CN220087815U - High-temperature-resistant circuit board for heating silica gel heating film - Google Patents
High-temperature-resistant circuit board for heating silica gel heating film Download PDFInfo
- Publication number
- CN220087815U CN220087815U CN202321522209.5U CN202321522209U CN220087815U CN 220087815 U CN220087815 U CN 220087815U CN 202321522209 U CN202321522209 U CN 202321522209U CN 220087815 U CN220087815 U CN 220087815U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- silica gel
- temperature resistant
- heating film
- high temperature
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000010438 heat treatment Methods 0.000 title claims abstract description 62
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 title claims abstract description 42
- 239000000741 silica gel Substances 0.000 title claims abstract description 42
- 229910002027 silica gel Inorganic materials 0.000 title claims abstract description 42
- 238000009413 insulation Methods 0.000 claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims description 9
- 230000001070 adhesive effect Effects 0.000 claims description 9
- 239000010425 asbestos Substances 0.000 claims description 8
- 229910052895 riebeckite Inorganic materials 0.000 claims description 8
- 229920000742 Cotton Polymers 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 claims description 7
- 239000000835 fiber Substances 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 5
- 229920001971 elastomer Polymers 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 14
- 239000010408 film Substances 0.000 description 31
- 229910001416 lithium ion Inorganic materials 0.000 description 3
- HBBGRARXTFLTSG-UHFFFAOYSA-N Lithium ion Chemical compound [Li+] HBBGRARXTFLTSG-UHFFFAOYSA-N 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Landscapes
- Resistance Heating (AREA)
Abstract
The utility model discloses a high-temperature-resistant circuit board for heating a silica gel heating film, which comprises a circuit board, wherein a circuit board body is arranged in the circuit board, high-temperature-resistant layers are arranged on the upper end face and the lower end face of the circuit board body, a heat insulation layer is arranged on one side of the two high-temperature-resistant layers, which is opposite to each other, support columns are arranged at four end corners of the upper end face of the circuit board, the upper end face of each support column is fixedly connected with a mounting plate, the upper end face of each mounting plate is provided with a groove, a plurality of positioning holes are uniformly formed in the upper end face of each groove, a plurality of springs are arranged on the front end face and the rear end face of the inner wall of each groove, and a U-shaped plate is fixedly connected with the other end of each spring. The utility model avoids the direct contact between the silica gel heating film and the circuit board, reduces heat transfer, has good high temperature resistance and heat insulation effect, and prolongs the service life of the circuit board in a high temperature environment.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a high-temperature-resistant circuit board for heating a silica gel heating film.
Background
Along with the development of new energy automobiles and energy storage technologies, the power battery technology is also continuously advancing. Power battery systems are also becoming increasingly popular in the automotive field. The lithium ion battery pack is formed by connecting a plurality of lithium ion battery cores together through a serial-parallel structure, and outputs the voltage, current and electric quantity required by a system. Lithium ion cells store or release electricity through chemical reactions, and it is well known that temperature has a significant effect on chemical reactions, particularly when the battery is in a low temperature environment below 0 ℃, and the battery is not allowed to charge. To meet the requirements of reliable and safe operation of the battery at low temperatures, it is necessary to add a thermal device to the surface of the battery to raise the temperature of the battery. The heating mode that comparatively uses at present is at battery module side whole piece pasting heating film, heats the battery core temperature to the operating temperature of adaptation through the heating film to guarantee the battery normal operating.
In order to reduce the occupied volume of the battery pack in the new energy source bicycle, a module is generally formed by the silica gel heating film and the circuit board. The silica gel heating film is made by sandwiching various resistance circuits made of metal foil between two insulating silicon rubber thin films, and has the advantages which are incomparable with many traditional thermal elements, such as long service life, strong corrosion resistance and continuous operation at high temperature. And the heating film can heat the circuit board in the heating process.
Small devices such as resistors and capacitors can be arranged on the existing circuit board, the heating film cannot be tightly adhered, the high-temperature resistance of the circuit board is poor, and the circuit board is easy to damage when used in a high-temperature environment; therefore, the existing requirements are not met, and a high-temperature-resistant circuit board for heating a silica gel heating film is provided.
Disclosure of Invention
The utility model aims to provide a high-temperature-resistant circuit board for heating a silica gel heating film, which solves the problems that small devices such as resistance and capacitance and the like are arranged on the conventional circuit board in the prior art, the heating film cannot be tightly adhered, the high-temperature resistance of the circuit board is poor, and the circuit board is easy to damage when used in a high-temperature environment.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a high temperature resistant circuit board for silica gel heating film heating, includes the circuit board, the inside of circuit board is provided with the circuit board body, the up end of circuit board body and lower terminal surface all are provided with high temperature resistant layer, two one side that high temperature resistant layer is on the back of the body is provided with the insulating layer, the support column is all installed to four terminal angles of circuit board up end, the up end fixedly connected with mounting panel of support column, the up end of mounting panel is provided with the recess, the up end of recess evenly is provided with a plurality of locating holes, a plurality of springs are all installed to the preceding terminal surface of recess inner wall and rear end face, the other end fixedly connected with U-shaped plate of spring, two one side that the U-shaped plate is relative is provided with the silica gel heating film, the lower terminal surface of silica gel heating film evenly is provided with a plurality of reference columns.
Preferably, the high temperature resistant layer is a ceramic fiber heat insulation cotton plate, and the heat insulation layer is made of asbestos materials.
Preferably, the high temperature resistant layer is tightly attached to the heat insulation layer and the circuit board body through high temperature resistant adhesive.
Preferably, two opposite sides of the outer surface of the U-shaped plate are fixedly connected with silica gel pads through clamping grooves.
Preferably, the positioning column is matched with the positioning hole, and the positioning column is fixedly connected with the silica gel heating film through a circular groove.
Preferably, a through groove is formed in the middle of one side of the upper end face of the mounting plate, a round hole is formed in the lower portion of the through groove, and rubber pads are fixedly connected to the upper portions of two sides of the inner wall of the through groove through adhesives.
Compared with the prior art, the utility model has the beneficial effects that:
1. according to the utility model, the support column and the mounting plate are arranged, the silica gel heating film is arranged in the mounting plate, the heating film is prevented from being directly adhered to the circuit board, small devices such as resistance and capacitance on the circuit board are prevented from being influenced, the silica gel heating film is not directly connected with the circuit board, part of heat transfer can be reduced, the temperature of the circuit board cannot be raised higher, the heat insulation layer and the high temperature resistant layer are arranged, the high temperature resistant layer is a ceramic fiber heat insulation cotton plate, the heat insulation layer is made of asbestos materials, the ceramic fiber heat insulation cotton plate is good in high temperature resistant effect, and the asbestos heat insulation effect is good, so that the circuit board body has good high temperature resistance and heat insulation effect, and meanwhile, the high temperature resistant layer is tightly adhered to the heat insulation layer and the circuit board body through the high temperature resistant adhesive, so that the high temperature resistance performance of the circuit board body is further improved, and the service life of the circuit board in a high temperature environment is prolonged.
Drawings
FIG. 1 is a schematic view of the overall structure of the present utility model;
FIG. 2 is a front cross-sectional view of the entire present utility model;
fig. 3 is a schematic view of a partial structure of a positioning column according to the present utility model.
In the figure: 1. a circuit board; 2. a mounting plate; 3. a groove; 4. heating a film by silica gel; 5. a U-shaped plate; 6. a through groove; 7. a thermal insulation layer; 8. a high temperature resistant layer; 9. a circuit board body; 10. a support column; 11. positioning columns; 12. positioning holes; 13. and (3) a spring.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.
Referring to fig. 1 to 3, an embodiment of the present utility model provides: a high temperature resistant circuit board for heating of silica gel heating film, including circuit board 1, circuit board 1's inside is provided with circuit board body 9, circuit board body 9's up end and lower terminal surface all are provided with high temperature resistant layer 8, one side that two high temperature resistant layers 8 are on the back is provided with insulating layer 7, support column 10 is all installed to four terminal angles of circuit board 1 up end, support column 10's up end fixedly connected with mounting panel 2, mounting panel 2's up end is provided with recess 3, recess 3's up end evenly is provided with a plurality of locating holes 12, a plurality of springs 13 are all installed to recess 3 inner wall's preceding terminal surface and rear end face, spring 13's other end fixedly connected with U-shaped board 5, one side that two U-shaped boards 5 are relative is provided with silica gel heating film 4, silica gel heating film 4's lower terminal surface evenly is provided with a plurality of reference columns 11.
The high-temperature resistant layer 8 is a ceramic fiber heat-insulating cotton plate, and the heat-insulating layer 7 is made of asbestos materials, so that the ceramic fiber heat-insulating cotton plate has good high-temperature resistant effect and good asbestos heat-insulating effect, and the circuit board body 9 has good high-temperature resistant and heat-insulating effects. The high-temperature resistant layer 8 is tightly attached to the heat insulation layer 7 and the circuit board body 9 through high-temperature resistant adhesive, so that the high-temperature resistance of the circuit board body 9 is further improved.
Two U-shaped plates 5 are all through draw-in groove fixedly connected with silica gel pad on one side that the surface is relative, prevent that U-shaped plate 5 from causing the damage to silica gel heating film 4. The reference column 11 and the locating hole 12 looks adaptation, reference column 11 and silica gel heating membrane 4 pass through circular slot fixed connection, and reference column 11 can insert the inboard of locating hole 12, improves the stability that reference column 11 and silica gel heating membrane 4 are connected.
The middle of mounting panel 2 up end one side is provided with logical groove 6, and the below of logical groove 6 is provided with the round hole, and the top of logical groove 6 inner wall both sides passes through the adhesive fixedly connected with rubber pad for the inboard of round hole can be gone into through logical groove 6 card to the electric wire of silica gel heating film 4, and can prevent that the electric wire from droing through being provided with the rubber pad.
This a high temperature resistant circuit board for silica gel heating film heating is when using, firstly place silica gel heating film 4 in the inboard of recess, the inboard of locating column 11 card income locating hole 12, U-shaped plate 5 is the inboard to silica gel heating film 4 centre gripping stability under the effect of spring 13, the inboard of round hole is gone into to the electric wire of silica gel heating film 4 through leading to groove 6 card, through being provided with support column 10 and mounting panel 2, install silica gel heating film 4 in mounting panel 2, avoid silica gel heating film 4 direct adhesion on circuit board 1, influence the little devices such as resistance electric capacity on circuit board 1, and silica gel heating film 4 is not direct connection with circuit board 1, can reduce a part heat transfer, the temperature of circuit board 1 can not intensify higher, through being provided with insulating layer 7, high temperature resistant layer 8 is ceramic fiber thermal insulation cotton board, insulating layer 7 is by asbestos material, high temperature resistant effect is good, asbestos thermal insulation effect is good, make circuit board body 9 have good high temperature resistant and thermal insulation effect, high temperature resistant layer 8 through high temperature resistant and insulating layer 7, circuit board body 9 laminating, the high temperature resistant adhesive of circuit board 9, further has improved circuit board 1, high temperature resistant layer 9 and high temperature resistant adhesive of heat resistant layer 9, the utility model is better heat resistant layer 1, the high temperature resistant plate 1 has the high temperature resistant effect of heat resistant and the circuit board is directly contacted with the circuit board, the high temperature resistant 1, the utility model, the high temperature resistant performance of the high temperature resistant pad is well 9, and has been improved the high temperature resistant effect of the utility model, and has been improved.
It will be evident to those skilled in the art that the utility model is not limited to the details of the foregoing illustrative embodiments, and that the present utility model may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (6)
1. A high temperature resistant circuit board for silica gel heating film heating, includes circuit board (1), its characterized in that: the inside of circuit board (1) is provided with circuit board body (9), the up end and the lower terminal surface of circuit board body (9) all are provided with high temperature resistant layer (8), two one side that high temperature resistant layer (8) are on the back of the body is provided with insulating layer (7), support column (10) are all installed at four terminal angles of circuit board (1) up end, up end fixedly connected with mounting panel (2) of support column (10), the up end of mounting panel (2) is provided with recess (3), the up end of recess (3) evenly is provided with a plurality of locating holes (12), a plurality of springs (13) are all installed to the preceding terminal surface and the rear end of recess (3) inner wall, the other end fixedly connected with U shaped plate (5) of spring (13), two one side that U shaped plate (5) are relative is provided with silica gel heating film (4), the lower terminal surface of silica gel heating film (4) evenly is provided with a plurality of reference columns (11).
2. The high temperature resistant circuit board for heating a silica gel heating film according to claim 1, wherein: the high-temperature resistant layer (8) is a ceramic fiber heat-insulating cotton plate, and the heat-insulating layer (7) is made of asbestos materials.
3. The high temperature resistant circuit board for heating a silica gel heating film according to claim 2, wherein: the high-temperature resistant layer (8) is tightly attached to the heat insulation layer (7) and the circuit board body (9) through high-temperature resistant adhesive.
4. The high temperature resistant circuit board for heating a silica gel heating film according to claim 1, wherein: and the opposite sides of the outer surfaces of the two U-shaped plates (5) are fixedly connected with silica gel pads through clamping grooves.
5. The high temperature resistant circuit board for heating a silica gel heating film according to claim 1, wherein: the positioning column (11) is matched with the positioning hole (12), and the positioning column (11) is fixedly connected with the silica gel heating film (4) through a circular groove.
6. The high temperature resistant circuit board for heating a silica gel heating film according to claim 1, wherein: the middle of one side of the upper end face of the mounting plate (2) is provided with a through groove (6), a round hole is formed below the through groove (6), and rubber pads are fixedly connected to the upper sides of two sides of the inner wall of the through groove (6) through adhesives.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321522209.5U CN220087815U (en) | 2023-06-15 | 2023-06-15 | High-temperature-resistant circuit board for heating silica gel heating film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321522209.5U CN220087815U (en) | 2023-06-15 | 2023-06-15 | High-temperature-resistant circuit board for heating silica gel heating film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220087815U true CN220087815U (en) | 2023-11-24 |
Family
ID=88816066
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321522209.5U Active CN220087815U (en) | 2023-06-15 | 2023-06-15 | High-temperature-resistant circuit board for heating silica gel heating film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220087815U (en) |
-
2023
- 2023-06-15 CN CN202321522209.5U patent/CN220087815U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204947033U (en) | Lithium secondary battery module | |
| CN206293500U (en) | A kind of electrostrictive polymer core power battery module for collecting radiating heating one | |
| CN211265578U (en) | Snake-shaped plate heating film for cylindrical battery cell module | |
| CN110718726A (en) | Cylindrical battery module cooling system and battery module | |
| CN217035868U (en) | Battery module, battery package and vehicle | |
| CN210866342U (en) | Equivalent temperature-equalizing battery module | |
| CN206532849U (en) | A kind of heat conductive silica gel vulcanization silica gel etching chip battery heating plate | |
| CN216698508U (en) | Battery module and battery pack | |
| CN205680760U (en) | A kind of new energy car battery bag heat management system | |
| CN220087815U (en) | High-temperature-resistant circuit board for heating silica gel heating film | |
| CN213340651U (en) | Battery module | |
| CN110635083A (en) | Rapid heating battery module | |
| CN110690529A (en) | Battery module fast dispels heat | |
| CN113346179B (en) | Automobile starting storage battery based on high-precision lamination process | |
| CN210866275U (en) | Rapid heating battery module | |
| CN108091801B (en) | Monomer battery with hexagonal honeycomb structure | |
| CN210576332U (en) | Cylindrical battery module cooling system and battery module | |
| CN210245575U (en) | Battery package integrated configuration | |
| CN220065891U (en) | Soaking plate, cylindrical cell battery module and electric vehicle | |
| CN108110152B (en) | Square battery pack based on honeycomb structure | |
| CN211907636U (en) | Lithium battery heating structure | |
| CN211959587U (en) | Structure for prolonging service life of flexible heating film of lithium battery | |
| CN217035787U (en) | Winding type temperature-equalizing heating device for battery | |
| CN206532848U (en) | A kind of polyimide film silica gel etches chip battery heating plate | |
| CN219476816U (en) | Low-temperature heating assembly and battery with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |