CN220020229U - Heat abstractor of computer processor - Google Patents

Abstract

The utility model discloses a heat dissipating device of a computer processor, which comprises a main board and a processor body, wherein four clamping blocks are fixedly connected to the surface of the main board, supporting rods are fixedly connected to the upper surfaces of the four clamping blocks, positioning plates are fixedly connected to the top ends of the four supporting rods, a heat dissipating assembly is arranged on the inner wall of each positioning plate and comprises two supporting plates, heat absorbing copper frames are fixedly connected to the opposite surfaces of the two supporting plates, and a water tank and a micropump are respectively and fixedly connected to the left side of each positioning plate. This heat abstractor of computer processor, heat absorption copper frame insert always in the surface of processor body, and the heat that the processor body gives off can directly transmit to in the heat absorption copper frame to the micropump can carry the flow with the intraductal cooling water of snakelike copper all the time, consequently the heat can transmit to snakelike copper pipe surface, and thereby through flowing the incessant flow of cooling water to improve transmission efficiency, thereby carry out radiating effect better through radiator fan.

Description

A heat dissipation device for a computer processor

Technical field

The utility model relates to the technical field of processor heat dissipation, and is specifically a heat dissipation device for a computer processor.

Background technique

Computer processor, also called CPU, is the core component of the computer and the final execution unit for information processing and program execution. Therefore, the processor is also the heart of the computer system. It includes two parts, namely the controller and the arithmetic unit. All components in the computer system The software layer operations will eventually be mapped to CPU operations through the instruction set. Since the processor will gradually dissipate heat over time and the size of the operation data during operation, in order to improve the protection effect of the processor, processing is generally The device performs separate heat dissipation;

After searching, the China Patent Network disclosed a radiator for computer processors (application number: 201920961488.2), which includes a motherboard 1. The upper side of the motherboard 1 is clamped with a CPU body 2, and the upper side of the CPU body 2 is covered with a heat absorption plate. 4. A spring 5 is fixedly connected to the upper side of the heat absorbing plate 4, and the other end of the spring 5 is fixedly connected to a connecting pipe 6. The connecting pipe 6 is connected to the heat dissipation ring 7, and the other end of the heat dissipation ring 7 is connected to the collecting pipe 10. The upper side of the collecting pipe 10 is fixedly welded with a connecting column 9, and the other end of the connecting column 9 is fixedly connected with a support frame 11 fixedly connected to the main board 1. The upper side of the support frame 11 is fixedly connected with a fan 8 through bolts to absorb heat. The connecting hose 3 is fixedly connected to the upper side of the plate 4, and the other end of the connecting hose 3 is fixedly connected to the connecting pipe 6. The heat dissipation ring 7 adopts a spiral structure, the heat dissipation ring 7 is made of brass, and the heat absorption plate 4 is made of brass. Material, the heat absorbing plate 4 is provided with a cavity, the heat absorbing plate 4, the connecting hose 3, the connecting pipe 6, the heat dissipation ring 7 and the collecting pipe 10 are all provided with thermal fluid, the collecting pipe 10 is made of brass, and the fan 8 is electrically connected to the motherboard 1 through wires;

When in use, the heat-absorbing plate 4 is connected to the CPU body 2, and then the support frame 11 is fixed to the motherboard 1 through bolts. When the CPU body 2 is working, due to the material of the heat-absorbing plate 4, the CPU body 2 The temperature can be quickly transferred to the heat-absorbing plate 4, and then the energy can be quickly transferred to the thermal fluid in the heat-absorbing plate 4, and then through the rapid transfer of the thermal fluid, the energy is transferred to the heat dissipation ring 7. Due to the heat dissipation ring 7 has a large heat dissipation area, so that the heat dissipation can be more sufficient. At the same time, the work of the fan 8 drives the overall air circulation, taking away the temperature on the heat dissipation ring 7, causing the temperature of the heat dissipation ring 7 to drop, and the heat transfer fluid will reduce the temperature again. The utility model has a simple structure and is easy to use. It can conduct temperature well, accelerate heat dissipation, reduce the temperature of the CPU, and protect the stable operation of the CPU. However, This application still has certain flaws in actual use, such as:

In this application, a heat-absorbing plate is used as a heat dissipation component to absorb the heat emitted by the processor to the heat-absorbing plate. At this time, the energy is transferred to the heat-dissipating ring through the thermal fluid in the heat-absorbing plate, and then the fan is used to drive the overall air circulation. The temperature on the heat sink is taken away. However, the thermal fluid in the heat absorbing plate does not directly contact the heat sink. That is, the thermal fluid cannot flow in the heat sink. As a result, when heat is transferred to the thermal fluid, the heat can only be transferred in the form of gas. When transferred to the surface of the heat dissipation ring, the heat conduction efficiency of this form is even worse, resulting in an insignificant heat dissipation effect on the processor, which causes certain inconvenience during use.

Utility model content

The purpose of this utility model is to provide a heat dissipation device for a computer processor to solve the problems raised in the above background technology.

In order to achieve the above purpose, the present invention provides the following technical solution: a heat dissipation device for a computer processor, which includes a motherboard and a processor body. Four clamping blocks are fixedly connected to the surface of the mainboard, and the upper surfaces of the four clamping blocks are evenly connected to each other. There are support rods fixedly connected, the tops of the four support rods are fixedly connected with positioning plates, and the inner walls of the positioning plates are equipped with heat dissipation components;

The heat dissipation assembly includes two support plates. The opposite surfaces of the two support plates are fixedly connected with heat-absorbing copper frames. The left side of the positioning plate is fixedly connected with a water tank and a micropump respectively. The output end of the micropump is connected with a serpentine copper pipe. , and the serpentine copper tube extends to the inside of the heat-absorbing copper frame, the right side of the positioning plate is fixedly connected to the motor, the output end of the motor is fixedly connected to the screw rod, the upper surface of the positioning plate is provided with a chute, and the inner wall of the chute slides An L-shaped positioning frame is connected. Three round holes are provided on the upper surface of the L-shaped positioning frame, and a cooling fan is installed on the inner wall of the round hole.

Preferably, two mounting bolts are threadedly connected to the sides of the four clamping blocks.

Preferably, the position of the positioning plate corresponds to the position of the motherboard, the position of the heat-absorbing copper frame corresponds to the position of the processor body, and the distance between the positioning plate and the motherboard is the combined height of the clamp block and the support rod. .

Preferably, the input end of the micro pump is connected to the inside of the water tank, and the end of the serpentine copper tube away from the micro pump is connected to the inside of the water tank.

Preferably, the left end of the screw rod extends to the inside of the chute and is rotationally connected with the inner wall of the chute.

Preferably, a screw hole is provided on the side of the L-shaped positioning frame, and the L-shaped positioning frame is threadedly connected to the screw rod through the screw hole.

beneficial effects

The utility model provides a heat dissipation device for a computer processor, which has the following beneficial effects:

1. In the heat dissipation device of this computer processor, the heat-absorbing copper frame is always inserted on the surface of the processor body. The heat emitted by the processor body can be directly transferred to the heat-absorbing copper frame, and the micro-pump can always remove the snake-shaped copper tube. The cooling water inside is transported and flowed, so the heat can be transferred to the surface of the serpentine copper tube, and the transfer efficiency is improved by the continuous flow of the flowing cooling water, so that the heat dissipation effect through the cooling fan is better.

2. In the heat dissipation device of the computer processor, the motor can drive the L-shaped positioning frame to move left and right on the inner wall of the chute through the screw rod. During the movement, the L-shaped positioning frame can drive three cooling fans to air vent the serpentine copper pipe. Cool down, thereby improving the heat dissipation effect on the surface of the serpentine copper tube, ensuring the uniformity of heat dissipation on the surface of the serpentine copper tube, and further improving the heat dissipation protection effect of the processor.

Description of the drawings

Figure 1 is a schematic diagram of the three-dimensional split structure of the utility model;

Figure 2 is a schematic diagram of the three-dimensional explosion structure of the positioning plate of the present utility model;

Figure 3 is a schematic cross-sectional view of the positioning plate of the present utility model.

In the picture: 1 motherboard, 2 processor body, 3 card block, 4 support rod, 5 positioning plate, 6 support plate, 7 heat-absorbing copper frame, 8 water tank, 9 micro pump, 10 serpentine copper tube, 11 motor, 12 Screw, 13L-shaped positioning frame, 14 cooling fan, 15 mounting bolts.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, not all implementations. example. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative efforts fall within the scope of protection of the present utility model.

Please refer to Figures 1-3. The present utility model provides a technical solution: a heat dissipation device for a computer processor, including a motherboard 1 and a processor body 2. Four card blocks 3 are fixedly connected to the surface of the motherboard 1. There are two mounting bolts 15 threaded on the sides of the block 3. The upper surfaces of the four blocks 3 are fixedly connected with support rods 4. The tops of the four support rods 4 are fixedly connected with positioning plates 5. The position of the positioning plate 5 is in line with the position of the positioning plate 5. The position of the main board 1 is corresponding, and the distance between the positioning plate 5 and the main board 1 is the combined height of the clamp 3 and the support rod 4. A heat dissipation component is installed on the inner wall of the positioning plate 5;

The heat dissipation assembly includes two support plates 6. The opposite surfaces of the two support plates 6 are fixedly connected to a heat-absorbing copper frame 7. The position of the heat-absorbing copper frame 7 corresponds to the position of the processor body 2. The left sides of the positioning plate 5 are respectively A water tank 8 and a micropump 9 are fixedly connected. The input end of the micropump 9 is connected with the inside of the water tank 8. The output end of the micropump 9 is connected with a serpentine copper tube 10, and the serpentine copper tube 10 is away from one end of the micropump 9. It is connected to the inside of the water tank 8, and the serpentine copper tube 10 extends to the inside of the heat-absorbing copper frame 7. A motor 11 is fixedly connected to the right side of the positioning plate 5, and the output end of the motor 11 is fixedly connected to a screw rod 12. The positioning plate A chute is provided on the upper surface of 5. The inner wall of the chute is slidingly connected with an L-shaped positioning frame 13. The left end of the screw rod 12 extends to the inside of the chute and is rotationally connected with the inner wall of the chute. The side of the L-shaped positioning frame 13 A screw hole is provided, and the L-shaped positioning frame 13 is threadedly connected to the screw rod 12 through the screw hole. Three round holes are provided on the upper surface of the L-shaped positioning frame 13, and a cooling fan 14 is installed on the inner wall of the round hole.

Referring to Figure 1, Figure 2 and Figure 3, first install the four clamping blocks 3 inside the chassis through the mounting bolts 15. The processor body 2 dissipates heat during operation, and the heat-absorbing copper frame 7 is always stuck in the processor body 2 surface, so it can absorb heat into the heat-absorbing copper frame 7. At this time, the micropump 9 can transport the coolant in the water tank 8 to the serpentine copper tube 10, and provide power to promote the coolant to flow in the serpentine copper tube. 10 continuously flows, so that the coolant is always in contact with the serpentine copper tube 10 and moves continuously, and the serpentine copper tube 10 can transfer the heat in the heat-absorbing copper frame 7 again. Due to the continuous flow of coolant inside, Therefore, the heat is transferred through the flow of coolant, which greatly improves the heat transfer efficiency, making the heat transfer to the surface of the serpentine copper tube 10 faster. At this time, the air circulation rate is increased through the cooling fan 14, which can dissipate the heat faster. The heat of the processor body 2 is thus reduced, thereby providing better protection to the processor body 2 .

In addition, the motor 11 can drive the L-shaped positioning frame 13 to move left and right on the inner wall of the chute through the screw rod 12, so that the three cooling fans 14 can continuously move on the positioning plate 5, and perform different positions of the serpentine copper tube 10. The air-cooling heat dissipation greatly increases the contact area between the wind force and the surface of the serpentine copper tube 10, thereby improving the dissipation efficiency of the surface temperature of the serpentine copper tube 10, making the air-cooling heat dissipation more uniform, further improving the heat dissipation effect, and making it more convenient to use. Safety.

Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art will understand that various changes and modifications can be made to these embodiments without departing from the principles and spirit of the present invention. , substitutions and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (6)

1. A heat dissipation device for a computer processor, including a motherboard (1) and a processor body (2), characterized in that: four card blocks (3) are fixedly connected to the surface of the motherboard (1), and the four card blocks are fixedly connected to the surface of the motherboard (1). The upper surfaces of the blocks (3) are fixedly connected with support rods (4), the tops of the four support rods (4) are fixedly connected with positioning plates (5), and the inner walls of the positioning plates (5) are equipped with heat dissipation components; The heat dissipation assembly includes two support plates (6). The opposite surfaces of the two support plates (6) are fixedly connected to a heat-absorbing copper frame (7). The left side of the positioning plate (5) is fixedly connected to a water tank (8). and the micropump (9), the output end of the micropump (9) is connected with a serpentine copper tube (10), and the serpentine copper tube (10) extends to the inside of the heat-absorbing copper frame (7), and the positioning plate (5) A motor (11) is fixedly connected to the right side of the motor (11), a screw rod (12) is fixedly connected to the output end of the motor (11), a chute is provided on the upper surface of the positioning plate (5), and the inner wall of the chute is slidingly connected with an L-shaped positioning Frame (13), the upper surface of the L-shaped positioning frame (13) is provided with three round holes, and a cooling fan (14) is installed on the inner wall of the round hole. 2. A heat dissipation device for a computer processor according to claim 1, characterized in that two mounting bolts (15) are threadedly connected to the sides of the four clamping blocks (3). 3. A heat dissipation device for a computer processor according to claim 1, characterized in that: the position of the positioning plate (5) corresponds to the position of the motherboard (1), and the position of the heat-absorbing copper frame (7) Corresponding to the position of the processor body (2), the distance between the positioning plate (5) and the motherboard (1) is the combined height of the clamping block (3) and the support rod (4). 4. A heat dissipation device for a computer processor according to claim 1, characterized in that: the input end of the micro pump (9) is connected with the inside of the water tank (8), and the serpentine copper tube (10) The end far away from the micropump (9) is connected with the inside of the water tank (8). 5. A heat dissipation device for a computer processor according to claim 1, characterized in that: the left end of the screw rod (12) extends to the inside of the chute and is rotationally connected with the inner wall of the chute. 6. A heat dissipation device for a computer processor according to claim 1, characterized in that: a screw hole is provided on the side of the L-shaped positioning frame (13), and the L-shaped positioning frame (13) is connected to the wire through the screw hole. The rod (12) is threaded.