CN220367375U - Test circuit board, test device, intelligent terminal and test system - Google Patents

Abstract

The application discloses a test circuit board, testing arrangement, intelligent terminal and test system. The test circuit board comprises a board body, a TYPE-C male head, a thimble male head, a first RX test point and a first TX test point, wherein the first RX test point and the first TX test point are arranged on the board body and are connected with a first SUB pin and a second SUB pin of the TYPE-C male head, the TYPE-C male head is connected with a first TYPE-C female head of the intelligent terminal in an inserting mode, and the first SUB pin and the second SUB pin of the first TYPE-C female head are connected with a second RX test point and a second TX test point which are arranged on a main board of the intelligent terminal; the first end of the thimble male head is connected with the first RX test point and the first TX test point, the second end of the thimble male head is connected with the female head of the serial port line, and the USB interface of the serial port line is used for connecting a test computer. Through the technical means, the problem that the intelligent terminal in the prior art can be tested only by disassembling the intelligent terminal is solved.

Description

Test circuit board, test device, intelligent terminal and test system

Technical Field

The application relates to the technical field of computers, in particular to a test circuit board, a test device, an intelligent terminal and a test system.

Background

When debugging a motherboard driver of an intelligent terminal, a software engineer issues a command to a motherboard CPU (central processing unit) for debugging or obtains a program running process of the motherboard by using RX (receiving pin) and TX (transmitting pin) communicated by a UART (Universal Asynchronous Receiver) serial port.

Currently, a hardware worker typically reserves an RX test point and a TX test point on a motherboard of an intelligent terminal. When the software engineer tests the intelligent terminal, the intelligent terminal is disassembled to expose the RX test point and the TX test point on the main board, one end of the male pin is welded with the RX test point and the TX test point through soldering iron, the other end of the male pin is connected with a serial bus, a USB (Universal Serial Bus ) interface of the serial bus is connected with a test computer, and the software engineer debugs the intelligent terminal through the test computer. But the work load of the disassembling machine is large, and when a large number of intelligent terminals are tested, the testing efficiency cannot be ensured. Moreover, the intelligent terminal is possibly damaged during disassembling, and the test reliability is low.

Disclosure of Invention

The utility model provides a test circuit board, testing arrangement, intelligent terminal and test system utilizes idle SBU pin on TYPE-C interface to shift the built-in RX test point of intelligent terminal mainboard and TX test point to on the test circuit board to the public first external test circuit board's of thimble RX test point and TX test point need not to tear open the machine also can test intelligent terminal, has improved efficiency of software testing, and avoids tearing open the equipment damage that the machine caused, has solved the intelligent terminal among the prior art and need tear open the problem that the machine just can test.

In a first aspect, the present application provides a test circuit board, including plate body, TYPE-C male head, thimble male head, first RX test point and first TX test point, wherein:

the first RX test point and the first TX test point are arranged on the board body and are connected with a first SUB pin and a second SUB pin of the TYPE-C male head, the TYPE-C male head is used for being inserted into a TYPE-C female head of the intelligent terminal, and the first SUB pin and the second SUB pin of the TYPE-C female head of the intelligent terminal are connected with a second RX test point and a second TX test point which are arranged on a main board of the intelligent terminal;

the first end of the thimble male head is connected with the first RX test point and the first TX test point, the second end of the thimble male head is used for being connected with a female head of a serial port line, and a USB interface of the serial port line is used for being connected with a test computer.

Further, the test circuit board further comprises a TYPE-C female head, and the TYPE-C female head of the test circuit board is arranged on the board body and connected with the TYPE-C male head.

Further, the board body is further provided with a ground wire point, the thimble male head comprises three first connecting wires, and first ends of the three first connecting wires are respectively connected with the ground wire point, the first RX test point and the first TX test point.

Further, the female head of the serial port line is provided with a ground wire pin, a TX pin and an RX pin, when the second end of the male head of the thimble is connected with the female head of the serial port line, the ground wire point is connected with the ground wire pin through the first connecting line, the first RX test point is connected with the RX pin through the first connecting line, and the first TX test point is connected with the TX pin through the first connecting line.

In a second aspect, the present application provides a test apparatus, including a serial port line and the test circuit board according to the first aspect, wherein:

the second end of the thimble male head of the test circuit board is connected with the female head of the serial port line, the USB interface of the serial port line is used for being connected with a test computer, the TYPE-C male head of the test circuit board is used for being connected with the TYPE-C female head of the intelligent terminal in an inserting mode, and the first SUB pin and the second SUB pin of the TYPE-C female head of the intelligent terminal are connected with a second RX test point and a second TX test point which are arranged on a main board of the intelligent terminal.

Further, the testing device further comprises a shell, the serial port line and the testing circuit board are both arranged in the cavity of the shell, the USB interface is exposed out of the shell through a first opening, and the TYPE-C male head is exposed out of the shell through a second opening.

In a third aspect, the application provides an intelligent terminal, the intelligent terminal includes a main board and a TYPE-C female head, wherein, be provided with second RX test point and second TX test point on the main board, second RX test point with second TX test point connects the first SUB pin and the second SUB pin of the TYPE-C female head of intelligent terminal, the TYPE-C female head of intelligent terminal is used for connecting the public head of TYPE-C of test circuit board according to the first aspect.

Further, the intelligent terminal further comprises a second connecting wire, a first end of the second connecting wire is welded on the second RX test point and the second TX test point, and a second end of the second connecting wire is welded on a first SUB pin and a second SUB pin of a TYPE-C female head of the intelligent terminal.

In a fourth aspect, the present application provides a test system comprising a test computer, a smart terminal as described in the third aspect and a test device as described in the second aspect.

In this application, test circuit board includes the plate body, the public head of TYPE-C, the public head of thimble, first RX test point and first TX test point set up on the plate body and connect the public first SUB pin and the second SUB pin of head of TYPE-C, the public head of TYPE-C is used for pegging graft the first TYPE-C female head of intelligent terminal, the first SUB pin and the second SUB pin of the female head of TYPE-C connect the second RX test point and the second TX test point that set up on intelligent terminal's the mainboard, the first RX test point and first TX test point are connected to the first end of the public head of thimble, the second end of the public head of thimble is used for connecting the female head of serial ports line, the USB interface of serial ports line is used for connecting test computer. Through the technical means, when the test computer is connected with the test circuit board through the serial port line, the test circuit board is plugged into the first TYPE-C female head of the intelligent terminal through the TYPE-C male head, the test computer is connected with the second RX test point arranged on the intelligent terminal mainboard through the serial port line, the thimble male head, the first RX test point, the TYPE-C male head and the first TYPE-C female head, the test computer is connected with the second TX test point arranged on the intelligent terminal mainboard through the serial port line, the thimble male head, the first TX test point, the TYPE-C male head and the first TYPE-C female head, at the moment, a software engineer can debug the intelligent terminal through the test computer, the inorganic test of the intelligent terminal is realized, the test efficiency is improved, the equipment damage caused by disassembling is avoided, and the problem that the intelligent terminal can be tested only by disassembling the intelligent terminal in the prior art is solved.

Drawings

Fig. 1 is a schematic structural diagram of a test circuit board according to an embodiment of the present application;

fig. 2 is a schematic structural diagram of an intelligent terminal provided in an embodiment of the present application;

FIG. 3 is a schematic structural diagram of a testing device according to an embodiment of the present disclosure;

FIG. 4 is a schematic diagram of a test system according to an embodiment of the present application;

in the figure, 10, a test circuit board; 11. a plate body; 12. TYPE-C male; 121. a second SUB pin; 122. a first SUB pin; 13. a thimble male head; 14. a first TX test point; 15. a first RX test point; 16. a second TYPE-C female; 17. a ground wire point; 18. a housing; 20. an intelligent terminal; 21. a main board; 211. a second TX test point; 212. a second RX test point; 22. a first TYPE-C female; 221. a fourth SUB pin; 222. a third SUB pin; 23. a second connecting line; 30. a serial port line; 31. a ground wire pin; 32. a TX pin; 33. an RX pin; 34. a USB interface; 40. and testing the computer.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the following detailed description of specific embodiments thereof is given with reference to the accompanying drawings. It is to be understood that the specific embodiments described herein are merely illustrative of the application and not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the matters related to the present application are shown in the accompanying drawings. Before discussing exemplary embodiments in more detail, it should be mentioned that some exemplary embodiments are described as processes or methods depicted as flowcharts. Although a flowchart depicts operations (or steps) as a sequential process, many of the operations can be performed in parallel, concurrently, or at the same time. Furthermore, the order of the operations may be rearranged. The process may be terminated when its operations are completed, but may have additional steps not included in the figures. The processes may correspond to methods, functions, procedures, subroutines, and the like.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type and not limited to the number of objects, e.g., the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In a more common existing implementation manner, when testing an intelligent terminal such as a learning machine, a tablet personal computer or a mobile phone, a screen or a bottom shell of the intelligent terminal is detached first, and a built-in main board of the intelligent terminal is exposed. One end of the thimble male head is welded on an RX test point and a TX test point of the main board through a soldering iron, the other end of the thimble male head is connected with a female head of a serial port line, a USB interface of the serial port line is inserted into a USB interface of a test computer, and a software engineer can debug the intelligent terminal through the test computer. Because the screen or the bottom shell of the intelligent terminal is large in workload and complex in operation, when a large number of intelligent terminals are tested, the time required by the test is long, and the test efficiency cannot be ensured. Moreover, the intelligent terminal is possibly damaged during disassembling, and the test reliability is low.

As shown in fig. 1-4, the embodiment of the present application provides a test circuit board 10, a test device, an intelligent terminal 20 and a test system, which aims to transfer an RX test point and a TX test point built in a motherboard 21 of the intelligent terminal 20 onto the test circuit board 10 by using an idle SBU pin on a TYPE-C (a USB interface 34 external standard) interface, so that an ejector pin male head 13 is externally connected with the RX test point and the TX test point of the test circuit board 10, the intelligent terminal 20 can be tested without disassembling the machine, the test efficiency is improved, the equipment damage caused by disassembling the machine is avoided, and the problem that the intelligent terminal 20 can be tested only by disassembling the machine in the prior art is solved.

Referring to fig. 1, a test circuit board 10 specifically includes a board body 11, a TYPE-C male head 12, a thimble male head 13, a first RX test point 15, and a first TX test point 14. The first RX test point 15 and the first TX test point 14 are arranged on the board body 11 and are connected with a first SUB pin 122 and a second SUB pin 121 of the TYPE-C male head 12, the TYPE-C male head 12 is used for being inserted into a first TYPE-C female head 22 of the intelligent terminal 20, and a third SUB pin 222 and a fourth SUB pin 221 of the first TYPE-C female head 22 are connected with a second RX test point 212 and a second TX test point 211 which are arranged on a main board 21 of the intelligent terminal 20; the first end of the thimble male head 13 is connected with the first RX test point 15 and the first TX test point 14, the second end of the thimble male head 13 is used for being connected with a female head of the serial port line 30, and the USB interface 34 of the serial port line 30 is used for being connected with the test computer 40.

Illustratively, when the TYPE-C male head 12 of the test circuit board 10 is plugged into the first TYPE-C female head 22 of the intelligent terminal 20, the first SUB pin 122 and the second SUB pin 121 of the TYPE-C male head 12 are respectively connected to the third SUB pin 222 and the fourth SUB pin 221 of the first TYPE-C female head 22. Since the first SUB pin 122 is connected to the first RX test point 15 of the test circuit board 10, the third SUB pin 222 is connected to the second RX test point 212 of the main board 21 of the intelligent terminal 20, and when the first SUB pin 122 is connected to the third SUB pin 222, the first RX test point 15 is connected to the second RX test point 212; similarly, the second SUB pin 121 is connected to the first TX test point 14 of the test circuit board 10, the fourth SUB pin 221 is connected to the second TX test point 211 of the main board 21 of the intelligent terminal 20, and when the second SUB pin 121 is connected to the fourth SUB pin 221, the first TX test point 14 is connected to the second TX test point 211. If the motherboard 21 sends a signal through the second TX test point 211, the signal is transmitted to the first TX test point 14 of the test circuit board 10, the signal is transmitted to the pin male head 13 by the first TX test point 14, and the pin male head 13 transmits the signal to the test computer 40 through the serial port line 30, so that the test computer 40 reads the signal sent by the motherboard 21. If the test computer 40 sends a signal through the serial port line 30 and the pin plug 13, the signal will reach the first RX test point 15 and then reach the second RX test point 212, so that the motherboard 21 receives the signal of the test computer 40. Therefore, when the TYPE-C male head 12 of the test circuit board 10 is plugged into the first TYPE-C female head 22 of the intelligent terminal 20, the TX test point and the RX test point of the main board 21 of the intelligent terminal 20 are transferred to the test circuit board 10, so that the pin male head 13 is externally connected with the TX test point and the RX test point, and the test of the intelligent terminal 20 can be realized without disassembling the machine.

It should be noted that, the two SUB pins set in the TYPE-C interface are idle pins, that is, when the devices such as a computer are plugged into the intelligent terminal 20 through the TYPE-C interface, the SUB pins do not participate in the data communication process.

Referring to fig. 1, the test circuit board 10 further includes a second TYPE-C female head 16, and the second TYPE-C female head 16 is disposed on the board body 11 and connected with the TYPE-C male head 12. Illustratively, the pins of the second TYPE-C female 16 are correspondingly connected to the pins of the TYPE-C male 12, but the SUB pins of the second TYPE-C female 16 are suspended and not connected to the SUB pins of the TYPE-C male 12, so as to avoid the SUB pins of the TYPE-C male 12 from giving signals output from the test points of the motherboard 21 to the second TYPE-C female 16. The second TYPE-C female terminal 16 of the test circuit board 10 has functions of copying data and charging with the first TYPE-C female terminal 22 of the intelligent terminal 20, and when the electric quantity of the intelligent terminal 20 is insufficient in the test process, the charger can be plugged into the second TYPE-C female terminal 16 to charge the intelligent terminal 20.

Referring to fig. 1, the board 11 is further provided with a ground point 17, and the thimble male head 13 includes three first connection lines, and first ends of the three first connection lines are respectively connected to the ground point 17, the first RX test point 15, and the first TX test point 14. The female end of the serial port line 30 is provided with a ground wire pin 31, a TX pin 32 and an RX pin 33, when the second end of the thimble male end 13 is connected with the female end of the serial port line 30, the ground wire point 17 is connected with the ground wire pin 31 through a first connecting wire, the first RX test point 15 is connected with the RX pin 33 through a first connecting wire, and the first TX test point 14 is connected with the TX pin 32 through a first connecting wire. For example, when the second end of the pin male head 13 is connected to the female head of the serial port line 30, the USB interface 34 of the serial port line 30 is plugged into the test computer 40, and the TYPE-C male head 12 of the test circuit board 10 is plugged into the first TYPE-C female head 22 of the intelligent terminal 20, the motherboard 21, the second RX test point 212, the first RX test point 15, the RX pin 33, the test computer 40, the ground pin 31 and the ground point 17 form a closed loop, and signals sent by the motherboard 21 can be smoothly transmitted to the test computer 40. Similarly, the motherboard 21, the second TX test point 211, the first TX test point 14, the TX pin 32, the test computer 40, the ground pin 31 and the ground point 17 form a closed loop, and the signal sent by the test computer 40 can be smoothly transmitted to the motherboard 21, so as to ensure the reliability of signal transmission.

In this embodiment, the first ends of the three first connection lines are soldered to the ground point 17, the first RX test point 15 and the first TX test point 14, respectively. Illustratively, the first end of the first connecting wire is fixed on the ground wire point 17, the first RX test point 15 and the first TX test point 14 by soldering iron, so as to avoid the loose connection between the pin male head 13 and the ground wire point 17, the first RX test point 15 and the first TX test point 14, which causes signal transmission failure and affects the reliability of signal transmission between the test computer 40 and the motherboard 21 of the intelligent terminal 20.

On the basis of the above embodiment, the embodiment of the present application further provides a testing device, which includes the serial port line 30 and the testing circuit board 10 described in the above embodiment. As shown in fig. 3, the test circuit board 10 and the serial port line 30 integrally form a test device, the TYPE-C male head 12 of the test circuit board 10 can be plugged into the first TYPE-C female head 22 of the intelligent terminal 20, and the USB interface 34 of the serial port line 30 can be plugged into the interface of the test computer 40, so that the test computer 40 can test the intelligent terminal 20 through the test device, the connection process of the test computer 40 and the intelligent terminal 20 is convenient and quick, the disassembly of the intelligent terminal 20 is not needed, and the test efficiency and the test reliability are improved.

Referring to fig. 3, the serial port line 30 and the test circuit board 10 are both disposed in the cavity of the housing 18, the USB interface 34 is exposed outside the housing 18 through the first opening, and the TYPE-C male 12 is exposed outside the housing 18 through the second opening. For example, various soldered circuits, such as the connection circuit between the first RX test point 15 and the first TX test point 14 and the first SUB pin 122 and the second SUB pin 121, the connection circuit between the pin male 13 and the first RX test point 15 and the first TX test point 14, and the connection circuit between the pin male 13 and the female connector of the serial port line 30 are disposed on the test circuit board 10 and the female connector of the serial port line 30, so as to protect various circuits from the external environment and improve the reliability of the test device. A first opening and a second opening are formed in the shell 18, and the TYPE-C male head 12 is exposed out of the shell 18 through the second opening so as to enable the testing device to be inserted into the intelligent terminal 20 through the TYPE-C male head 12; part of the wires of the serial port line 30 and the USB interface 34 are exposed outside the shell 18 through the first opening, so that the testing device is plugged into the testing computer 40 through the USB interface 34. The serial port line 30, the test circuit board 10 and the cavity of the shell 18 are integrally arranged, so that the integration level of the test device is improved, the volume of the test device is reduced, and the portability of the test device in carrying and using is improved.

It should be noted that if the test circuit board 10 is further provided with the second TYPE-C female connector 16, the housing 18 is further provided with a third opening, and the second TYPE-C female connector 16 is exposed outside the housing 18 through the third opening.

On the basis of the above embodiment, the embodiment of the present application further provides an intelligent terminal 20. Referring to fig. 2, the intelligent terminal 20 includes a main board 21 and a first TYPE-C female head 22, wherein a second RX test point 212 and a second TX test point 211 are provided on the main board 21, the second RX test point 212 and the second TX test point 211 are connected to a third SUB pin 222 and a fourth SUB pin 221 of the first TYPE-C female head 22, and the first TYPE-C female head 22 is used for connecting to the TYPE-C male head 12 of the test circuit board 10 described in the above embodiment. The intelligent terminal 20 further comprises a second connecting wire 23, a first end of the second connecting wire 23 is welded on the second RX test point 212 and the second TX test point 211, and a second end of the second connecting wire 23 is welded on the third SUB pin 222 and the fourth SUB pin 221. For example, when the intelligent terminal 20 is manufactured, after the main board 21 and the first TYPE-C mother head 22 of the intelligent terminal 20 are installed, the second RX test point 212 on the main board 21 is connected to the third SUB pin 222 of the first TYPE-C mother head 22 through one second connection line 23, and the second TX test point 211 on the main board 21 is connected to the fourth SUB pin 221 of the first TYPE-C mother head 22 through the other second connection line 23. The two ends of the second connecting wire 23 are respectively fixed on the second RX test point 212 and the second TX test point 211, and the third SUB pin 222 and the fourth SUB pin 221 through soldering iron, so that the connection between the second RX test point 212 and the second TX test point 211 and the third SUB pin 222 and the fourth SUB pin 221 cannot be loosened, and when the TYPE-C male head 12 of the test circuit board 10 is plugged into the first TYPE-C female head 22, the lines between the second RX test point 212 and the first RX test point 15 and the lines between the second TX test point 211 and the first TX test point 14 are communicated, thereby ensuring the reliability of signal transmission during the test. Since the connection lines of the second RX test point 212 and the second TX test point 211 and the third SUB pin 222 and the fourth SUB pin 221 are already established in advance when the intelligent terminal 20 is produced, after the test circuit board 10 is plugged into the intelligent terminal 20 during testing, the built-in RX test point and TX test point of the main board 21 of the intelligent terminal 20 are transferred to the test circuit board 10, the intelligent terminal 20 can be tested without disassembling the machine, the test efficiency is improved, and the damage of the intelligent terminal 20 caused by disassembling the machine is avoided.

On the basis of the above embodiment, the embodiment of the present application further provides a test system, as shown in fig. 4, where the test system includes a test computer 40, the intelligent terminal 20 described in the above embodiment, and a test device, the TYPE-C male head 12 of the test device is plugged into the first TYPE-C female head 22 of the intelligent terminal 20, and the USB interface 34 of the test device is plugged into the interface of the test computer 40. Based on the test system, a software engineer can test the intelligent terminal 20 through the test computer 40, and can test the intelligent terminal 20 without disassembling the machine, so that the test efficiency is improved, and equipment damage caused by disassembling the machine is avoided.

In summary, the test circuit board 10 provided in this embodiment of the present application includes a board body 11, a TYPE-C male 12, a thimble male 13, a first RX test point 15 and a first TX test point 14, where the first RX test point 15 and the first TX test point 14 are disposed on the board body 11 and connected to a first SUB pin 122 and a second SUB pin 121 of the TYPE-C male 12, the TYPE-C male 12 is used for plugging a first TYPE-C female 22 of the intelligent terminal 20, the first SUB pin 122 and the second SUB pin 121 of the first TYPE-C female 22 are connected to a second RX test point 212 and a second TX 211 disposed on a main board 21 of the intelligent terminal 20, a first end of the thimble male 13 is connected to the first RX test point 15 and the first TX test point 14, a second end of the thimble male 13 is used for connecting to a female of the serial port line 30, and the USB interface 34 of the serial port line 30 is used for connecting the test computer 40. Through the technical means, when the test computer 40 is connected with the test circuit board 10 through the serial port line 30, the test circuit board 10 is plugged into the first TYPE-C female head 22 of the intelligent terminal 20 through the TYPE-C male head 12, the test computer 40 is connected with the second RX test point 212 arranged on the main board 21 of the intelligent terminal 20 through the serial port line 30, the thimble male head 13, the first RX test point 15, the TYPE-C male head 12 and the first TYPE-C female head 22, the test computer 40 is connected with the second TX test point 211 arranged on the main board 21 of the intelligent terminal 20 through the serial port line 30, the thimble male head 13, the first TX test point 14, the TYPE-C male head 12 and the first TYPE-C female head 22, and at the moment, a software engineer can debug the intelligent terminal 20 through the test computer 40, so that the machine-free test of the intelligent terminal 20 is realized, the test efficiency is improved, the equipment damage caused by the machine disassembly is avoided, and the problem that the intelligent terminal 20 can be tested only by the machine disassembly in the prior art is solved.

The foregoing description is only of the preferred embodiments of the present application and the technical principles employed. The present application is not limited to the specific embodiments described herein, but is capable of numerous obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the present application. Therefore, while the present application has been described in connection with the above embodiments, the present application is not limited to the above embodiments, but may include many other equivalent embodiments without departing from the spirit of the present application, and the scope of the present application is determined by the scope of the claims.

Claims (10)

1. The utility model provides a test circuit board, its characterized in that includes plate body, TYPE-C male head, thimble male head, first RX test point and first TX test point, wherein:

the first RX test point and the first TX test point are arranged on the board body and are connected with a first SUB pin and a second SUB pin of the TYPE-C male head, the TYPE-C male head is used for being inserted into a first TYPE-C female head of the intelligent terminal, and a third SUB pin and a fourth SUB pin of the first TYPE-C female head are connected with a second RX test point and a second TX test point which are arranged on a main board of the intelligent terminal;

the first end of the thimble male head is connected with the first RX test point and the first TX test point, the second end of the thimble male head is used for being connected with a female head of a serial port line, and a USB interface of the serial port line is used for being connected with a test computer.

2. The test circuit board of claim 1, further comprising a second TYPE-C female head disposed on the board body and connected to the TYPE-C male head.

3. The test circuit board of claim 1, wherein the board body is further provided with a ground point, the ejector pin male head includes three first connection lines, and first ends of the three first connection lines are respectively connected to the ground point, the first RX test point and the first TX test point.

4. A test circuit board according to claim 3, wherein the female end of the serial port line is provided with a ground wire pin, a TX pin and an RX pin, and wherein the ground wire point is connected to the ground wire pin through the first connection line when the second end of the male end of the ejector pin is connected to the female end of the serial port line, the first RX test point is connected to the RX pin through the first connection line, and the first TX test point is connected to the TX pin through the first connection line.

5. A test circuit board according to claim 3, wherein first ends of three of said first connection lines are soldered to said ground point, said first RX test point and said first TX test point, respectively.

6. A test apparatus comprising a serial port line and a test circuit board according to any one of claims 1-5, wherein:

the second end of the thimble male head of the test circuit board is connected with the female head of the serial port line, the USB interface of the serial port line is used for being connected with a test computer, the TYPE-C male head of the test circuit board is used for being inserted into a first TYPE-C female head of the intelligent terminal, and a third SUB pin and a fourth SUB pin of the first TYPE-C female head are connected with a second RX test point and a second TX test point which are arranged on a main board of the intelligent terminal.

7. The test device of claim 6, further comprising a housing, wherein the serial port line and the test circuit board are disposed within a cavity of the housing, wherein the USB interface is exposed to an exterior of the housing through a first opening, and wherein the TYPE-C male is exposed to an exterior of the housing through a second opening.

8. An intelligent terminal, characterized in that, the intelligent terminal includes mainboard and first TYPE-C female head, wherein, be provided with second RX test point and second TX test point on the mainboard, second RX test point and second TX test point connect the third SUB pin and the fourth SUB pin of first TYPE-C female head, first TYPE-C female head is used for connecting the public head of TYPE-C of the test circuit board of any one of claims 1-5.

9. The intelligent terminal of claim 8, further comprising a second connection wire, a first end of the second connection wire being soldered to the second RX test point and the second TX test point, a second end of the second connection wire being soldered to the third SUB pin and the fourth SUB pin.

10. A test system comprising a test computer, a smart terminal according to claim 8 or 9 and a test device according to claim 6 or 7.