CN220475991U - Circuit board structure for camera module, camera module and electronic equipment - Google Patents

Abstract

The utility model discloses a circuit board structure for a camera module, the camera module and electronic equipment. By adopting the scheme of the utility model, the circuit board structure comprises the substrate layer, and the first circuit layer and the second circuit layer which are respectively arranged on two opposite sides of the substrate layer, and because the circuit board structure is of a symmetrical structure in the thickness direction, the stress in the thickness direction of the circuit board structure is uniform in the moving process of the circuit board structure, abnormal stress obstruction caused by deformation and warping of the circuit board structure is avoided, and the circuit board can also work normally in the moving process.

Description

Circuit board structure for camera module, camera module and electronic equipment

Technical Field

The present utility model relates to the field of circuit boards, and more particularly, to a circuit board structure for a camera module, and an electronic device.

Background

When the user uses the camera module of the electronic device, the camera module shakes to influence the camera shooting effect of the camera module because the arm cannot continuously and stably hold the electronic device, in the related art, the camera module of the electronic device always adopts a sensor-shift (sensor displacement) principle and moves through driving the photosensitive chip to compensate the shake of the camera module, so that the purpose of preventing the shake of the camera module is realized, and the camera shooting effect of the camera module is improved. However, since the circuit board connected to the photosensitive chip in such a camera module is generally required to be deformed, the circuit board is easy to deform and warp in the thickness direction to generate abnormal stress obstruction, thereby affecting the normal operation of the circuit board.

Disclosure of Invention

The embodiment of the utility model discloses a circuit board structure for a camera module, the camera module and electronic equipment, wherein the circuit board structure is of a symmetrical structure in the thickness direction, and the stress in the thickness direction is uniform in the moving process of the circuit board structure, so that the influence on the normal operation of the circuit board structure due to deformation and warpage of the circuit board structure is avoided.

To achieve the above object, in a first aspect, the present utility model discloses a circuit board structure for a camera module, comprising:

a substrate layer, wherein the substrate layer is made of elastic materials, and/or is constructed into an elastic structure capable of being elastically deformed;

the first circuit layer is arranged on one side of the substrate layer; and

the second circuit layer is arranged on one side of the substrate layer, which is away from the first circuit layer.

In the circuit board structure provided by the first aspect of the utility model, since the circuit board structure is of a symmetrical structure in the thickness direction, the stress of the circuit board structure in the thickness direction is uniform in the deformation process of the circuit board structure, abnormal stress obstruction caused by deformation and buckling of the circuit board structure is avoided, the circuit board structure can work normally in the moving process, and in addition, the substrate layer is made of an elastic material and/or is constructed into an elastic structure capable of being elastically deformed, so that the circuit board structure can rebound rapidly when external force is removed after the circuit board structure is deformed under the force, and the state of the circuit board structure before the circuit board structure is restored is ensured, so that the photosensitive assembly arranged on the circuit board structure can be reset.

As an alternative embodiment, in an example of the first aspect of the utility model,

the material of the base material layer is conductive material,

the circuit board structure further comprises a first insulating layer and a second insulating layer, wherein the first insulating layer is arranged between the base material layer and the first circuit layer and used for separating the base material layer from the first circuit layer, the second insulating layer is arranged on one side, deviating from the first insulating layer, of the base material layer, the second circuit layer is arranged on one side, deviating from the base material layer, of the second insulating layer, and the second insulating layer is used for separating the base material layer from the second circuit layer.

By adopting the implementation mode, the first insulating layer is arranged between the substrate layer and the first circuit layer, the second insulating layer is arranged between the substrate layer and the second circuit layer, all circuits of the first circuit layer and the second circuit layer are prevented from being conducted with the substrate layer to be short-circuited, the circuit board structure cannot work normally, and meanwhile, part of circuits of the first circuit layer and the second circuit layer are electrically connected with the conductive substrate layer, and the substrate layer can play a role of grounding or switching and the like.

In an alternative embodiment, in an embodiment of the first aspect of the present utility model, the material of the substrate layer is a metal material.

By adopting the implementation mode, the substrate layer is made of metal, has better structural strength and ductility, and is not easy to break in the continuous moving process and has longer service life. In addition, since the metal is usually a conductive material, when the material of the base material layer is a metal material, a first insulating layer needs to be disposed between the base material layer and the first circuit layer, and a second insulating layer needs to be disposed between the base material layer and the second circuit layer.

In an embodiment of the first aspect of the present utility model, the first insulating layer is provided with a first via hole, the first via hole is connected to the substrate layer and the first circuit layer, the first circuit layer includes a first circuit, the first circuit is disposed on a side of the first insulating layer facing away from the substrate layer, the first circuit is electrically connected to the substrate layer through the first via hole, and/or the second insulating layer is provided with a second via hole, the second via hole is connected to the substrate layer and the second circuit layer, the second circuit layer includes a second circuit, the second circuit is disposed on a side of the second insulating layer facing away from the substrate layer, and the second circuit is electrically connected to the substrate layer through the second via hole.

By adopting the embodiment, the first circuit in the first circuit layer can be electrically connected with the substrate layer by arranging the first via hole on the first insulating layer, so that the first circuit can be grounded or switched through the substrate layer, and the second circuit in the second circuit layer can be electrically connected with the substrate layer by arranging the second via hole on the second insulating layer, so that the second circuit can be grounded or switched through the substrate layer.

In an optional implementation manner, in an embodiment of the first aspect of the present utility model, the first insulating layer is provided with a third via hole, the third via hole is connected to the substrate layer and the first circuit layer, the second insulating layer is provided with a fourth via hole corresponding to the third via hole, the fourth via hole is connected to the substrate layer and the second circuit layer, the substrate layer is provided with an avoidance hole connected to the third via hole and the fourth via hole, the first circuit layer includes a third circuit, the third circuit is disposed on a side, facing away from the substrate layer, of the first insulating layer, the second circuit layer includes a fourth circuit, and the fourth circuit is disposed on a side, facing away from the substrate layer, of the second insulating layer, and is electrically connected to the fourth circuit through the third via hole, the avoidance hole, and the fourth via hole.

By adopting the embodiment, the third via hole is arranged on the first insulating layer, the fourth via hole corresponding to the third via hole is arranged on the second insulating layer, and the avoidance hole communicated with the third via hole and the fourth via hole is arranged on the base material layer, so that the third circuit in the first circuit layer can be directly connected with the fourth circuit of the second circuit layer, and the third circuit and the fourth circuit can not be electrically connected with the base material layer through the avoidance hole.

In an optional embodiment of the first aspect of the present utility model, the substrate layer includes a main body portion and a conducting portion, the avoidance hole is disposed in the main body portion, the conducting portion is disposed in the avoidance hole and spaced from the main body portion, the third line extends to the third conducting hole to be electrically connected to the conducting portion, and the fourth line extends to the fourth conducting hole to be electrically connected to the conducting portion.

By adopting the embodiment, the substrate layer is divided into the main body part and the conducting part, the avoiding hole is formed in the main body part, the conducting part is arranged in the avoiding hole and is arranged at intervals with the main body part, so that the conducting part and the main body part are not electrically connected, the third circuit extends to the third conducting hole to be electrically connected with the conducting part in contact, the fourth circuit extends to the fourth conducting hole to be electrically connected with the conducting part in contact, the electric connection of the third circuit and the fourth circuit is realized, and the third circuit and the fourth circuit are not electrically connected with the main body part of the substrate layer.

In an optional implementation manner, in an embodiment of the first aspect of the present utility model, the circuit board structure further includes a first protection layer and a second protection layer, where the first protection layer covers a side of the first circuit layer facing away from the substrate layer, and the second protection layer covers a side of the second circuit layer facing away from the substrate layer.

By adopting the implementation mode, the first protection layer is arranged on one side, deviating from the substrate layer, of the first circuit layer, the second protection layer is arranged on one side, deviating from the substrate layer, of the second circuit layer, and the first protection layer and the second protection layer can protect the circuit board structure, so that the normal operation of the circuit board structure is avoided from being influenced by the external environment.

As an optional implementation manner, in an embodiment of the first aspect of the present utility model, the circuit board structure further includes a third insulating layer, a fourth insulating layer, a third line layer and a fourth line layer, where the third insulating layer is disposed on a side of the first line layer facing away from the substrate layer, the third line layer is disposed on a side of the third insulating layer facing away from the first line layer, the third insulating layer is used for separating the third line layer from the first line layer, the fourth insulating layer is disposed on a side of the second line layer facing away from the substrate layer, the fourth line layer is disposed on a side of the fourth insulating layer facing away from the second line layer, and the fourth insulating layer is used for separating the fourth line layer from the second line layer.

By adopting the implementation mode, the circuit board structure forms four layers of circuit layers by arranging the third insulating layer, the fourth insulating layer, the third circuit layer and the fourth circuit layer, so that more circuits can be arranged on the circuit board structure, and the circuit board structure can have more functions.

In a second aspect, the utility model discloses a camera module, which comprises a housing, a photosensitive assembly, a connection circuit board and the circuit board structure according to the first aspect, wherein the photosensitive assembly is movably arranged in the housing, the photosensitive assembly is arranged in and electrically connected with the connection circuit board, the connection circuit board is arranged in the housing, the connection circuit board is electrically connected with the first circuit layer and the second circuit layer of the circuit board, and the circuit board structure is connected with the housing.

According to the camera module provided by the second aspect of the utility model, the photosensitive component can move relative to the shell under the driving of the anti-shake motor of the camera module so as to compensate shake of the camera module, so that the camera effect of the camera module is improved, and the photosensitive component can drive the connecting circuit board to move relative to the shell under the driving of the anti-shake motor, so that the circuit board structure fixed on the shell is elastically deformed, and the photosensitive component can still be kept in electrical connection with the circuit board structure through the connecting circuit board in the moving process. Because the camera module adopts the circuit board structure provided by the first aspect of the utility model, the circuit board structure is of a symmetrical structure in the thickness direction, the stress of the circuit board structure in the thickness direction is even in the deformation process of the circuit board structure, abnormal stress obstruction caused by deformation and warping of the circuit board structure is avoided, and the circuit board structure can work normally in the moving process.

In a third aspect, the utility model discloses an electronic device, which comprises a host and the camera module set in the second aspect, wherein the camera module set is arranged on the host.

According to the electronic equipment provided by the third aspect of the utility model, as the camera module provided by the second aspect of the utility model is arranged, the camera module comprises the shell, the photosensitive component, the connecting circuit board and the circuit board structure provided by the first aspect of the utility model, the photosensitive component can move relative to the shell under the driving of the anti-shake motor of the camera module to compensate shake of the camera module, so that the shooting effect of the camera module is improved, and the photosensitive component can drive the connecting circuit board to move relative to the shell under the driving of the anti-shake motor, so that the circuit board structure fixed on the shell generates elastic deformation, and the photosensitive component can still keep electric connection with the circuit board structure through the connecting circuit board in the moving process. Because the camera module adopts the circuit board structure provided by the first aspect of the utility model, the circuit board structure is of a symmetrical structure in the thickness direction, the stress of the circuit board structure in the thickness direction is even in the deformation process of the circuit board structure, abnormal stress obstruction caused by deformation and warping of the circuit board structure is avoided, and the circuit board structure can work normally in the moving process.

Compared with the prior art, the utility model has the beneficial effects that:

the circuit board structure for the camera module, the camera module and the electronic equipment provided by the embodiment of the utility model comprise the substrate layer, and the first circuit layer and the second circuit layer which are respectively arranged at the two opposite sides of the substrate layer, and because the circuit board structure is of a symmetrical structure in the thickness direction, the stress in the thickness direction of the circuit board structure is uniform in the deformation process of the circuit board structure, abnormal stress obstruction caused by deformation and warping of the circuit board structure is avoided, and the circuit board structure can work normally in the moving process. In addition, through setting up the material of substrate layer into elastic material and/or construct the substrate layer into the elastic structure that can take place elastic deformation for circuit plate structure can rebound rapidly when external force is removed after atress deformation, guarantees that circuit plate structure resumes the state before the deformation, thereby makes the sensitization subassembly that sets up on circuit plate structure can reset.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a cross-sectional view of an exemplary circuit board structure disclosed in the first aspect of the embodiments of the present application;

FIG. 2 is a cross-sectional view of another example circuit board structure disclosed in the first aspect of the embodiments of the present application;

FIG. 3 is a cross-sectional view of a camera module disclosed in a second aspect of an embodiment of the present application;

FIG. 4 is a schematic view of a circuit board structure, a connection circuit board and a substrate according to a second aspect of the embodiments of the present application;

fig. 5 is a schematic block diagram of an electronic device disclosed in a third aspect of an embodiment of the present application.

Icon: 1. a circuit board structure; 10. a substrate layer; 100. avoidance holes; 101. a main body portion; 102. a conduction part; 11. a first circuit layer; 110. a first line; 111. a third line; 112. a fifth line; 12. a second circuit layer; 120. a second line; 121. a fourth line; 122. a sixth line; 13. a first insulating layer; 130. a first via hole; 131. a third via hole; 14. a second insulating layer; 140. a second via hole; 141. a fourth via hole; 15. a first protective layer; 16. a second protective layer; 17. a third insulating layer; 18. a fourth insulating layer; 19. a third circuit layer; 20. a fourth line layer; 2. a camera module; 21. a housing; 210. an upper housing; 211. a lower housing; 22. a photosensitive assembly; 220. a carrier circuit board; 221. a photosensitive chip; 23. connecting a circuit board; 24. an anti-shake motor; 25. a filter assembly; 26. a lens assembly; 27. a substrate; 3. an electronic device; 30. and a host.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

The technical scheme of the utility model will be further described with reference to the examples and the accompanying drawings.

Referring to fig. 1, a first aspect of the present utility model provides a circuit board structure 1 for a camera module, where the circuit board structure 1 includes a substrate layer 10, a first circuit layer 11 and a second circuit layer 12, the first circuit layer 11 is disposed on a side of the substrate layer 10, and the second circuit layer 12 is disposed on a side of the substrate layer 10 facing away from the first circuit layer 11.

In the circuit board structure 1 for a camera module provided in the first aspect of the present utility model, the circuit board structure 1 includes a substrate layer 10, and a first circuit layer 11 and a second circuit layer 12 respectively disposed on two opposite sides of the substrate layer 10, and since the circuit board structure 1 has a symmetrical structure in its thickness direction, stress in its thickness direction is uniform during deformation of the circuit board structure 1, abnormal stress obstruction caused by deformation and warpage of the circuit board structure 1 is avoided, and normal operation of the circuit board structure 1 during movement is ensured.

In some examples, the material of the substrate layer 10 is an elastic material. Like this, through setting the material of substrate layer 10 to elastic material for circuit plate structure 1 can rebound rapidly when external force is removed after atress deformation, guarantees that circuit plate structure 1 resumes the state before the deformation, thereby makes photosensitive assembly can reset.

Alternatively, the material of the substrate layer 10 may be rubber, latex, memory metal, etc., and may be specifically selected according to practical situations, which is not particularly limited in this embodiment.

In other examples, the substrate layer 10 is configured as an elastic structure capable of elastic deformation. Like this, through constructing substrate layer 10 into the elastic structure that can take place elastic deformation for circuit plate structure 1 can rebound rapidly when external force is removed after atress deformation, guarantees that circuit plate structure 1 resumes the state before the deformation, thereby makes photosensitive assembly can reset.

Alternatively, the substrate layer 10 may be configured as a metal sheet (the substrate layer 10 may form a spring structure after bending to rebound), and the like, and may be specifically selected according to practical situations, and is not specifically limited in this embodiment.

In still other examples, the material of the substrate layer 10 is an elastic material and is configured as an elastic structure capable of elastic deformation. Like this, through setting up the material of substrate layer 10 into elastic material and being constructed into elastic structure that can take place elastic deformation for circuit plate structure 1 can rebound rapidly when external force is removed after atress deformation, guarantees that circuit plate structure 1 resumes the state before the deformation, thereby makes photosensitive assembly can reset.

Alternatively, the substrate layer 10 may be a memory metal sheet, and may be specifically selected according to practical situations, which is not particularly limited in this embodiment.

Preferably, the material of the substrate layer 10 may be selected to be a memory metal, where the memory metal is a conductive material in the first aspect, and can play a role in grounding or transferring for the first circuit layer 11 and the second circuit layer 12, and the memory metal is also a metal material in the second aspect, so that the substrate layer 10 is not easy to break in the continuous moving process and has a longer service life, and the memory metal is also an elastic material in the third aspect, so that after the circuit board structure 1 is deformed under force, the circuit board structure 1 can rebound rapidly when the external force is removed, and the circuit board structure 1 is guaranteed to recover the state before being deformed, so that the photosensitive assembly can be reset.

Optionally, the material of the substrate layer 10 may be an insulating material or a conductive material, and may be specifically selected according to practical situations.

In some embodiments, the substrate layer 10 is made of a conductive material, the circuit board structure 1 further includes a first insulating layer 13 and a second insulating layer 14, the first insulating layer 13 is disposed between the substrate layer 10 and the first circuit layer 11 to separate the substrate layer 10 and the first circuit layer 11, the second insulating layer 14 is disposed on a side of the substrate layer 10 facing away from the first insulating layer 13, the second circuit layer 12 is disposed on a side of the second insulating layer 14 facing away from the substrate layer 10, and the second insulating layer 14 is used for isolating the substrate layer 10 and the second circuit layer 12.

Thus, since the material of the substrate layer 10 is a conductive material, by disposing the first insulating layer 13 between the substrate layer 10 and the first circuit layer 11 and disposing the second insulating layer 14 between the substrate layer 10 and the second circuit layer 12, it is possible to avoid that all the circuits of the first circuit layer 11 and the second circuit layer 12 are electrically connected with the substrate layer 10 and short-circuited, which results in that the circuit board structure 1 cannot normally work, and meanwhile, by electrically connecting part of the circuits of the first circuit layer 11 and the second circuit layer 12 with the conductive substrate layer 10, the substrate layer 10 can play a role of grounding or switching.

Alternatively, the materials of the first insulating layer 13 and the second insulating layer 14 are polyimide, polyvinyl chloride, or the like, which can be specifically selected according to practical situations, and are not specifically limited in this embodiment.

In some embodiments, the substrate layer 10 is made of metal. Like this, through making substrate layer 10 be the metal material, substrate layer 10 has better structural strength and ductility, guarantees that substrate layer 10 is difficult for taking place the fracture and have longer life in the in-process of continuous activity. In addition, since the metal is also generally a conductive material, when the material of the base material layer 10 is a metal material, it is also necessary to provide a first insulating layer 13 between the base material layer 10 and the first wiring layer 11 and a second insulating layer 14 between the base material layer 10 and the second wiring layer 12.

In some examples, the first insulating layer 13 is provided with a first via 130, the first via 130 is connected to the substrate layer 10 and the first circuit layer 11, the first circuit layer 11 includes a first circuit 110, the first circuit 110 is disposed on a side of the first insulating layer 13 facing away from the substrate layer 10, and the first circuit 110 is electrically connected to the substrate layer 10 through the first via 130. In this way, by providing the first via hole 130 in the first insulating layer 13, the first wiring 110 in the first wiring layer 11 can be electrically connected to the base material layer 10, and the base material layer 10 can serve as a ground, a transfer, or the like for the first wiring 110. Alternatively, the first circuit 110 may be electrically connected to the substrate layer 10 by electroplating a metal such as copper or zinc on the first via hole 130, or by extending the first circuit 110 into the first via hole 130 to connect to the substrate layer 10, which may be specifically selected according to the actual situation, and is not specifically limited in this embodiment.

In other examples, the second insulating layer 14 is provided with a second via 140, the second via 140 is connected to the substrate layer 10 and the second circuit layer 12, the second circuit layer 12 includes a second circuit 120, the second circuit 120 is disposed on a side of the second insulating layer 14 facing away from the substrate layer 10, and the second circuit 120 is electrically connected to the substrate layer 10 through the second via 140. In this way, by providing the second via 140 in the second insulating layer 14, the second wiring 120 in the second wiring layer 12 can be electrically connected to the base material layer 10, and the base material layer 10 can serve as a ground, a transfer, or the like for the second wiring 120. Alternatively, the second circuit 120 may be electrically connected to the substrate layer 10 by electroplating a metal such as copper or zinc on the second via hole 140, or by extending the second circuit 120 into the second via hole 140 to connect to the substrate layer 10, which may be specifically selected according to the actual situation, and is not specifically limited in this embodiment.

In still other examples, the first insulating layer 13 is provided with a first via 130, the first via 130 is connected to the substrate layer 10 and the first circuit layer 11, the first circuit layer 11 includes a first circuit 110, the first circuit 110 is disposed on a side of the first insulating layer 13 facing away from the substrate layer 10, the first circuit 110 is electrically connected to the substrate layer 10 through the first via 130, and the second insulating layer 14 is provided with a second via 140, the second via 140 is connected to the substrate layer 10 and the second circuit layer 12, the second circuit layer 12 includes a second circuit 120, the second circuit 120 is disposed on a side of the second insulating layer 14 facing away from the substrate layer 10, and the second circuit 120 is electrically connected to the substrate layer 10 through the second via 140. By providing the first via 130 in the first insulating layer 13 and providing the second via 140 in the second insulating layer 14 in this way, the first wiring 110 in the first wiring layer 11 can be electrically connected to the base material layer 10, and the second wiring 120 in the second wiring layer 12 can be electrically connected to the base material layer 10, so that the base material layer 10 can serve as a ground or a transfer between the first wiring 110 and the second wiring 120. Alternatively, the first and second wires 110 and 120 may be electrically connected to the substrate layer 10 by electroplating metals such as copper and zinc on the first and second via holes 130 and 140, or by extending the first wire 110 into the first via hole 130 to be connected to the substrate layer 10, and extending the second wire 120 into the second via hole 140 to be connected to the substrate layer 10, which may be specifically selected according to the actual situation, and is not specifically limited in this embodiment.

Alternatively, if the first insulating layer 13 and the second insulating layer 14 are made of photosensitive materials, the first via hole 130 and the second via hole 140 may be formed by photosensitive etching, and if the first insulating layer 13 and the second insulating layer 14 are made of non-photosensitive materials, the first via hole 130 and the second via hole 140 may be formed by laser drilling or mechanical drilling.

In some embodiments, the first insulating layer 13 is provided with a third via hole 131, the third via hole 131 is connected to the substrate layer 10 and the first circuit layer 11, the second insulating layer 14 is provided with a fourth via hole 141 corresponding to the third via hole 131, the fourth via hole 141 is connected to the substrate layer 10 and the second circuit layer 12, the substrate layer 10 is provided with a avoiding hole 100 connected to the third via hole 131 and the fourth via hole 141, the first circuit layer 11 includes a third circuit 111, the third circuit 111 is disposed on a side of the first insulating layer 13 facing away from the substrate layer 10, the second circuit layer 12 includes a fourth circuit 121, the fourth circuit 121 is disposed on a side of the second insulating layer 14 facing away from the substrate layer 10, and the third circuit 111 is electrically connected to the fourth circuit 121 through the third via hole 131, the avoiding hole 100 and the fourth via hole 141.

In this way, by providing the third via hole 131 on the first insulating layer 13, providing the fourth via hole 141 corresponding to the third via hole 131 on the second insulating layer 14, and providing the escape hole 100 communicating with the third via hole 131 and the fourth via hole 141 on the base material layer 10, the third line 111 in the first line layer 11 can be directly connected to the fourth line 121 of the second line layer 12, and the third line 111 and the fourth line 121 can not be electrically connected to the base material layer 10 by the escape hole 100.

In some embodiments, the substrate layer 10 includes a main body 101 and a via 102, the via 100 is disposed in the main body 101, the via 102 is disposed in the via 100 and spaced apart from the main body 101, the third line 111 extends to the third via 131 to be electrically connected to the via 102, and the fourth line 121 extends to the fourth via 141 to be electrically connected to the via 102.

In this way, by dividing the base material layer 10 into the main body 101 and the via 102, the via 100 is provided in the main body 101, the via 102 is provided in the via 100 and is spaced from the main body 101, so that the via 102 and the main body 101 are not electrically connected, the third line 111 extends to the third via 131 to be in contact with the via 102 and is electrically connected, the fourth line 121 extends to the fourth via 141 to be in contact with the via 102 and is electrically connected, and thus, the electrical connection between the third line 111 and the fourth line 121 is realized, and the third line 111 and the fourth line 121 are not electrically connected to the main body 101 of the base material layer 10.

Alternatively, an insulating material may be filled between the conductive portion 102 and the main body portion 101 to ensure insulation between the conductive portion 102 and the main body portion 101, and may be specifically set according to practical situations, and is not specifically limited in this embodiment.

The processing process of the circuit-board structure 1 in the present embodiment will be described briefly here. The substrate layer 10 is etched to form the main body 101 and the via 102, then the first insulating layer 13 and the second insulating layer 14 are coated and formed on two sides of the substrate layer 10, then the third via 131 and the fourth via 141 are formed by etching or drilling the positions of the first insulating layer 13 and the second insulating layer 14 corresponding to the via 102, finally the first circuit layer 11 and the second circuit layer 12 are electroplated on the first insulating layer 13 and the second insulating layer 14, and the first circuit layer 11 and the second circuit layer fill the third via 131 and the fourth via 141, so that at least part of the first circuit layer 11 (i.e. the third circuit 111) and at least part of the second circuit layer 12 (i.e. the fourth circuit 121) are directly electrically connected.

In some embodiments, the first circuit layer 11 further includes a fifth circuit 112, the second circuit layer 12 further includes a sixth circuit 122, and neither the fifth circuit 112 nor the sixth circuit 122 are electrically connected to the substrate layer 10, nor are they electrically connected to each other.

Optionally, the first circuit layer 11 may include any one or more of the first circuit 110, the third circuit 111, and the fifth circuit 112, the second circuit layer 12 includes any one or more of the second circuit 120, the fourth circuit 121, and the sixth circuit 122 corresponding to the first circuit layer 11, for example, the first circuit layer 11 includes the first circuit 110, the third circuit 111, and the fifth circuit 112, the second circuit layer 12 includes the second circuit 120, the fourth circuit 121, and the sixth circuit 122, or the first circuit layer 11 includes the first circuit 110 and the third circuit 111, the second circuit layer 12 includes the second circuit 120 and the fourth circuit 121, which may be specifically selected according to practical situations, and is not specifically limited in this embodiment.

In some embodiments, the circuit board structure 1 further includes a first protection layer 15 and a second protection layer 16, wherein the first protection layer 15 covers a side of the first circuit layer 11 facing away from the substrate layer 10, and the second protection layer 16 covers a side of the second circuit layer 12 facing away from the substrate layer 10.

Like this, through setting up first protective layer 15 in the one side that first circuit layer 11 deviates from substrate layer 10, set up second protective layer 16 in the one side that second circuit layer 12 deviates from substrate layer 10, first protective layer 15 and second protective layer 16 can play the guard action to circuit plate structure 1, avoid external environment to influence the normal work of circuit plate structure 1.

Referring to fig. 2, in some embodiments, the circuit board structure 1 further includes a third insulating layer 17, a fourth insulating layer 18, a third circuit layer 19 and a fourth circuit layer 20, the third insulating layer 17 is disposed on a side of the first circuit layer 11 facing away from the substrate layer 10, the third circuit layer 19 is disposed on a side of the third insulating layer 17 facing away from the first circuit layer 11, the third insulating layer 17 is used for separating the third circuit layer 19 from the first circuit layer 11, the fourth insulating layer 18 is disposed on a side of the second circuit layer 12 facing away from the substrate layer 10, the fourth circuit layer 20 is disposed on a side of the fourth insulating layer 18 facing away from the second circuit layer 12, and the fourth insulating layer 18 is used for separating the fourth circuit layer 20 from the second circuit layer 12.

In this way, by providing the third insulating layer 17, the fourth insulating layer 18, the third wiring layer 19 and the fourth wiring layer 20, the circuit-board structure 1 is made to form four wiring layers, thereby enabling the circuit-board structure 1 to be provided with more wiring, enabling the circuit-board structure 1 to have more functions. In this embodiment, the first protection layer 15 is disposed on a side of the third circuit layer 19 facing away from the third insulation layer 17, and the second protection layer 16 is disposed on a side of the fourth circuit layer 20 facing away from the fourth insulation layer 18.

Alternatively, all lines may be conducted between the third line layer 19 and the first line layer 11, or may be conducted by a part of lines, or may be conducted by all lines, or may be conducted by the fourth line layer 20 and the second line layer 12, or may be selected according to actual situations, and in this embodiment, the present utility model is not limited specifically. The conduction manner between the third circuit layer 19 and the first circuit layer 11, and the conduction manner between the fourth circuit layer 20 and the second circuit layer 12 can refer to the conduction manner between the first circuit layer 11 and the second circuit layer 12, and will not be described herein.

Referring to fig. 3 and fig. 4 together, a camera module 2 according to a second aspect of the present utility model includes a housing 21, a photosensitive element 22, a connection circuit board 23, and a circuit board structure 1 according to the first aspect of the present utility model, wherein the photosensitive element 22 is movably disposed in the housing 21, the photosensitive element 22 is disposed and electrically connected to the connection circuit board 23, the connection circuit board 23 is disposed in the housing 21, the connection circuit board 23 is electrically connected to the first circuit layer 11 and the second circuit layer 12 of the circuit board structure 1, and the circuit board structure 1 is connected to the housing 21.

According to the camera module 2 provided by the second aspect of the embodiment of the utility model, the camera module 2 comprises the shell 21, the photosensitive assembly 22, the connecting circuit board 23 and the circuit board structure 1 provided by the first aspect of the embodiment of the utility model, the photosensitive assembly 22 can move relative to the shell 21 under the driving of the anti-shake motor 24 of the camera module 2 to compensate shake of the camera module 2, so that the camera effect of the camera module 2 is improved, the photosensitive assembly 22 can drive the connecting circuit board 23 to move relative to the shell 21 under the driving of the anti-shake motor 24, so that the circuit board structure 1 fixed on the shell 21 generates elastic deformation, and the photosensitive assembly 22 can still keep electric connection with the circuit board structure 1 through the connecting circuit board 23 in the moving process. Because the camera module adopts the circuit board structure 1 provided by the first aspect of the embodiment of the utility model, the circuit board structure 1 has a symmetrical structure in the thickness direction, and the stress in the thickness direction of the circuit board structure 1 is even in the deformation process of the circuit board structure 1, so that abnormal stress obstruction caused by deformation and buckling of the circuit board structure 1 is avoided, and the circuit board structure 1 can work normally in the moving process.

Alternatively, the number of the connection circuit boards 23 may be one or more, and may be specifically selected according to the actual situation, and is not particularly limited in this embodiment.

Alternatively, the connection circuit board 23 and the circuit board structure 1 may be integrally formed, or may be separate pieces, which are separately provided, and may be specifically selected according to practical situations, and are not specifically limited in this embodiment.

In some embodiments, the number of the connection circuit boards 23 is two, the two connection circuit boards 23 are respectively disposed on two sides of the circuit board structure 1, the photosensitive assembly 22 includes a carrier circuit board 220 and a photosensitive chip 221, the photosensitive chip 221 is disposed on the carrier circuit board 220 and electrically connected to the carrier circuit board 220, and the carrier circuit board 220 is disposed on and electrically connected to the two connection circuit boards 23. Like this, the effect of bearing the weight of sensitization chip 221 can be played to bearing circuit board 220, and is convenient for realize that sensitization chip 221 is connected with the stable electricity of connecting circuit board 23, through setting up two connecting circuit boards 23, can make bearing circuit board 220 comparatively firm in the in-process that drives connecting circuit board 23 activity, makes the deformation of circuit board structure 1 comparatively even simultaneously.

In some embodiments, the camera module 2 further includes an anti-shake motor 24, an optical filter assembly 25, a lens assembly 26 and a substrate 27, the housing 21 includes an upper housing 210 and a lower housing 211, the upper housing 210 and the lower housing 211 are correspondingly disposed up and down, the lens assembly 26 is disposed on one side of the upper housing 210 facing away from the lower housing 211, the substrate 27 is disposed between the upper housing 210 and the lower housing 211, the circuit board structure 1 is disposed on and electrically connected to the substrate 27, the photosensitive chip 221 and the carrier circuit board 220 are disposed between the upper housing 210 and the substrate 27, the anti-shake motor 24 is connected to the upper housing 210 and is disposed between the upper housing 210 and the carrier circuit board 220, the optical filter assembly 25 is disposed between the anti-shake motor 24 and the carrier circuit board 220, and the optical filter assembly 25 is covered on the periphery of the photosensitive chip 221. Like this, the base plate 27 can play the effect of fixed circuit board structure, and the circuit board structure of being convenient for realizes being connected with the electricity of other devices through the base plate 27, and anti-shake motor 24 can drive the relative and lens subassembly 26 activity of bearing circuit board 220 to drive the relative lens subassembly 26 activity of sensitization chip 221, realize the compensation to the shake of camera module 2, the filter module can be for sensitization chip 221 filtration parasitic light, improves the shooting effect of camera module 2.

Referring to fig. 5, a third aspect of the present utility model provides an electronic device 3, which includes a host 30 and a camera module 2 according to the second aspect, wherein the camera module 2 is disposed on the host 30.

According to the electronic device 3 provided in the third aspect of the embodiment of the present utility model, since the electronic device 3 is provided with the camera module 2 provided in the second aspect of the embodiment of the present utility model, the camera module 2 includes the housing 21, the photosensitive assembly 22, the connection circuit board 23, and the circuit board structure 1 provided in the first aspect of the embodiment of the present utility model, the photosensitive assembly 22 can move relative to the housing 21 under the driving of the anti-shake motor 24 of the camera module 2 to compensate the shake of the camera module 2, so as to further improve the image capturing effect of the camera module 2, and the photosensitive assembly 22 can drive the connection circuit board 23 to move relative to the housing 21 under the driving of the anti-shake motor 24, so that the circuit board structure 1 fixed to the housing 21 generates elastic deformation, thereby ensuring that the photosensitive assembly 22 can still maintain electrical connection with the circuit board structure 1 through the connection circuit board 23 in the moving process. Because the camera module adopts the circuit board structure 1 provided by the first aspect of the embodiment of the utility model, the circuit board structure 1 has a symmetrical structure in the thickness direction, and the stress in the thickness direction of the circuit board structure 1 is even in the deformation process of the circuit board structure 1, so that abnormal stress obstruction caused by deformation and buckling of the circuit board structure 1 is avoided, and the circuit board structure 1 can work normally in the moving process.

Alternatively, the electronic device 3 may be a mobile phone, a tablet, a smart watch, etc., and may be specifically selected according to practical situations, which is not specifically limited in this embodiment.

The circuit board structure for the camera module, the camera module and the electronic device disclosed in the embodiments of the present utility model are described in detail, and specific examples are applied to the description of the principles and the implementation manners of the present utility model, where the description of the above embodiments is only for helping to understand the circuit board structure for the camera module, the camera module and the electronic device and the core ideas thereof; meanwhile, as those skilled in the art will vary in the specific embodiments and application scope according to the idea of the present utility model, the present disclosure should not be construed as limiting the present utility model in summary.

Claims (10)

1. A circuit board structure for a camera module, comprising:

a substrate layer, wherein the substrate layer is made of elastic materials, and/or is constructed into an elastic structure capable of being elastically deformed;

the first circuit layer is arranged on one side of the substrate layer; and

the second circuit layer is arranged on one side of the substrate layer, which is away from the first circuit layer.

2. The circuit board structure of claim 1, wherein the circuit board comprises a plurality of circuit boards,

the material of the base material layer is conductive material,

the circuit board structure further comprises a first insulating layer and a second insulating layer, wherein the first insulating layer is arranged between the base material layer and the first circuit layer and used for separating the base material layer from the first circuit layer, the second insulating layer is arranged on one side, deviating from the first insulating layer, of the base material layer, the second circuit layer is arranged on one side, deviating from the base material layer, of the second insulating layer, and the second insulating layer is used for separating the base material layer from the second circuit layer.

3. The circuit board structure of claim 2, wherein the substrate layer is made of metal.

4. The circuit board structure according to claim 2, wherein the first insulating layer is provided with a first via hole, the first via hole is communicated to the substrate layer and the first circuit layer, the first circuit layer comprises a first circuit, the first circuit is arranged on one side of the first insulating layer, which is away from the substrate layer, the first circuit is electrically connected to the substrate layer through the first via hole, and/or the second insulating layer is provided with a second via hole, the second via hole is communicated to the substrate layer and the second circuit layer, the second circuit layer comprises a second circuit, the second circuit is arranged on one side of the second insulating layer, which is away from the substrate layer, and the second circuit is electrically connected to the substrate layer through the second via hole.

5. The circuit board structure according to claim 2, wherein the first insulating layer is provided with a third via hole, the third via hole is connected to the substrate layer and the first circuit layer, the second insulating layer is provided with a fourth via hole corresponding to the third via hole, the fourth via hole is connected to the substrate layer and the second circuit layer, the substrate layer is provided with an avoiding hole connected to the third via hole and the fourth via hole, the first circuit layer comprises a third circuit, the third circuit is arranged on a side, away from the substrate layer, of the first insulating layer, the second circuit layer comprises a fourth circuit, the fourth circuit is arranged on a side, away from the substrate layer, of the second insulating layer, and the third circuit is electrically connected to the fourth circuit through the third via hole, the avoiding hole and the fourth via hole.

6. The circuit board structure of claim 5, wherein the substrate layer comprises a main body portion and a conducting portion, the via is disposed in the main body portion, the conducting portion is disposed in the via and spaced apart from the main body portion, the third line extends to the third via to be electrically connected to the conducting portion, and the fourth line extends to the fourth via to be electrically connected to the conducting portion.

7. The circuit-board structure of any of claims 1-6, further comprising a first protective layer covering a side of the first circuit layer facing away from the substrate layer and a second protective layer covering a side of the second circuit layer facing away from the substrate layer.

8. The circuit board structure of any of claims 1-6, further comprising a third insulating layer, a fourth insulating layer, a third circuit layer, and a fourth circuit layer, wherein the third insulating layer is disposed on a side of the first circuit layer facing away from the substrate layer, the third circuit layer is disposed on a side of the third insulating layer facing away from the first circuit layer, the third insulating layer is configured to separate the third circuit layer from the first circuit layer, the fourth insulating layer is disposed on a side of the second circuit layer facing away from the substrate layer, the fourth insulating layer is disposed on a side of the fourth insulating layer facing away from the second circuit layer, and the fourth insulating layer is configured to separate the fourth circuit layer from the second circuit layer.

9. A camera module, characterized in that, include casing, sensitization subassembly, connection circuit board and the circuit board structure of any one of preceding claims 1-8, sensitization subassembly movably locates in the casing, sensitization subassembly locate and electrically connect in connection circuit board, connection circuit board locates in the casing, connection circuit board electricity connect in circuit board's first circuit layer with the second circuit layer, circuit board structure connect in the casing.

10. An electronic device, comprising a host and the camera module according to claim 9, wherein the camera module is disposed on the host.