CN220307074U

CN220307074U - Switch magnetic resistance module

Info

Publication number: CN220307074U
Application number: CN202321917873.XU
Authority: CN
Inventors: 陆均尧; 郝文煊; 张鹏
Original assignee: Shandong Sli Microelectronics Co ltd
Current assignee: Qinku Technology Shenzhen Co ltd
Priority date: 2023-07-20
Filing date: 2023-07-20
Publication date: 2024-01-05
Anticipated expiration: 2033-07-20

Abstract

The utility model relates to the technical field of electronics, in particular to a switch reluctance module, which comprises: the power terminal comprises a bottom plate, wherein fixing columns which are symmetrical in pairs are arranged at four corners of the outer wall of one side of the bottom plate, a shell is arranged on the outer wall of each fixing column, power terminals are arranged at two ends of the shell, and a plurality of signal terminal pins are arranged on the side wall of one end of the shell; the beneficial effects are as follows: the Econodusal packaging is adopted, the module space is large, the accommodated chip is higher in specification, the area of the bottom plate is large, the heat dissipation performance is better, the chip arrangement is evenly dispersed, the temperature is evenly led out during operation, and the copper connecting bridge is firmer and more reliable and has stronger current carrying capacity.

Description

Switch magnetic resistance module

Technical Field

The utility model relates to the technical field of electronics, in particular to a switch reluctance module.

Background

In the field of IGBT module encapsulation, it belongs to microelectronic industry, IGBT is a device formed by conforming MOSFET and bipolar transistor, its input electrode is MOSFET, and its output electrode is PNP transistor, and it combines the advantages of these two devices, not only has the advantages of MOSFET device small driving power and quick switching speed, but also has the advantages of bipolar device with reduced saturation voltage and large capacity, its frequency characteristic is between MOSFET and power transistor, and can normally work in several tens KHZ frequency range, and can be extensively used in modern industrial electronic technology, such as frequency converter, air conditioner, welder, photovoltaic and automobile industry.

In the prior art, the switch reluctance motor is a novel speed regulating motor, is a new generation of speed regulating system after frequency conversion speed regulation, and the switch reluctance module plays an important role as a main device of power conversion, but in a high-power module, because the specification of a chip is large, the internal space of the module is limited, the heat dissipation of the chip is not timely, and the heat generation points are not uniform and are too concentrated to form module thermal failure; and too much current, the interior of the module cannot be provided with sufficient overcurrent medium due to space obstruction, so that the aluminum wires are loosened and overheated to cause failure. Therefore, the present utility model provides a switched reluctance module for solving the above-mentioned problems.

Disclosure of Invention

The utility model aims to provide a switch reluctance module, which is used for solving the problems that the switch reluctance motor proposed in the background art is a novel speed regulating motor and is a new generation of speed regulating system after frequency conversion speed regulation, and the switch reluctance module is used as a main device for power conversion and plays an important role, but in a high-power module, because the specification of a chip is large, the internal space of the module is limited, the heat dissipation of the chip is not timely, and the heat generation point is not uniform and is concentrated too intensively, so that the module is in thermal failure; and the current is too large, so that sufficient overcurrent medium cannot be supplied to the inside of the module due to space obstruction, and the problem of failure caused by loosening and overheating of the aluminum wire is caused.

In order to achieve the above purpose, the present utility model provides the following technical solutions: a switched reluctance module comprising:

the power circuit comprises a bottom plate, wherein fixing columns which are symmetrical in pairs are arranged at four corners of the outer wall of one side of the bottom plate, a shell is arranged on the outer wall of each fixing column, power ends are arranged at two ends of the shell, and a plurality of signal terminal pins are arranged on the side wall of one end of the shell;

the copper-clad substrate is characterized in that one side outer wall of the copper-clad substrate is fixedly connected with one side outer wall of the bottom plate, one side of the copper-clad substrate is provided with a plurality of chips and temperature acquisition sensors, the chips on the copper-clad substrate are divided into two half-bridges, and one end of the copper-clad substrate is provided with two half counter bores.

Preferably, the outer wall of one side of the bottom plate is fixedly connected with the side wall of one end of the fixed column, and the outer wall of the fixed column is spliced with the inner wall of the shell.

Preferably, the power ends are fixed at two ends by screws, and the power ends are connected with the chip by an aluminum wire connecting bridge.

Preferably, the signal terminal pin is fixed by welding, and the signal terminal is electrically connected with the chip.

Preferably, the chips are connected through aluminum wire connecting bridges, and copper connecting bridges are welded on the copper-clad substrate.

Preferably, the copper connecting bridge connects two half-bridges on the copper-clad substrate, and the copper connecting bridge has better overcurrent capacity and better firmness.

Compared with the prior art, the utility model has the beneficial effects that:

the Econodul packaging is adopted, the module space is large, and the accommodating chip specification is higher; the area of the bottom plate is large, the heat dissipation is better, the chip is distributed uniformly and dispersed, the temperature is led out uniformly during operation, and the copper connecting bridge is used more firmly and reliably, so that the current carrying capacity is stronger.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model.

In the figure: the device comprises a bottom plate 1, a fixed column 2, a shell 3, a mounting sleeve 4, a power end 5, a signal terminal pin 6, a copper-clad substrate 7, a chip 8, a temperature acquisition sensor 9, a copper connecting bridge 10 and a half counter bore 11.

Detailed Description

In order to make the objects, technical solutions, and advantages of the present utility model more apparent, the embodiments of the present utility model will be further described in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are some, but not all, embodiments of the present utility model, are intended to be illustrative only and not limiting of the embodiments of the present utility model, and that all other embodiments obtained by persons of ordinary skill in the art without making any inventive effort are within the scope of the present utility model.

In the description of the present utility model, it should be noted that the terms "center," "middle," "upper," "lower," "left," "right," "inner," "outer," "top," "bottom," "side," "vertical," "horizontal," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate description of the present utility model and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "a," an, "" the first, "" the second, "" the third, "" the fourth, "" the fifth, "and the sixth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

For purposes of brevity and description, the principles of the embodiments are described primarily by reference to examples. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the embodiments. It will be apparent, however, to one of ordinary skill in the art that the embodiments may be practiced without limitation to these specific details. In some instances, well-known methods and structures have not been described in detail so as not to unnecessarily obscure the embodiments. In addition, all embodiments may be used in combination with each other.

Referring to fig. 1, the present utility model provides a technical solution: a switched reluctance module comprising:

the power circuit comprises a base plate 1, two symmetrical fixing columns 2 are arranged at four corners of one side outer wall of the base plate 1, a shell 3 is arranged on the outer wall of the fixing columns 2, power ends 5 are arranged at two ends of the shell 3, a plurality of signal terminal pins 6 are arranged on one end side wall of the shell 1, one side outer wall of the base plate 1 is fixedly connected with one end side wall of the fixing columns 2, the outer wall of the fixing columns 2 is spliced with the inner wall of the shell 3, the power ends 5 are fixed at two ends by screws, and the power ends 5 are connected with a chip 8 through an aluminum wire connecting bridge;

the copper-clad substrate 7, one side outer wall of the copper-clad substrate 7 and one side outer wall of the bottom plate 1 are fixedly connected, a plurality of chips 8 and temperature acquisition sensors 9 are installed on one side of the copper-clad substrate 7, the chips on the copper-clad substrate 7 are divided into two half-bridges, two half counter bores 11 are formed in one end of the copper-clad substrate 7, the signal terminal pins 6 are fixed in a welding mode, the signal terminals 6 are electrically connected with the chips 8, all the chips 8 are connected through aluminum wire connecting bridges, copper connecting bridges 10 are welded on the copper-clad substrate 7, the copper connecting bridges 10 are connected with the two half-bridges on the copper-clad substrate 7, and the copper connecting bridges 10 are better in overcurrent capacity and better in firmness.

The device adopts Econodus encapsulation during operation, and the module space is big, holds the chip specification higher, and the bottom plate area is big, and the heat dispersion is better, and the chip is arranged evenly dispersed, and the temperature is evenly derived during operation, uses copper connecting bridge 10 more firm reliable, and the current-carrying capacity is stronger.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A switched reluctance module, characterized by: comprising the following steps:

the power circuit comprises a bottom plate (1), fixing columns (2) which are symmetrical in pairs are arranged at four corners of the outer wall of one side of the bottom plate (1), a shell (3) is arranged on the outer wall of each fixing column (2), power ends (5) are arranged at two ends of the shell (3), and a plurality of signal end pins (6) are arranged on the side wall of one end of the shell (3);

the copper-clad substrate (7), one side outer wall of copper-clad substrate (7) and one side outer wall fixed connection of bottom plate (1), a plurality of chips (8) and temperature acquisition sensor (9) are installed to one side of copper-clad substrate (7), the chip on copper-clad substrate (7) is divided into two half-bridges, two half counter bores (11) have been seted up to one end of copper-clad substrate (7).

2. The switched reluctance module of claim 1 wherein: the outer wall of one side of the bottom plate (1) is fixedly connected with the side wall of one end of the fixed column (2), and the outer wall of the fixed column (2) is spliced with the inner wall of the shell (3).

3. A switched reluctance module as claimed in claim 2, wherein: the power ends (5) are fixed at two ends by screws, and the power ends (5) are connected with the chip (8) through an aluminum wire connecting bridge.

4. A switched reluctance module as claimed in claim 3, wherein: the signal terminal pins (6) are fixed in a welding mode, and the signal terminal pins (6) are electrically connected with the chip (8).

5. The switched reluctance module of claim 4 wherein: the chips (8) are connected through aluminum wire connecting bridges, and copper connecting bridges (10) are welded on the copper-clad substrate (7).

6. The switched reluctance module of claim 5 wherein: the copper connecting bridge (10) is used for connecting the two half-bridges on the copper-clad substrate (7), and the copper connecting bridge (10) has better overcurrent capacity and better firmness.