CN220907688U - Electroplating solution side spraying structure for ceramic plate copper plating cylinder - Google Patents
Electroplating solution side spraying structure for ceramic plate copper plating cylinder Download PDFInfo
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- CN220907688U CN220907688U CN202322704990.4U CN202322704990U CN220907688U CN 220907688 U CN220907688 U CN 220907688U CN 202322704990 U CN202322704990 U CN 202322704990U CN 220907688 U CN220907688 U CN 220907688U
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- Prior art keywords
- spraying
- pipe
- ceramic plate
- side spraying
- pipes
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- 238000005507 spraying Methods 0.000 title claims abstract description 81
- 239000000919 ceramic Substances 0.000 title claims abstract description 29
- 238000009713 electroplating Methods 0.000 title claims abstract description 29
- 238000007747 plating Methods 0.000 title claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 22
- 239000010949 copper Substances 0.000 title claims abstract description 20
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 20
- 239000007788 liquid Substances 0.000 claims abstract description 15
- 239000007921 spray Substances 0.000 claims description 22
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 4
- 239000012535 impurity Substances 0.000 claims description 2
- 230000003014 reinforcing effect Effects 0.000 claims description 2
- 230000009286 beneficial effect Effects 0.000 description 1
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- Electroplating Methods And Accessories (AREA)
Abstract
The utility model discloses an electroplating liquid side spraying structure for a ceramic plate copper plating cylinder, which relates to the technical field of ceramic plate electroplating processing.
Description
Technical Field
The utility model relates to the technical field of ceramic plate electroplating processing, in particular to an electroplating liquid side spraying structure for a ceramic plate copper plating cylinder.
Background
When the ceramic plate is electroplated, a copper plating cylinder is often used, and when the electroplating operation is performed, a circulating spraying structure in the copper plating cylinder can spray electroplating liquid in the copper plating cylinder on the ceramic plate in a circulating manner, so that the electroplating of the ceramic plate is completed.
However, most of the existing side spray pipes are directly connected into the side spray main pipe, so that uneven flow of the side spray pipes and the nozzles is caused, electroplating uniformity and through hole capacity are deteriorated, electroplating quality of the ceramic plate is affected, and the ceramic plate is inconvenient for users to use.
In order to solve the problems, an improved electroplating liquid side spraying structure for a ceramic plate copper plating cylinder is designed.
Disclosure of utility model
The utility model aims to provide an electroplating liquid side spraying structure for a ceramic plate copper plating cylinder, which solves the problems in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a structure is spouted with plating solution side to ceramic plate copper facing jar, includes cylinder body and spraying mechanism, all install positive pole titanium basket on two relative inner walls of cylinder body, two positive pole screen that is parallel to each other is vertically installed to inside cylinder body between the positive pole titanium basket, positive pole screen is parallel to each other with the cylinder body lateral wall that positive pole titanium basket is located, two vertical stores pylon that is used for the mount ceramic plate between the positive pole screen, the upper end of stores pylon is provided with the negative pole copper flat.
The spraying mechanism is arranged on the anode screen and is used for circularly spraying the electroplating solution in the cylinder body onto the ceramic plate on the hanger.
As a further scheme of the utility model: the spraying mechanism comprises two side spraying main pipes, the two side spraying main pipes are respectively and horizontally arranged on the inner wall of the cylinder body above the anode screen, side spraying pump suction pipes which are in one-to-one correspondence with the side spraying main pipes are arranged at the bottom of the cylinder body, a water pump used for enabling electroplating liquid inside the side spraying pump suction pipes to flow to the side spraying main pipes is arranged between the output ends of the side spraying pump suction pipes and the output ends of the side spraying main pipes, a plurality of side spraying pipes are vertically arranged on one side, close to the center position of the cylinder body, of the anode screen, pipe caps are respectively arranged at two ends of the side spraying pipes, spray heads used for spraying electroplating liquid are arranged on the side wall, close to the center position of the cylinder body, of the side spraying main pipes, connecting pipes are arranged at the lower ends of the side spraying main pipes in one-to-one correspondence with the side spraying pipes, and one ends, far away from the side spraying main pipes, of the connecting pipes penetrate through the anode screen and are arranged on the side wall, close to the center position of the side spraying pipes.
As still further aspects of the utility model: the side wall upper end of the connecting pipe is provided with a ball valve for controlling the switch of the connecting pipe, and the side wall of the connecting pipe between the ball valve and the side spray pipe is provided with a pressure gauge for detecting the pressure inside the connecting pipe.
As still further aspects of the utility model: the side wall of the hanging frame is provided with a reinforcing rib for improving the structural strength of the hanging frame.
As still further aspects of the utility model: the filter cover used for preventing impurities from entering the side-spraying pump suction pipe is arranged at the input end of the side-spraying pump suction pipe.
As still further aspects of the utility model: the shower nozzle is last to be provided with the baffle that is used for protecting the shower nozzle, the baffle is vertical to be installed on the inner wall of cylinder body.
Compared with the prior art, the utility model has the beneficial effects that:
Compared with the prior art, the utility model has the advantages that the middle position of the side spray pipe is connected with the side spray main pipe through the connecting pipes, and the ball valve and the pressure gauge are arranged on each connecting pipe, so that the flow of each side spray pipe can be monitored and controlled in real time, the deviation of the flow of the spray head on each side spray pipe is reduced, the electroplating uniformity and the passing capacity are improved, the cost is reduced for customers, and the use is convenient for users.
Drawings
Fig. 1 is a schematic structural view of the present utility model.
Fig. 2 is a schematic view of the structure of the spraying mechanism in the present utility model.
Wherein: 1. a cylinder; 2. a hanging rack; 3. a pressure gauge; 4. cathode copper flattening; 5. a side spraying main pipe; 6. a ball valve; 7. a connecting pipe; 8. a spray head; 9. an anode titanium basket; 10. a side nozzle; 11. an anode screen; 12. a side-spraying pump suction pipe; 13. a pipe cap.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-2, in the embodiment of the utility model, an electroplating liquid side spraying structure for a ceramic plate copper plating cylinder comprises a cylinder body 1 and a spraying mechanism, wherein anode titanium baskets 9 are respectively installed on two opposite inner walls of the cylinder body 1, two mutually parallel anode screens 11 are vertically installed in the cylinder body 1 between the two anode titanium baskets 9, the anode screens 11 are mutually parallel to the side wall of the cylinder body 1 where the anode titanium baskets 9 are located, a hanging frame 2 for hanging the ceramic plate is vertically arranged between the two anode screens 11, and a cathode copper flat 4 is arranged at the upper end of the hanging frame 2.
The spraying mechanism is arranged on the anode screen 11 and is used for circularly spraying the electroplating solution in the cylinder body 1 onto the ceramic plate on the hanging frame 2.
The spraying mechanism comprises two side spraying main pipes 5, the two side spraying main pipes 5 are respectively and horizontally arranged on the inner wall of the cylinder body 1 above the anode screen 11, side spraying pump suction pipes 12 which are in one-to-one correspondence with the side spraying main pipes 5 are arranged at the bottom of the cylinder body 1, a water pump for enabling electroplating liquid inside the side spraying pump suction pipes 12 to flow to the side spraying main pipes 5 is arranged between the output ends of the side spraying pump suction pipes 12 and the output ends of the side spraying main pipes 5, a plurality of side spraying pipes 10 are vertically arranged on one side of the anode screen 11, pipe caps 13 are respectively arranged at two ends of the side spraying pipes 10, spray heads 8 for spraying electroplating liquid are arranged on the side walls of the side spraying pipes 10, which are close to the center of the cylinder body 1, connecting pipes 7 are arranged at the lower ends of the side spraying main pipes 5, one ends of the connecting pipes 7, which are far away from the side spraying main pipes 5, penetrate through the anode screen 11, are arranged on the side walls of the center positions of the side spraying pipes 10, ball valves 6 for controlling the opening and closing of the connecting pipes 7 are arranged at the side walls of the side spraying main pipes, and the side walls 6 are provided with pressure gauges for detecting the pressure gauges 3 arranged on the side walls of the connecting pipes 7.
Compared with the prior art, the middle position of the side spray pipe 10 is connected with the side spray main pipe 5 through the connecting pipes 7, and the ball valve 6 and the pressure gauge 3 are arranged on each connecting pipe 7, so that the flow of each side spray pipe 10 can be monitored and controlled in real time, the deviation of the flow of the spray head 8 on each side spray pipe 10 is reduced, the electroplating uniformity and the passing capacity are improved, the cost is reduced for customers, and the use is convenient for users.
Working principle of electroplating liquid side spraying structure for ceramic plate copper plating cylinder:
the worker moves the hanger 2 between the two anode screens 11 through the lifting device, and then turns on the power supply to perform the electroplating operation.
Simultaneously start the water pump, carry the plating solution of cylinder body 1 bottom to the side through positive pole screen 11 and spout the inside of being responsible for 5, the side spouts the inside of being responsible for 5 and carry the plating solution to connecting pipe 7, and connecting pipe 7 carries the inside of side spray tube 10 with the plating solution, and side spray tube 10 carries the inside of shower nozzle 8 with the plating solution, and shower nozzle 8 sprays the plating solution on the ceramic plate on hanger 2.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof.
Claims (6)
1. The utility model provides a structure is spouted with electroplating solution side to ceramic plate copper plating jar, includes cylinder body (1) and spraying mechanism, all install positive pole titanium basket (9) on two relative inner walls of cylinder body (1), two positive pole titanium basket (9) between cylinder body (1) inside is vertical installs two positive pole screens (11) that are parallel to each other, a serial communication port, positive pole screen (11) are parallel to each other with cylinder body (1) lateral wall that positive pole titanium basket (9) are located, two between positive pole screen (11) vertical stores pylon (2) that are used for carrying the ceramic plate, the upper end of pylon (2) is provided with negative pole copper flat (4);
The spraying mechanism is arranged on the anode screen (11) and is used for circularly spraying the electroplating solution in the cylinder body (1) onto the ceramic plate on the hanging frame (2).
2. The electroplating liquid side spraying structure for the ceramic plate copper plating tank according to claim 1, wherein the spraying mechanism comprises two side spraying main pipes (5), the two side spraying main pipes (5) are respectively horizontally installed on the inner wall of the tank body (1) above the anode screen (11), side spraying pump suction pipes (12) which are in one-to-one correspondence with the side spraying main pipes (5) are installed at the bottom of the tank body (1), a water pump for enabling electroplating liquid inside the side spraying pump suction pipes (12) to flow to the side spraying main pipes (5) is installed between the output ends of the side spraying main pipes (5), a plurality of side spraying pipes (10) are vertically installed on one side, close to the center position of the tank body (1), of each side spraying pipe (10) is provided with a pipe cap (13), a spray head (8) for spraying the electroplating liquid is installed on the side wall, close to the center position of the tank body (1), of each side spraying pipe is provided with a lower end, corresponding to the side spraying pipe (7), of each side spraying pipe (5) is installed on one side, and the side spraying pipe (10) is far away from the center of the side connecting pipe (7), of the side spraying pipe (5).
3. The plating solution side spraying structure for the ceramic plate copper plating tank according to claim 2, wherein a ball valve (6) for controlling the opening and closing of the connecting pipe (7) is arranged at the upper end of the side wall of the connecting pipe (7), and a pressure gauge (3) for detecting the pressure inside the connecting pipe (7) is arranged on the side wall of the connecting pipe (7) between the ball valve (6) and the side spraying pipe (10).
4. The plating solution side spraying structure for a copper plating tank of a ceramic plate according to claim 1, wherein a reinforcing rib for improving the structural strength of the hanger (2) is installed on the side wall of the hanger (2).
5. The plating liquid side-spraying structure for a copper plating tank of a ceramic plate according to claim 2, wherein the input end of the side-spraying pump suction pipe (12) is provided with a filter cover for preventing impurities from entering the inside of the side-spraying pump suction pipe (12).
6. The plating solution side spraying structure for a ceramic plate copper plating tank according to claim 2, wherein a baffle plate for protecting the nozzle (8) is provided on the nozzle (8), and the baffle plate is vertically installed on the inner wall of the tank body (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322704990.4U CN220907688U (en) | 2023-10-09 | 2023-10-09 | Electroplating solution side spraying structure for ceramic plate copper plating cylinder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322704990.4U CN220907688U (en) | 2023-10-09 | 2023-10-09 | Electroplating solution side spraying structure for ceramic plate copper plating cylinder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220907688U true CN220907688U (en) | 2024-05-07 |
Family
ID=90915631
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322704990.4U Active CN220907688U (en) | 2023-10-09 | 2023-10-09 | Electroplating solution side spraying structure for ceramic plate copper plating cylinder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220907688U (en) |
-
2023
- 2023-10-09 CN CN202322704990.4U patent/CN220907688U/en active Active
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