CN220545201U

CN220545201U - Inductance based on printed circuit board

Info

Publication number: CN220545201U
Application number: CN202321457368.1U
Authority: CN
Inventors: 粘为裕; 刘志明; 赖弘伟
Original assignee: Advanced Semiconductor Engineering Inc
Current assignee: Advanced Semiconductor Engineering Inc
Priority date: 2023-06-08
Filing date: 2023-06-08
Publication date: 2024-02-27
Anticipated expiration: 2033-06-08

Abstract

The application provides an inductance based on printed circuit board, it includes: a substrate; the magnetic layer is arranged on one side of the substrate and is in contact with the substrate; and the inductance structure penetrates through the magnetic layer and the substrate, and the inductance structure penetrates through part of the magnetic layer to be in contact with the magnetic layer. The application has the advantages that: the perforation of the magnetic layer is not required to be attached with a connecting material, so that the aperture of the perforation is reduced, and the volume of the PCB inductor is reduced; the conductor penetrating through the perforations on the magnetic layer is in direct contact with the magnetic layer, so that the mutual interference of magnetic fields between adjacent perforations is reduced, and the performance of the PCB inductor is improved.

Description

Inductance based on printed circuit board

Technical Field

The application relates to the field of inductance equipment, in particular to an inductance based on a printed circuit board.

Background

In recent years, wireless charging technology is increasingly applied to various electronic devices, and products such as mobile phones, earphones, hearing aids and the like begin to adopt the wireless charging technology. Wireless chargers often use printed circuit board (PCB, printed Circuit Board) inductance as the charging unit for the charger. Printed circuit board inductors are typically printed with one or more spiral inductors on at least one board layer of a PCB. The spiral inductor and the circuit element are arranged on the same plate layer and are directly connected with each other or are connected with each other through a jumper wire, or the inductor and the circuit element are arranged on different plate layers, and the inductor is connected with a circuit component of another plate layer through a via hole penetrating through the PCB. The printed inductor of the PCB has the characteristics of low cost, high quality and high precision, and is widely applied to the fields of wireless charging and the like.

As the volume of PCB inductors becomes smaller, there is an increasing need to design a conductor structure through the magnetic material. Fig. 1 shows a schematic cross-sectional view of an inductance unit of a prior art printed circuit board-based inductance in a top view. Fig. 2 shows a schematic cross-sectional view in a side view of a prior art inductance unit based on printed circuit board inductance as shown in fig. 1. As shown in fig. 1-2, in the conventional design, since the magnetic layer 201 is made of a metal material, it cannot be directly perforated by laser. The mechanical drilling may result in a high hole wall roughness, making it difficult for the conductor 202 to adhere firmly to the hole wall. This requires that the joining material 203 made of a material such as resin be attached to the hole wall before plating to improve the smoothness of the hole wall. The disadvantage of this design is that the larger diameter of the drilled holes in the magnetic layer 201 is disadvantageous in terms of shrinking the volume of the PCB inductor due to the need to leave room for attaching the bonding material 203. In addition, due to the existence of the linking material 203, the conductor 202 and the magnetic layer 201 in the PCB inductor in the prior art are not in direct contact, so that the magnetic field forms between adjacent holes are easy to interfere with each other, and the performance of the PCB inductor is not improved.

In view of the foregoing, there is a need in the art for a printed circuit board-based inductor that overcomes the shortcomings of the prior art.

Disclosure of Invention

The application provides an inductance based on a printed circuit board, which can solve the problem that the coating property of a magnetic field on the inductance based on the printed circuit board is insufficient. The aim of the application is achieved by the following technical scheme.

One embodiment of the present application provides a printed circuit board-based inductor, which includes:

a substrate;

the magnetic layer is arranged on one side of the substrate and is contacted with the substrate;

and the inductance structure penetrates through the magnetic layer and the substrate, and part of the inductance structure penetrating through the magnetic layer is in contact with the magnetic layer.

In some alternative embodiments, the printed circuit board based inductor provided according to the above one embodiment of the present application further includes a first dielectric layer disposed on the other side of the magnetic layer opposite the substrate, the first dielectric layer being in contact with the magnetic layer, the inductor structure passing through the first dielectric layer.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the thickness of the first dielectric layer is less than the thickness of the substrate.

In some alternative embodiments, the inductor structure provided according to the foregoing embodiment of the present application includes a first conductor, a second conductor and a third conductor, where the second conductor is disposed on the other side of the first dielectric layer opposite to the magnetic layer, the second conductor is in contact with the first dielectric layer, the second conductor extends on the surface of the first dielectric layer to form a patterned first conductive layer, the third conductor is disposed on the other side of the substrate opposite to the magnetic layer, the third conductor is in contact with the substrate, the third conductor extends on the surface of the substrate to form a patterned second conductive layer, the first conductor is columnar, the first conductor sequentially passes through the first dielectric layer, the magnetic layer and the substrate, the first conductor is in contact with the magnetic layer, and two ends of the first conductor are respectively connected with the second conductor and the third conductor.

In some alternative embodiments, the printed circuit board based inductor provided according to one of the above embodiments of the present application, wherein the inductor structure 3 further comprises a fourth conductor, the fourth conductor being located between the substrate and the first dielectric layer, one side of the fourth conductor being in contact with the outside of the magnetic layer.

In some alternative embodiments, the printed circuit board based inductor provided according to one of the above embodiments of the present application, wherein the printed circuit board based inductor further comprises a second dielectric layer disposed on the other side of the substrate opposite the magnetic layer, the second dielectric layer embedded with a third conductor, the third conductor and the second dielectric layer forming a first surface of the printed circuit board based inductor.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the thickness of the second dielectric layer is less than the thickness of the substrate.

In some alternative embodiments, the inductor based on the printed circuit board provided according to the above one embodiment of the present application further includes a third dielectric layer, the third dielectric layer and the magnetic layer are disposed on two sides of the first dielectric layer, respectively, the third dielectric layer is embedded in the second conductor, and the second conductor and the third dielectric layer form a second surface of the inductor based on the printed circuit board.

In some alternative embodiments, the printed circuit board-based inductor provided according to one of the above embodiments of the present application, wherein a roughness of a surface of the magnetic layer on a contact side with the first conductor is greater than a roughness of a surface of the magnetic layer on a contact side with the first dielectric layer.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the substrate includes a first via, the first via extending through the substrate, the first conductor extending from the first via through the substrate.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the first perforation is frustoconical in cross section, the cross section of the first perforation transitioning from a minimum diameter to a maximum diameter along a direction from a side closer to the magnetic layer to a side farther from the magnetic layer.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the first dielectric layer comprises a second perforation, the second perforation extending through the first dielectric layer, the first conductor extending from the second perforation through the first dielectric layer.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the second perforation is frustoconical in cross section, the cross section of the second perforation transitioning from a minimum diameter to a maximum diameter along a direction from a side closer to the magnetic layer to a side farther from the magnetic layer.

The advantage of the printed circuit board based inductor according to the embodiments of the present application is: the perforation of the magnetic layer is not required to be attached with a connecting material, so that the aperture of the perforation is reduced, and the volume of the PCB inductor is reduced; the conductor penetrating through the perforations on the magnetic layer is in direct contact with the magnetic layer, so that the mutual interference of magnetic fields between adjacent perforations is reduced, and the performance of the PCB inductor is improved.

Drawings

Other features, objects and advantages of the present application will become more apparent from the detailed description of non-limiting embodiments thereof, which proceeds with reference to the accompanying drawings.

Fig. 1 shows a schematic cross-sectional view of an inductance unit of a prior art printed circuit board based inductance in a top view;

fig. 2 shows a schematic cross-sectional view in a side view of an inductance unit of the prior art printed circuit board based inductance shown in fig. 1;

fig. 3 shows a schematic cross-sectional view of an inductance unit of a printed circuit board based inductance in a top view according to an embodiment of the present application;

fig. 4 shows a schematic cross-sectional view of the inductance unit of fig. 3 in a side view of the printed circuit board based inductance according to one embodiment of the present application;

fig. 5 shows a schematic structural diagram of a printed circuit board based inductor according to one embodiment of the present application;

FIG. 6 shows an enlarged schematic view of the portion identified as A in FIG. 5 based on a printed circuit board according to one embodiment of the present application;

FIG. 7 shows an enlarged schematic view of the portion identified as B in the printed circuit board based according to one embodiment of the present application as shown in FIG. 5;

FIG. 8 shows an enlarged schematic view of the portion identified as B in the printed circuit board based on one embodiment of the present application as shown in FIG. 5;

fig. 9 shows a schematic diagram of a manufacturing process of a printed circuit board based inductor according to an embodiment of the present application;

fig. 10 shows a perspective view of two adjacent inductive units of a prior art printed circuit board based inductor;

FIG. 11 shows magnetic field patterns of two adjacent inductive elements of a prior art printed circuit board based inductor as shown in FIG. 10;

fig. 12 shows a schematic perspective view of two adjacent inductive units of a printed circuit board based inductor according to an embodiment of the present application;

fig. 13 shows magnetic field patterns of two adjacent inductive elements of the printed circuit board based inductor according to one embodiment of the present application as shown in fig. 12.

Reference numerals and part names: 1-substrate, 2-magnetic layer, 3-inductive structure, 4-first dielectric layer, 5-second dielectric layer, 6-third dielectric layer, 7-first surface, 8-second surface, 11-first via, 31-first conductor, 32-second conductor, 33-third conductor, 34-fourth conductor, 41-second via, 101-substrate, 102-first conductor layer, 103-second conductor layer, 104-first via, 105-first recess, 106-conductive stud, 107-second recess 108-magnetic material, 109-first dielectric layer, 110-second via, 111-third conductor layer, 112-second dielectric layer, 113-third dielectric layer, 201-magnetic layer, 202-conductor, 203-junction material, 300-inductive element, 301-conductor, 302-magnetic layer, 400-inductive element, 401-conductor, 402-magnetic layer.

Detailed Description

The following description of the present application is given by way of example with reference to the accompanying drawings, and the technical solutions, problems to be solved and technical effects to be produced will be clearly and completely understood by those skilled in the art from the description of the present application. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not limiting. In addition, for convenience of description, only parts related to the present application are shown in the drawings.

It should be readily understood that the meanings of "on," "above," and "above" in this application should be interpreted in the broadest sense so that "on" means not only "directly on" but also "on" including intermediate components or layers that exist therebetween.

Further, spatially relative terms, such as "below," "under," "lower," "above," "upper," and the like, may be used herein for ease of description to describe one element or component's relationship to another element or component as illustrated in the figures. In addition to the orientations depicted in the drawings, the spatially relative terms are intended to encompass different orientations of the device in use or operation. The device may be otherwise oriented (rotated 90 ° or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.

The term "layer" as used herein refers to a portion of material that includes regions having a certain thickness. The layers may extend over the entire underlying or overlying structure, or may have a degree less than the extent of the underlying or overlying structure. Furthermore, the layer may be a region of homogeneous or heterogeneous continuous structure having a thickness less than the thickness of the continuous structure. For example, the layer may be located between the top and bottom surfaces of the continuous structure or between any pair of horizontal planes therebetween. The layers may extend horizontally, vertically and/or along a tapered surface. The substrate (substrate) may be a layer, may include one or more layers therein, and/or may have one or more layers thereon, and/or thereon. One layer may comprise multiple layers. For example, the semiconductor layer may include one or more doped or undoped semiconductor layers, and may have the same or different materials.

The term "substrate" as used herein refers to a material to which subsequent layers of material are added. The substrate itself may be patterned. The material added to the top of the substrate may be patterned or may remain unpatterned. In addition, the substrate may include a variety of semiconductor materials such as silicon, silicon carbide, gallium nitride, germanium, gallium arsenide, indium phosphide, and the like. Alternatively, the substrate may be made of a non-conductive material such as glass, plastic, sapphire wafer, polyamide fiber (PA), polyimide (PI), epoxy (Epoxy), poly-p-phenylene benzobisoxazole, PBO) fiber, FR-4 Epoxy glass laminate, PP (pre, prePreg or semi-cured resin, prePreg) or ABF (Ajinomoto Build-up Film) or the like. Further alternatively, the substrate may have a semiconductor device or a circuit formed therein.

It should be noted that, the structures, proportions, sizes, etc. shown in the drawings are merely used in conjunction with the descriptions of the embodiments and should not be construed as limiting the applicable limitations of the present application, so that any modification, variation of proportions, or adjustment of sizes of structures, proportions, etc. which are not intended to affect the efficacy of the present application or the objects achieved, are still within the scope of what is disclosed herein. Also, the terms "upper", "first", "second", and "a" and "an" as used in the present specification are merely for descriptive purposes and are not intended to limit the scope of the utility model in which the utility model may be practiced or their relative relationships may be altered or modified without materially altering the technical context.

It should be further noted that, in the embodiment of the present application, the corresponding longitudinal section may be a section corresponding to a front view direction, the corresponding transverse section may be a section corresponding to a right view direction, and the corresponding horizontal section may be a section corresponding to an upper view direction.

In addition, embodiments and features of embodiments in this application may be combined with each other without conflict. The present application will be described in detail below with reference to the accompanying drawings in conjunction with embodiments.

Fig. 3 shows a schematic cross-sectional view of an inductance unit of a printed circuit board based inductance in a top view according to an embodiment of the present application. Fig. 4 shows a schematic cross-sectional view of the inductance unit of fig. 3 in a side view of the printed circuit board based inductance according to an embodiment of the present application. Fig. 5 shows a schematic structural diagram of a printed circuit board based inductor according to one embodiment of the present application. As shown in fig. 3-5, the printed circuit board based inductor comprises a substrate 1; a magnetic layer 2, the magnetic layer 2 being disposed on one side of the substrate 1, the magnetic layer 2 being in contact with the substrate 1; an inductance structure 3, the inductance structure 3 passes through the magnetic layer 2 and the substrate 1, and a portion of the inductance structure 3 passing through the magnetic layer 2 contacts the magnetic layer 2.

In some alternative embodiments, the printed circuit board based inductor provided according to one of the above embodiments of the present application, wherein the printed circuit board based inductor further comprises a first dielectric layer 4, the first dielectric layer 4 being disposed on the other side of the magnetic layer 2 opposite to the substrate 1, the first dielectric layer 4 being in contact with the magnetic layer 2, the inductor structure 3 passing through the first dielectric layer 4.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the thickness of the first dielectric layer 4 is smaller than the thickness of the substrate 1.

In some alternative embodiments, the printed circuit board-based inductor provided according to the above one embodiment of the present application, wherein the inductor structure 3 includes a first conductor 31, a second conductor 32 and a third conductor 33, the second conductor 32 is disposed on the other side of the first dielectric layer 4 opposite to the magnetic layer 2, the second conductor 32 is in contact with the first dielectric layer 4, the second conductor 32 extends to form a patterned first conductive layer on the surface of the first dielectric layer 4, the third conductor 33 is disposed on the other side of the substrate 1 opposite to the magnetic layer 2, the third conductor 33 is in contact with the substrate 1, the third conductor 33 extends to form a patterned second conductive layer on the surface of the substrate 1, the first conductor 31 is in a column shape, the first conductor 31 sequentially passes through the first dielectric layer 4, the magnetic layer 2 and the substrate 1, the first conductor 31 is in contact with the magnetic layer 2, and both ends of the first conductor 31 are respectively connected to the second conductor 32 and the third conductor 33.

In some alternative embodiments, the printed circuit board based inductor provided according to one of the above embodiments of the present application, wherein one first conductor 31 and the magnetic layer surrounding the first conductor 31 constitute one inductance unit.

In some alternative embodiments, the printed circuit board based inductor provided according to one of the above embodiments of the present application, wherein the inductor structure 3 further comprises a fourth conductor 34, the fourth conductor 34 being located between the substrate 1 and the first dielectric layer 4, one side of the fourth conductor 34 being in contact with the outside of the magnetic layer 2.

In some alternative embodiments, the printed circuit board based inductor provided according to one of the above embodiments of the present application, wherein the printed circuit board based inductor further comprises a second dielectric layer 5, the second dielectric layer 5 being arranged on the other side of the substrate 1 opposite to the magnetic layer 2, the second dielectric layer 5 being embedded in a third conductor 33, the third conductor 33 and the second dielectric layer 5 forming a first surface 7 of the printed circuit board based inductor.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the thickness of the second dielectric layer 5 is smaller than the thickness of the substrate 1.

In some alternative embodiments, the printed circuit board based inductor provided according to the above one embodiment of the present application, wherein the printed circuit board based inductor further comprises a third dielectric layer 6, the third dielectric layer 6 and the magnetic layer 2 are disposed on both sides of the first dielectric layer 4, respectively, wherein the magnetic layer 2 is disposed on one side of the first dielectric layer 4, the third dielectric layer 6 is disposed on the other side of the first dielectric layer 4, the third dielectric layer 6 is embedded in the second conductor 32, and the second conductor 32 and the third dielectric layer 6 form the second surface 8 of the printed circuit board based inductor.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the substrate 1 comprises a first perforation 11, the first perforation 11 penetrating the substrate 1, the first conductor 31 penetrating the substrate 1 from the first perforation 11.

In some alternative embodiments, a printed circuit board based inductor is provided according to one of the above embodiments of the present application, wherein the first dielectric layer 4 comprises a second perforation 41, the second perforation 41 penetrating the first dielectric layer 4, the first conductor 31 penetrating the first dielectric layer 4 from the second perforation 41.

In some alternative embodiments, the printed circuit board based inductor provided according to one of the above embodiments of the present application, wherein the inductor structure 3 is made of a conductive material of a metal or metal alloy, where the metal may be, for example, gold (Au), silver (Ag), aluminum (Al), nickel (Ni), palladium (Pd), copper (Cu) or an alloy thereof.

In some alternative embodiments, the printed circuit board-based inductor provided according to one of the above embodiments of the present application, wherein the first dielectric layer 4, the second dielectric layer 5 and the third dielectric layer 6 are made using dielectric materials including, but not limited to, polyamide fiber (PA), polyimide (PI), epoxy, poly-p-phenylene benzobisoxazole, PBO) fiber, FR-4 Epoxy glass cloth laminate, PP (pre, prePreg), ABF (Ajinomoto Build-up Film) and the like.

Fig. 6 shows an enlarged schematic view of the portion identified as a based on the printed circuit board shown in fig. 5 according to one embodiment of the present application. As shown in fig. 6, the first perforation 11 has a truncated cone shape, and the cross section of the first perforation 11 transitions from a minimum diameter to a maximum diameter along a direction from a side close to the magnetic layer 2 to a side away from the magnetic layer 2.

Fig. 7 shows an enlarged schematic view of the portion identified as B in fig. 5 based on a printed circuit board according to an embodiment of the present application. As shown in fig. 7, the second perforation 41 has a truncated cone shape, and the cross section of the second perforation 41 transitions from the minimum diameter to the maximum diameter along the direction from the side close to the magnetic layer 2 to the side away from the magnetic layer 2.

Fig. 8 shows an enlarged schematic view of the portion identified as B in fig. 5 based on a printed circuit board according to an embodiment of the present application. As shown in fig. 8, the roughness of the surface of the magnetic layer 2 on the side contacting the first conductor 31 is larger than the roughness of the surface of the magnetic layer 2 on the side contacting the first dielectric layer 4. The larger roughness can increase the friction force between the magnetic layer 2 and the first conductor 31, and avoid displacement between the magnetic layer 2 and the first conductor 31. The reason why the picture in fig. 5 is clearly shown does not show the difference in roughness.

Fig. 8 illustrates a schematic diagram of a printed circuit board based inductor fabrication process according to one embodiment of the present application. As shown in fig. 8, the manufacturing process of the printed circuit board-based inductor adopting one embodiment of the present application includes a plurality of steps:

step 1001: providing a substrate 101, and respectively arranging a first conductor layer 102 and a second conductor layer 103 on two sides of the substrate 101;

step 1002: drilling a hole from the second conductor layer 103 through the substrate 101 to the first conductor layer 102, forming a first through hole 104 in the substrate 101, filling the first through hole 104 in the substrate 101 and the drilled hole (not shown) in the first conductor layer 102 and the second conductor layer 103 with a conductive material, thereby making the first conductor layer 102 and the second conductor layer 103 conductive through the conductive material in the first through hole 104;

step 1003: after etching the first conductive layer 103, electroplating on the first conductive layer to form conductive posts 106, forming first grooves 105 between the conductive posts 106, and exposing the substrate 101 from the first grooves 105; etching the second conductor layer 103 to form a second groove 107, the substrate 101 being exposed from the second groove 107;

step 1004: providing a magnetic material in the recess 105 to form a magnetic layer 108, providing a dielectric layer material in the second recess 107 to form a second dielectric layer 112, and providing a first dielectric layer 109 on the side of the magnetic layer 108 and the conductive pillars 106 opposite the substrate 101;

step 1005: drilling a second through hole 110 on the first dielectric layer 109 above the conductive pillar 106, filling the second through hole 110 with a conductive material, and disposing a third conductor layer 111 above the first dielectric layer 109, wherein the third conductor layer 111 is in conduction with the second conductor layer 103 through the conductive pillar 106; and

step 1006: the third conductor layer 111 is etched to form a third recess (not shown) in which a third dielectric layer 113 is disposed.

Fig. 9 shows a perspective view of two adjacent inductive units of a prior art printed circuit board based inductor. Fig. 10 shows the magnetic field patterns of two adjacent inductive elements of a prior art printed circuit board based inductor as shown in fig. 9. As shown in fig. 9 to 10, the prior art printed circuit board based inductor has a low degree of convergence of the magnetic field around the inductor unit 200 and a high degree of mutual interference between the magnetic fields around two adjacent inductor units 300, wherein the inductor units 300 include a conductor 301 passing through a magnetic layer 302, the conductor 301 not being in contact with the magnetic layer 302. It will be appreciated that there is an interface material between the conductors 301 of the magnetic layer 302, which is not depicted in the figures for ease of illustration in fig. 9.

Fig. 11 shows a schematic perspective view of two adjacent inductive units of a printed circuit board based inductor according to an embodiment of the present application. Fig. 12 shows magnetic field patterns of two adjacent inductive elements of the printed circuit board based inductor according to one embodiment of the present application as shown in fig. 11. As shown in fig. 11-12, the degree of convergence of the magnetic field around two adjacent inductive elements 400 of the printed circuit board based inductor according to one embodiment of the present application is higher, the magnetic field strength between two adjacent inductive elements 600 of the printed circuit board based inductor according to one embodiment of the present application (region identified as D in fig. 12) is lower than the magnetic field strength between two adjacent inductive elements 400 of the prior art printed circuit board based inductor shown in fig. 10 (region identified as C in fig. 11), which illustrates the lower degree of mutual interference between the magnetic fields around two adjacent inductive elements 400 of the printed circuit board based inductor according to one embodiment of the present application, wherein inductive elements 400 include conductors 401 passing through magnetic layer 402. The above-mentioned change in the degree of mutual interference of the magnetic fields between two adjacent inductance units brings about a change in the performance of the inductance units, as shown in the following table 1, the inductance value (L) of the inductance based on the printed circuit board of the prior art is 0.836 nanohenry (nH), the resistance (R) is 8.376 milliohms (mOhm), and the quality coefficient (Q) is 0.627; with the printed circuit board-based inductor according to one embodiment of the present application, the inductance value (L) of the inductor was 1.083 nanohenry (nH), the resistance (R) was 8.477 milliohms (mOhm), and the quality factor (Q) was 0.803, with the same dimensions of the conductors passing through the magnetic layer in the inductive element.

Table 1 comparison of the performance of prior art printed circuit board based inductors and printed circuit board based inductors according to one embodiment of the present application

While the present application has been depicted and described with reference to particular embodiments thereof, such depicted and described are not meant to imply a limitation on the present application. It will be apparent to those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof within the embodiments thereof without departing from the scope of the application as defined in the claims. There may be a distinction between technical reproductions in this application and actual equipment due to variables in the manufacturing process, etc. Other embodiments of the present application not specifically described may exist. The specification and figures are to be regarded in an illustrative rather than a restrictive sense, and all such modifications are intended to be included within the scope of the present application. Although the methods disclosed herein have been described with reference to particular operations being performed in a particular order, it should be understood that these operations may be rearranged, sub-divided, or arranged to form an equivalent method without departing from the teachings of the present application. Thus, unless specifically indicated herein, the order and grouping of operations is not a limitation of the present application.

Claims

1. An inductor based on a printed circuit board, comprising:

a substrate;

the magnetic layer is arranged on one side of the substrate and is in contact with the substrate;

and the inductance structure penetrates through the magnetic layer and the substrate, and the inductance structure penetrates through part of the magnetic layer to be in contact with the magnetic layer.

2. The printed circuit board based inductor of claim 1, further comprising a first dielectric layer disposed on the other side of the magnetic layer opposite the substrate, the first dielectric layer in contact with the magnetic layer, the inductor structure passing through the first dielectric layer.

3. The printed circuit board based inductor of claim 2 wherein a thickness of the first dielectric layer is less than a thickness of the substrate.

4. The printed circuit board-based inductor of claim 2, wherein the inductor structure comprises a first conductor, a second conductor and a third conductor, the second conductor is disposed on the other side of the first dielectric layer opposite to the magnetic layer, the second conductor is in contact with the first dielectric layer, the third conductor is disposed on the other side of the substrate opposite to the magnetic layer, the third conductor is in contact with the substrate, the first conductor is columnar, the first conductor sequentially passes through the first dielectric layer, the magnetic layer and the substrate, the first conductor is in contact with the magnetic layer, and both ends of the first conductor are connected with the second conductor and the third conductor, respectively.

5. The printed circuit board based inductor of claim 4, further comprising a second dielectric layer disposed on the other side of the substrate opposite the magnetic layer, the second dielectric layer embedded in the third conductor, the third conductor and the second dielectric layer forming a first surface of the printed circuit board based inductor.

6. The printed circuit board based inductor of claim 5, wherein a thickness of the second dielectric layer is less than a thickness of the substrate.

7. The printed circuit board based inductor of claim 4, further comprising a third dielectric layer, the third dielectric layer and the magnetic layer disposed on respective sides of the first dielectric layer, the third dielectric layer embedded in the second conductor, the second conductor and the third dielectric layer forming a second surface of the printed circuit board based inductor.

8. The printed circuit board based inductor of claim 4, wherein a roughness of a surface of the magnetic layer on a contact side with the first conductor is greater than a roughness of a surface of the magnetic layer on a contact side with the first dielectric layer.

9. The printed circuit board based inductor of claim 4, wherein the substrate includes a first perforation, the first perforation extending through the substrate, the first conductor extending from the first perforation through the substrate.

10. The printed circuit board based inductor of claim 4, wherein the first dielectric layer includes a second perforation that extends through the first dielectric layer, the first conductor extending from the second perforation through the first dielectric layer.