CN220172085U - Wafer film sticking machine - Google Patents
Wafer film sticking machine Download PDFInfo
- Publication number
- CN220172085U CN220172085U CN202223406486.8U CN202223406486U CN220172085U CN 220172085 U CN220172085 U CN 220172085U CN 202223406486 U CN202223406486 U CN 202223406486U CN 220172085 U CN220172085 U CN 220172085U
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- Prior art keywords
- film
- wafer
- roller
- frame
- placing
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- 235000012431 wafers Nutrition 0.000 claims abstract description 177
- 238000005520 cutting process Methods 0.000 claims abstract description 81
- 239000000463 material Substances 0.000 claims abstract description 54
- 238000003825 pressing Methods 0.000 claims description 41
- 238000013519 translation Methods 0.000 claims description 8
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 3
- 238000004804 winding Methods 0.000 claims description 2
- 238000010030 laminating Methods 0.000 claims 3
- 238000007599 discharging Methods 0.000 claims 1
- 238000004064 recycling Methods 0.000 abstract 1
- 238000004801 process automation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000007517 polishing process Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a wafer film sticking machine which comprises a feed box, a receiving box, a wafer inserting and placing manipulator and a film sticking device, wherein the film sticking device comprises a film pulling mechanism, a wafer carrying table and a film cutting mechanism; the feeding box and the receiving box are used for placing wafers; the wafer inserting and placing manipulator is used for inserting and placing the wafers of the feed box into the wafer carrier and inserting and placing the wafers of the wafer carrier into the feed box; the film pulling mechanism comprises a film supply roller and a film collecting roller, wherein a film material is wound on the film supply roller, is discharged by the film supply roller, and is wound to the film collecting roller after horizontally tensioning and passing over the wafer carrier; the wafer carrying platform is positioned below the film material between the film supply roller and the film collecting roller and is used for carrying the wafer to lift so as to enable the wafer to be attached to the film material when the wafer is lifted; the film cutting mechanism is positioned above the film material between the film feeding roller and the film collecting roller and is opposite to the wafer carrier and used for cutting the film material along the edge of the wafer on the wafer carrier. The utility model realizes automatic feeding film pasting and recycling of the wafer, has simple equipment and saves space in layout.
Description
Technical Field
The utility model relates to the technical field of wafer production equipment, in particular to a wafer film sticking machine.
Background
Before polishing, a film needs to be adhered to the surface of the wafer to prevent the wafer from being broken and damaged in the polishing process.
The current part adopts artifical pad pasting, and efficiency is comparatively low, and though current device that can carry out wafer surface diaphragm and paste, degree of automation is not high, can't realize the wafer from getting to the pad pasting again to receive the full process automation of material, and efficiency remains to promote.
Disclosure of Invention
The utility model aims to provide a wafer film sticking machine, which overcomes the defects and realizes the whole process automation from taking out a film to sticking the film to collecting the film in the film sticking process of a wafer.
To achieve the above object, the solution of the present utility model is: the wafer film sticking machine comprises a feed box, a receiving box, a wafer inserting and placing manipulator and a film sticking device, wherein the film sticking device comprises a film pulling mechanism, a wafer carrying table and a film cutting mechanism;
the feeding box and the receiving box are used for placing wafers;
the wafer inserting and placing manipulator is used for inserting and placing the wafers of the feed box into the wafer carrier and inserting and placing the wafers of the wafer carrier into the feed box;
the film pulling mechanism comprises a film supply roller and a film collecting roller, wherein a film material is wound on the film supply roller, is discharged by the film supply roller, and is wound to the film collecting roller after horizontally tensioning and passing over the wafer carrier;
the wafer carrying platform is positioned below the film material between the film supply roller and the film collecting roller and is used for carrying the wafer to lift so as to enable the wafer to be attached to the film material when the wafer is lifted;
the film cutting mechanism is positioned above the film material between the film supply roller and the film collecting roller and is opposite to the wafer carrier and used for cutting the film material along the wafer edge on the wafer carrier.
Further, still include location camera, counterpoint platform, the location camera is used for gathering the wafer in the position on the wafer inserts and puts the manipulator, the wafer inserts and puts the manipulator and can get the wafer put in on the counterpoint platform, counterpoint platform communication connection the location camera, the counterpoint platform is used for driving the wafer of placing on it and carries out the displacement counterpoint.
Further, the wafer inserting and placing manipulator is arranged in the center of the frame, and the feeding box, the alignment platform, the film pasting device and the receiving box are sequentially arranged and arranged on the frame around the periphery of the wafer inserting and placing manipulator.
Further, the wafer inserting and placing manipulator comprises a lifting driving mechanism, a lifting frame, a rotary driving mechanism, a rotating frame, a telescopic driving mechanism and a wafer inserting plate, wherein the lifting driving mechanism is arranged on the frame and is connected with and drives the lifting frame to lift, the rotary driving mechanism is arranged on the lifting frame and is connected with and drives the rotating frame to horizontally rotate, and the telescopic driving mechanism is arranged on the rotating frame and is used for driving the wafer inserting plate to horizontally extend outwards or retract inwards.
Further, the film cutting mechanism comprises a film cutting mechanism fixing frame, a film cutting lifting driving mechanism, a film cutting motor, a film cutting knife rest and a film cutting blade, wherein the film cutting mechanism fixing frame is installed on the frame in a lifting manner through the film cutting lifting driving mechanism, the film cutting motor is fixed on the film cutting mechanism fixing frame and is connected with and driven by the film cutting knife rest to horizontally rotate, and the film cutting blade is fixed on the film cutting knife rest and is biased to a rotating shaft horizontally rotating by the film cutting knife rest and downwards extends out of the lower part of the film cutting mechanism.
Further, the film pulling mechanism further comprises a film pressing assembly, the film pressing assembly comprises a first film pressing roller, a second film pressing roller and a film pressing roller translation driving mechanism, the first film pressing roller and the second film pressing roller are arranged at the same height and are parallel to rotating shafts of the film supplying roller and the film collecting roller, a film material between the film supplying roller and the film collecting roller bypasses below the first film pressing roller and below the second film pressing roller, and the film pressing roller translation driving mechanism drives the first film pressing roller or the second film pressing roller to radially and horizontally displace.
Further, the film pulling mechanism further comprises a release paper receiving roller, wherein the release paper receiving roller is parallel to the rotating shafts of the film supply roller and the film receiving roller and is used for winding the release paper on the film material discharged by the film supply roller.
Further, the feeding box and the receiving box are opened towards one side of the wafer inserting and placing manipulator to form a box opening, and a plurality of layers of wafer slots for horizontally inserting wafers are arranged in the feeding box and the receiving box in a longitudinal array.
After the scheme is adopted, the beneficial effects of the utility model are as follows: the wafer inserting and placing manipulator is used for inserting and placing the wafers of the feed box on the wafer carrier so as to realize automatic material taking of the wafers; the wafer carrying platform is positioned below the film material between the film supply roller and the film receiving roller and is used for bearing the lifting of the wafer so that the wafer is attached to the film material conveyed between the film supply roller and the film receiving roller, and the film cutting mechanism is positioned above the film material between the film supply roller and the film receiving roller and is opposite to the wafer carrying platform and is used for cutting the film material along the edge of the wafer on the wafer carrying platform so that the film material forms a film sheet which is matched with the outline of the wafer, thereby automatically realizing film attachment of the wafer; and after the film is pasted, the wafer on the wafer carrying platform is inserted and placed into the material receiving box through the wafer inserting and placing mechanical arm, so that automatic material receiving of the wafer after the film is pasted is realized, and the whole process automation of the wafer from feeding to film pasting and material receiving is realized.
Drawings
FIG. 1 is a schematic perspective view of the present utility model;
FIG. 2 is an enlarged partial schematic view of the present utility model at A in FIG. 1;
FIG. 3 is a schematic top view of the present utility model;
FIG. 4 is a schematic diagram of a partially exploded view of a wafer handling robot according to the present utility model;
FIG. 5 is a schematic diagram of a three-dimensional structure of a film feeding roller, a film receiving roller and a release paper receiving roller for conveying film materials;
FIG. 6 is a schematic perspective view of a membrane module according to the present utility model;
fig. 7 is a schematic perspective view of a film cutting mechanism according to the present utility model.
Description of the reference numerals: the device comprises a 1-feeding box, a 2-receiving box, a 3-wafer inserting and placing manipulator, a 4-film pasting device, a 5-film pulling mechanism, a 6-wafer carrying platform, a 7-film cutting mechanism, an 8-wafer, a 9-film feeding roller, a 10-film receiving roller, an 11-film material, a 12-positioning camera, a 13-alignment platform, a 14-frame, a 15-lifting driving mechanism, a 16-lifting frame, a 17-rotation driving mechanism, a 18-rotating frame, a 19-telescopic driving mechanism, a 20-wafer inserting plate, a 21-film cutting mechanism fixing frame, a 22-film cutting motor, a 23-film cutting knife rest, a 24-film cutting knife blade, a 25-film pressing assembly, a 26-first film pressing roller, a 27-second film pressing roller, a 28-film pressing roller translation driving mechanism, a 29-release paper receiving roller, a 30-release paper, a 31-material box opening, a 32-wafer inserting groove and a 33-portal.
Detailed Description
The utility model will be described in detail with reference to the accompanying drawings and specific embodiments.
The utility model provides a wafer film sticking machine, which is shown in figures 1-7, and comprises a rack 14, a feed box 1, a receiving box 2, a wafer inserting and placing manipulator 3 and a film sticking device 4, wherein the feed box 1, the receiving box 2, the wafer inserting and placing manipulator 4 are arranged above the rack 14; the film pasting device 4 comprises a film pulling mechanism 5, a wafer carrying table 6 and a film cutting mechanism 7;
the supply box 1 and the receiving box 2 are used for placing the wafer 8, and in this embodiment, the supply box 1 and the receiving box 2 adopt the same structure, the supply box 1 and the receiving box 2 are opened at one side facing the wafer inserting and placing manipulator 3 to form a box opening 31, and a plurality of layers of wafer slots 32 for horizontally inserting the wafer 8 are longitudinally arranged in the supply box 1 and the receiving box 2 in an array manner;
the wafer inserting and placing manipulator 3 may be any existing manipulator capable of being used for inserting and placing the transfer wafer 8, and the wafer inserting and placing manipulator 3 is used for inserting and placing a wafer 8 in the feed box 1 onto the wafer carrier 6 for film pasting, and inserting and placing the wafer 8 with the film pasted on the wafer carrier 6 into the material receiving box 2;
the film pulling mechanism 5 comprises a film feeding roller 9 and a film collecting roller 10, wherein a film material 11 is wound on the film feeding roller 9, the film material 11 is discharged by the film feeding roller 9 when rotating along with the film feeding roller 9, and is wound to the film collecting roller 10 after horizontally tensioning and passing over the wafer carrying table 6, the structure for tensioning the film material 11 is not particularly limited, a plurality of rollers parallel to the axes of the film feeding roller 9 and the film collecting roller 10 can be adopted, after the film material 11 is wound by the film feeding roller 9, a plurality of rollers are sequentially wound, when the film material 11 is wound on a plurality of rollers, a section of horizontal section is formed above the wafer carrying table 6, and then wound to the film collecting roller 10, the film feeding roller 9 and the film collecting roller 9 are respectively driven by a motor to rotate, the two motors drive the film feeding roller 9 and the film collecting roller 10 to rotate in a differential mode, the film 11 between the film feeding roller 9 and the film collecting roller 10 can be tensioned, the film material 11 can be conveyed by a plurality of rollers parallel to the axes of the film feeding roller 9 and the film collecting roller 10, the film 11 is prevented from being adhered to the top surface of the film feeding roller 9, and the film material is further driven by a film collecting roller 29, and the film material is wound on the film collecting roller 10, and the film is prevented from being separated from the rotating from the film feeding roller 9 and being separated from the film feeding roller 5 by the rotating roller and the film feeding roller 30;
the wafer carrying platform 6 is positioned below a film material 11 horizontally tensioned between the film feeding roller 9 and the film collecting roller 10 and is used for carrying the wafer 8 to lift so as to enable the wafer 8 to be attached to the film material 11 when lifted, and a sufficient gap is reserved between the wafer carrying platform 6 and the film material 11 when the wafer carrying platform descends so that the wafer inserting and placing manipulator 3 extends into the wafer 8;
the film cutting mechanism 7 may be any existing device capable of cutting the film material 11 along the edge of the wafer, and the film cutting mechanism 7 is located above the film material 11 between the film feeding roller 9 and the film collecting roller 10 and opposite to the wafer carrier 6, and is used for cutting the film material 11 along the edge of the wafer 8 on the wafer carrier 6.
In order to ensure that the film material 11 cut by the film cutting mechanism 7 is consistent with the outline of the wafer 8 on the wafer carrying platform 6, the wafer 8 needs to be accurately placed on the wafer carrying platform 6, for this purpose, a positioning camera 12 and an alignment platform 13 are further arranged on the stand 14, and the positioning camera 12 is used for collecting the position of the wafer 8 on the wafer inserting and placing manipulator 3; the wafer inserting and placing manipulator 3 can take and place the wafer 8 on the alignment platform 13, the alignment platform 13 is in communication connection with the positioning camera, the alignment platform 13 is used for driving the wafer 8 placed on the alignment platform to carry out displacement alignment, the preset position of the wafer 8 on the wafer inserting and placing manipulator 3 is preset, after the wafer 8 is detected from the feed box 1 by the wafer inserting and placing manipulator 3, the positioning camera 12 collects the actual position of the wafer 8 on the wafer inserting and placing manipulator 3 and compares the actual position with the preset position, the wafer inserting and placing manipulator 3 places the wafer 8 on the alignment platform 13, the alignment platform carries out position adjustment compensation according to the actual position of the wafer 8 on the wafer inserting and placing manipulator 3, the wafer 3 is inserted again on the alignment platform 13, at the moment, the actual position of the wafer 8 on the wafer inserting and placing manipulator 3 is matched with the preset position, and then the wafer 8 is placed on the wafer placing manipulator 6, and the wafer 8 can be accurately placed on the wafer placing platform 6.
In order to make the equipment structure more compact, the wafer inserting and placing manipulator 3 is installed in the center of the frame 14, the feed box 1, the alignment platform 13, the film pasting device 4 and the receiving box 2 are sequentially arranged and installed on the frame 14 around the periphery of the wafer inserting and placing manipulator 3, the wafer inserting and placing manipulator 3 comprises a lifting driving mechanism 15, a lifting frame 16, a rotary driving mechanism 17, a rotating frame 18, a telescopic driving mechanism 19 and a wafer inserting plate 20, the lifting driving mechanism 15 is installed on the frame 14 and connected and driven to lift the lifting frame 16, the rotary driving mechanism 17 is installed on the lifting frame 16 and is lifted along with the lifting frame 16, the rotary driving mechanism 17 is connected and driven to horizontally rotate along with the rotating frame 18, the telescopic driving mechanism 19 is installed on the rotating frame 18 and horizontally rotates along with the rotating frame 18, the telescopic driving mechanism 19 is used for driving the wafer inserting plate 20 to horizontally or inwards shrink, the feed box 1, the alignment platform 13, the wafer carrying platform 6 and the receiving box 2 are all positioned on the radius of the wafer inserting plate 20, and the specific driving mechanism 17 is not limited by the lifting driving mechanism 15, and the specific driving mechanism is not specifically described.
In this embodiment, the film cutting mechanism 7 includes a film cutting mechanism fixing frame 21, a film cutting lifting driving mechanism, a film cutting motor 22, a film cutting knife rest 23 and a film cutting blade 24, the frame 14 includes a gantry 33 disposed above the frame 14, the film feeding roller 9, the film collecting roller 10 and the release paper collecting roller 29 are also mounted on the gantry 33, the film cutting lifting driving mechanism may be any existing lifting driving device, the film cutting mechanism fixing frame 21 is mounted on the gantry 33 in a lifting manner through the film cutting lifting driving mechanism, the film cutting motor 22 is fixed on the film cutting mechanism fixing frame 21, and is connected to drive the film cutting knife rest 23 to horizontally rotate, the film cutting blade 24 is fixed on the film cutting knife rest 23, and is biased to a rotating shaft horizontally rotating with the film cutting knife rest 23, the distance between the bottom knife tip of the film cutting blade 24 and the rotating axis of the film cutting knife rest 23 is equal to the radius of the wafer 8, and when the film cutting is required, the film feeding roller 9 and the film collecting roller 10 drive the film cutting knife rest 23 to rotate, and the film cutting knife rest 23 to drive the film cutting knife rest 23 to horizontally rotate, and the film cutting knife rest 23 to drive the film cutting motor 22 to rotate on the film cutting knife rest 23, and the film cutting knife rest 23 to drive the film cutting knife rest 11 to rotate on the film cutting knife rest 23. In a preferred embodiment, in order to enable the film material 11 to be adhered to the wafer 8 more smoothly, the film pulling mechanism 5 further includes a film pressing assembly 25, the film pressing assembly 25 includes a first film pressing roller 26, a second film pressing roller 27, and a film pressing roller translation driving mechanism 28, where the first film pressing roller 26 and the second film pressing roller 27 are disposed at the same height and are parallel to the rotation axes of the film feeding roller 9 and the film collecting roller 10, the film material 11 between the film feeding roller 9 and the film collecting roller 10 bypasses from below the first film pressing roller 26 and the second film pressing roller 27, and the film pressing roller translation driving mechanism 28 may be any conventional linear displacement driving mechanism, and the film pressing roller translation driving mechanism 28 drives the first film pressing roller 26 or the second film pressing roller 27 to radially and horizontally displace so as to press the film material 11 to roll and adhere the film material 11 on the upper surface of the wafer 8 before cutting the film material 11.
The above embodiments are only preferred embodiments of the present utility model, and are not limited to the present utility model, and all equivalent changes made according to the design key of the present utility model fall within the protection scope of the present utility model.
Claims (8)
1. The utility model provides a wafer film sticking machine which characterized in that: the wafer film laminating device comprises a feed box (1), a receiving box (2), a wafer inserting and placing manipulator (3) and a film laminating device (4), wherein the film laminating device (4) comprises a film pulling mechanism (5), a wafer carrying table (6) and a film cutting mechanism (7);
the feeding box (1) and the receiving box (2) are used for placing wafers (8);
the wafer inserting and placing manipulator (3) is used for inserting and placing the wafer (8) of the feed box (1) into the wafer carrying platform (6) and inserting and placing the wafer (8) of the wafer carrying platform (6) into the feed box (2);
the film pulling mechanism (5) comprises a film feeding roller (9) and a film collecting roller (10), wherein a film material (11) is wound on the film feeding roller (9), and the film material (11) is discharged from the film feeding roller (9) and is wound to the film collecting roller (10) after horizontally tensioning and passing over the wafer carrying table (6);
the wafer carrying table (6) is positioned below the film material (11) between the film supply roller (9) and the film collecting roller (10) and is used for carrying the wafer (8) to lift so as to enable the wafer (8) to be attached to the film material (11) when the wafer carrying table is lifted;
the film cutting mechanism (7) is positioned above the film material (11) between the film feeding roller (9) and the film collecting roller (10) and is opposite to the wafer carrying table (6) and used for cutting the film material (11) along the edge of the wafer (8) on the wafer carrying table (6).
2. A wafer laminator as defined in claim 1, wherein: still include location camera (12), counterpoint platform (13), location camera (12) are used for gathering wafer (8) are in the position on the wafer inserts and puts manipulator (3), wafer inserts and puts manipulator (3) can get wafer (8) put on counterpoint platform (13), counterpoint platform (13) communication connection location camera (12), counterpoint platform (13) are used for driving wafer (8) that place on it and carry out the displacement counterpoint.
3. A wafer laminator as defined in claim 2, wherein: still include frame (14), wafer inserts and puts manipulator (3) and install frame (14) central authorities, feed box (1), counterpoint platform (13), pad pasting device (4), receipts magazine (2) are around wafer inserts and puts manipulator (3) periphery arranges in proper order and installs on frame (14).
4. A wafer laminator as defined in claim 3, wherein: the wafer inserting and placing manipulator (3) comprises a lifting driving mechanism (15), a lifting frame (16), a rotary driving mechanism (17), a rotating frame (18), a telescopic driving mechanism (19) and a wafer inserting plate (20), wherein the lifting driving mechanism (15) is installed on a frame (14) and is connected with and drives the lifting frame (16) to lift, the rotary driving mechanism (17) is installed on the lifting frame (16) and is connected with and drives the rotating frame (18) to horizontally rotate, and the telescopic driving mechanism (19) is installed on the rotating frame (18) and is used for driving the wafer inserting plate (20) to horizontally extend outwards or retract inwards.
5. A wafer laminator as defined in claim 3, wherein: the film cutting mechanism (7) comprises a film cutting mechanism fixing frame (21), a film cutting lifting driving mechanism, a film cutting motor (22), a film cutting knife rest (23) and a film cutting blade (24), wherein the film cutting mechanism fixing frame (21) is installed on the frame (14) in a lifting mode through the film cutting lifting driving mechanism, the film cutting motor (22) is fixed on the film cutting mechanism fixing frame (21) and is connected to drive the film cutting knife rest (23) to horizontally rotate, and the film cutting blade (24) is fixed on the film cutting knife rest (23) and is biased to a rotating shaft horizontally rotating the film cutting knife rest (23) to downwards extend to the lower portion of the film cutting mechanism (7).
6. A wafer laminator as defined in claim 1, wherein: the film pulling mechanism (5) further comprises a film pressing assembly (25), the film pressing assembly (25) comprises a first film pressing roller (26), a second film pressing roller (27) and a film pressing roller translation driving mechanism (28), the first film pressing roller (26) and the second film pressing roller (27) are arranged at the same height and are parallel to rotating shafts of the film feeding roller (9) and the film collecting roller (10), a film material (11) between the film feeding roller (9) and the film collecting roller (10) bypasses below the first film pressing roller (26) and below the second film pressing roller (27), and the film pressing roller translation driving mechanism (28) drives the first film pressing roller (26) or the second film pressing roller (27) to horizontally displace radially.
7. A wafer laminator as defined in claim 1, wherein: the film pulling mechanism (5) further comprises a release paper collecting roller (29), wherein the release paper collecting roller (29) is parallel to the rotating shafts of the film feeding roller (9) and the film collecting roller (10) and is used for winding the release paper (30) on the film feeding roller (9) for discharging the film material (11).
8. A wafer laminator as defined in claim 1, wherein: the feeding box (1) and the receiving box (2) are opened towards one side of the wafer inserting and placing manipulator (3) to form a box opening (31), and a plurality of layers of wafer slots (32) for horizontally inserting wafers (8) are arranged in the feeding box (1) and the receiving box (2) in a longitudinal array.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223406486.8U CN220172085U (en) | 2022-12-19 | 2022-12-19 | Wafer film sticking machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202223406486.8U CN220172085U (en) | 2022-12-19 | 2022-12-19 | Wafer film sticking machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220172085U true CN220172085U (en) | 2023-12-12 |
Family
ID=89057046
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202223406486.8U Active CN220172085U (en) | 2022-12-19 | 2022-12-19 | Wafer film sticking machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220172085U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119153367A (en) * | 2024-11-14 | 2024-12-17 | 深圳市易天自动化设备股份有限公司 | Wafer UV film sticking machine |
-
2022
- 2022-12-19 CN CN202223406486.8U patent/CN220172085U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119153367A (en) * | 2024-11-14 | 2024-12-17 | 深圳市易天自动化设备股份有限公司 | Wafer UV film sticking machine |
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