CN220874917U - Semiconductor substrate packaging structure - Google Patents
Semiconductor substrate packaging structure Download PDFInfo
- Publication number
- CN220874917U CN220874917U CN202322573071.8U CN202322573071U CN220874917U CN 220874917 U CN220874917 U CN 220874917U CN 202322573071 U CN202322573071 U CN 202322573071U CN 220874917 U CN220874917 U CN 220874917U
- Authority
- CN
- China
- Prior art keywords
- semiconductor substrate
- fixed
- clamping strip
- sliding block
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 62
- 239000004065 semiconductor Substances 0.000 title claims abstract description 58
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 25
- 230000006835 compression Effects 0.000 claims description 11
- 238000007906 compression Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 241001124569 Lycaenidae Species 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000014987 copper Nutrition 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
Abstract
The utility model discloses a semiconductor substrate packaging structure, which relates to the technical field of semiconductor substrate packaging and comprises a base; a placing plate is arranged at the top of the base; the top of the placing plate is provided with a first clamping strip and a second clamping strip, wherein the first clamping strip is fixed at the top of the placing plate; the top of the placing plate is fixedly provided with a connecting plate, one end of the connecting plate is provided with a threaded hole, the threaded hole is internally and in threaded connection with a threaded rod, one end of the threaded rod is fixedly provided with a rotating shaft, the other end of the threaded rod is rotationally connected with a second clamping strip, the top of the placing plate is provided with a linear chute, and a first sliding block is arranged in the linear chute; the clamping strip II is fixed at the top of the first sliding block, so that the semiconductor substrate is conveniently fixed, and the packaging efficiency of the semiconductor substrate is improved.
Description
Technical Field
The present utility model relates to the field of semiconductor substrate packaging technology, and in particular, to a semiconductor substrate packaging structure.
Background
The semiconductor substrate is a basic material for manufacturing a PCB, and in general, the substrate is a Copper clad laminate, and in manufacturing, single and double sided printed boards are formed by selectively performing hole processing, electroless Copper plating, electrolytic Copper plating, etching, and the like on a substrate material, i.e., a Copper clad laminate (coppers CLAD LAMINATE, CCL), to obtain a desired circuit pattern. Another type of multilayer printed board is also manufactured by using a thin copper clad laminate with an inner core as a substrate, and alternately laminating and bonding conductive pattern layers and prepregs (Pregpr' eg) together at one time to form more than 3 layers of conductive pattern interlayer interconnection. It has the functions of conducting, insulating and supporting. The performance, quality, workability in manufacturing, manufacturing cost, manufacturing level, etc. of the printed board depend to a large extent on the substrate material.
At present, when packaging a semiconductor substrate, a fixing device is required to fix the semiconductor substrate, but the conventional fixing device is relatively complicated to operate, so that the packaging efficiency of the semiconductor substrate is affected.
Disclosure of utility model
The utility model aims to provide a semiconductor substrate packaging structure, which aims to solve the problem that the prior fixing device is required to fix a semiconductor substrate when the semiconductor substrate is packaged, but the prior fixing device is relatively complicated to operate, so that the packaging efficiency of the semiconductor substrate is affected.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
A semiconductor substrate package structure, comprising:
A base;
A placing plate is arranged at the top of the base;
The top of the placing plate is provided with a first clamping strip and a second clamping strip, wherein the first clamping strip is fixed at the top of the placing plate;
the top of the placing plate is fixedly provided with a connecting plate, one end of the connecting plate is provided with a threaded hole, the threaded hole is internally connected with a threaded rod, one end of the threaded rod is fixedly provided with a rotating shaft, and the other end of the threaded rod is rotationally connected with a clamping strip II.
As a further scheme of the utility model, a linear chute is formed at the top of the placing plate, and a first sliding block is arranged in the linear chute;
and the second clamping strip is fixed at the top of the first sliding block.
As a further scheme of the utility model, soft cushions are arranged at the opposite ends of the first clamping strip and the second clamping strip.
As a further scheme of the utility model, an annular chute is formed at the top of the base, and a second sliding block is arranged in the annular chute;
the placing plate is fixed on the top of the second sliding block.
As a further scheme of the utility model, a transverse chute is formed at the top of the base, and a sliding block III is arranged in the transverse chute;
A vertical plate is fixed at the three top parts of the sliding blocks, and a clamping column is fixed at one end of the vertical plate;
the outer wall of the placing plate is provided with a plurality of clamping holes, and one end of the clamping column is clamped inside one of the clamping holes.
As a further scheme of the utility model, a telescopic rod is fixed on the inner wall of one side of the transverse chute, and one end of the telescopic rod, which is far away from the inner wall of one side of the transverse chute, is fixed with a sliding block III;
The telescopic rod is characterized in that a compression spring is arranged on the outer wall of the telescopic rod, one end of the compression spring is fixed with the inner wall of one side of the transverse chute, and the other end of the compression spring is fixed with the sliding block III.
Compared with the prior art, the utility model has the beneficial effects that:
According to the utility model, the semiconductor substrate is placed on the top of the placing plate, one end of the semiconductor substrate is abutted against the first clamping strip, then the rotating shaft is rotated, the threaded rod is driven by the rotating shaft to move in the threaded hole, the second clamping strip is driven to move towards the first clamping strip when the threaded rod moves, after the second clamping strip is abutted against the semiconductor substrate, the semiconductor substrate can be clamped and fixed under the cooperation of the first clamping strip and the second clamping strip, and compared with the prior art, the semiconductor substrate packaging device is convenient for fixing the semiconductor substrate, and the packaging efficiency of the semiconductor substrate is improved.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;
FIG. 3 is a schematic view of a portion of the structure of the present utility model;
fig. 4 is an enlarged view of the structure of fig. 3B according to the present utility model.
In the figure: 1. a base; 2. placing a tray; 3. clamping the first strip; 4. a soft cushion; 5. clamping a second strip; 6. a connecting plate; 7. a threaded hole; 8. a threaded rod; 9. a rotating shaft; 10. a straight line chute; 11. a first sliding block; 12. an annular chute; 13. a second slide block; 14. a transverse chute; 15. a third slide block; 16. a riser; 17. a clamping column; 18. a clamping hole; 19. a telescopic rod; 20. compressing the spring.
Detailed Description
The following describes the embodiments of the present utility model further with reference to the drawings. The description of these embodiments is provided to assist understanding of the present utility model, but is not intended to limit the present utility model. In addition, the technical features of the embodiments of the present utility model described below may be combined with each other as long as they do not collide with each other.
Example 1
Referring to fig. 1-3, the present utility model provides a technical solution: a semiconductor substrate package structure includes a base 1; the top of the base 1 is provided with a placing plate 2; the top of the placing plate 2 is provided with a clamping strip I3 and a clamping strip II 5, wherein the clamping strip I3 is fixed at the top of the placing plate 2; the top of the placing plate 2 is fixedly provided with a connecting plate 6, one end of the connecting plate 6 is provided with a threaded hole 7, the threaded hole 7 is internally connected with a threaded rod 8, one end of the threaded rod 8 is fixedly provided with a rotating shaft 9, the other end of the threaded rod 8 is rotationally connected with a clamping strip II 5, the top of the placing plate 2 is provided with a linear chute 10, and a first sliding block 11 is arranged in the linear chute 10; the clamping strip II 5 is fixed at the top of the first sliding block 11, and the soft cushion 4 is arranged at the opposite ends of the clamping strip I3 and the clamping strip II 5.
Specifically, the semiconductor substrate is placed on the top of the placing tray 2, one end of the semiconductor substrate is abutted against the first clamping strip 3, then the rotating shaft 9 is rotated, the threaded rod 8 is driven by the rotating shaft 9 to move in the threaded hole 7, the second clamping strip 5 is driven to move towards the first clamping strip 3 when the threaded rod 8 moves, after the second clamping strip 5 is abutted against the semiconductor substrate, the semiconductor substrate can be clamped and fixed under the cooperation of the first clamping strip 3 and the second clamping strip 5, and compared with the prior art, the semiconductor substrate packaging device is convenient for fixing the semiconductor substrate, and improves the packaging efficiency of the semiconductor substrate;
Through being equipped with cushion 4 in clamping strip one 3, clamping strip two 5 diametrically opposite's one end, cushion 4 can avoid semiconductor substrate and clamping strip one 3, clamping strip two 5 direct contact, avoids clamping strip one 3, clamping strip two 5 to cause the damage to semiconductor substrate.
Example 2
Referring to fig. 1, 3 and 4, the present utility model provides a technical solution: in the semiconductor substrate packaging structure, an annular chute 12 is formed at the top of a base 1, and a second slider 13 is arranged in the annular chute 12; the placing plate 2 is fixed at the top of the second sliding block 13, a transverse sliding groove 14 is formed in the top of the base 1, and a third sliding block 15 is arranged in the transverse sliding groove 14; a vertical plate 16 is fixed at the top of the sliding block III 15, and a clamping column 17 is fixed at one end of the vertical plate 16; the outer wall of the placing plate 2 is provided with a plurality of clamping holes 18, one end of a clamping column 17 is clamped in one of the clamping holes 18, the inner wall of one side of the transverse sliding groove 14 is fixed with a telescopic rod 19, and one end of the telescopic rod 19, which is far away from the inner wall of one side of the transverse sliding groove 14, is fixed with a sliding block III 15; the outer wall of the telescopic rod 19 is provided with a compression spring 20, one end of the compression spring 20 is fixed with the inner wall of one side of the transverse chute 14, and the other end of the compression spring 20 is fixed with the sliding block III 15.
Specifically, the utility model can drive the placing tray 2 to rotate under the cooperation of the annular chute 12 and the second sliding block 13, thereby achieving the purpose of adjusting the angle of the semiconductor substrate at the top of the placing tray 2, being convenient for packaging the semiconductor substrate at multiple angles and indirectly improving the packaging efficiency of the semiconductor substrate;
After the angle of the semiconductor substrate is adjusted, the telescopic rod 19 is driven to stretch under the action of the elastic force of the compression spring 20, the sliding block III 15 is pushed to move in the transverse sliding groove 14 when the telescopic rod 19 stretches, the clamping column 17 is driven to move when the sliding block III 15 moves, and the clamping column 17 is clamped into the clamping hole 18, so that the fixing of the semiconductor substrate is completed.
Working principle:
Firstly, a semiconductor substrate is placed on the top of a placing disc 2, one end of the semiconductor substrate is abutted against a clamping strip I3, then a rotating shaft 9 is rotated, the rotating shaft 9 drives a threaded rod 8 to move in a threaded hole 7, a clamping strip II 5 is driven to move towards the clamping strip I3 when the threaded rod 8 moves, after the clamping strip II 5 is abutted against the semiconductor substrate, the semiconductor substrate can be clamped and fixed under the cooperation of the clamping strip I3 and the clamping strip II 5, and compared with the prior art, the semiconductor substrate packaging device is convenient for fixing the semiconductor substrate, and improves the packaging efficiency of the semiconductor substrate;
Secondly, the placing tray 2 can be driven to rotate under the cooperation of the annular chute 12 and the second sliding block 13, so that the angle of the semiconductor substrate at the top of the placing tray 2 is adjusted, the semiconductor substrate is conveniently packaged at multiple angles, and the packaging efficiency of the semiconductor substrate is indirectly improved;
Finally, after the angle of the semiconductor substrate is adjusted, the telescopic rod 19 is driven to stretch under the action of the elastic force of the compression spring 20, the sliding block III 15 is pushed to move in the transverse sliding groove 14 when the telescopic rod 19 stretches, the clamping column 17 is driven to move when the sliding block III 15 moves, and the clamping column 17 is clamped into the clamping hole 18, so that the fixing of the semiconductor substrate is completed.
The embodiments of the present utility model have been described in detail above with reference to the accompanying drawings, but the present utility model is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the utility model, and yet fall within the scope of the utility model.
Claims (6)
1. A semiconductor substrate package structure, comprising:
a base (1);
a placing disc (2) is arranged at the top of the base (1);
the top of the placing disc (2) is provided with a clamping strip I (3) and a clamping strip II (5), wherein the clamping strip I (3) is fixed at the top of the placing disc (2);
The utility model discloses a clamping device, including placing dish (2), screw rod (8), threaded rod (8) one end, place dish (2) top and be fixed with connecting plate (6), screw hole (7) have been seted up to connecting plate (6) one end, threaded rod (8) one end is fixed with pivot (9), threaded rod (8) other end and clamping strip two (5) rotate and are connected.
2. The semiconductor substrate packaging structure according to claim 1, wherein a linear chute (10) is formed at the top of the placing tray (2), and a first slider (11) is installed in the linear chute (10);
the clamping strip II (5) is fixed at the top of the sliding block I (11).
3. The semiconductor substrate packaging structure according to claim 1, wherein the opposite ends of the first clamping strip (3) and the second clamping strip (5) are respectively provided with a soft pad (4).
4. The semiconductor substrate packaging structure according to claim 1, wherein an annular chute (12) is formed at the top of the base (1), and a second slider (13) is installed in the annular chute (12);
the placing disc (2) is fixed on the top of the second sliding block (13).
5. The semiconductor substrate packaging structure according to claim 1, wherein a transverse chute (14) is formed at the top of the base (1), and a sliding block III (15) is installed in the transverse chute (14);
A vertical plate (16) is fixed at the top of the third sliding block (15), and a clamping column (17) is fixed at one end of the vertical plate (16);
A plurality of clamping holes (18) are formed in the outer wall of the placing disc (2), and one end of the clamping column (17) is clamped inside one of the clamping holes (18).
6. The semiconductor substrate packaging structure according to claim 5, wherein a telescopic rod (19) is fixed on one side inner wall of the transverse chute (14), and one end of the telescopic rod (19) far away from one side inner wall of the transverse chute (14) is fixed with a sliding block III (15);
The telescopic rod is characterized in that a compression spring (20) is arranged on the outer wall of the telescopic rod (19), one end of the compression spring (20) is fixed with the inner wall of one side of the transverse sliding groove (14), and the other end of the compression spring (20) is fixed with the sliding block III (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322573071.8U CN220874917U (en) | 2023-09-21 | 2023-09-21 | Semiconductor substrate packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322573071.8U CN220874917U (en) | 2023-09-21 | 2023-09-21 | Semiconductor substrate packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220874917U true CN220874917U (en) | 2024-04-30 |
Family
ID=90820454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322573071.8U Active CN220874917U (en) | 2023-09-21 | 2023-09-21 | Semiconductor substrate packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220874917U (en) |
-
2023
- 2023-09-21 CN CN202322573071.8U patent/CN220874917U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN210928133U (en) | Portable folding type circuit board | |
| CN220874917U (en) | Semiconductor substrate packaging structure | |
| CN214675936U (en) | Hard circuit board pressing device accurate in positioning | |
| CN209815029U (en) | Substrate conveying device | |
| CN213875930U (en) | Inspection device for circuit substrate | |
| CN214281772U (en) | Multilayer substrate's preparation equipment | |
| CN215702072U (en) | Cutting device of flexible circuit board | |
| CN113400362B (en) | Cutting mechanism of PCB substrate and using method thereof | |
| CN221020626U (en) | Clamp with stable clamping | |
| CN111586980A (en) | Drilling equipment is used in circuit board production | |
| CN214757120U (en) | Adjustable base plate stop position device | |
| CN112930035A (en) | Integrated circuit substrate manufacturing equipment | |
| CN215787131U (en) | Positioning device for processing 5G high-frequency high-speed substrate | |
| CN220510019U (en) | Insulated semiconductor substrate | |
| CN210758000U (en) | Circuit board substrate cutting device | |
| CN206895022U (en) | A kind of wiring board hole plugging machine that can reduce air drag | |
| CN221962039U (en) | Circuit board pressing device | |
| CN219577369U (en) | Photovoltaic circuit substrate unable adjustment base | |
| CN109176352B (en) | Fixing base is used in processing of cell-phone circuit board | |
| CN220533386U (en) | Fixing clamp for welding circuit board | |
| CN221955261U (en) | Pressure data linkage clamping and transport mechanism for PCB production | |
| CN219612115U (en) | Anti-loosening circuit board for gardening tool | |
| CN221306194U (en) | PCBA circuit board clamp with overturning function | |
| CN219961144U (en) | High-density printed circuit board with arbitrary layer interconnection | |
| CN220922559U (en) | Precise cutting device for PCB substrate production |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |