CN220627008U - Immersed liquid cooling host - Google Patents

Abstract

The utility model discloses an immersed liquid cooling host machine, which is applicable to the technical field of liquid cooling and is used for improving the heat dissipation efficiency of the host machine. The immersed liquid cooling host comprises a case and a main board, wherein a first cavity, a cooling pipeline and a cooler are arranged in the case, cooling liquid is filled in the first cavity, and the cooling pipeline is communicated with the first cavity and the cooler; the main board is arranged in the first cavity and is wholly immersed in the cooling liquid. This scheme has designed the inside of submergence formula liquid cooling host computer, opens up the space that is used for placing cooler, cooling pipeline and first cavity to make these three parts constitute the liquid cooling loop in the host computer, so, the accessible is directly placed the mainboard in first cavity, makes whole mainboard submergence in the coolant liquid, and then makes the subassembly in the mainboard can directly carry out heat exchange with the coolant liquid for the radiating efficiency of mainboard, maintains the normal operating of host computer.

Description

Immersed liquid cooling host

Technical Field

The utility model relates to the technical field of liquid cooling, in particular to an immersed liquid cooling host.

Background

With the update iteration of the computer, the computing power of the graphics processor (graphics processing unit, GPU) and the central processing unit (central processing unit, CPU) for implementing the software function is gradually increased, and the high-power CPU and GPU generate great heat during operation, so that the chassis of the personal computer (personal computer, PC) is also in a high-heat state for a long time, especially in a high-heat state when running a large game, and effective cooling is required.

At present, some schemes adopt an air cooling mode to dissipate heat of the PC case. However, such air-cooled heat-dissipating PC chassis generally have the following drawbacks:

(1) When large software is operated, a large amount of CPU and GPU resources are consumed by sudden operation, so that the temperature in the case is instantaneously and greatly increased, the speed of air cooling and heat dissipation is not ideal, the case cannot be cooled rapidly, and the phenomena of dead halt, blocking and the like of a server can be caused;

(2) When large software is operated, the fan rotates at a high speed, and obvious noise can be generated;

(3) The air cooling heat dissipation needs a large air inlet window and an air exhaust window, dust is easy to accumulate, and particularly after the case is used for a period of time, the dust is very obvious.

In summary, there is a need for an immersion liquid cooling host to improve heat dissipation efficiency of the host and maintain normal operation of the host.

Disclosure of Invention

The embodiment of the utility model provides an immersed liquid cooling host which is used for improving the heat dissipation efficiency of the host and maintaining the normal operation of the host.

The embodiment of the utility model provides an immersed liquid cooling host, which comprises a chassis and a main board; the machine case is internally provided with a first cavity, a cooling pipeline and a cooler, wherein the first cavity is filled with cooling liquid, and the cooling pipeline is communicated with the first cavity and the cooler; the main board is arranged in the first cavity and is wholly immersed in the cooling liquid.

In the scheme, through designing the inside of the immersed liquid cooling host, open up the space that is used for placing first cavity, cooling pipeline and cooler to make these three parts constitute the liquid cooling loop in the host, so, the accessible is immersed whole mainboard in the coolant liquid, can not only make the subassembly in the mainboard directly carry out the heat exchange with the coolant liquid for the radiating efficiency of mainboard, maintain the normal operating of host, need not to carry out solitary liquid cooling setting to each single device in the host moreover, help reducing the structural complexity of immersed liquid cooling host.

In one possible design, the chassis further has a first chamber and a second chamber, where the first chamber is separated from the second chamber; the first cavity is arranged in the first cavity; the cooler is disposed in the second chamber.

By adopting the design, the first cavity and the cooler can be separated in different cavities, so that the installation is convenient, the contact area between the cooler and air is larger, and the heat dissipation efficiency of the cooler is improved.

In one possible design, the cooling pipeline comprises a liquid inlet pipeline, a liquid outlet pipeline and a reflux pipeline, wherein two opposite sides of the first cavity are respectively provided with a liquid inlet and a liquid outlet; one end of the liquid inlet pipeline is arranged at the liquid inlet, and the other end of the liquid inlet pipeline is connected with the reflux pipeline; one end of the liquid outlet pipeline is arranged at the liquid outlet, and the other end of the liquid outlet pipeline is connected with the inlet of the cooler. One end of the reflux pipeline is arranged at the outlet of the cooler, and the other end of the reflux pipeline is connected with the liquid inlet pipeline.

In the scheme, the pipelines in the submerged liquid cooling host are distributed, so that a closed loop route can be formed in the pipelines by the cooling liquid, and the circulating flow of the cooling liquid is realized.

In a further possible design, the submerged liquid cooling host further comprises a water tank, wherein the water tank is connected between the other end of the liquid inlet pipeline and the other end of the backflow pipeline, and a circulating pump is further arranged between the inlet of the water tank and the backflow pipeline.

In the above scheme, the water tank can be used for storing the cooling liquid, so that the cooling liquid capacity in the first cavity meets the standard value. The circulation pump may apply pressure to the coolant in the water tank so that the coolant in the cooling line flows. A liquid cooling loop is formed by a first cavity, a circulating pump, a water tank, a cooling pipeline and a cooler in the immersed liquid cooling host, and heat of the main board is taken away by flowing cooling liquid.

In one possible design, the chassis further includes a power source mounted within the first cavity and wholly immersed in the cooling fluid.

In the scheme, the power supply serving as the heating component in the host can also radiate heat through the cooling liquid, so that the normal operation of the host is maintained.

In one possible design, the bottom surface of the case is provided with a relief port and a sealing plug, and the relief port is communicated with the inlet of the cooler and is blocked by the sealing plug.

In the scheme, liquid draining of the immersed liquid cooling host is designed, and when parts in the liquid cooling loop break down, a user can drain cooling liquid in the liquid cooling loop through the drain opening.

In one possible design, the top surface of the chassis has a cover plate under which is placed a mounting plate that includes a liquid injection port that communicates with the first cavity.

In the scheme, the liquid supplementing of the immersed liquid cooling host is designed, and when the cooling liquid in the first cavity does not reach the standard value, the cooling liquid can be supplemented through the liquid injection port, so that the cooling liquid in the liquid cooling loop can normally flow.

In one possible design, both sides of the chassis are provided with air inlets; and the air inlets on the two sides are symmetrically distributed, and any air inlet comprises a grid and a dustproof net arranged in the grid.

In the scheme, the external air enters the case from the air inlet at the side, exchanges heat with the cooling liquid in the cooler, and finally is discharged into the external air from the bottom of the case, so that an air cooling loop is formed in the case.

In one possible design, the front of the cabinet is provided with a liquid crystal display that displays the temperature of one or more devices contained in the motherboard.

In the scheme, the liquid crystal display screen is arranged on the front surface of the case, so that a user can know the working state of the electronic equipment in the host in real time.

In one possible design, the front side of the chassis is provided with a perspective window, or both the front and back sides are provided with perspective windows.

In the scheme, the surface of the case is provided with the perspective window, so that a user can observe the liquid flowing condition in the case conveniently.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the description of the embodiments will be briefly described below, it will be apparent that the drawings in the following description are only some embodiments of the present utility model, and that other drawings can be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic view of an internal left three-dimensional structure of an immersion liquid cooling host provided by the utility model;

FIG. 2 is a schematic diagram of an internal planar structure of an immersion liquid cooling host provided by the present utility model;

FIG. 3 is a schematic diagram of a first cavity of an immersion liquid cooling host provided by the present utility model;

FIG. 4 is a schematic view of the internal right three-dimensional structure of an immersion liquid cooling host provided by the utility model;

FIG. 5 is a schematic view of the three-dimensional structure of the back of an immersion liquid cooling host provided by the utility model;

FIG. 6 is a schematic view of the three-dimensional structure of the inner bottom surface of an immersion liquid cooling host provided by the utility model;

FIG. 7 is a schematic diagram of the top structure of an immersion liquid cooling host provided by the present utility model;

FIG. 8 is a schematic diagram of the internal top surface structure of an immersion liquid cooling host provided by the present utility model;

FIG. 9 is a schematic diagram of a left-side adapter of an immersion liquid-cooled host machine according to the present utility model;

FIG. 10 is a schematic diagram of a left side structure of an immersion liquid cooling host provided by the present utility model;

FIG. 11 is a schematic diagram of a front structure of an immersion liquid cooling host according to the present utility model;

FIG. 12 is a schematic view of an external left three-dimensional structure of an immersion liquid cooling host provided by the present utility model;

fig. 13 is a schematic view of an external right three-dimensional structure of an immersion liquid cooling host provided by the utility model.

Detailed Description

In order to make the objects, technical solutions and advantages of the present utility model more apparent, the present utility model will be further described in detail with reference to the accompanying drawings. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model.

All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are also within the scope of the utility model.

As described in the background art, the existing air-cooled host has many problems, and rapid heat dissipation of the host cannot be realized. Accordingly, various new cooling techniques have been tried. For example, the use of a cooling fluid as a cooling medium for electronic equipment is one of the directions.

However, existing liquid cooled hosts typically provide a separate liquid cooling device for each electronic component, such as a cold row heat sink for each electronic component within the host. Although the liquid cooling host can realize effective heat dissipation of each electronic component, the whole liquid cooling device has very complex structure and troublesome assembly process, and is not beneficial to design and manufacture of the host.

In view of this, the utility model provides an immersed liquid cooling host, which directly submerges the whole main board in an insulating cooling liquid, so that electronic components on the main board can directly exchange heat with the cooling liquid, quickly take away heat of the electronic components, realize quick heat dissipation of the host, reduce complexity of a liquid cooling device, and simplify assembly process of the liquid cooling host.

Fig. 1 schematically illustrates an internal left three-dimensional structure of an immersion liquid cooling host provided by the utility model. As shown in fig. 1, the immersion liquid cooling mainframe includes a chassis 101 and a main board 201. Referring to fig. 2, an internal plan view of an immersion liquid cooling host according to the present utility model is schematically shown. The cabinet 101 has a first cavity 102, a cooling line (including a liquid inlet pipe 303, a liquid outlet pipe 304, and a return pipe 306 shown in the drawing), and a cooler 305, wherein the first cavity 102 is filled with a cooling liquid, and the cooling line communicates the first cavity 102 with the cooler 305. The main plate 201 is installed in the first chamber 102, and is entirely immersed in the cooling liquid.

In the above scheme, through designing the inside of immersion liquid cooling host computer, submerge whole mainboard 201 in the coolant liquid, not only can make the subassembly in the mainboard 201 directly carry out the heat exchange with the coolant liquid for the radiating efficiency of mainboard 201, maintain the normal operating of host computer, need not to carry out solitary liquid cooling setting to each single device in the host computer moreover, help reducing the structural complexity of immersion liquid cooling host computer.

Alternatively, in order to facilitate the user to see the flow condition of the internal cooling liquid and the operation condition of the main board 201, the first cavity 102 may be made of a transparent material or a semitransparent material, such as an acrylic board, glass, transparent resin, etc., so the shape and structure of the first cavity 102 are not shown in fig. 1 and 2. Fig. 3 illustrates a schematic diagram of a first cavity 102 of an immersion liquid cooling host according to the present utility model, and the shape and structure of the first cavity 102 are not illustrated in other drawings except fig. 3. Fig. 3 illustrates the shape of the first cavity 102 as a cuboid, but the shape may be designed according to practical requirements, for example, a cuboid, a cylinder, a cube, or other polygonal bodies.

Specifically, referring to fig. 1 and 2, a support plate 105 is further disposed inside the cabinet 101, and the support plate 105 is defined as a dividing line, so that the internal space of the cabinet 101 can be divided into a first chamber 103 and a second chamber 104. In fig. 1, the support plate 105 is taken as an example, and the first chamber 103 is located above the drawing, and the second chamber 104 is located below the drawing. It should be appreciated that support plate 105 may be disposed in any or all directions within chassis 101, such as, but not limited to, transverse, vertical, diagonal, curved, etc.

Further, referring to fig. 1 and 2, the first cavity 102 may be disposed in the first chamber 103, and the cooler 105 may be disposed in the second chamber 104, so that the first cavity 102 and the cooler 105 may be separated in different chambers, which is convenient for installation, and may further increase the contact area between the cooler and air, and improve the heat dissipation efficiency of the cooler 105.

It is understood that first cavity 102 may also be fixed with chassis 101. There are many ways to achieve the fixing, for example, welding, pasting, clamping, riveting, etc. Optionally, in a specific fixing manner, a clamping structure may be provided on an inner frame of the first chamber 103, and the bottom of the first chamber 102 is placed on the support plate 105, and the periphery of the bottom is clamped by the frame clamping structure inside the first chamber 103, so as to fix the first chamber 102 and the chassis 101.

In order to further describe the implementation manner of the liquid cooling function, please refer to fig. 2, which schematically illustrates an internal planar structure of an immersion liquid cooling host provided by the present utility model. As shown in fig. 2, the cooling pipeline may include a liquid inlet 303, a liquid outlet 304 and a backflow 306, where two opposite sides of the first cavity 102 are respectively provided with a liquid inlet 3031 and a liquid outlet 3041, where one end of the liquid inlet 303 is disposed at the liquid inlet 3031, and the other end of the liquid inlet 303 is connected to the backflow 306. One end of the liquid outlet pipe 304 is disposed at the liquid outlet 3041, and the other end of the liquid outlet pipe 304 is connected to the inlet 3051 of the cooler 305. One end of the return pipe 306 is provided at the outlet 3052 of the cooler 305, and the other end is connected to the liquid inlet pipe 303. Therefore, the pipeline inside the immersed liquid cooling host is distributed, so that the cooling liquid can form a closed loop route in the pipeline, and the circulating flow of the cooling liquid is realized.

Further exemplary, the other end of the liquid outlet pipe 304 may be connected to the cooler 305 by a hose (the shape of the hose is not shown in all the drawings). One end of the hose is sleeved at the other end of the liquid outlet pipeline 304, the other end of the hose is sleeved at the inlet 3051 of the cooler 305, and both ends of the hose are fixed in a clamping mode.

In one example, referring to fig. 2, the submerged liquid-cooled host machine may further include a water tank 302, where the water tank 302 is located between the other end of the liquid inlet pipe 303 and the other end of the return pipe 306, and a circulation pump 301 is further disposed between the inlet of the water tank 302 and the return pipe 306. The water tank 302 may be used to store a portion of the cooling fluid such that the volume of cooling fluid within the first chamber 102 meets a standard value. The circulation pump 301 may apply pressure to the coolant in the water tank 302 so that the coolant in the cooling line flows. The first cavity 102, the circulating pump 301, the water tank 302, the cooling pipeline (including the liquid inlet pipeline 303, the liquid outlet pipeline 304 and the reflux pipeline 306 in the drawing) and the cooler 305 in the immersed liquid cooling host form a liquid cooling loop, and heat of the main board 201 is taken away by flowing cooling liquid.

In an alternative embodiment, referring to fig. 4, a schematic diagram of the internal right three-dimensional structure of an immersion liquid cooling host provided by the present utility model is shown, as shown in fig. 4, the chassis 101 may further include a power source 202, where the power source 202 is also installed in the first cavity 102, and is immersed in the cooling liquid as a whole. In this way, by immersing the main components capable of generating heat, such as the main board 201 and the power source 202, together in the cooling liquid, cooling of at least two separate components can be achieved by the same cooling liquid.

In order to facilitate understanding of the cooling implementation flow, please refer to fig. 5, which illustrates a schematic diagram of an internal back three-dimensional structure of an immersion liquid cooling host provided by the present utility model. Referring to fig. 4 and 5 together, when the circulation pump 301 is started, the cooling liquid enters the first cavity 102 from the water tank 302 through the liquid inlet pipe 303, uniformly flows through heating elements such as the main board 201 and the power supply 202, and then flows into the cooler 305 through the liquid outlet pipe 304, and after heat exchange between the cooler 305 and air, the temperature of the cooling liquid is reduced, and then enters the water tank 302 through the return pipe 306. And repeating the above actions, so that the heat dissipation process can be realized through the circulating flowing cooling liquid.

The bottom structure of the immersion liquid cooling host machine will be described.

Referring to fig. 6, a schematic diagram of an internal bottom surface three-dimensional structure of an immersion liquid cooling host according to the present utility model is shown. As shown in fig. 4 and 6, in one example, a bottom of the chassis 101 may be provided with a drain 3053, the drain 3053 communicating with an inlet 3051 of the cooler 305. Alternatively, in order to allow the coolant to smoothly drain from the drain port 3053, the drain port 3053 may be provided with a diameter slightly larger than the inlet 3051 of the cooler 305. The vent 3053 may be normally closed by a sealing plug 3054, and in use, the sealing plug 3054 may be pulled off to drain the cooling fluid from the cooler 305. For example, when a component in the liquid cooling loop fails, a user can drain the cooling liquid in the liquid cooling loop through the drain port 3053.

In a further example, referring to fig. 6, an exhaust hole 1011 may be further provided on the bottom surface of the casing 101, and the exhaust hole 1011 is located below the cooler 305, so that the air after heat exchange in the cooler 305 may be exhausted from the exhaust hole 1011 to the outside air.

The top structure of the immersion liquid cooling host machine will be described below.

Referring to fig. 7, a schematic top structure of an immersion liquid cooling host provided by the present utility model is shown, a cover plate 106 may be further installed on top of a chassis 101, and the cover plate 106 is fixedly connected with the chassis 101, for example, may be connected by a bolt.

Further, referring to fig. 8, a schematic diagram of the internal top surface structure of an immersion liquid cooling host provided by the present utility model is shown, where the schematic diagram may be considered as a view from the top surface of the chassis 101 to the inside after the top cover 106 is removed. As shown in fig. 8, a mounting plate 107 may be disposed in the casing 101, and the mounting plate 107 is placed on the frame inside the casing 101, and although the first chamber 102 is already fixed by the frame structure inside the casing 101 by the locking means, in order to ensure the fixing stability, a locking position may be provided between the mounting plate 107 and the first chamber 102, and the mounting plate 107 may be fixed inside the casing 101 by the locking means.

In one example, the mounting plate 107 may also be provided with a first rectangular hole 1071 and a second rectangular hole 1072, and the first rectangular hole 1071 and the second rectangular hole 1072 may be used to secure related interfaces on the motherboard 201 and the power source 202. For example, in one example, the motherboard 201 includes an input/output interface 2011, and when the motherboard 201 is mounted on the mounting board 107 in the form of a screw, the input/output interface 2011 may be simultaneously inserted into the first rectangular hole 1071 of the mounting board 107, so as to fix the input/output interface 2011 to the mounting board 107. For another example, the power supply 202 includes a power supply interface 2021, and when the power supply 202 is mounted on the mounting board 107 in the form of a screw, the power supply interface 2021 may be simultaneously inserted into the second rectangular hole 1072 of the mounting board 107 to fix the power supply interface 2021 to the mounting board 107.

In one example, the mounting plate 107 may further be provided with handles 108, where the handles 108 may be disposed on two opposite sides of the mounting plate 107 and symmetrically distributed, such as symmetrically distributed on two sides as shown, and may be connected to the mounting plate 107 by bolts. Through setting up handle 108, when the inside electronic component of host computer breaks down, the user only need demolish the apron 106 at host computer top, need not to dismantle whole quick-witted case 101, can be through lifting handle 108 with mounting panel 107 separation from quick-witted case 101, and then with electronic component such as mainboard 201, power 202 follow first cavity 102 propose and separate, the maintenance of the electronic equipment of being convenient for.

Further exemplary, with continued reference to fig. 8, the mounting plate 107 may further be provided with a fluid-filling port 1073, where one end of the fluid-filling port 1073 is connected to air, and the other end is connected to a cooling fluid, and is sealed by the sealing plug 1074 at ordinary times, and opened in use for injecting the cooling fluid into the first cavity 102.

Optionally, before starting up, it is checked whether the cooling liquid in the first cavity 102 reaches a standard value, if the cooling liquid is lower than the standard value, the top cover 106 of the chassis 101 may be removed first, and then a small amount of liquid is added at the liquid injection port 1073 to supplement the cooling liquid in the first cavity 102, so that enough cooling liquid is provided in the liquid cooling loop, and normal flow of the cooling liquid is ensured.

The left side structure of the immersion type liquid cooling host machine will be described.

Referring to fig. 9, a schematic diagram of a left-side adapter of an immersion liquid cooling host according to the present utility model is shown. As shown in fig. 9, a switch port 203 is provided on the left side surface of the casing 101, and the switch port 203 is used to implement part of functions of the main board 201 and the power supply 202. The switching port 203 may include one or more of a power interface, an RJ45 network cable interface, a USB3.0 socket, and an HDMI interface, for example. Through the design of the interface 203 on the side surface of the case 101, the connection with the main board 201 and the power supply 202 in the case 101 can be realized without dismantling the cover plate 106, and the use by a user is facilitated.

For example, considering that the input/output interface 2011 and the power interface 2021 are generally disposed below the cover 106, and the cover 106 and the chassis 101 are connected by screws, the adapter 203 may be disposed below a side of the chassis 101 for convenience of a user, and may connect the motherboard 201 and the power source 203 by a wire.

For example, referring to fig. 10, in order to ensure the integrity of the left side of the chassis 101, a rotating plate 109 may be further disposed on the left side of the chassis 101, where the rotating plate 109 and the chassis 101 may be connected in a form of a rotating shaft, and the adapter 203 is covered by the rotating plate 109. Thus, when the user uses the adapter 203, the rotating plate 109 is rotated upward, so that the adapter 203 is exposed.

For example, with continued reference to fig. 10, an air inlet 1012 may be provided on the left side of the chassis 101, where the air inlet 1012 may include a grille and a dust screen provided in the grille for providing the air intake required for heat dissipation to the chassis 101. For example, referring to fig. 1, 6 and 10 together, the outside air enters the casing 101 from the air inlet 1012 on the left side, passes through the first chamber 103, enters the second chamber 104, exchanges heat with the cooling liquid in the cooler 305, and finally is discharged to the outside air from the air outlet 1011 on the bottom of the casing 101, so as to form an air cooling loop in the casing 101.

It can be appreciated that, in order to generate better ventilation effect, symmetrical air inlets may be further disposed on the left and right sides of the chassis 101, so as to increase ventilation area and improve air cooling effect.

The front structure of the immersion liquid cooling host machine will be described.

Referring to fig. 11, a schematic diagram of a front structure of an immersion liquid cooling host according to the present utility model is shown. In order to enable the user to know the working state of the electronic components in the host in real time, a liquid crystal display 204 may also be disposed on the front surface of the chassis 101, where the liquid crystal display 204 is connected to a sensor on the motherboard 201, such as a temperature sensor, for displaying the temperature of one or more devices contained in the motherboard 201. Alternatively, the liquid crystal display 204 may be disposed above the front surface of the cabinet 101 for compatibility with the line-of-sight position of the user.

For example, referring to fig. 11, a perspective window 110 may be further disposed on the front surface of the chassis 101, and a user may observe the heat dissipation situation caused by the fluid flowing in the first cavity 102 through the perspective window 110. The transparent window 110 may be made of a transparent material such as an acryl plate, glass, transparent resin, etc.

It will be appreciated that to facilitate the user's view of the internal fluid flow from different sides, a see-through window 110 may also be provided on the back side of the cabinet 101, the shape and material of the see-through window 110 being designed with reference to the front side of the see-through window 110.

For example, referring to fig. 11, a caster 111 may be further disposed on the bottom surface of the chassis 101, where the caster 111 is used for moving the host, or a detent structure may be further disposed on the caster 111 for moving and fixing the host in a certain position.

In summary, the outline of the immersion liquid cooling host machine is shown in fig. 12 and 13. The immersion liquid cooling host adopts an immersion liquid cooling mode, so that the heat dissipation efficiency of the host is improved, and the normal operation of the host is maintained.

While preferred embodiments of the present utility model have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. It is therefore intended that the following claims be interpreted as including the preferred embodiments and all such alterations and modifications as fall within the scope of the utility model.

It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.

Claims (8)

1. The immersed liquid cooling host is characterized by comprising a case and a main board;

the machine case is internally provided with a supporting plate, a first cavity, a cooling pipeline and a cooler, the supporting plate divides the internal space of the machine case into a first cavity and a second cavity, the first cavity is arranged in the first cavity, the bottom of the first cavity is arranged on the supporting plate and is in clamping connection with the first cavity, and the cooler is arranged in the second cavity;

the first cavity is filled with cooling liquid, and the cooling pipeline is communicated with the first cavity and the cooler; the main board is arranged in the first cavity and is wholly immersed in the cooling liquid;

the bottom surface of machine case sets up bleed mouth and sealing plug, bleed mouth intercommunication the entry of cooler, and by the sealing plug plugs.

2. The submerged liquid cooling host machine of claim 1, wherein the cooling pipeline comprises a liquid inlet pipeline, a liquid outlet pipeline and a reflux pipeline, and two opposite sides of the first cavity are respectively provided with a liquid inlet and a liquid outlet;

one end of the liquid inlet pipeline is arranged at the liquid inlet, and the other end of the liquid inlet pipeline is connected with the backflow pipeline;

one end of the liquid outlet pipeline is arranged at the liquid outlet, and the other end of the liquid outlet pipeline is connected with the inlet of the cooler;

one end of the backflow pipeline is arranged at the outlet of the cooler, and the other end of the backflow pipeline is connected with the liquid inlet pipeline.

3. The submerged entry liquid cooling host machine of claim 2, further comprising a water tank connected between the other end of the liquid inlet pipe and the other end of the return pipe, and a circulation pump is further provided between the inlet of the water tank and the return pipe.

4. The submerged entry liquid cooling host machine of claim 1, wherein the chassis further comprises a power supply;

the power supply is installed in the first cavity, and the whole body is immersed in the cooling liquid.

5. The submerged entry liquid cooling host machine of claim 1, wherein the top surface of the chassis has a cover plate, and wherein a mounting plate is positioned below the cover plate, wherein the mounting plate includes a liquid injection port, and wherein the liquid injection port is in communication with the first cavity.

6. The submerged entry liquid cooling host machine of any one of claims 1 to 5, wherein both sides of the chassis are provided with air inlets, and the air inlets of both sides are symmetrically distributed, any one of the air inlets comprising a grille and a dust screen disposed in the grille.

7. The submerged entry liquid-cooled host machine of any one of claims 1 to 5, wherein the front face of the chassis is provided with a liquid crystal display screen for displaying the temperature of one or more devices contained in the motherboard.

8. The submerged entry liquid cooling host machine of any one of claims 1 to 5, wherein a perspective window is provided on the front side of the chassis or both the front and back sides of the chassis.