CN220796729U

CN220796729U - Chip heat abstractor

Info

Publication number: CN220796729U
Application number: CN202322573690.7U
Authority: CN
Inventors: 杨永旺
Original assignee: Beijing Alphazhi Technology Co ltd
Current assignee: Beijing Alphazhi Technology Co ltd
Priority date: 2023-09-21
Filing date: 2023-09-21
Publication date: 2024-04-16
Anticipated expiration: 2033-09-21

Abstract

The utility model discloses a chip heat dissipation device which comprises a main board, a chip, a mounting frame, a radiator and a mounting block, wherein the chip is arranged at the top of the main board, the mounting frame is fixedly connected to the top of the main board, and jacks are formed in the left side and the right side of the inner wall of the mounting frame. According to the utility model, through the matched use of the main board, the chip, the mounting frame, the radiator, the mounting block, the cavity, the positioning mechanism and the adjusting mechanism, when the radiator and the mounting frame are assembled, the adjusting mechanism is pressed, so that the positioning mechanism is driven to enter the cavity, and the assembly of the radiator can be completed at the moment, so that the problem that the installation of the radiator is influenced because the main case is narrow in space, the radiator is usually fixed by adopting screws when being installed, and the screws are relatively small when being installed.

Description

Chip heat abstractor

Technical Field

The utility model belongs to the technical field of chips, and particularly relates to a chip heat dissipation device.

Background

Integrated circuits, or microcircuits, microchips, wafers/chips, are one way in electronics to miniaturize circuits (mainly including semiconductor devices, also including passive components, etc.) and are often manufactured on semiconductor wafer surfaces, and the classification methods of integrated circuits are numerous and can be classified according to the category of analog or digital circuits: analog integrated circuits, digital integrated circuits and mixed signal integrated circuits (analog and digital are on a single chip), the chip can be used in a computer, and when the chip is used, heat can be generated, if the heat is not dissipated, the heat can cause the chip to overheat and burn out, and the problems in the prior art are that: because the space of the main case is narrow, the main case is usually fixed by adopting screws when the heat radiator is installed, and because the screws are small, the installation of the heat radiator is inconvenient, so that the installation of the heat radiator is affected.

Disclosure of utility model

Aiming at the problems in the prior art, the utility model provides the chip heat dissipation device which has the advantage of being convenient for installing the heat dissipation device, and solves the problem that the heat dissipation device is affected due to the fact that the main case is small in space, screws are usually adopted to fix the heat dissipation device when the heat dissipation device is installed, and the screws are small and inconvenient when the heat dissipation device is installed.

The utility model discloses a chip heat dissipation device which comprises a main board, a chip, a mounting frame, a radiator and a mounting block, wherein the chip is arranged at the top of the main board, the mounting frame is fixedly connected to the top of the main board, jacks are formed in the left side and the right side of the inner wall of the mounting frame, the radiator is arranged at the top of the main board, the mounting block is fixedly connected to the surface of the radiator, a cavity is formed in the mounting block, a positioning mechanism is arranged in the cavity, and an adjusting mechanism matched with the positioning mechanism is arranged in the cavity.

As the preferred one of the utility model, the said locating mechanism includes two compression springs, two vertical blocks, two locating columns and two connecting columns, two said vertical blocks are all fixedly connected to both ends of two compression springs, the said locating column is fixedly connected to one side of the vertical block far away from compression spring, one side of the said locating column far away from vertical block runs through and extends to the inside of the jack, two said connecting columns are fixedly connected to the front sides of two vertical blocks separately, said connecting columns are used with regulating mechanism cooperatively, through setting up the locating mechanism, can fix it through the installation block after radiator and mounting bracket are assembled, thus dispel the heat to the chip through the radiator.

As the preferable one of the utility model, the said regulating mechanism includes pressing the pole, horizontal pole, two push blocks, locating shaft and two straight poles, the said pressing the pole to connect fixedly to the top of the horizontal pole, the said pressing the top of the pole to run through and extend out the surface of the installation block, two said push blocks connect fixedly to left and right sides of the rear side of horizontal pole separately, the said locating shaft connects fixedly to the inside of the cavity, two said straight poles connect in the surface of the locating shaft rotatably, one side that the said push block approaches the straight pole contacts with surface of the straight pole, one side that the said straight pole approaches the connecting pole is covered on the surface of the connecting pole, through setting up the regulating mechanism, can assemble the radiator and all around the chip, thus dispel the heat to it.

As the preferred embodiment of the utility model, the surface of the straight rod is provided with the extrusion hole, the straight rod is sleeved on the surface of the connecting column through the extrusion hole, and the surface of the connecting column can be extruded through the inner wall of the extrusion hole after the straight rod rotates around the positioning shaft through the extrusion hole, so that the connecting column is driven to move.

As the utility model is preferable, the transverse column is arranged in the cavity, both ends of the transverse column are fixedly connected with the inner wall of the cavity, the vertical block is slidably connected to the surface of the transverse column, and the transverse column is arranged to guide the movement of the vertical block, so that the vertical block is prevented from shifting during movement.

Preferably, the rear side of the cross bar is not contacted with the front side of the straight bar, and when the cross bar is not contacted with the straight bar, the cross bar can be prevented from being contacted with the straight bar during movement, so that the cross bar cannot move.

As the utility model is preferable, the number of the mounting frames is four, the mounting frames are respectively arranged around the chip, the number of the mounting blocks is the same as that of the mounting frames, and the mounting blocks are in one-to-one correspondence, and the radiator can be stably fixed at the top of the chip by arranging the four corresponding mounting blocks and the mounting frames, so that the radiator can radiate heat of the chip.

Compared with the prior art, the utility model has the following beneficial effects:

1. According to the utility model, through the matched use of the main board, the chip, the mounting frame, the radiator, the mounting block, the cavity, the positioning mechanism and the adjusting mechanism, when the radiator and the mounting frame are assembled, the adjusting mechanism is pressed, so that the positioning mechanism is driven to enter the cavity, and the assembly of the radiator can be completed at the moment, so that the problem that the installation of the radiator is influenced because the main case is narrow in space, the radiator is usually fixed by adopting screws when being installed, and the screws are relatively small when being installed.

2. According to the utility model, the radiator can be stably fixed on the top of the chip by arranging the four corresponding mounting blocks and the mounting frame, so that the radiator can radiate heat of the chip.

Drawings

FIG. 1 is a schematic diagram of a structure provided by an embodiment of the present utility model;

FIG. 2 is a partial enlarged view of FIG. 1 at A provided by an embodiment of the present utility model;

Fig. 3 is a schematic perspective view of a heat sink and a motherboard according to an embodiment of the present utility model;

Fig. 4 is a partial enlarged view of fig. 3 at B provided by an embodiment of the present utility model.

In the figure: 1. a main board; 2. a chip; 3. a mounting frame; 4. a heat sink; 5. a mounting block; 6. a cavity; 7. a positioning mechanism; 701. a pressure spring; 702. a vertical block; 703. positioning columns; 704. a connecting column; 8. an adjusting mechanism; 801. pressing a pressing rod; 802. a cross bar; 803. a pushing block; 804. positioning a shaft; 805. a straight rod; 9. a jack; 10. extruding the hole; 11. and a cross column.

Detailed Description

For a further understanding of the utility model, its features and advantages, reference is now made to the following examples, which are illustrated in the accompanying drawings.

The structure of the present utility model will be described in detail with reference to the accompanying drawings.

As shown in fig. 1 to 4, the chip heat dissipation device provided by the embodiment of the utility model comprises a main board 1, a chip 2, a mounting frame 3, a radiator 4 and a mounting block 5, wherein the chip 2 is arranged at the top of the main board 1, the mounting frame 3 is fixedly connected to the top of the main board 1, jacks 9 are respectively formed in the left side and the right side of the inner wall of the mounting frame 3, the radiator 4 is arranged at the top of the main board 1, the mounting block 5 is fixedly connected to the surface of the radiator 4, a cavity 6 is formed in the mounting block 5, a positioning mechanism 7 is arranged in the cavity 6, and an adjusting mechanism 8 matched with the positioning mechanism 7 is arranged in the cavity 6.

Referring to fig. 2 and 4, the positioning mechanism 7 includes two compression springs 701, two vertical blocks 702, two positioning columns 703 and two connecting columns 704, the two vertical blocks 702 are fixedly connected to two ends of the two compression springs 701, the positioning columns 703 are fixedly connected to one side of the vertical blocks 702 away from the compression springs 701, one side of the positioning columns 703 away from the vertical blocks 702 penetrates through and extends to the inside of the jack 9, the two connecting columns 704 are respectively fixedly connected to the front sides of the two vertical blocks 702, and the connecting columns 704 are matched with the adjusting mechanism 8.

The scheme is adopted: through setting up positioning mechanism 7, can be after radiator 4 assembles with mounting bracket 3, fix it through installation piece 5 to dispel the heat to chip 2 through radiator 4.

Referring to fig. 4, the adjusting mechanism 8 includes a pressing rod 801, a cross rod 802, two pushing blocks 803, a positioning shaft 804 and two straight rods 805, the pressing rod 801 is fixedly connected to the top of the cross rod 802, the top of the pressing rod 801 penetrates through and extends out of the surface of the mounting block 5, the two pushing blocks 803 are respectively fixedly connected to the left side and the right side of the rear side of the cross rod 802, the positioning shaft 804 is fixedly connected to the inside of the cavity 6, the two straight rods 805 are both rotatably connected to the surface of the positioning shaft 804, one side, close to the straight rods 805, of the pushing blocks 803 is in contact with the surface of the straight rods 805, and one side, close to the connecting column 704, of the straight rods 805 is sleeved on the surface of the connecting column 704.

The scheme is adopted: through setting up adjustment mechanism 8, can assemble radiator 4 and chip 2 all around mounting bracket 3 to it dispels the heat.

Referring to fig. 4, the surface of the straight rod 805 is provided with a pressing hole 10, and the straight rod 805 is sleeved on the surface of the connecting post 704 through the pressing hole 10.

The scheme is adopted: by providing the extrusion hole 10, after the straight rod 805 rotates around the positioning shaft 804, the surface of the connecting column 704 is extruded by the inner wall of the extrusion hole 10, so as to drive the connecting column 704 to move.

Referring to fig. 4, a cross column 11 is provided in the cavity 6, both ends of the cross column 11 are fixedly connected with the inner wall of the cavity 6, and a vertical block 702 is slidably connected to the surface of the cross column 11.

The scheme is adopted: by providing the cross posts 11, the movement of the vertical block 702 can be guided, and the vertical block 702 is prevented from being deviated during the movement.

Referring to fig. 4, the rear side of the rail 802 is not in contact with the front side of the straight bar 805.

The scheme is adopted: when the cross bar 802 is not in contact with the straight bar 805, the cross bar 802 can be prevented from contacting the straight bar 805 when moving, so that the cross bar 802 cannot move.

Referring to fig. 1 and 3, the number of the mounting frames 3 is four, and the mounting frames 3 are respectively arranged around the chip 2, and the number of the mounting blocks 5 is the same as that of the mounting frames 3 and corresponds to one.

The scheme is adopted: through setting up four corresponding installation pieces 5 and mounting bracket 3, can be with the stable top of fixing at chip 2 of radiator 4 to dispel the heat to chip 2 through radiator 4.

The working principle of the utility model is as follows:

When the radiator is used, the mounting block 5 on the surface of the radiator 4 and the mounting frame 3 on the top of the main board 1 are assembled after alignment, then the pressing rod 801 is pressed, the pressing rod 801 drives the cross rod 802 and the two pushing blocks 803 to move downwards when moving, the pushing blocks 803 squeeze the surface of the straight rod 805 when moving, so that the two straight rods 805 move around the positioning shaft 804 to the side far away from the mounting frame 3, the two straight rods 805 squeeze the surface of the connecting column 704 through the inner wall of the squeezing hole 10 when moving, thereby driving the two connecting columns 704 to move to the side far away from the mounting frame 3, the two connecting columns 704 drive the two vertical blocks 702 to move to the side close to each other when moving, the two vertical blocks 702 drive the two positioning columns 703 to move to the side close to each other when moving, the two compression springs 701 compress when moving, after the positioning columns 703 enter the inside of the cavity 6, the assembly of the radiator 4 is completed, then the pressing rods 801 are pulled in the opposite direction, and the fixing of the radiator 4 is completed after the positioning columns 703 penetrate through the jack 9.

To sum up: this chip heat abstractor, through setting up mainboard 1, chip 2, mounting bracket 3, radiator 4, installation piece 5, cavity 6, positioning mechanism 7, pressure spring 701, erect piece 702, reference column 703, spliced pole 704, adjustment mechanism 8, press the pole 801, horizontal pole 802, promote the piece 803, the locating shaft 804, straight-bar 805, jack 9, extrusion hole 10 and the cooperation of horizontal pole 11 is used, solved because the space of mainframe box is narrow and small, generally adopt the screw to fix it when installing heat abstractor, and because the screw is less, it is comparatively inconvenient when carrying out the installation, thereby influence the problem to heat abstractor's installation.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a chip heat abstractor, includes mainboard (1), chip (2), mounting bracket (3), radiator (4) and installation piece (5), its characterized in that: chip (2) set up in the top of mainboard (1), the top of mounting bracket (3) fixed connection in mainboard (1), jack (9) have all been seted up to the left and right sides of mounting bracket (3) inner wall, radiator (4) set up in the top of mainboard (1), install piece (5) fixed connection in the surface of radiator (4), cavity (6) have been seted up to the inside of installing piece (5), the inside of cavity (6) is provided with positioning mechanism (7), the inside of cavity (6) is provided with adjustment mechanism (8) that use with positioning mechanism (7) cooperation.

2. A chip heat sink as defined in claim 1, wherein: positioning mechanism (7) include two pressure springs (701), two perpendicular piece (702), two reference column (703) and two spliced pole (704), two perpendicular piece (702) all fixed connection is in the both ends of two pressure springs (701), reference column (703) fixed connection is in perpendicular piece (702) one side of keeping away from pressure spring (701), one side of keeping away from perpendicular piece (702) of reference column (703) runs through and extends to the inside of jack (9), two spliced pole (704) are fixed connection respectively in the front side of two perpendicular piece (702), spliced pole (704) are used with adjustment mechanism (8) cooperation.

3. A chip heat sink as defined in claim 2, wherein: adjustment mechanism (8) are including pressing pole (801), horizontal pole (802), two promote piece (803), location axle (804) and two straight-bars (805), press the top of pole (801) fixed connection in horizontal pole (802), press the top of pole (801) to run through and extend the surface of installation piece (5), two promote piece (803) respectively fixed connection in the left and right sides of horizontal pole (802) rear side, location axle (804) fixed connection is in the inside of cavity (6), two all rotate connection in the surface of location axle (804) straight-bars (805), one side that promotes piece (803) to be close to straight-bars (805) and the surface contact of straight-bars (805), one side cover that straight-bars (805) are close to spliced pole (704) is located the surface of spliced pole (704).

4. A chip heat sink as claimed in claim 3, wherein: the surface of the straight rod (805) is provided with an extrusion hole (10), and the straight rod (805) is sleeved on the surface of the connecting column (704) through the extrusion hole (10).

5. A chip heat sink as defined in claim 2, wherein: the inside of cavity (6) is provided with diaphragm (11), the both ends of diaphragm (11) all with the inner wall fixed connection of cavity (6), perpendicular piece (702) sliding connection is in the surface of diaphragm (11).

6. A chip heat sink as claimed in claim 3, wherein: the rear side of the cross bar (802) is not in contact with the front side of the straight bar (805).

7. A chip heat sink as defined in claim 1, wherein: the number of the mounting frames (3) is four, the mounting frames are respectively arranged around the chip (2), and the mounting blocks (5) are the same as the number of the mounting frames (3) and correspond to each other one by one.