the movable portion 520, so that the movable portion 520 can rotate relative to the fixed portion 510, and the upper surfaces of the fixed portion 510 and the movable portion 520 directly support the second surface 420 of the flexible temperature equalizing plate 140, so as to effectively support the flexible temperature equalizing plate 140 and rotate.

In some embodiments, the rotatable auxiliary fin sets 160 are symmetrically disposed on both sides of the main fin set 130.

In some embodiments, the heat dissipating device 100 further includes a plurality of fixing screws 180 for fixing the fixing substrate 110 on a circuit board, and for contacting the heat conductive blocks 170 under the fixing substrate 110 with the cpu on the circuit board. In some embodiments, a heat dissipating paste is further applied between the heat conducting block 170 and the cpu to increase heat dissipation efficiency.

In summary, the heat dissipating device disclosed by the utility model can utilize the flexible temperature equalizing plate to transfer heat to the rotatable auxiliary heat dissipating fin set, and adjust the angle of the rotatable auxiliary heat dissipating fin set through the flexible temperature equalizing plate and the hinge module, so as to effectively increase the heat dissipating area of the heat dissipating fins, facilitate the installation of the memory by a user, and improve the heat dissipating efficiency of the CPU and the memory, thereby improving the overall efficiency of the computer device.

While the present disclosure has been described with reference to the embodiments, it should be understood that the invention is not limited thereto, but may be variously modified and modified by those skilled in the art without departing from the spirit and scope of the present disclosure, and thus the scope of the present disclosure is defined by the appended claims.

Claims (10)

1. A heat sink, comprising:

A fixed substrate;

A heat pipe group fixed on the fixed base plate;

The flexible temperature equalizing plate is fixed above the heat pipe group; and

And the rotatable auxiliary radiating fin group is connected with the flexible temperature equalizing plate so as to rotate relative to the heat pipe group.

2. The heat sink of claim 1, further comprising:

the main radiating fin group is arranged below the flexible temperature equalizing plate; and

The hinge module is arranged below the flexible temperature-equalizing plate, connected with the rotatable auxiliary radiating fin group and the main radiating fin group, and used for driving the flexible temperature-equalizing plate to bend when the rotatable auxiliary radiating fin group rotates through the hinge module.

3. The heat dissipating device of claim 2, wherein the hinge module comprises a fixed portion, a movable portion and a rotating shaft, the fixed portion is connected to the main heat dissipating fin set, the movable portion is connected to the rotatable auxiliary heat dissipating fin set, and the rotating shaft is pivoted to the fixed portion and the movable portion, so that the movable portion can rotate relative to the fixed portion.

4. The heat dissipating device of claim 2, wherein the primary set of fins comprises a plurality of pockets, the set of heat pipes comprises a first heat pipe and a fourth heat pipe, a portion of the first heat pipe and a portion of the fourth heat pipe are disposed in the plurality of pockets of the set of primary fins and contact the flexible temperature equalizing plate.

5. The heat dissipating device of claim 4, further comprising a thermally conductive block secured below said stationary substrate.

6. The heat dissipating device of claim 5, wherein said fixed substrate comprises a recess and an opening, said recess being disposed adjacent to said opening, said first heat pipe and said fourth heat pipe each comprising a first portion, a second portion and a third portion, and said first portion of said first heat pipe and said first portion of said fourth heat pipe being secured in said recess of said fixed substrate, and said first portion of said first heat pipe and said first portion of said fourth heat pipe each being in contact with said heat conducting block via said opening.

7. The heat dissipating device of claim 6, wherein said third portion of said first heat pipe and said third portion of said fourth heat pipe are respectively secured within said plurality of receiving grooves of said primary set of heat dissipating fins and directly contact said flexible temperature equalizing plate.

8. The heat dissipating device of claim 7, further comprising a second heat pipe and a third heat pipe, wherein the second heat pipe and the third heat pipe comprise a first portion, a second portion, and a third portion, respectively, and the first portion of the second heat pipe and the first portion of the third heat pipe are fixed in the groove of the fixed substrate, and the first portion of the second heat pipe and the first portion of the third heat pipe are in contact with the heat conducting block via the opening of the fixed substrate, respectively, and the first portion of the second heat pipe and the first portion of the third heat pipe are located between the first portion of the first heat pipe and the first portion of the fourth heat pipe.

9. The heat dissipating device of claim 8, wherein said set of primary heat dissipating fins comprises a plurality of perforations, said third portion of said second heat pipe and said third portion of said third heat pipe being secured within said plurality of perforations of said set of primary heat dissipating fins, respectively.

10. The heat sink of claim 9, wherein the third portion of the first heat pipe and the third portion of the fourth heat pipe are located between the third portion of the second heat pipe and the third portion of the third heat pipe.