CN219899806U - Buffer structure of stamping die for metal product processing - Google Patents
Buffer structure of stamping die for metal product processing Download PDFInfo
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- CN219899806U CN219899806U CN202320837672.2U CN202320837672U CN219899806U CN 219899806 U CN219899806 U CN 219899806U CN 202320837672 U CN202320837672 U CN 202320837672U CN 219899806 U CN219899806 U CN 219899806U
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- buffer
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- product processing
- stamping
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- 239000002184 metal Substances 0.000 title claims abstract description 20
- 238000003466 welding Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 description 6
- 230000003139 buffering effect Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Abstract
The utility model provides a buffer structure of a stamping die for metal product processing, which comprises a base and a buffer mechanism. When the buffer structure of the stamping die for metal product processing is used, an external power supply is connected, then stamping is started, the press machine is started, the upper die can be driven to move downwards rapidly, the upper die is matched with the lower die to stamp a part, when impact force is generated between the upper die and the lower die, the buffer spring is compressed, the buffer spring is matched with the damper to buffer the impact force received by the upper mounting plate, when the lower die is subjected to the impact force, the lower die vibrates, the lower die can drive the lower supporting plate to vibrate, the supporting plate vibrates, and the vibration of the supporting plate can be buffered through the cooperation among the supporting plate, the stand column, the spring, the buffer cylinder and the mounting base, so that the purpose of constructing the buffer structure of the stamping die is achieved.
Description
Technical Field
The utility model relates to the technical field of stamping dies, in particular to a buffer structure of a stamping die for metal product processing.
Background
At present, a die used for stamping is called a stamping die, namely a stamping die for short; the stamping die is a special tool for processing materials into required stamping parts in batches, is important in stamping, and is difficult to carry out in batch stamping production without a stamping die meeting the requirements; without advanced dies, advanced stamping processes cannot be realized; the stamping process, the die, the stamping equipment and the stamping material form three elements of stamping, and stamping parts can be obtained only by combining the three elements, and meanwhile, the buffer structure can protect a processed product in the stamping process, so that the buffer structure of the stamping die for processing the metal product is particularly needed.
However, the existing stamping die does not have a buffer structure in the use process, and when the upper die is driven by the press to press down, the upper die and the lower die are damaged due to large impact force.
Disclosure of Invention
The utility model aims to provide a buffer structure of a stamping die for metal product processing, which aims to solve the problem that the existing stamping die provided in the background art does not have a buffer structure in the use process, and the upper die and the lower die are damaged due to larger impact force when the upper die is driven to press down by a press machine.
In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a stamping die's buffer structure for metal product processing, includes base and buffer gear, the bottom of base is provided with anti-skidding subassembly, the top of base is provided with the pole setting, the top of pole setting is provided with the roof, the bottom of roof is provided with buffer gear, the bottom of roof is provided with the press, the bottom of press is provided with the telescopic link, the bottom of telescopic link is provided with the lifter plate, the bottom of lifter plate is provided with buffer spring, one side of buffer spring is provided with the attenuator, the bottom of attenuator is provided with the mounting panel, the bottom of mounting panel is provided with the mould, the bottom of going up the mould is provided with the bed die, the bottom of bed die is provided with the backup pad, the backup pad bottom is provided with the backing sheet, the bottom of backing sheet is provided with the stand, the outside of stand is provided with the spring, the bottom of stand is provided with the buffer tube, the bottom of buffer tube is provided with the installation base.
Preferably, the anti-slip assembly comprises a supporting block and an anti-slip pad, wherein the supporting block is arranged at the bottom end of the base, and the anti-slip pad is arranged at the bottom end of the supporting block.
Preferably, a telescopic structure is formed between the press and the telescopic rod, and welding is performed between the press and the top plate.
Preferably, the buffer springs are connected with the lifting plate through clamping grooves, the buffer springs are provided with four groups, and the dampers are connected with the lifting plate through clamping grooves.
Preferably, the upper die is connected with the mounting plate through a clamping groove, and the supporting plate is connected with the lower die through a clamping groove.
Preferably, a telescopic structure is formed between the spring and the buffer cylinder, and the upright post is movably connected with the spring.
Preferably, the mounting base is connected with the base through a clamping groove, and five groups of mounting bases are arranged.
Compared with the prior art, the utility model has the beneficial effects that: this stamping die's for metal product processing buffer structure, through the press, the telescopic link, the lifter plate, buffer spring, the attenuator, the mounting panel, the cope match-plate pattern, the bed die, the backup pad, the backing sheet, the stand, the spring, buffer tube and installation base's setting, when using, install cope match-plate pattern and bed die respectively in the backup pad that is located the top and is located the below, switch on external power source earlier, then begin the punching press, open the press, the press starts, can drive the cope match-plate pattern and move down fast, cope match-plate pattern and bed die carry out the punching press to the part, when producing the impact force between cope match-plate pattern and the bed die, buffer spring is compressed, buffer spring can cushion the impact force that the mounting panel that is located the top received to the mounting panel cooperation attenuator that the top produced, the bed die vibration when the bed die received the impact force, the bed die can drive the backup pad vibration that is located the below, the backup pad vibration, cooperation between through backing sheet, the stand, buffer tube and installation base can play the cushioning effect to the vibration of backup pad, can prevent like this and prevent to go up the impact force between mould and the bed die and cause the impact force to the metal product to the purpose of constructing the punching press structure.
Drawings
FIG. 1 is a schematic overall perspective view of the present utility model;
FIG. 2 is a schematic view of a press according to the present utility model;
FIG. 3 is a schematic view of a buffer cartridge according to the present utility model;
fig. 4 is a schematic view of the overall planar structure of the present utility model.
In the figure: 1. a base; 2. an anti-slip assembly; 201. a support block; 202. an anti-slip pad; 3. a vertical rod; 4. a top plate; 5. a buffer mechanism; 501. a press; 502. a telescopic rod; 503. a lifting plate; 504. a buffer spring; 505. a damper; 506. a mounting plate; 507. an upper die; 508. a lower die; 509. a support plate; 510. a support sheet; 511. a column; 512. a spring; 513. a buffer tube; 514. and (5) installing a base.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, the present utility model includes a base 1 and a buffer mechanism 5, wherein the bottom end of the base 1 is provided with an anti-slip component 2, the top end of the base 1 is provided with a vertical rod 3, the top end of the vertical rod 3 is provided with a top plate 4, the bottom end of the top plate 4 is provided with the buffer mechanism 5, the bottom end of the top plate 4 is provided with a press machine 501, the bottom end of the press machine 501 is provided with a telescopic rod 502, the bottom end of the telescopic rod 502 is provided with a lifting plate 503, the bottom end of the lifting plate 503 is provided with a buffer spring 504, one side of the buffer spring 504 is provided with a damper 505, the bottom end of the damper 505 is provided with a mounting plate 506, the bottom end of the mounting plate 506 is provided with an upper mold 507, the bottom end of the upper mold 507 is provided with a lower mold 508, the bottom end of the lower mold 508 is provided with a support plate 509, the bottom end of the support plate 509 is provided with a support plate 510, the bottom end of the support plate 510 is provided with a column 511, the outer side of the column 511 is provided with a spring 512, the bottom of the column 511 is provided with a buffer cylinder 513, and the bottom of the buffer cylinder 513 is provided with a mounting base 514. The anti-slip assembly 2 comprises the supporting block 201 and the anti-slip pad 202, the supporting block 201 is arranged at the bottom end of the base 1, and the anti-slip pad 202 is arranged at the bottom end of the supporting block 201, so that the stability of the device can be improved, and the device is prevented from sliding when in use. A telescopic structure is formed between the press 501 and the telescopic rod 502, and welding is adopted between the press 501 and the top plate 4 to provide power for metal product processing. The buffer springs 504 are connected with the lifting plate 503 through clamping grooves, four groups of buffer springs 504 are arranged, and the dampers 505 are connected with the lifting plate 503 through clamping grooves to play a role in buffering the upper die 507 during operation. The upper die 507 is connected with the mounting plate 506 through a clamping groove, and the supporting plate 509 is connected with the lower die 508 through a clamping groove, so that the dies can be replaced conveniently. A telescopic structure is formed between the spring 512 and the buffer drum 513, and the upright column 511 is movably connected with the spring 512 to buffer the lower die 508 during operation. The mounting base 514 is connected with the base 1 through clamping grooves, five groups of mounting bases 514 are arranged, and the multiple groups of designs can prevent the die from being damaged due to large impact force during stamping.
Working principle: when the buffer structure of the stamping die for metal product processing is used, the upper die and the lower die are firstly respectively arranged on the upper mounting plate 506 and the lower mounting plate 509, an external power supply is connected, then stamping is started, the press 501 is opened, the press 501 is started and can drive the upper die to move downwards rapidly, the upper die 507 is matched with the lower die 508 to stamp a part, when impact force is generated between the upper die 507 and the lower die 508, the buffer spring 504 is compressed, the buffer spring 504 is matched with the buffer 505 to buffer the impact force received by the upper mounting plate 506, when the lower die 508 is subjected to the impact force, the lower die vibrates, the lower die drives the lower mounting plate 509 to vibrate, and the support plate 509 can play a buffering role in buffering the vibration of the support plate 509 through the matching between the support plate 510, the upright post 511, the spring 512 and the buffer drum 513 and the mounting base 514, so that the impact force between the upper die 507 and the lower die 508 can be prevented from damaging the upper die, the lower die and the metal product, and the buffer process of the metal product processing is finished by using the stamping die.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The utility model provides a stamping die's buffer structure for metalwork processing, includes base (1) and buffer gear (5), its characterized in that: the utility model discloses a buffer drum, including base (1), mounting panel (506) are provided with pole setting (3) on the top, the bottom of pole setting (3) is provided with roof (4), the bottom of roof (4) is provided with buffer gear (5), the bottom of roof (4) is provided with press (501), the bottom of press (501) is provided with telescopic link (502), the bottom of telescopic link (502) is provided with lifter plate (503), the bottom of lifter plate (503) is provided with buffer spring (504), one side of buffer spring (504) is provided with attenuator (505), the bottom of attenuator (505) is provided with mounting panel (506), the bottom of mounting panel (506) is provided with cope match-up die (507), the bottom of cope match-up die (507) is provided with bed die (508), the bottom of drag-up die (508) is provided with backup pad (509), the bottom of backup pad (509) is provided with backup pad (510), the bottom of backup pad (510) is provided with stand (511), one side (511) is provided with buffer drum (511), the bottom end of the buffer drum (513) is provided with a mounting base (514).
2. The buffer structure of a stamping die for metal product processing according to claim 1, wherein the anti-slip assembly (2) comprises a supporting block (201) and an anti-slip pad (202), the bottom end of the base (1) is provided with the supporting block (201), and the bottom end of the supporting block (201) is provided with the anti-slip pad (202).
3. The buffer structure of a stamping die for metal product processing according to claim 1, wherein a telescopic structure is formed between the press (501) and the telescopic rod (502), and welding is performed between the press (501) and the top plate (4).
4. The buffer structure of the stamping die for metal product processing according to claim 1, wherein the buffer springs (504) are connected with the lifting plate (503) through clamping grooves, the buffer springs (504) are provided with four groups, and the dampers (505) are connected with the lifting plate (503) through clamping grooves.
5. The buffer structure of a stamping die for metal product processing according to claim 1, wherein the upper die (507) is connected to the mounting plate (506) by a clamping groove, and the support plate (509) is connected to the lower die (508) by a clamping groove.
6. The buffer structure of a stamping die for metal product processing according to claim 1, wherein a telescopic structure is formed between the spring (512) and the buffer drum (513), and the upright post (511) is movably connected with the spring (512).
7. The buffer structure of a stamping die for metal product processing according to claim 1, wherein the mounting base (514) is connected with the base (1) by a clamping groove, and five groups of mounting bases (514) are arranged.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320837672.2U CN219899806U (en) | 2023-04-16 | 2023-04-16 | Buffer structure of stamping die for metal product processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320837672.2U CN219899806U (en) | 2023-04-16 | 2023-04-16 | Buffer structure of stamping die for metal product processing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219899806U true CN219899806U (en) | 2023-10-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320837672.2U Active CN219899806U (en) | 2023-04-16 | 2023-04-16 | Buffer structure of stamping die for metal product processing |
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| CN (1) | CN219899806U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121042439A (en) * | 2025-11-03 | 2025-12-02 | 南通鼎昌模具科技有限公司 | Accurate press is used in automobile parts production |
-
2023
- 2023-04-16 CN CN202320837672.2U patent/CN219899806U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN121042439A (en) * | 2025-11-03 | 2025-12-02 | 南通鼎昌模具科技有限公司 | Accurate press is used in automobile parts production |
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