CN220710295U - Silicon wafer clamping mechanism and wafer inserting machine system - Google Patents

Abstract

The utility model discloses a silicon wafer clamping mechanism and an inserting machine system, wherein the silicon wafer clamping mechanism is used for the inserting machine system and comprises the following components: the silicon wafer processing device comprises a frame body, wherein an accommodating groove is formed in the frame body, and a plurality of silicon wafers to be processed are suitable for being stacked in the accommodating groove along the length direction of the accommodating groove; the clamping assembly is arranged on the frame body and comprises a plurality of clamping pieces which are arranged along the length direction of the accommodating groove, the clamping pieces are movably arranged on the frame body, and the clamping pieces are used for clamping a plurality of silicon wafers to be processed which are positioned in the accommodating groove. According to the silicon wafer clamping mechanism, the silicon wafers to be processed can be reliably fixed, the integrated movement of a plurality of silicon wafers to be processed is facilitated, the labor cost is reduced, and the production efficiency is improved.

Description

Silicon wafer clamping mechanism and wafer inserting machine system

Technical Field

The utility model relates to the technical field of crystal manufacturing, in particular to a silicon wafer clamping mechanism and an inserting machine system.

Background

In the related art, a plurality of silicon wafers to be processed need to be carried and placed for many times by manpower, and the silicon wafers to be processed are easy to incline and extrude each other when stacked, so that the problems of cracking or hidden cracking of the silicon wafers to be processed are caused, and the production cost is increased.

Disclosure of Invention

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, an object of the present utility model is to provide a silicon wafer clamping mechanism, which can ensure the fixing reliability of the silicon wafer to be processed, and facilitate the overall movement of a plurality of silicon wafers to be processed, thereby being beneficial to reducing the labor cost and improving the production efficiency.

Another object of the present utility model is to provide an wafer insertion machine system having the above silicon wafer clamping mechanism.

According to an embodiment of the utility model, the silicon wafer clamping mechanism is used for an inserting machine system and comprises: the silicon wafer processing device comprises a frame body, wherein a containing groove is formed in the frame body, and a plurality of silicon wafers to be processed are suitable for being stacked in the containing groove along the length direction of the containing groove; the clamping assembly is arranged on the frame body and comprises a plurality of clamping pieces which are arranged along the length direction of the accommodating groove, the clamping pieces are movably arranged on the frame body, and the clamping pieces are used for clamping a plurality of silicon wafers to be processed and located in the accommodating groove.

According to the silicon wafer clamping mechanism provided by the embodiment of the utility model, the plurality of silicon wafers to be processed are stacked in the accommodating groove along the length direction of the accommodating groove of the frame body, and the plurality of clamping pieces are movably arranged on the frame body and used for clamping the plurality of silicon wafers to be processed in the accommodating groove, so that the plurality of clamping pieces can fix the plurality of silicon wafers to be processed, the silicon wafers to be processed are prevented from being placed and inclined, the silicon wafers to be processed are ensured to be fixed and reliable during processing, the silicon wafers to be processed can be respectively clamped and released, the problems of damage and the like caused by the mutual inclination of the simultaneous release of the plurality of silicon wafers to be processed are avoided, the silicon wafers to be processed are conveniently processed sequentially, the whole movement of the plurality of silicon wafers to be processed can be realized, the movement of the silicon wafers to be processed is more convenient, the labor cost is reduced, and the production efficiency is improved.

In addition, the silicon wafer clamping mechanism according to the above embodiment of the present utility model may further have the following additional technical features:

according to some embodiments of the utility model, one end of each clamping piece is rotatably connected with the frame body, and each clamping piece is switched between a first position, in which the other end of the clamping piece is suitable for being abutted against the silicon wafer to be processed, and a second position, in which the other end of the clamping piece is spaced from the silicon wafer to be processed.

According to some embodiments of the utility model, a flexible member is provided between each of the clamping members and the silicon wafer to be processed.

According to some embodiments of the utility model, the clamping assemblies are two, and the two clamping assemblies are respectively arranged at two sides of the width direction of the accommodating groove.

According to some embodiments of the utility model, in the degumming process, the silicon wafer to be processed is provided with a wafer support, and the frame body comprises: the accommodating groove is formed in the first frame body; the second frame body is covered on the first frame body, and when a plurality of silicon wafers to be processed are positioned in the accommodating groove, the wafer support is supported on the second frame body.

According to some embodiments of the utility model, a supporting table for supporting a plurality of silicon wafers to be processed is arranged on the bottom wall of the accommodating groove, and the supporting table extends along the length direction of the accommodating groove.

The wafer inserting machine system comprises the silicon wafer clamping mechanism.

According to the wafer inserting machine system provided by the embodiment of the utility model, the plurality of wafers to be processed are stacked in the accommodating groove along the length direction of the accommodating groove of the frame body, and the plurality of clamping pieces are movably arranged on the frame body and used for clamping the plurality of wafers to be processed in the accommodating groove, so that the plurality of clamping pieces can fix the plurality of wafers to be processed, the wafers to be processed are prevented from being placed and inclined, the wafers to be processed are ensured to be fixed and reliable during processing, the wafers to be processed can be respectively clamped and released, the problems of damage and the like caused by the mutual inclination of the simultaneous release of the plurality of wafers to be processed are avoided, the wafers to be processed are conveniently processed sequentially, the whole movement of the wafers to be processed can be realized, the movement of the wafers to be processed is more convenient, the labor cost is reduced, and the production efficiency is improved.

According to some embodiments of the utility model, a tab machine system includes: the wafer inserting machine comprises a box body and a transmission device, wherein the transmission device is arranged on one side of the box body and used for driving the silicon wafer clamping mechanism to move.

According to some embodiments of the utility model, the transmission comprises: the connecting part is connected with one side of the box body, a sliding rail and a rack are arranged on one side of the connecting part, which is far away from the box body, and the sliding rail and the rack are arranged at intervals along the width direction of the connecting part and extend along the length direction of the connecting part; the fixing plate is slidably arranged on the sliding rail, and a fixing bracket for placing the silicon wafer clamping mechanism is arranged on the fixing plate; the driving piece comprises a gear and a motor, the motor is connected with the fixed plate, the motor is connected with the gear, and the gear is meshed with the rack to be used for driving the fixed plate to move.

According to some embodiments of the utility model, the tab machine system further comprises: and the movable trolley is used for transferring the silicon wafer clamping mechanism.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

The foregoing and/or additional aspects and advantages of the utility model will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

FIG. 1 is a schematic view of a first frame of a silicon wafer clamping mechanism in cooperation with a mobile cart according to an embodiment of the present utility model;

FIG. 2 is a schematic structural view of a wafer clamping mechanism according to an embodiment of the present utility model;

FIG. 3 is an enlarged schematic view of the structure of FIG. 2 at circle A;

FIG. 4 is a schematic diagram of a mobile cart of the tab machine system according to an embodiment of the utility model;

FIG. 5 is a schematic diagram of the transmission of the tab machine system in accordance with an embodiment of the utility model.

Reference numerals:

100. a silicon wafer clamping mechanism;

10. a frame; 11. a receiving groove; 12. a support table; 13. a handle; 14. a positioning piece; 15. a positioning groove; 16. a support part; 101. a first frame; 102. a second frame;

20. a clamping assembly; 21. a clamping member; 22. a support plate; 211. a mounting cavity; 212. a through hole;

30. a transmission device; 31. a connection part; 32. a fixing plate; 33. a driving member; 311. a slide rail; 312. a rack; 331. a gear; 332. a motor;

40. moving the cart; 41. and a limiting part.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

In the description of the utility model, "a first feature" may include one or more such features, and "a plurality" may mean two or more, and that a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, or may include both the first and second features not being in direct contact but being in contact with each other through additional features therebetween, with the first feature "above", "over" and "above" the second feature including both the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature.

A wafer clamping mechanism 100 according to an embodiment of the present utility model is described below with reference to the accompanying drawings.

Referring to fig. 1-4, a wafer clamping mechanism 100 according to an embodiment of the present utility model is used in an wafer insertion machine system, and the wafer clamping mechanism 100 may include: a frame 10 and a clamping assembly 20.

Specifically, the housing 10 is provided with a receiving groove 11, and a plurality of (greater than or equal to two) silicon wafers to be processed can be stacked in the receiving groove 11 along the length direction (for example, the front-rear direction shown in fig. 2) of the receiving groove 11, so that the plurality of silicon wafers to be processed can be placed through the receiving groove 11, and the placing requirement of the plurality of silicon wafers to be processed on the silicon wafer clamping mechanism 100 is realized.

In addition, as shown in fig. 1 to 3, the clamping assembly 20 is disposed on the frame 10, the clamping assembly 20 includes a plurality of (two or more) clamping members 21, the plurality of clamping members 21 are arranged along the length direction of the accommodating groove 11, the plurality of clamping members 21 are movably disposed on the frame 10, and the plurality of clamping members 21 are used for clamping a plurality of wafers to be processed in the accommodating groove 11. From this, can fix a plurality of silicon chips that wait to process through a plurality of clamping pieces 21, ensure that a plurality of silicon chips that wait to process are fixed reliably on silicon chip clamping mechanism 100, avoid waiting to process the silicon chip slope, thereby ensure that the silicon chip that wait to process is fixed reliably when processing, for example, silicon chip clamping mechanism 100 can realize waiting to process the fixed of silicon chip in the process of degumming or inserted sheet process, and can realize the integrated movement of a plurality of silicon chips that wait to process through moving silicon chip clamping mechanism 100, it is more convenient to make waiting to process the silicon chip removal, be favorable to reducing the cost of labor, improve production efficiency.

Meanwhile, the clamping and releasing of the silicon wafers to be processed can be realized through the clamping pieces 21, the problems that the silicon wafers to be processed are simultaneously released to incline mutually to cause damage and the like are avoided, the silicon wafers to be processed are prevented from being damaged, the silicon wafers to be processed are convenient to process sequentially, and the production efficiency is improved.

It can be appreciated that the plurality of clamping members 21 can be in one-to-one correspondence with the plurality of silicon wafers to be processed, or each clamping member 21 can be in correspondence with the plurality of silicon wafers to be processed, or each silicon wafer to be processed can be in correspondence with the plurality of clamping members 21, so that the fixing reliability of the silicon wafers to be processed can be ensured, and the required fixing requirement can be met.

For convenience of description, the directions of the present utility model, such as the front-back direction and the left-right direction, are based on the azimuth relationship shown in the drawings, and are not limited to the directions in the practical application process.

According to the silicon wafer clamping mechanism 100 provided by the embodiment of the utility model, the plurality of silicon wafers to be processed are stacked in the accommodating groove 11 along the length direction of the accommodating groove 11 of the frame body 10, and the plurality of clamping pieces 21 are movably arranged on the frame body 10 and used for clamping the plurality of silicon wafers to be processed in the accommodating groove 11, so that the plurality of clamping pieces 21 can fix the plurality of silicon wafers to be processed, the silicon wafers to be processed are prevented from being placed and inclined, the silicon wafers to be processed are ensured to be fixed and reliable during processing, the silicon wafers to be processed can be respectively clamped and released, the problems of damage and the like caused by the mutual inclination of the simultaneous release of the plurality of silicon wafers to be processed are avoided, the silicon wafers to be processed are conveniently processed sequentially, and meanwhile, the integral movement of the plurality of silicon wafers to be processed is realized, the movement of the silicon wafers to be processed is more convenient, the labor cost is reduced, and the production efficiency is improved.

In some embodiments of the present utility model, as shown in fig. 1-3, one end of each clamping member 21 is rotatably connected with the frame 10, and each clamping member 21 is switched between a first position and a second position to meet different use requirements.

When the clamping piece 21 is in the first position, the other end of the clamping piece 21 can prop against the silicon wafer to be processed, so that the clamping piece 21 can fix the silicon wafer to be processed, the silicon wafer to be processed is ensured to be fixed reliably, and the silicon wafer to be processed is prevented from moving in the silicon wafer clamping mechanism 100; when the clamping piece 21 is in the second position, the other end of the clamping piece 21 is arranged at an interval with the silicon wafer to be processed, so that the silicon wafer to be processed is released conveniently, and the silicon wafer to be processed can be processed later, for example, an inserting process is performed on the silicon wafer to be processed.

Meanwhile, the clamping piece 21 can be rotatably switched between the first position and the second position, so that the clamping piece 21 can avoid the silicon wafer to be processed, the silicon wafer to be processed is conveniently placed in the accommodating groove 11 from the upper part, interference between the clamping piece 21 and the silicon wafer to be processed is avoided, the silicon wafer to be processed is more conveniently placed, and production efficiency is improved.

In some embodiments, as shown in fig. 3, the clamping assembly 20 further includes a support plate 22, where the support plate 22 is connected to the frame 10, and the support plate 22 is located below the plurality of clamping members 21, and the plurality of clamping members 21 can be supported by the support plate 22, so as to avoid the problem that the clamping members 21 rotate downwards, and ensure that the clamping members 21 fix the silicon wafer to be processed reliably. In addition, when the clamping piece 21 is in the first position, one side of the supporting plate 22, which faces the silicon wafer to be processed, is inwards contracted to one side of the clamping piece 21, which faces the silicon wafer to be processed, so that the supporting plate 22 can avoid the silicon wafer to be processed, and when the clamping piece 21 is in the second position, the silicon wafer to be processed is conveniently placed in the accommodating groove 11 from the upper part, and interference between the supporting plate 22 and the silicon wafer to be processed is avoided, so that the silicon wafer to be processed is more convenient to place.

According to some embodiments of the utility model, a flexible piece is arranged between each clamping piece 21 and the silicon wafer to be processed, so that the clamping pieces 21 can be contacted with the silicon wafer to clamp the silicon wafer, the silicon wafer to be processed can be prevented from being scratched by the flexible pieces, the silicon wafer to be processed is reliably protected, and the production qualification rate of the silicon wafer is ensured. For example, the flexible member may be a sponge or the like.

In some embodiments, as shown in fig. 3, the mounting cavity 211 is formed on the clamping member 21, the flexible member can be arranged in the mounting cavity 211, so that the flexible member is placed conveniently, the through hole 212 is formed on the clamping member 21, the through hole 212 is communicated with the mounting cavity 211, the fastener can fix the flexible member through the through hole 212, the flexible member is ensured to be fixed and reliable on the clamping member 21, the flexible member is prevented from moving, and the clamping and protection reliability of the silicon wafer to be processed are ensured.

In some embodiments of the present utility model, as shown in fig. 1 and 2, there may be two clamping assemblies 20, and the two clamping assemblies 20 are respectively disposed on two sides of the width direction (for example, the left-right direction in fig. 1) of the accommodating groove 11, so that the two sides of the silicon wafer to be processed can be fixed by the two clamping assemblies 20, and the fixing reliability of the silicon wafer to be processed is ensured.

According to some embodiments of the utility model, a wafer support is provided on the silicon wafer to be processed during the degumming process.

In the production process of the silicon wafer, the single crystal is stuck on the wafer support, and then the single crystal is cut into the silicon wafer to be processed through the wire cutting machine, so that the silicon wafer to be processed after wire cutting needs to be degummed in order to realize automatic degumping of the silicon wafer to be processed, for example, the wafer support and the silicon wafer to be processed on the wafer support are conveyed into the degumping machine to be degummed, and the silicon wafer to be processed is separated from the wafer support.

In the related art, the wafer to be processed separated after degumming falls into the degumming tank by carrying the wafer support to the degumming machine for degumming, the wafer to be processed is easy to fall down to cause damage, and the wafer to be processed which falls off in the degumming machine needs to be taken out manually, so that the production cost is increased.

Therefore, in the present utility model, as shown in fig. 2, the frame 10 includes a first frame 101 and a second frame 102, the accommodating groove 11 is disposed on the first frame 101, the second frame 102 is covered on the first frame 101, when a plurality of wafers to be processed are located in the accommodating groove 11, the wafer support is supported on the second frame 102, so that the clamping assembly 20 can clamp the wafers to be processed, ensuring that the wafers to be processed are reliably fixed in the accommodating groove 11, and the second cover can support the wafer support, so that the wafer support is conveniently fixed on the wafer clamping mechanism 100. When degumming is carried out, the silicon wafer to be processed after degumming is clamped by the clamping piece 21, so that falling silicon wafer to be processed is prevented from toppling over, and further the silicon wafer to be processed is prevented from being mutually extruded and cracked; and in the process of carrying out the subsequent transport of the silicon wafer to be processed, the silicon wafer to be processed is positioned in the accommodating groove 11 and is clamped all the time, so that the silicon wafer to be processed is effectively prevented from being cracked in the transport process, the movement of the silicon wafer to be processed is not needed for a plurality of times, the production efficiency is improved, and the production cost is reduced.

In some embodiments, the wafer to be processed is subjected to an insert process after the wafer to be processed is subjected to a degumming process. When the silicon wafer to be processed carries out the inserting process, the wafer support and the second frame 102 are only required to be taken down from the first frame 101, the first frame 101 and the silicon wafer to be processed are integrally placed in the inserting machine for inserting the wafers, and the silicon wafers to be processed do not need to be independently moved and placed, so that the processing efficiency is improved.

In the utility model, the degumming machine and the inserting machine are the degumming equipment and the inserting equipment commonly used in the prior art, and specific structures of the degumming machine and the inserting machine are not repeated here.

In some embodiments, as shown in fig. 1 and fig. 2, handles 13 are disposed on the first frame 101 and the second frame 102, and the handles 13 facilitate moving the first frame 101 and the second frame 102, which is beneficial to improving the working efficiency.

In some embodiments, as shown in fig. 1 and fig. 2, the number of handles 13 on the first frame 101 may be multiple, where the multiple handles 13 are disposed at intervals along the circumferential direction of the first frame 101, and the stress on the first frame 101 can be more uniform through the multiple handles 13, so that the movement of the first frame 101 is reliable, and the movement stability of the first frame 101 is ensured.

In the embodiment of the present utility model, the number of the handles 13 on the first frame 101 may be flexibly set according to practical situations, for example, four handles 13 on the first frame 101 may be shown in fig. 2, or two, three, five, six or more handles may be used, which is within the scope of the present utility model.

In some embodiments, as shown in fig. 1 and fig. 2, the number of handles 13 on the second frame 102 may be multiple, where the multiple handles 13 are disposed at intervals along the circumferential direction of the second frame 102, and the stress on the second frame 102 can be more uniform through the multiple handles 13, so that the movement of the second frame 102 is reliable, and the movement stability of the second frame 102 is ensured.

In the embodiment of the present utility model, the number of the handles 13 on the second frame 102 may be flexibly set according to practical situations, for example, four handles 13 on the second frame 102 may be shown in fig. 2, or two, three, five, six or more handles may be used, which is within the scope of the present utility model.

In some examples, as shown in fig. 1 and fig. 2, the first frame 101 is provided with a positioning member 14, and the second frame 102 is provided with a positioning slot 15, so that the first frame 101 and the second frame 102 can be installed and positioned by matching the positioning member 14 with the positioning slot 15, which is beneficial to reducing difficulty of positioning matching of the first frame 101 and the second frame 102, and when the first frame 101 and the second frame 102 are assembled, quick positioning and installation of the first frame 101 and the second frame 102 are realized by means of the positioning member 14 and the positioning slot 15, which is beneficial to improving assembly efficiency.

Of course, the setting position of the positioning element 14 may also be set on the second frame 102, and the first frame 101 is provided with a positioning slot 15 matched with the positioning element 14, which is also within the protection scope of the present utility model.

In some embodiments, as shown in fig. 2, a support rod is disposed on the crystal support, and the second frame 102 is provided with a support portion 16, where the support rod can be supported on the support portion 16, so as to ensure that the second frame 102 supports the crystal support reliably, avoid the crystal support from moving on the second frame 102, and ensure the reliability of the degumming process.

In some embodiments, as shown in fig. 2, the support rods are multiple, the multiple support rods are arranged at intervals along the length direction of the crystal support, the support portions 16 are multiple corresponding to the support rods one by one, and the support to the support rods can be reliable through the matching of the multiple support rods and the multiple support portions 16 one by one, so that the placement stability of the crystal support on the second frame 102 is ensured.

In the embodiment of the present utility model, the number of the supporting parts 16 may be flexibly set according to the actual situation, for example, the number of the supporting parts 16 may be four as shown in fig. 2, or may be two, three, five, six or more, which is within the scope of the present utility model.

In some embodiments of the present utility model, as shown in fig. 1 and fig. 2, a supporting table 12 is disposed on a bottom wall of the accommodating groove 11, the supporting table 12 is used for supporting a plurality of silicon wafers to be processed, the supporting table 12 extends along a length direction of the accommodating groove 11, and the supporting table 12 ensures that the plurality of silicon wafers to be processed are reliably supported, so that a better supporting effect can be achieved, and the silicon wafers to be processed are reliably fixed in the accommodating groove 11.

In some embodiments, as shown in fig. 1 and fig. 2, the number of support tables 12 may be plural, and the plurality of support tables 12 are disposed at intervals along the width direction of the accommodating groove 11, so that the support of the silicon wafer to be processed can be ensured to be reliable and stable by the plurality of support tables 12, and the problem that the silicon wafer to be processed is inclined to cause damage and the like is avoided.

In the embodiment of the present utility model, the number of the support tables 12 may be flexibly set according to the actual situation, for example, two support tables 12 may be shown in fig. 2, or three, four, five, six or more support tables may be used, which is within the scope of the present utility model.

In some embodiments, during the degumming procedure, the silicon wafer to be processed and the crystal support are placed on the silicon wafer clamping mechanism 100, and the silicon wafer to be processed is adhered to the crystal support, so that the lower part of the silicon wafer to be processed is arranged at intervals with the supporting table 12, and during degumming, the silicon wafer to be processed is separated from the crystal support, so that the silicon wafer to be processed moves downwards, the supporting table 12 can support the silicon wafer to be processed, the clamping piece 21 can clamp the silicon wafer to be processed, the falling silicon wafer to be processed is prevented from falling, and the reliability of the silicon wafer to be processed in the silicon wafer clamping mechanism 100 is ensured.

The wafer cassette system according to an embodiment of the present utility model includes a wafer clamping mechanism 100 according to an embodiment of the present utility model. Because the silicon wafer clamping mechanism 100 according to the embodiment of the utility model has the beneficial technical effects, according to the wafer inserting machine system of the embodiment of the utility model, the plurality of silicon wafers to be processed are stacked in the accommodating groove 11 along the length direction of the accommodating groove 11 of the frame 10, and the plurality of clamping pieces 21 are movably arranged on the frame 10 and used for clamping the plurality of silicon wafers to be processed in the accommodating groove 11, so that the plurality of clamping pieces 21 can fix the plurality of silicon wafers to be processed, the placing of the silicon wafers to be processed is prevented from tilting, the fixation reliability of the silicon wafers to be processed during processing is ensured, the respective clamping and releasing of the plurality of silicon wafers to be processed can be realized, the problem that the silicon wafers to be processed are damaged due to the mutual tilting caused by the simultaneous releasing of the plurality of the silicon wafers to be processed is avoided, the processing of the plurality of silicon wafers to be processed is facilitated, and the whole movement of the plurality of the silicon wafers to be processed can be realized simultaneously, the movement of the silicon wafers to be processed is more convenient, the labor cost is reduced, and the production efficiency is improved.

In some embodiments of the present utility model, the wafer inserting machine system includes a wafer inserting machine, the wafer inserting machine includes a box and a transmission device 30, the transmission device 30 is disposed on one side of the box, and the transmission device 30 is used for driving the silicon wafer clamping mechanism 100 to move, so that the silicon wafer clamping mechanism 100 moves more reliably, the wafer inserting machine is convenient for inserting wafers to be processed subsequently, the automatic production is facilitated, and the work efficiency is improved.

In some embodiments, the two boxes and the two transmission devices 30 may be arranged at intervals in the width direction, the two transmission devices 30 are respectively located at one sides of the two boxes far away from each other, the two transmission devices 30 extend along the length direction of the boxes, the two silicon wafer clamping mechanisms 100 can be moved simultaneously through the two boxes and the two transmission devices 30, the processing efficiency is improved, the two transmission devices 30 are respectively located at one sides of the two boxes far away from each other, the transmission devices 30 are convenient to perform fault maintenance or maintenance, and the like, and the maintenance efficiency is improved.

In some embodiments, the silicon wafer clamping mechanism 100 can realize the placement of all silicon wafers to be processed, which are cut into the silicon wafers to be processed, on a single crystal, compared with a tool for placing only one third of the single crystals in the related art, the silicon wafer to be processed is convenient to process, the frequency of manual loading is reduced, the edge breakage index is reduced, the yield is improved, meanwhile, the labor intensity is reduced, and the work efficiency is improved. For example, the size of the cassette may be 2500mm by 480mm, which can meet the placement requirements of the wafer clamping mechanism 100 on the cassette.

According to some embodiments of the present utility model, as shown in fig. 5, the transmission device 30 includes a connection portion 31, and the connection portion 31 is connected to one side of the case, so that connection requirements of the transmission device 30 and the case can be achieved.

Further, as shown in fig. 5, the transmission device 30 includes a fixing plate 32 and a driving member 33, a side of the connection portion 31 away from the case is provided with a slide rail 311 and a rack 312, the slide rail 311 and the rack 312 are disposed at intervals in a width direction of the connection portion 31, and the slide rail 311 and the rack 312 extend in a length direction (for example, a front-rear direction shown in fig. 5) of the connection portion 31. The fixed plate 32 is slidably arranged on the sliding rail 311, and a fixed bracket is arranged on the fixed plate 32 and is used for placing the silicon wafer clamping mechanism 100, so that the placing requirement of the silicon wafer clamping mechanism 100 on the transmission device 30 can be met. The driving member 33 includes a gear 331 and a motor 332, the motor 332 is connected to the fixing plate 32, the motor 332 is connected to the gear 331, and the gear 331 is engaged with the rack 312.

Therefore, when the motor 332 works, the motor 332 can drive the gear 331 to rotate, the gear 331 is meshed with the rack 312 to drive the gear 331 to move on the rack 312, the gear 331 can drive the motor 332 connected with the gear 331 to move, the motor 332 can drive the fixing plate 32 connected with the motor 332 to move along the length direction of the connecting part 31, and the fixing plate 32 can drive the silicon wafer clamping mechanism 100 to move through the fixing support, so that the moving requirement of the silicon wafer clamping mechanism 100 is met, the required inserting sheet requirement is met, the transmission device 30 is simple in structure and convenient to process and manufacture. Meanwhile, compared with the prior art that the silicon wafer to be processed is driven by adopting screw rod transmission, the transmission device 30 disclosed by the utility model realizes the movement of the silicon wafer clamping mechanism 100 through the meshing of the gear 331 and the rack 312, can provide the movement requirement required by the silicon wafer clamping mechanism 100, has high transmission efficiency and better transmission precision, and ensures reliable work. For example, by adjusting the incremental amount of the motor 332, different movement distances of the wafer clamping mechanism 100 can be achieved to meet different use requirements.

In some embodiments of the present utility model, as shown in fig. 1 and 4, the wafer inserting machine system further includes a moving cart 40, where the moving cart 40 is used for transferring the silicon wafer clamping mechanism 100, and the moving cart 40 is used for transferring the silicon wafer clamping mechanism 100, so that the movement of the silicon wafer clamping mechanism 100 is more convenient, and the improvement of the processing efficiency is facilitated.

In some embodiments, as shown in fig. 1 and 4, the moving cart 40 is provided with a plurality of limiting portions 41, the plurality of limiting portions 41 are disposed at intervals in a length direction (for example, a front-rear direction shown in fig. 1) of the moving cart 40, the plurality of limiting portions 41 are disposed at intervals in a width direction (for example, a left-right direction shown in fig. 1) of the moving cart 40, and the position of the silicon wafer clamping mechanism 100 on the moving cart 40 can be limited by the limiting portions 41, that is, the plurality of limiting portions 41 can limit the length direction and the width direction of the silicon wafer clamping mechanism 100, so that the silicon wafer clamping mechanism 100 is prevented from moving on the moving cart 40, and the moving reliability is ensured.

In the embodiment of the present utility model, the number of the limiting parts 41 may be flexibly set according to actual situations, for example, the number of the limiting parts 41 may be eight as shown in fig. 4, or may be two, three, four, five, six, seven, nine or more, which is within the scope of the present utility model.

In some embodiments, the wafer insertion machine system includes a manipulator that can be used to grasp the silicon wafer clamping mechanism 100, and the manipulator is used to facilitate placement of the silicon wafer clamping mechanism 100 on the mobile cart 40 or removal from the mobile cart 40, avoiding manual handling, reducing the manual labor intensity, and improving the production efficiency.

Other configurations and operations of wafer clamping mechanisms 100 and wafer insertion machine systems according to embodiments of the present utility model are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the description herein, reference to the terms "embodiment," "specific embodiment," "example," and the like, means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present utility model have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the utility model, the scope of which is defined by the claims and their equivalents.

Claims (10)

1. A silicon wafer clamping mechanism for use in an wafer insertion machine system, the silicon wafer clamping mechanism comprising:

the silicon wafer processing device comprises a frame body, wherein a containing groove is formed in the frame body, and a plurality of silicon wafers to be processed are suitable for being stacked in the containing groove along the length direction of the containing groove;

the clamping assembly is arranged on the frame body and comprises a plurality of clamping pieces which are arranged along the length direction of the accommodating groove, the clamping pieces are movably arranged on the frame body, and the clamping pieces are used for clamping a plurality of silicon wafers to be processed and located in the accommodating groove.

2. A wafer clamping mechanism according to claim 1 wherein one end of each of said clamping members is rotatably connected to said frame and each of said clamping members is switchable between a first position in which the other end of said clamping member is adapted to bear against said wafer to be processed and a second position in which the other end of said clamping member is spaced from said wafer to be processed.

3. A wafer clamping mechanism according to claim 1 wherein a flexible member is provided between each of said clamping members and said wafer to be processed.

4. The wafer clamping mechanism as set forth in claim 1 wherein there are two of said clamping assemblies, said two clamping assemblies being disposed on either side of said receiving slot in a width direction thereof.

5. The wafer clamping mechanism of claim 1 wherein, during the de-bonding process, the wafer to be processed is provided with a wafer support, and the frame comprises:

the accommodating groove is formed in the first frame body;

the second frame body is covered on the first frame body, and when a plurality of silicon wafers to be processed are positioned in the accommodating groove, the wafer support is supported on the second frame body.

6. The wafer clamping mechanism of claim 1 wherein a support table for supporting a plurality of said wafers to be processed is provided on a bottom wall of said receiving slot, said support table extending along a length of said receiving slot.

7. An wafer handling machine system comprising a silicon wafer clamping mechanism according to any one of claims 1-6.

8. The tab machine system of claim 7, comprising:

the wafer inserting machine comprises a box body and a transmission device, wherein the transmission device is arranged on one side of the box body and used for driving the silicon wafer clamping mechanism to move.

9. The tab machine system of claim 8, wherein the transmission comprises:

the connecting part is connected with one side of the box body, a sliding rail and a rack are arranged on one side of the connecting part, which is far away from the box body, and the sliding rail and the rack are arranged at intervals along the width direction of the connecting part and extend along the length direction of the connecting part;

the fixing plate is slidably arranged on the sliding rail, and a fixing bracket for placing the silicon wafer clamping mechanism is arranged on the fixing plate;

the driving piece comprises a gear and a motor, the motor is connected with the fixed plate, the motor is connected with the gear, and the gear is meshed with the rack to be used for driving the fixed plate to move.

10. The tab machine system of claim 7, further comprising:

and the movable trolley is used for transferring the silicon wafer clamping mechanism.