CN220894849U

CN220894849U - Radiator fixing structure

Info

Publication number: CN220894849U
Application number: CN202322563645.3U
Authority: CN
Inventors: 吴凯峰; 喻玄; 叶显; 程盼
Original assignee: Xindong Microelectronics Technology Wuhan Co ltd
Current assignee: Xindong Microelectronics Technology Wuhan Co ltd
Priority date: 2023-09-20
Filing date: 2023-09-20
Publication date: 2024-05-03
Anticipated expiration: 2033-09-20

Abstract

The utility model provides a radiator fixing structure, which is characterized in that through holes are formed in the periphery of a radiator, corresponding threaded holes are formed in a middle frame on the inner side of a shell, and spring screws penetrate through the through holes and are in threaded connection with the threaded holes to fix the radiator and the middle frame. Simultaneously, fix the PCB board with middle frame bottom mutually to it is fixed with radiator and PCB board all to be relative to the middle frame, and make the relative fixation between radiator and the PCB board through middle frame as the medium with the main chip contact on radiator and the PCB board, avoid extra trompil on the PCB board, influence the wiring on the PCB board, also make the trompil position more nimble.

Description

Radiator fixing structure

Technical Field

The utility model relates to the field of heat dissipation of display cards, in particular to a radiator fixing structure.

Background

In the current high-power display card, a radiator is used for radiating the main chip of the display card so as to meet the performance of the display card. In the existing heat dissipation fixing mode, a plurality of spring screws are uniformly arranged around a main chip of a display card, so that a radiator can be uniformly stressed and pressed on the main chip, and the spring screws penetrate through holes in a printed circuit board (Printed Circuit Board, abbreviated as a PCB) and then penetrate through a middle frame of the display card, and finally are locked on the radiator. Under this kind of structure, need open metal via hole on the PCB board, cause the PCB board usable floor area tension, on the one hand can influence the wiring on the PCB board, on the other hand needs increase PCB board area in order to hold corresponding metal via hole, increases overall cost.

In view of this, overcoming the drawbacks of the prior art is a problem to be solved in the art.

Disclosure of utility model

The utility model solves the problem of how to reduce the through holes for screw fixation on the PCB as much as possible on the premise of fixing the radiator and the PCB.

The utility model provides a radiator fixing structure, comprising: the heat radiator comprises a spring screw 1, a heat radiator 2, a shell 3, a middle frame 31 and a PCB 4, wherein a main chip 42 is arranged on the PCB 4;

The middle frame 31 is positioned in the shell 3;

the PCB 4 is positioned below the middle frame 31, and the PCB 4 is fixedly connected with the middle frame 31;

Two sides of the heat radiator 2 are positioned above the middle frame 31, and the heat radiator 2 is in contact with the main chip 42;

the spring screw 1 passes through the radiator 2 from the top of the radiator 2 and is fixedly connected with the middle frame 31.

Preferably, the radiator 2 is provided with a first through hole 21, the middle frame 31 is provided with a first threaded hole 311, and the spring screw 1 penetrates through the first through hole 21 and is in threaded connection with the first threaded hole 311.

Preferably, the spring screw 1 comprises: spring 11 and screw 12:

The screw 12 comprises a nut 121 and a screw rod 122, wherein the nut 121 is positioned at the upper end of the screw rod 122;

the screw 122 penetrates through the first through hole 21, and the lower end of the screw 122 is in threaded connection with the first threaded hole 311;

The spring 11 is sleeved on the screw 122, the upper end of the spring 11 is connected with the nut 121, and the lower end of the spring 11 is abutted against the radiator 2.

Preferably, the heat sink fixing structure further includes a bottom case 5, the bottom case 5 is located below the PCB board 4, the bottom case 5 is fixedly connected with the middle frame 31, and the PCB board 4 is clamped between the bottom case 5 and the middle frame 31.

Preferably, the bottom case 5 is provided with a second through hole 51, the PCB 4 is provided with a third through hole 41, and the middle frame 31 is provided with a second threaded hole 312;

The second through hole 51, the third through hole 41 and the second threaded hole 312 are sequentially matched through the screw 12, so as to realize the fixed connection between the bottom shell 5 and the middle frame 31.

Preferably, the heat sink 2 includes a side connection portion 22 and a heat transfer portion 23, wherein:

The side connection part 22 is positioned at a peripheral side position of the radiator 2, and the heat transfer part 23 is positioned at an intermediate position of the radiator 2;

the side connection portion 22 is located on the middle frame 31, the heat transfer portion 23 passes through the notch of the middle frame 31, and the heat transfer portion 23 contacts with the main chip 42.

Preferably, a predetermined gap exists between the side connection portion 22 and the middle frame 31.

Preferably, the width of the preset gap is 0.3mm to 1mm.

Preferably, the heat sink 2 further includes heat dissipating teeth 24, and the heat dissipating teeth 24 are located at upper ends of the side connection portion 22 and the heat transfer portion 23.

Preferably, a fourth through hole 241 is provided at the bottom of the heat dissipating tooth 24, where the fourth through hole 241 corresponds to the first through hole 21, and the spring screw 1 is fixedly connected to the middle frame 31 after sequentially passing through the fourth through hole 241 and the first through hole 21.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a radiator fixing structure according to an embodiment of the present utility model;

fig. 2 is a cross-sectional view of a radiator fixing structure according to an embodiment of the present utility model;

FIG. 3 is a cross-sectional view of another heat sink securing structure according to an embodiment of the present utility model;

FIG. 4 is a cross-sectional view of yet another heat sink securing structure provided in accordance with an embodiment of the present utility model;

Fig. 5 is a cross-sectional view of a radiator fixing structure according to an embodiment of the present utility model;

FIG. 6 is a cross-sectional view of another heat sink securing structure according to an embodiment of the present utility model;

FIG. 7 is a cross-sectional view of yet another heat sink securing structure provided in accordance with an embodiment of the present utility model;

Wherein, the reference numerals are as follows:

A spring screw 1; a spring 11; a screw 12; a nut 121; a screw 122; a radiator 2; a first through hole 21; a side connection portion 22; a heat transfer section 23; heat dissipation teeth 24; a fourth through hole 241; a housing 3; a middle frame 31; a first threaded hole 311; a second threaded hole 312; a PCB 4; a third through hole 41; a main chip 42; a bottom case 5; and a second through hole 51.

Detailed Description

In the description of the present utility model, the terms "inner", "outer", "longitudinal", "transverse", "upper", "lower", "top", "bottom", etc. refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of describing the present utility model and do not require that the present utility model must be constructed and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

The terms "first," "second," and the like herein are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first", "a second", etc. may explicitly or implicitly include one or more such feature. In the description of the present utility model, unless otherwise indicated, the meaning of "a plurality" is two or more.

In the present utility model, unless explicitly specified and limited otherwise, the term "connected" is to be construed broadly, and for example, "connected" may be either fixedly connected, detachably connected, or integrally formed; can be directly connected or indirectly connected through an intermediate medium. Furthermore, the term "coupled" may be a means of electrical connection for achieving signal transmission.

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

An embodiment of the present utility model provides a radiator fixing structure, as shown in fig. 1, including: the heat radiator comprises a spring screw 1, a heat radiator 2, a shell 3 and a PCB 4, wherein a main chip 42 is arranged on the PCB 4; the housing 3 comprises a middle frame 31, and the middle frame 31 is positioned in the housing 3; the PCB 4 is positioned below the middle frame 31, and the PCB 4 is fixedly connected with the middle frame 31; two sides of the heat radiator 2 are positioned above the middle frame 31, and the heat radiator 2 is in contact with the main chip 42; the spring screw 1 passes through the radiator 2 from the top of the radiator 2 and is fixedly connected with the middle frame 31.

As shown in fig. 1 and 2, in this embodiment, the middle frame 31 is used as a fixing frame of the whole structure, the housing 3 is fixed on the middle frame 31, and the middle position of the middle frame 31 is used for accommodating other components in the graphics card, such as one or more of the PCB board 4 and/or the heat sink 2; in this embodiment, the PCB 4 and the radiator 2 are disposed in the housing 3, when the PCB 4 is actually operated, the operating temperature of the chip on the PCB 4 will gradually increase along with the increase of the operating time, so that synchronous heat dissipation is required for the chip on the PCB 4, in this embodiment, the radiator 2 is used for dissipating heat from the PCB 4, so that the radiator 2 needs to be fixed on the PCB 4, and the PCB 4 is located below the middle frame 31.

In addition, as shown in fig. 1 and 2, because the size of the PCB 4 itself and the position of the PCB 4 itself need to be limited on the middle frame 31, in this embodiment, the PCB 4 is disposed at the lower end of the middle frame 31, and corresponding through holes are disposed at corresponding positions of the threaded holes of the middle frame 31, so that the screws 12 (as shown in fig. 3) are used for sleeving, and the PCB is fixed at the lower end of the middle frame 31 by the screws 12.

As shown in fig. 1 and 2, in this embodiment, the heat spreader 2 is directly placed above the PCB 4, and the heat transfer portion 23 of the heat spreader 2 directly faces the chip on the PCB 4 to be heat-dissipated to dissipate heat; therefore, in this embodiment, the radiator 2 and the PCB 4 need to be fixed relatively, and the common fixing manner is to directly set corresponding threaded holes or through holes on the radiator 2 and the PCB 4 and connect and fix the radiator and the PCB 4 through the screws 12, but considering that a large number of wires need to be routed on the PCB 4, if the holes are directly formed on the PCB 4, the wires on the PCB 4 need to be planned, so that the positions of the holes cannot be set at will, and in some cases, in order to form the holes at extra positions on the PCB 4, the board surface of the PCB 4 needs to be enlarged, and the manufacturing cost needs to be further increased; in this embodiment, the screws 12 are prevented from being fixed through the PCB board 4, but the middle frame 31 and the heat sink 2 are relatively fixed to realize the fixation of the heat sink 2 and the PCB board 4, because the middle frame 31 can be used as an intermediary, and only the corresponding holes are formed in the heat sink 2 and the middle frame 31 and are fixed through the screws, so that the additional holes are prevented from being formed in the PCB board 4.

As shown in fig. 1 and 2, it should be noted that, in order to ensure the stability of fixing between the radiator 2 and the middle frame 31, the corresponding spring screws 1 are required to be disposed on the periphery of the radiator 2 and are matched with the corresponding middle frame 31, and the fixing of the radiator 2 is realized by fixing and matching the positions of the periphery of the radiator 2 with the corresponding middle frame 31.

In this embodiment, considering that the material of the surface of the main chip 42 is fragile, the heat sink 2 should be prevented from being damaged by the excessive contact force to the main chip 42 when the heat sink 2 is attached to the main chip 42, so that the heat sink 2 and the middle frame 31 are connected by the spring screw 1, the following design is involved:

As shown in fig. 3 and 4, the radiator 2 is provided with a first through hole 21, the middle frame 31 is provided with a first threaded hole 311, and the spring screw 1 penetrates through the first through hole 21 and is in threaded connection with the first threaded hole 311.

The spring screw 1 comprises: spring 11, screw 12, wherein:

The screw 12 comprises a nut 121 and a screw rod 122, wherein the nut 121 is positioned at the upper end of the screw 12; the screw 122 penetrates through the first through hole 21, and the lower end of the screw 122 is matched and fixed with the first threaded hole 311; the spring 11 is sleeved on the screw 122, the upper end of the spring 11 is connected with the nut 121, and the lower end of the spring 11 is abutted against the upper surface of the radiator 2.

As shown in fig. 3 and 4, in this embodiment, the screw 12 is provided with a corresponding threaded portion, in this embodiment, the threaded portion is disposed at the lower end of the screw 12, the threaded portion at the lower end of the screw 12 is matched with the first threaded hole 311 to fix, while the other positions of the screw 12 are sleeved on the heat sink 2, and then the nut 121 and the spring 11 complete the fixing and matching of the spring screw 1. The spring 11 is sleeved on the screw 12, in this embodiment, the spring 11 is in a shape of a circular truncated cone, wherein the diameter of the upper end of the spring 11 is smaller than that of the lower end of the spring 11, the upper end of the spring 11 is connected with the nut 121, the lower end of the spring 11 is abutted against the upper surface of the radiator 2, when the spring screw 1 is screwed down for matching, the spring 11 limits the screw 12 to be screwed down completely, the elastic restoring force of the spring 11 ensures that the screw 12 and the middle frame 31 are fixedly matched, and meanwhile, excessive abutting force is not applied to the upper surface of the radiator 2, so that the lower surface of the radiator 2 is prevented from applying excessive pressure to the PCB 4, and damage is avoided to the surface of the PCB.

In this embodiment, a corresponding protective housing is further required to be disposed below the PCB 4, and at the same time, fixation of the PCB 4 is further required to be ensured, so this embodiment further has the following design:

As shown in fig. 5, the radiator fixing structure further includes a bottom case 5, the bottom case 5 is located below the PCB board 4, the bottom case 5 is fixedly connected with the middle frame 31, and the PCB board 4 is clamped between the bottom case 5 and the middle frame 31.

The bottom shell 5 is provided with a second through hole 51, the PCB 4 is provided with a third through hole 41, and the middle frame 31 is provided with a second threaded hole 312; the second through hole 51, the third through hole 41 and the second threaded hole 312 are sequentially matched through the screw 12, so as to realize the fixed connection between the bottom shell 5 and the middle frame 31.

As shown in fig. 5, it should be noted that the second through hole 51 needs to be disposed away from the first through hole 21, so as to avoid contradiction between the first through hole 21 and the second through hole 51, so that part of the middle frame 31 is used for fixedly matching with the radiator 2, and the other part of the middle frame 31 is used for fixedly matching with the bottom shell 5, as shown in fig. 5, it can be seen that the middle frame 31 extends downward, the extending part is used for disposing the corresponding second threaded hole 312, the bottom shell 5 is disposed with the corresponding second through hole 51, the PCB board 4 is disposed with the corresponding third through hole 41, and the second threaded hole 312, the second through hole 51 and the third through hole 41 are sequentially abutted and matched by the fixing screw 12. It should be noted that, in this embodiment, since the bottom shell 5 and the middle frame 31 are correspondingly fixed, and the PCB 4 needs to be disposed between the bottom shell 5 and the middle frame 31, the PCB 4 needs to be provided with the corresponding third through hole 41, on this basis, the embodiment is turned to the spring screw 1 that should be matched with the radiator 2 and the PCB 4 originally to be used for fixing the radiator 2 and the middle frame 31, so as to reduce the number of holes on the PCB 4, thereby reducing the influence on the routing on the PCB 4, and meanwhile, setting the hole position more flexibly.

As shown in fig. 6, the heat sink 2 includes a side connection portion 22 and a heat transfer portion 23, wherein:

The side connection part 22 is positioned at a peripheral side position of the radiator 2, and the heat transfer part 23 is positioned at an intermediate position of the radiator 2; the side connection portion 22 is located on the middle frame 31, the heat transfer portion 23 passes through the notch of the middle frame 31, and the heat transfer portion 23 contacts with the main chip 42.

As shown in fig. 6, the side connection portion 22 is located at the peripheral side of the heat sink 2, the heat transfer portion 23 is located at the middle position of the heat sink 2, in this embodiment, the middle frame 31 is located at the peripheral ring inside the housing 3, the housing 3 removes the middle portion of the middle frame 31, and there is a receiving space for receiving the corresponding heat sink 2 and PCB board 4. It should be noted that in this embodiment, the heat sink 2 is a single integral piece, and the side connection portion 22, the heat transfer portion 23, and the heat dissipating teeth 24 are not separate components.

As shown in fig. 6, it should be noted that, in the prior art, the corresponding housing 3 of the graphics card is generally rectangular, in order to adapt the radiator 2 and the housing 3, the outer contour of the radiator 2 is also rectangular, and the side connection portion 22 is disposed on the outer periphery of the radiator 2, so that the outer contour of the side connection portion 22 is rectangular; in this embodiment, the first through holes 21 are located at four top corners of the side connecting portion 22, that is, at least four first through holes 21 on the side connecting portion 22 correspond to four first threaded holes 311 on the middle frame 31, and the first through holes 21 and the first threaded holes 311 are matched by the spring screws 1, so as to achieve the fixed connection between the radiator 2 and the middle frame 31. Therefore, similarly, the outer contour of the middle frame 31 is rectangular and is disposed at the inner position of the housing 3, and corresponding first screw holes 311 are disposed at four vertex angle positions of the outer contour of the middle frame 31.

As shown in fig. 6, a predetermined gap exists between the side connection portion 22 and the middle frame 31.

In this embodiment, the preset gap is set by a person skilled in the art, and the width of the preset gap may be 0.3mm to 1mm. Through the preset gap, the following beneficial effects can be achieved: 1. when the SMT patch tolerance of the main chip 42 and the thickness tolerance of the heat sink 2 are both lower, the preset interval can absorb the tolerance thickness of the heat sink 2 and the patch tolerance of the main chip 42, so that when the tolerance is too large, the middle frame 31 is prevented from supporting the heat sink 2, and the main chip 42 and the heat sink 2 cannot be well contacted, and poor heat dissipation is caused; 2. when the SMT chip tolerance of the main chip 42 and the thickness tolerance of the heat sink 2 are both limited, the spring 11 of the spring screw 1 can increase the compression amount to absorb the excessive tolerance, so that the main chip 42 and the heat sink 2 can still be in good contact.

In this embodiment, the heat sink 2 itself needs to release the heat exchanged by heat, so the heat sink 2 also needs to provide an air outlet for discharging the heat to the outside of the device, and therefore, as shown in fig. 7, the heat sink 2 further includes heat dissipating teeth 24, and the heat dissipating teeth 24 are located at the upper ends of the side connection portion 22 and the heat transfer portion 23.

In this embodiment, the heat dissipation teeth 24 are in a grid mesh shape, the heat dissipation teeth 24 include an exhaust space, the exhaust space is communicated with the heat transfer portion 23 below, the heat transfer portion 23 is in contact with the main chip 42, the heat transfer portion 23 exchanges heat with the main chip 42, and the heat transfer portion 23 transfers heat to the heat dissipation teeth 24 and is discharged to the outside through the heat dissipation teeth 24.

The foregoing description of the preferred embodiments of the present utility model should not be taken as limiting the utility model, but rather should be understood to cover all modifications, equivalents, alternatives, improvements and etc. that are within the spirit and scope of the present utility model.

Claims

1. A radiator fixing structure, characterized by comprising: the heat radiator comprises a spring screw (1), a heat radiator (2), a shell (3), a middle frame (31) and a PCB (4), wherein a main chip (42) is arranged on the PCB (4);

the middle frame (31) is positioned in the shell (3);

The PCB (4) is positioned below the middle frame (31), and the PCB (4) is fixedly connected with the middle frame (31);

Two sides of the radiator (2) are positioned above the middle frame (31), and the radiator (2) is in contact with the main chip (42);

The spring screw (1) penetrates through the radiator (2) from the top of the radiator (2) and is fixedly connected with the middle frame (31).

2. The radiator fixing structure according to claim 1, wherein a first through hole (21) is provided in the radiator (2), a first threaded hole (311) is provided in the middle frame (31), and the spring screw (1) penetrates through the first through hole (21) and is in threaded connection with the first threaded hole (311).

3. The heat sink fixing structure according to claim 2, wherein the spring screw (1) comprises: spring (11) and screw (12):

The screw (12) comprises a nut (121) and a screw rod (122), wherein the nut (121) is positioned at the upper end of the screw rod (122);

The screw rod (122) penetrates through the first through hole (21), and the lower end of the screw rod (122) is in threaded connection with the first threaded hole (311);

The spring (11) is sleeved on the screw rod (122), the upper end of the spring (11) is connected with the nut (121), and the lower end of the spring (11) is abutted with the radiator (2).

4. The radiator fixing structure according to claim 1, further comprising a bottom case (5), the bottom case (5) being located under the PCB board (4), the bottom case (5) being fixedly connected with the middle frame (31), the PCB board (4) being sandwiched between the bottom case (5) and the middle frame (31).

5. The radiator fixing structure according to claim 4, wherein a second through hole (51) is provided on the bottom case (5), a third through hole (41) is provided on the PCB board (4), and a second threaded hole (312) is provided on the middle frame (31);

The second through hole (51), the third through hole (41) and the second threaded hole (312) are sequentially matched through screws (12) to realize the fixed connection between the bottom shell (5) and the middle frame (31).

6. The heat sink fixing structure according to claim 2, wherein the heat sink (2) comprises a side connection portion (22) and a heat transfer portion (23), wherein:

The side connecting part (22) is positioned at the peripheral side of the radiator (2), and the heat transfer part (23) is positioned at the middle position of the radiator (2);

The side connecting part (22) is positioned on the middle frame (31), the heat transfer part (23) passes through the notch of the middle frame (31), and the heat transfer part (23) is contacted with the main chip (42).

7. The radiator fixing structure according to claim 6, wherein a predetermined gap exists between the side connection portion (22) and the center frame (31).

8. The heat sink fixing structure according to claim 7, wherein the width of the preset gap is 0.3mm to 1mm.

9. The radiator fixing structure according to claim 6, wherein the radiator (2) further includes radiating teeth (24), the radiating teeth (24) being located at upper ends of the side connection portion (22) and the heat transfer portion (23).

10. The radiator fixing structure according to claim 9, wherein a fourth through hole (241) is provided at the bottom of the heat dissipation tooth (24), the fourth through hole (241) corresponds to the first through hole (21), and the spring screw (1) is fixedly connected to the middle frame (31) after sequentially passing through the fourth through hole (241) and the first through hole (21).