CN219999853U - Heat radiation structure of server cabinet - Google Patents
Heat radiation structure of server cabinet Download PDFInfo
- Publication number
- CN219999853U CN219999853U CN202320950133.XU CN202320950133U CN219999853U CN 219999853 U CN219999853 U CN 219999853U CN 202320950133 U CN202320950133 U CN 202320950133U CN 219999853 U CN219999853 U CN 219999853U
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- heat dissipation
- fan
- server
- heat
- cabinet
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- 230000005855 radiation Effects 0.000 title claims description 9
- 239000004065 semiconductor Substances 0.000 claims abstract description 34
- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
- 238000005057 refrigeration Methods 0.000 claims description 16
- 230000001681 protective effect Effects 0.000 claims description 8
- 230000000694 effects Effects 0.000 abstract description 8
- 238000009434 installation Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 2
- 238000004891 communication Methods 0.000 description 12
- 238000012216 screening Methods 0.000 description 3
- 241000255925 Diptera Species 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 239000011435 rock Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the field of server cabinets and discloses a heat dissipation structure of a server cabinet. The heat dissipation mechanism comprises a cabinet body, wherein one side of the cabinet body is fixedly provided with the heat dissipation mechanism, the heat dissipation mechanism further comprises a main shell, the center of the inside of the main shell is fixedly provided with a fan installation seat, the inside of the fan installation seat is fixedly provided with a fan, the heat dissipation fins face the outer side of the cabinet body and are connected with the hot end of a semiconductor refrigerating sheet, and the heat conduction plate faces the inner wall of the cabinet body and is in contact with the cold end of the semiconductor refrigerating sheet. The semiconductor refrigerating sheet works, one end of the semiconductor refrigerating sheet, which is positioned in the cabinet body, is a cold end to generate low temperature, the low temperature is transmitted into the cabinet body through the heat conducting plate, meanwhile, the cooling air is blown to the server by the fan, the server is cooled, the heat dissipation effect of the server cabinet in a high-temperature environment is improved, and the heat generated by the hot end of the semiconductor refrigerating sheet is transmitted to the outside of the cabinet body through the heat dissipation fins.
Description
Technical Field
The utility model belongs to the technical field of server cabinets, and particularly relates to a heat dissipation structure of a server cabinet.
Background
The communication equipment is divided into wired communication equipment and wireless communication equipment, the wired communication equipment mainly solves serial port communication of industrial sites, communication of professional bus type, communication of industrial Ethernet and conversion equipment among various communication protocols, the wireless communication equipment mainly comprises equipment such as wireless AP, wireless network bridge, wireless network card, wireless lightning arrester, antenna and the like, along with development of communication and electronic integrated monitoring technology, the communication equipment is widely adopted, and the cabinet certainly becomes a basic unit and a carrier of the communication equipment.
In the patent document with the publication number of CN216532323U, a heat radiation structure for a cloud server cabinet is disclosed, the cabinet radiates heat to a server in a mechanism through a heat radiation fan, when the external environment temperature is higher, the wind temperature generated by the heat radiation fan is also higher, the heat radiation effect is poorer, and in order to solve the problem, the heat radiation structure for the server cabinet is provided.
Disclosure of Invention
The utility model aims at: in order to solve the problem of poor heat dissipation effect in the high-temperature environment, the heat dissipation structure of the server cabinet is provided.
The technical scheme adopted by the utility model is as follows: the utility model provides a heat radiation structure of server rack, includes fixed mounting in the heat dissipation mechanism of rack body one side, heat dissipation mechanism still includes the main casing, the inside center through connection of main casing has the fan mount pad, fan mount pad internally mounted has the fan, the inside upper and lower both ends of main casing are equal fixed mounting has the semiconductor refrigeration piece, semiconductor refrigeration piece both sides outer wall respectively fixed mounting have fin and heat conduction board, fin is "L" type structure, fin one end contacts with the hot junction of semiconductor refrigeration piece, and the other end extends the main casing, the heat conduction board towards rack body inner wall and with the cold junction contact of semiconductor refrigeration piece, the one end that the semiconductor refrigeration piece was kept away from to the heat conduction board sets up in the rack body inside.
Through adopting above-mentioned technical scheme, when daily use server rack, dispel the heat to inside the server rack through the fan, when external environment temperature is higher, the work of semiconductor refrigeration piece, it is located inside one end of server rack and produces low temperature for the cold junction, the low temperature passes through the heat-conducting plate and transmits to inside the server rack, cooperate the fan simultaneously with the cold wind blow to the server, cool down the server, improve the radiating effect of server rack under high temperature environment, the heat that the semiconductor refrigeration piece hot junction produced is outside through radiating fin conduction to the rack body.
In a preferred embodiment, the heat radiating fin and the heat conducting plate are fixed by bolts.
By adopting the technical scheme, the radiating fins and the heat conducting plate are tightly attached to the semiconductor refrigerating sheet, so that the heat conducting effect is improved.
In a preferred embodiment, the outer walls of the left and right sides of the main housing are integrally provided with connecting seats, and the main housing is fixedly mounted outside the cabinet body through the connecting seat and the bolts.
In a preferred embodiment, the outer wall of the fan mounting seat is fixedly provided with a protective net.
In a preferred embodiment, the specification of the protection net is 300 meshes.
By adopting the technical scheme, the meshes of the protective net can effectively prevent external mosquitoes and the like from entering.
In a preferred embodiment, the air inlet and the air outlet of the fan are both provided with cover nets.
Through adopting above-mentioned technical scheme, cover the net and can avoid the rack body to take place to rock or after live time is too long, the circuit mistake of inside advance cause the fan rotate the time with the circuit emergence winding phenomenon of entering.
In summary, due to the adoption of the technical scheme, the beneficial effects of the utility model are as follows:
when external environment temperature is higher, the semiconductor refrigeration piece work, and its one end that is located inside the server rack is the cold junction and produces low temperature, and low temperature passes through the heat-conducting plate and transmits to inside the server rack, and the cooperation fan blows the cold wind to the server simultaneously, cools down the server, improves the radiating effect of server rack under high temperature environment, and the heat that the semiconductor refrigeration piece hot junction produced is outside through radiating fin conduction to the rack body.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of a heat dissipation mechanism according to the present utility model;
FIG. 3 is a top cross-sectional view of a heat dissipating mechanism according to the present utility model;
fig. 4 is a schematic structural view of a heat dissipating fin according to the present utility model.
The marks in the figure: 1. a cabinet body; 2. a heat dissipation mechanism; 3. a main housing; 4. a fan mounting base; 5. a fan; 6. a semiconductor refrigeration sheet; 7. a heat radiation fin; 8. a heat conductive plate; 9. a connecting seat; 10. and a protective net.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions in the embodiments of the present utility model will be clearly and completely described in the following in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples:
referring to fig. 1 and 2, a heat dissipation structure of a server cabinet includes a heat dissipation mechanism 2 fixedly installed at one side of a cabinet body 1, the heat dissipation mechanism 2 further includes a main casing 3, a fan mounting seat 4 is penetratingly connected to an inner center of the main casing 3, and the fan mounting seat 4 penetrates into the cabinet body 1. The fan 5 is installed in the fan installation seat 4, the cover net is installed at the air inlet and the air outlet of the fan 5, and when the server cabinet is used daily, heat is dissipated to the inside of the server cabinet through the fan 5. The outer wall of the fan mounting seat 4 is fixedly provided with the protective screening 10, the mesh number of the protective screening 10 is 300 meshes, and the mesh holes of the protective screening 10 can effectively prevent external mosquitoes and the like from entering.
Referring to fig. 3 and 4, semiconductor refrigerating sheets 6 are fixedly installed at both upper and lower ends inside the main housing 3, and a fan 5 is located between the two semiconductor refrigerating sheets 6 to avoid interference. The outer walls of two sides of the semiconductor refrigerating sheet 6 are respectively and fixedly provided with radiating fins 7 and heat conducting plates 8, the radiating fins 7 are of L-shaped structures, one ends of the radiating fins 7 are in contact with the hot ends of the semiconductor refrigerating sheet 6, the other ends of the radiating fins 7 extend out of the main shell 3 from the top wall or the bottom wall of the main shell 3, the heat conducting plates 8 face the inner wall of the cabinet body 1 and are in contact with the cold ends of the semiconductor refrigerating sheet 6, one ends of the heat conducting plates 8, far away from the semiconductor refrigerating sheet 6, are arranged inside the cabinet body 1, when the external environment temperature is higher, the semiconductor refrigerating sheet 6 works, one ends of the semiconductor refrigerating sheet 6, which are positioned inside the cabinet body 1, generate low temperature for the cold ends, are transmitted to the inside of the server cabinet through the heat conducting plates 8, meanwhile cool air is blown to the server by matching with the fan 5, the cooling effect of the server cabinet in the high temperature environment is improved, and heat generated by the hot ends of the semiconductor refrigerating sheet 6 is conducted outside the cabinet body 1 through the radiating fins 7.
Referring to fig. 2 and 3, the heat dissipation fins 7 and the heat conduction plate 8 are fixed by bolts, so that the heat dissipation fins 7 and the heat conduction plate 8 are tightly attached to the semiconductor refrigeration sheet, the heat conduction effect is improved, the outer walls on the left side and the right side of the main casing 3 are uniformly provided with the connecting seats 9, and the main casing 3 is fixedly installed outside the cabinet 1 body by matching the bolts with the connecting seats 9.
Referring to fig. 2, the air inlet and the air outlet of the fan 5 are both provided with a cover net, which can prevent the cabinet from winding with the incoming line when the fan rotates due to the false inlet of the internal line after shaking or long service time.
The implementation principle of the embodiment of the heat dissipation structure of the server cabinet is as follows:
when the server cabinet is used daily, the fan 5 is used for radiating the inside of the server cabinet, when the external environment temperature is higher, the semiconductor refrigerating sheet 6 works, one end of the semiconductor refrigerating sheet, which is positioned inside the cabinet body 1, generates low temperature for the cold end, the low temperature is transmitted to the inside of the server cabinet through the heat conducting plate 8, meanwhile, the fan 5 is matched for blowing cold air to the server, the temperature of the server is reduced, the radiating effect of the server cabinet in the high temperature environment is improved, and the heat generated by the hot end of the semiconductor refrigerating sheet 6 is transmitted to the outside of the cabinet body 1 through the radiating fins 7.
The above embodiments are only for illustrating the technical solution of the present utility model, and are not limiting; although the utility model has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present utility model.
Claims (6)
1. A heat radiation structure of a server cabinet is characterized in that: including fixed mounting in radiating mechanism (2) of rack body (1) one side, radiating mechanism (2) still includes main casing (3), main casing (3) inside center through-connection has fan mount pad (4), fan mount pad (4) internally mounted has fan (5), both ends all fixed mounting have semiconductor refrigeration piece (6) about main casing (3) inside, semiconductor refrigeration piece (6) both sides outer wall respectively fixed mounting have radiating fin (7) and heat conduction board (8), radiating fin (7) are "L" type structure, radiating fin (7) one end and the hot junction contact of semiconductor refrigeration piece (6), and main casing (3) are extended to the other end, heat conduction board (8) face rack body (1) inner wall and with the cold junction contact of semiconductor refrigeration piece (6), the one end that semiconductor refrigeration piece (6) were kept away from to heat conduction board (8) sets up in rack body (1) inside.
2. The heat dissipation structure of a server cabinet as recited in claim 1, wherein: the radiating fins (7) and the heat conducting plate (8) are fixed through bolts.
3. The heat dissipation structure of a server cabinet as recited in claim 1, wherein: the outer walls of the left side and the right side of the main shell (3) are uniformly provided with connecting seats (9), and the main shell (3) is fixedly arranged outside the cabinet body (1) through the connecting seats (9) in cooperation with bolts.
4. The heat dissipation structure of a server cabinet as recited in claim 1, wherein: the outer wall of the fan mounting seat (4) is fixedly provided with a protective net (10).
5. The server rack heat dissipation structure as recited in claim 4, wherein: the specification of the protective net (10) is 300 meshes.
6. The heat dissipation structure of a server cabinet as recited in claim 1, wherein: the air inlet and the air outlet of the fan (5) are both provided with cover nets.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320950133.XU CN219999853U (en) | 2023-04-25 | 2023-04-25 | Heat radiation structure of server cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320950133.XU CN219999853U (en) | 2023-04-25 | 2023-04-25 | Heat radiation structure of server cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219999853U true CN219999853U (en) | 2023-11-10 |
Family
ID=88616230
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320950133.XU Active CN219999853U (en) | 2023-04-25 | 2023-04-25 | Heat radiation structure of server cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219999853U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119396254A (en) * | 2024-10-08 | 2025-02-07 | 苏州元脑智能科技有限公司 | Servers and Data Centers |
-
2023
- 2023-04-25 CN CN202320950133.XU patent/CN219999853U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119396254A (en) * | 2024-10-08 | 2025-02-07 | 苏州元脑智能科技有限公司 | Servers and Data Centers |
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