CN220613504U - Quick polishing device for quartz ring for semiconductor - Google Patents
Quick polishing device for quartz ring for semiconductor Download PDFInfo
- Publication number
- CN220613504U CN220613504U CN202322083138.XU CN202322083138U CN220613504U CN 220613504 U CN220613504 U CN 220613504U CN 202322083138 U CN202322083138 U CN 202322083138U CN 220613504 U CN220613504 U CN 220613504U
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- Prior art keywords
- quartz ring
- movable sleeve
- dust
- fixed
- polishing
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- 238000005498 polishing Methods 0.000 title claims abstract description 48
- 239000010453 quartz Substances 0.000 title claims abstract description 40
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 239000004065 semiconductor Substances 0.000 title claims abstract description 20
- 239000000428 dust Substances 0.000 claims abstract description 65
- 230000007246 mechanism Effects 0.000 claims abstract description 13
- 238000007517 polishing process Methods 0.000 claims abstract description 7
- 235000008331 Pinus X rigitaeda Nutrition 0.000 abstract description 2
- 235000011613 Pinus brutia Nutrition 0.000 abstract description 2
- 241000018646 Pinus brutia Species 0.000 abstract description 2
- 230000036541 health Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000005489 elastic deformation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
Abstract
The utility model discloses a rapid polishing device for a quartz ring for a semiconductor, which comprises a base for supporting, a base which is arranged in a horizontal state, and a polishing machine which is fixedly arranged at the output end of an electric telescopic rod, wherein the movable sleeve is connected to the outer surface of a supporting column in a sliding manner, the left side and the right side of the upper end of the movable sleeve are respectively connected with a fixed rod in a rotating manner, the movable sleeve drives a fixed clamping block to form a telescopic structure at the upper end of a polishing table through the fixed rods, the limiting mechanism is arranged at the lower end of the movable sleeve, the limiting mechanism is used for limiting the space between the movable sleeve and the supporting column, and a dust hood is connected with the air suction end of an air suction device. This a quick burnishing device for quartz ring for semiconductor is convenient for stabilize the centre gripping to quartz ring, prevents to produce the pine in the course of working and takes off, can adsorb the dust that produces in the polishing process and collect and clear up, prevents that the dust from outwards scattering and polluting the environment.
Description
Technical Field
The utility model relates to the technical field related to quartz ring polishing processing, in particular to a rapid polishing device for a quartz ring for a semiconductor.
Background
The quartz ring refers to a high-performance quartz product, is mainly used in high-temperature, corrosion and high-pressure environments in the semiconductor production process, has a plurality of use advantages, such as high purity, high hardness, high temperature stability, low thermal expansion coefficient and the like, can bear high temperature and pressure, is widely used, and comprises a plurality of steps in the actual processing process, including polishing the quartz ring;
however, in the prior art, the fixing effect on the quartz ring is poor in the polishing process of the quartz ring, the quartz ring is easy to separate in polishing, dust generated in polishing is scattered outwards, pollution is caused to the environment, and an operator inhales a large amount of dust to influence the health of the operator, so that the dust is inconvenient to collect and clean;
for this reason, we have proposed a rapid polishing apparatus for quartz rings for semiconductors, which is intended to solve the above-mentioned problems.
Disclosure of Invention
The utility model aims to provide a rapid polishing device for a quartz ring for a semiconductor, which solves the problems that in the prior art, the fixing effect on the quartz ring is poor, the quartz ring is easy to separate during polishing, dust generated during polishing is scattered outwards to pollute the environment, and an operator inhales a large amount of dust to influence the health of the operator, so that the dust is inconvenient to collect and clean.
In order to achieve the above purpose, the present utility model provides the following technical solutions: a quick polishing device for a quartz ring for a semiconductor comprises a base for supporting, a base arranged in a horizontal state and a polishing machine fixedly arranged at the output end of an electric telescopic rod;
further comprises:
the movable sleeve is connected to the outer surface of the support column in a sliding manner, the left side and the right side of the upper end of the movable sleeve are respectively connected with a fixed rod in a rotating manner, and the movable sleeve drives the fixed clamping block to form a telescopic structure at the upper end of the polishing table through the fixed rods;
the limiting mechanism is arranged at the lower end of the movable sleeve and is used for limiting the space between the movable sleeve and the support column;
the dust hood is connected with the air suction end of the air suction device, a dust screen is inserted in the middle of the dust hood, and the dust hood is used for collecting and cleaning dust generated in the polishing process.
Preferably, the upper end of the base is fixedly connected with a support column, the upper end of the support column is fixedly connected with a polishing table, the rear side of the upper end of the polishing table is fixedly connected with a fixing frame, and the upper end of the fixing frame is slidably provided with an electric telescopic rod;
wherein, the fixed slot has been seted up to the inside wall equidistant interval at both ends about the support column.
Preferably, the upper end of the fixing rod is rotationally connected with the fixing clamping block, and the fixing clamping block is connected with the base through a clamping groove.
Preferably, the fixed clamping blocks are used for clamping and fixing the quartz ring, the fixed clamping blocks are symmetrically arranged at the left end and the right end of the base, and the air suction device is arranged at the edge of the lower end of the base.
Preferably, the limiting mechanism comprises a movable plate for limiting, a spring arranged between the movable plate at the left end and the right end and the movable plate, a connecting rod fixedly connected to the upper end of the movable plate, a connecting column in a T-shaped structure and a fixing bolt for limiting.
Preferably, the movable plate is connected with the support column in a clamping groove mode, and the movable plate is clamped and connected in a fixing groove at a corresponding position on the inner side wall of the support column.
Preferably, the movable plate drives the connecting rod to slide with the connecting column, the connecting column is fixedly connected with the left end and the right end of the movable sleeve, the connecting rod and the connecting column are limited through the fixing bolt, and the fixing bolt is in threaded connection with the connecting column and the fixing bolt and the connecting rod.
Preferably, the dust screen and the dust hood are limited by a stop block, and the stop block is hinged to the upper end of the dust hood, and the stop block and the dust screen are in fit arrangement.
Compared with the prior art, the utility model has the beneficial effects that: this a quick burnishing device for quartz ring for semiconductor, in the in-service use, drive fixed clamp splice through movable sleeve and dead lever and stabilize the centre gripping to the quartz ring, guarantee the stability of quartz ring in polishing course of working, prevent to produce the pine in the course of working and take off, combine stop gear to spacing between movable sleeve and the support column, the tightness is good, through the setting of induced draft device, dust hood and dust screen, can adsorb the dust that produces in the polishing course and collect and clear up, prevent that the dust from outwards scattering from polluting the environment, prevent that operating personnel from inhaling a large amount of dust and influencing oneself healthy;
1. the movable sleeve, the fixed rod and the fixed clamping block are arranged, and the fixed rod drives the fixed clamping block to stably clamp the quartz ring at the upper end of the polishing table through the up-down sliding between the movable sleeve and the support column, so that the stability of the quartz ring in the processing process is maintained, and the loosening is prevented;
2. the limiting mechanism is arranged below the movable sleeve and comprises a movable plate, a spring, a connecting rod, a connecting column and a fixed bolt, and the limiting mechanism is arranged to facilitate limiting between the movable sleeve and the supporting column;
3. the dust suction device is provided with an air suction device, a dust hood and a dust screen, the air suction end of the air suction device is connected with the dust hood, and the dust hood and the dust screen are combined to facilitate adsorption, collection and cleaning of dust generated in the polishing process, and prevent the dust from being outwards scattered to pollute the environment.
Drawings
FIG. 1 is a schematic view of the front cut-away structure of the present utility model;
FIG. 2 is a schematic diagram of the front view of the connection of the movable sleeve and the support column;
FIG. 3 is an enlarged schematic view of the structure of FIG. 1A according to the present utility model;
FIG. 4 is a schematic diagram of the front view of the spring, connecting rod and connecting post connection of the present utility model;
fig. 5 is a schematic view of the whole structure of the connection between the dust screen and the stopper.
In the figure: 1. a base; 2. a support column; 3. a polishing table; 4. a fixing frame; 5. an electric telescopic rod; 6. polishing machine; 7. a movable sleeve; 8. a fixed rod; 9. fixing the clamping blocks; 10. a limiting mechanism; 11. a movable plate; 12. a spring; 13. a connecting rod; 14. a connecting column; 15. a fixing bolt; 16. an air suction device; 17. a dust hood; 18. a dust screen; 19. and a stop block.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the present utility model provides a technical solution: a quick polishing device for a quartz ring for a semiconductor comprises a base 1, a support column 2, a polishing table 3, a fixing frame 4, an electric telescopic rod 5, a polishing machine 6, a movable sleeve 7, a fixed rod 8, a fixed clamping block 9, a limiting mechanism 10, a movable plate 11, a spring 12, a connecting rod 13, a connecting column 14, a fixing bolt 15, an air suction device 16, a dust hood 17, a dust screen 18 and a stop block 19.
When the rapid polishing device for the quartz ring for the semiconductor is used, as shown in fig. 1, 2, 3 and 4, the upper end of a base 1 is fixedly connected with a support column 2, the upper end of the support column 2 is fixedly connected with a polishing table 3, firstly, the quartz ring to be processed is directly placed in the middle of the upper end of the polishing table 3, meanwhile, the left end and the right end of the polishing table 3 are both provided with a fixed clamping block 9, the fixed clamping block 9 is rotationally connected to the upper end of a fixed rod 8, the fixed rod 8 is respectively rotationally connected to the left side and the right side of the upper end of a movable sleeve 7, the movable sleeve 7 and the support column 2 are limited through a limiting mechanism 10, and the limiting mechanism 10 comprises a movable plate 11 used for limiting, a spring 12 arranged between the movable plate 11 at the left end and the right end, a connecting rod 13 fixedly connected to the upper end of the movable plate 11, a connecting column 14 in a T-shaped structure and a fixing bolt 15 used for limiting;
by pressing the connecting rod 13, the connecting rod 13 and the connecting column 14 slide, the connecting rod 13 drives the movable plate 11 to move, so that the movable plate 11 is separated from the fixed grooves on the inner side walls of the support columns 2, the fixed grooves are formed in the inner side walls of the left end and the right end of the support columns 2 at equal intervals, the movable plate 11 extrudes the springs 12, so that the springs 12 are elastically deformed, at the moment, the movable plate 11 loosens the limit between the movable sleeve 7 and the support columns 2, then pulls the movable sleeve 7, slides between the movable sleeve 7 and the support columns 2, the movable sleeve 7 moves downwards, rotates between the movable sleeve 7 and the fixed rod 8, and rotates between the fixed rod 8 and the fixed clamping blocks 9, so that the fixed clamping blocks 9 can be driven to stably clamp the quartz ring on the upper ends of the polishing table 3, and the stability of the quartz ring in the polishing process is kept;
after the fixation is completed, the connecting rod 13 is loosened, at the moment, the spring 12 recovers elastic deformation, the connecting rod 13 and the connecting column 14 are driven to slide, the movable plate 11 is clamped and connected in a fixed groove at a corresponding position, the movable sleeve 7 and the supporting column 2 are further conveniently limited, meanwhile, the fixing bolt 15 used for locking is rotated, the fixing bolt 15, the connecting rod 13 and the fixing bolt 15 are in threaded connection with the connecting column 14, the fixing bolt 15 and the connecting column 14 are further locked and limited, loosening is prevented, the clamping tightness of a quartz ring is improved, then an electric telescopic rod 5 which is slidably installed at the upper end of the fixed frame 4 and a polishing machine 6 which is fixedly installed at the output end of the electric telescopic rod 5 are started, the polishing machine 6 is driven to move downwards through the electric telescopic rod 5, the electric telescopic rod 5 is combined to move left and right at the upper end of the fixed frame 4, the electric telescopic rod 5 drives the polishing machine 6 to move, and each position of the quartz ring is polished;
meanwhile, when polishing, the air suction device 16 arranged at the edge of the base 1 is started, the air suction end of the air suction device 16 is connected with the dust hood 17, dust generated in the polishing process can be sucked into the dust hood 17 to be collected through the arrangement of the air suction device 16 and the dust hood 17, the dust is prevented from being scattered outwards to pollute the environment, an operator is prevented from sucking a large amount of dust to affect the health of the human body, the dust screen 18 is installed in the dust hood 17 in a plugging manner, the dust is prevented from entering the air suction device 16 when the dust is adsorbed through the arrangement of the dust screen 18, a power supply is closed after the processing is finished, the stop 19 is turned on the upper end of the dust hood 17 through the overturning of the stop 19, the stop 19 and the dust hood 17 are elastically deformed through torsion springs connected, at the moment, the stop 19 is separated from the dust screen 18, the limit of the dust screen 18 is loosened, the dust screen 18 is pulled upwards, and the dust on the dust screen 18 is further cleaned conveniently, and the dust screen 18 is prevented from being blocked after long-time use.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A rapid polishing device for a quartz ring for a semiconductor comprises a base (1) for supporting, the base (1) arranged in a horizontal state and a polishing machine (6) fixedly arranged at the output end of an electric telescopic rod (5);
characterized by further comprising:
the movable sleeve (7) is connected to the outer surface of the supporting column (2) in a sliding manner, the left side and the right side of the upper end of the movable sleeve (7) are respectively connected with a fixed rod (8) in a rotating manner, and the movable sleeve (7) drives the fixed clamping block (9) to form a telescopic structure at the upper end of the polishing table (3) through the fixed rods (8);
the limiting mechanism (10) is arranged at the lower end of the movable sleeve (7), and the limiting mechanism (10) is used for limiting the space between the movable sleeve (7) and the support column (2);
the dust hood (17), the dust hood (17) is connected with the induced draft end of the induced draft device (16), and dust screen (18) is installed in the middle part grafting of dust hood (17), and dust hood (17) are used for collecting and clearing up the dust that produces in the polishing process.
2. A rapid polishing apparatus for a quartz ring for semiconductors as recited in claim 1, wherein: the upper end of the base (1) is fixedly connected with a support column (2), the upper end of the support column (2) is fixedly connected with a polishing table (3), the rear side of the upper end of the polishing table (3) is fixedly connected with a fixing frame (4), and the upper end of the fixing frame (4) is slidably provided with an electric telescopic rod (5);
wherein, fixed slots are arranged on the inner side walls of the left end and the right end of the support column (2) at equal intervals.
3. A rapid polishing apparatus for a quartz ring for semiconductors as recited in claim 1, wherein: the upper end of the fixed rod (8) is rotationally connected with the fixed clamping block (9), and the fixed clamping block (9) is connected with the base (1) in a clamping groove mode.
4. A rapid polishing apparatus for a quartz ring for semiconductors according to claim 3, wherein: the fixed clamping blocks (9) are used for clamping and fixing the quartz ring, the fixed clamping blocks (9) are symmetrically arranged at the left end and the right end of the base (1), and an air suction device (16) is arranged at the edge of the lower end of the base (1).
5. A rapid polishing apparatus for a quartz ring for semiconductors as recited in claim 1, wherein: the limiting mechanism (10) comprises a movable plate (11) for limiting, a spring (12) arranged between the movable plate (11) at the left end and the right end and the movable plate (11), a connecting rod (13) fixedly connected to the upper end of the movable plate (11), a connecting column (14) in a T-shaped structure and a fixing bolt (15) for limiting.
6. The rapid polishing apparatus for a quartz ring for semiconductors according to claim 5, wherein: the movable plate (11) is connected with the support column (2) through a clamping groove, and the movable plate (11) is clamped and connected in a fixed groove at a corresponding position on the inner side wall of the support column (2).
7. The rapid polishing apparatus for a quartz ring for semiconductors according to claim 6, wherein: the movable plate (11) drives the connecting rod (13) to slide with the connecting column (14), the connecting column (14) is fixedly connected to the left end and the right end of the movable sleeve (7), the connecting rod (13) and the connecting column (14) are limited through the fixing bolt (15), and the fixing bolt (15) is in threaded connection with the connecting column (14) and the fixing bolt (15) and the connecting rod (13).
8. A rapid polishing apparatus for a quartz ring for semiconductors as recited in claim 1, wherein: the dust screen (18) and the dust hood (17) are limited through a stop block (19), the stop block (19) is hinged to the upper end of the dust hood (17), and the stop block (19) and the dust screen (18) are in fit arrangement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322083138.XU CN220613504U (en) | 2023-08-04 | 2023-08-04 | Quick polishing device for quartz ring for semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202322083138.XU CN220613504U (en) | 2023-08-04 | 2023-08-04 | Quick polishing device for quartz ring for semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220613504U true CN220613504U (en) | 2024-03-19 |
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ID=90221049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202322083138.XU Active CN220613504U (en) | 2023-08-04 | 2023-08-04 | Quick polishing device for quartz ring for semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220613504U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119714180A (en) * | 2024-11-07 | 2025-03-28 | 连云港太平洋润辉光电科技有限公司 | Quartz ring flatness detection device |
-
2023
- 2023-08-04 CN CN202322083138.XU patent/CN220613504U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119714180A (en) * | 2024-11-07 | 2025-03-28 | 连云港太平洋润辉光电科技有限公司 | Quartz ring flatness detection device |
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