CN220357547U

CN220357547U - Edge computing equipment with enhanced heat dissipation effect

Info

Publication number: CN220357547U
Application number: CN202322113478.2U
Authority: CN
Inventors: 王静
Original assignee: Beijing Hanzhixing Technology Co ltd
Current assignee: Beijing Hanzhixing Technology Co ltd
Priority date: 2023-08-08
Filing date: 2023-08-08
Publication date: 2024-01-16
Anticipated expiration: 2033-08-08

Abstract

The utility model relates to edge computing equipment with enhanced heat dissipation effect, which comprises a motherboard, a mainframe box and a heat dissipation module, wherein the motherboard comprises a motherboard and a core board, the motherboard is provided with a core board slot, the core board is detachably arranged on the motherboard, the core board comprises at least one operation processor module and an interface, the core board can be correspondingly inserted into the core board slot of the motherboard through the interface, the motherboard is fixed in the mainframe box, and the heat dissipation module is connected to the outer side of the mainframe box; according to the edge computing equipment with the enhanced heat dissipation effect, the heat dissipation module is further arranged on the outer side of the main cabinet, and the heat dissipation module can achieve better cooling effect through simultaneous heat dissipation of the inner part and the outer part, so that the edge computing equipment can be better applied to an edge environment with higher temperature.

Description

Edge computing equipment with enhanced heat dissipation effect

Technical Field

The present utility model relates to a computer device used in an edge computing environment, and more particularly to an edge computing device with enhanced heat dissipation.

Background

With the rapid development of the internet of things, we are in the era of everything interconnection. More and more devices enable the ability to connect to networks and exchange data. The internet of things provides a trigger for digitalized transformation of various industries, so that the traditional industry can also utilize the technology to upgrade and transform.

The common edge computing equipment is mainly focused on the field of industrial Internet of things, not only supports rich industrial protocols and Internet of things interfaces, but also can adapt to the connection scenes of equipment in different industries.

However, in order to meet the needs of diversification and convenient arrangement, the main body of the conventional edge computing device is usually designed to be narrower, so that the heat dissipation space of the internal main board and the chassis is insufficient, and when some CPUs with higher temperature rise are used, the heat is easily down due to the higher temperature rise in the internal part, so that the inventor of the utility model provides a means for solving the heat dissipation problem on the premise of excessively increasing the volume of the chassis.

Disclosure of Invention

As described above, since the existing edge computing device has a poor internal heat dissipation due to a narrow chassis design, the inventor of the present utility model has developed an improved existing defect technology in view of the existing defects and shortcomings, and the main objective of the present utility model is to provide an edge computing device with enhanced heat dissipation effect, comprising:

the motherboard comprises a motherboard and a core board, the motherboard is provided with a core board slot, the core board is detachably arranged on the motherboard, the core board comprises at least one operation processor module and an interface, and the core board can be correspondingly inserted into the core board slot of the motherboard through the interface;

the host machine box is internally provided with an accommodating space, and the host board is arranged in the accommodating space of the host machine box;

the heat dissipation module is further connected to the outer side of the main case and comprises a plurality of heat dissipation fins and a plurality of heat dissipation channels formed among the heat dissipation fins.

Preferably, the heat dissipation fins of the heat dissipation module further comprise a plurality of heat conduction fins and a plurality of spacing pieces, wherein a bending guide structure is formed at the top of each heat conduction fin, the heat conduction fins are arranged at intervals, each spacing piece is arranged between the two heat conduction fins at intervals, the heat conduction fins at the central position of the heat dissipation module are T-shaped, and the heat conduction fins at the left side and the right side of the heat dissipation module are L-shaped and respectively bend towards the central heat conduction fins.

Preferably, the motherboard of the edge computing device with enhanced heat dissipation effect includes a plurality of external slots.

Preferably, the plurality of external slots of the motherboard of the edge computing device with enhanced heat dissipation effect include a network card slot, a memory module slot, a radio frequency module slot and a SIM card slot.

Preferably, the edge computing device with enhanced heat dissipation effect has the core board slot and the core board adopting 260pin SO-DIMM connector.

Preferably, the motherboard of the edge computing device with enhanced heat dissipation effect includes a plurality of external interfaces.

Preferably, the external interface of the motherboard of the edge computing device with enhanced heat dissipation effect includes a USB interface, a network line interface, an external port, a power interface, and a fan interface.

Preferably, the mainframe box is provided with an interface front panel and an interface rear panel corresponding to the mainframe board at the front side and the rear side respectively, the mainframe box further comprises a detachable bottom plate and a detachable top plate, and the heat dissipation module is arranged above the top plate.

By means of the technical characteristics, the improved edge computing device with the enhanced heat dissipation effect is redesigned with the heat dissipation module connected with the mainframe, the heat dissipation module is further connected to the outer side of the mainframe, the heat dissipation module comprises a plurality of heat dissipation fins, a plurality of heat dissipation channels are formed among the heat dissipation fins, the heat dissipation fins comprise a plurality of heat conduction fins and a plurality of spacing pieces, the top of each heat conduction fin is provided with a bending guide structure, heat conducted out of the mainframe through each heat conduction fin and the spacing piece can be effectively contacted with the outside air, good heat conduction effect is achieved, even if the heat dissipation device is applied to a narrower mainframe, the heat dissipation problem of the existing edge device is effectively improved.

Drawings

Fig. 1 is a perspective view of the present utility model.

Fig. 2 is a front view of the present utility model.

Fig. 3 is a rear view of the present utility model.

Fig. 4 is a left side view of the present utility model.

Fig. 5 is a top view of the motherboard of the present utility model.

Fig. 6 is a bottom view of the motherboard of the present utility model.

Detailed Description

The technical means adopted by the utility model to achieve the preset aim are further described below by matching with the drawings and the preferred embodiments of the utility model.

As shown in fig. 1 to 6, the present utility model relates to an edge computing device with enhanced heat dissipation effect, which includes a main chassis 10, a heat dissipation module 20 and a motherboard 30.

As shown in fig. 1 to 4, the mainframe box 10 is a rectangular hollow box body, and has a containing space therein, the mainframe board is disposed in the containing space of the mainframe box, and the mainframe box is provided with a first interface panel 11 and a second interface panel 12 corresponding to each module of the mainframe board on the front and left sides thereof, respectively, and further comprises a detachable bottom plate and a detachable top plate.

As shown in fig. 1 to 3, the heat dissipation module 20 is further connected to the outside of the mainframe 10, the heat dissipation module 20 includes a plurality of heat dissipation fins 21 and a connection seat 22 connected below the heat dissipation fins 21, and a plurality of heat dissipation channels 23 are formed between the heat dissipation fins, preferably, the heat dissipation fins 21 further include a plurality of heat conduction fins 211 and a plurality of spacing pieces 212, the top of each heat conduction fin 211 is formed with a curved guiding structure, the heat conduction fins 211 are arranged at intervals, each spacing piece 212 is arranged between two heat conduction fins 211 at intervals, and each heat dissipation channel 23 is distributed between each spacing piece 212 and each heat conduction fin 211.

More specifically, the heat conducting fins 211 at the central position of the heat dissipating module 20 are T-shaped, and the heat conducting fins 211 at the left and right sides are L-shaped and are respectively bent towards the central heat conducting fins 211, so that the air flow guiding function is generated by the modeling design, and the heat flow is led out from the central position of the heat dissipating module towards the outside of the two sides, thereby achieving a better heat flow conduction effect.

The motherboard 30 includes a motherboard and a core board, and the motherboard includes a core board slot 31, a plurality of external slots 32, and a plurality of external interfaces 33.

The core board is detachably mounted on the motherboard, and comprises at least one operation processor module and an inserting port, the core board can be correspondingly inserted into a core board slot 31 of the motherboard through the inserting port, and the inserting port is a connector adopting 260pin SO-DIMM (Small Outline Dual In-Line Memory Modul, small-sized double-row inline memory module).

The external slot 32 is disposed at a corresponding position of the motherboard as required, and includes, but is not limited to, a network card slot, a storage module slot, a radio frequency module slot, a SIM card slot, and other slots for external hardware devices, for example, the network card slot may be correspondingly provided with an external card, a storage module, or an external device of a corresponding specification and protocol, for example, the network card slot may be correspondingly provided with a mini PCIe wireless network card, the storage module may be a storage module for storing data, such as an m.2ssd, an SDHC card, an SD card, or a mico SD card, and the storage module is not limited herein, the storage module slot may be disposed corresponding to the aforementioned storage module, the radio frequency module slot may be correspondingly provided with a 4G/5G radio frequency module, the SIM card slot may be correspondingly provided with a SIM card, and the like, and so on.

The external interface 33 is disposed at a corresponding position of the motherboard as required, and includes, but is not limited to, devices with connection lines or connection interfaces, such as USB interfaces, network line interfaces, external ports, power interfaces, and fan interfaces, etc., where the USB interfaces are correspondingly connected to corresponding connectors, such as USB connectors, OTG connectors (Mini USB, mico USB), network line interfaces corresponding to network lines, network line interfaces corresponding to COM1/2 connectors, HDMI connection ports corresponding to HDMI connectors, power interfaces corresponding to GPIO, power lines, or fan interfaces corresponding to fan connection lines, etc.

The utility model relates to a newly improved edge computing device with enhanced heat dissipation effect, which is designed with a heat dissipation module connected with a mainframe box, wherein the heat dissipation module is further connected with the outer side of the mainframe box, the heat dissipation module comprises a plurality of heat dissipation fins, a plurality of heat dissipation channels are formed among the heat dissipation fins, the heat dissipation fins comprise a plurality of heat conduction fins and a plurality of spacing pieces, the tops of the heat conduction fins are provided with bending guide structures, and heat conducted out of the mainframe box can be effectively contacted with external air through the heat conduction fins and the spacing pieces, so that good heat conduction effect is achieved, even if the heat dissipation device is applied to a narrower mainframe box, the heat dissipation problem of the existing edge device is effectively improved.

The present utility model is not limited to the above-mentioned embodiments, but is not limited to the above-mentioned embodiments, and any simple modification, equivalent changes and modification made to the above-mentioned embodiments according to the technical matters of the present utility model can be made by those skilled in the art without departing from the scope of the present utility model.

Claims

1. An edge computing device with enhanced heat dissipation, comprising:

the main machine box is internally provided with an accommodating space, and the main machine boards are all arranged in the accommodating space of the main machine box;

the heat dissipation module is further connected to the outer side of the main case and comprises a plurality of heat dissipation fins and a plurality of heat dissipation channels formed among the heat dissipation fins; the heat radiation fins of the heat radiation module further comprise a plurality of heat conduction fins and a plurality of spacing pieces, the top of each heat conduction fin is provided with a bending guide structure, the heat conduction fins are arranged at intervals, and each spacing piece is arranged between the two heat conduction fins at intervals.

2. The edge computing device with enhanced heat dissipation effect according to claim 1, wherein the heat conducting fins at the central position of the heat dissipation module are T-shaped, and the heat conducting fins at the left and right sides of the heat dissipation module are L-shaped and are respectively bent toward the central heat conducting fins.

3. The edge computing device of claim 1 or 2, wherein the motherboard comprises a plurality of external sockets.

4. The edge computing device with enhanced heat dissipation as recited in claim 3, wherein the plurality of external sockets of the motherboard comprises a network card socket, a memory module socket, a radio frequency module socket, and a SIM card socket.

5. The edge computing device of claim 1 or 2, wherein the motherboard comprises a plurality of external interfaces.

6. The edge computing device with enhanced heat dissipation according to claim 5, wherein the external interface of the motherboard comprises a USB interface, a network interface, an external port, a power interface, and a fan interface.

7. The edge computing device with enhanced heat dissipation effect according to claim 1 or 2, wherein the mainframe box is provided with an interface front panel and an interface rear panel corresponding to the mainframe board at the front side and the rear side respectively, the mainframe box further comprises a detachable bottom plate and a detachable top plate, and the heat dissipation module is arranged above the top plate.