CN219804873U - Electronic component adhesive deposite device - Google Patents
Electronic component adhesive deposite device Download PDFInfo
- Publication number
- CN219804873U CN219804873U CN202320469994.6U CN202320469994U CN219804873U CN 219804873 U CN219804873 U CN 219804873U CN 202320469994 U CN202320469994 U CN 202320469994U CN 219804873 U CN219804873 U CN 219804873U
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- Prior art keywords
- glue
- fixing
- electronic component
- top surface
- pipe
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- 239000000853 adhesive Substances 0.000 title claims description 4
- 230000001070 adhesive effect Effects 0.000 title claims description 4
- 239000003292 glue Substances 0.000 claims abstract description 86
- 238000003756 stirring Methods 0.000 claims abstract description 38
- 239000007921 spray Substances 0.000 claims abstract description 7
- 230000007246 mechanism Effects 0.000 claims description 16
- 238000005507 spraying Methods 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 4
- 238000007664 blowing Methods 0.000 abstract 2
- 239000000243 solution Substances 0.000 description 20
- 238000004026 adhesive bonding Methods 0.000 description 9
- 238000009434 installation Methods 0.000 description 7
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000005070 sampling Methods 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses an electronic component dispensing device, which relates to the technical field of electronic components, and comprises an operation table, wherein a fixing frame is fixedly arranged on the top surface of the operation table, a glue barrel is arranged on the top surface of the fixing frame, a fixing plate is fixedly arranged in the bottom of the fixing frame, an electric lifting rod is detachably arranged in the middle of the bottom surface of the fixing plate, a dispensing component is detachably arranged at the output end of the electric lifting rod, a stirring device is arranged in the glue barrel, the stirring shaft is driven to rotate through the output end of a motor, a plurality of stirring blades arranged on the surface of a fixing ring are driven to rotate while the stirring shaft rotates, glue solution stored in the glue barrel is stirred through the stirring blades, the glue solution in the glue barrel is stirred through the stirring device, the dispensing effect is improved, hot air generated by a hot air blower is conveyed into two air blowing pipes through air outlet pipes, the hot air is uniformly sprayed out through a plurality of spray heads arranged on the surfaces of the two air blowing pipes, and the chip completed by the glue is timely dried.
Description
Technical Field
The utility model relates to the technical field of electronic components, in particular to an electronic component dispensing device.
Background
The electronic components are made by utilizing and controlling the electronic motion law in vacuum, gas or solid, and are divided into an electric vacuum device, an air charging tube device and a solid electronic device, and the electronic components are subjected to rectification, amplification, modulation, oscillation, frequency conversion, phase locking, control, correlation and other functions in an analog circuit, and are subjected to sampling, amplitude limiting, logic, storage, counting, delay and the like in a digital circuit, and the components can be pre-fixed by dispensing the chip, so that the electronic components are beneficial to automatic production.
However, when some of the conventional dispensing devices perform dispensing treatment on electronic components, the glue solution for dispensing cannot be stirred, the glue solution is easy to coagulate, so that the dispenser is blocked, the dispensing quality is poor, and secondly, the adhesion between the chip and the main board cannot be dried in time after the dispensing is completed, so that the adhesion between the main board and the chip is weak, and the misplacement is easy to occur.
Disclosure of Invention
In order to solve the problems that when the traditional part of glue dispensing devices are used for dispensing electronic components, glue liquid for dispensing cannot be stirred, the glue liquid is easy to coagulate, the glue dispensing device is blocked, the glue dispensing quality is poor, and secondly, the adhesion between a chip and a main board cannot be dried in time after the glue dispensing is finished, so that the adhesion between the main board and the chip is weak and the misplacement is easy; the utility model aims to provide an electronic component dispensing device.
In order to solve the technical problems, the utility model adopts the following technical scheme: the utility model provides an electronic components adhesive deposite device, the operation panel is including the top surface fixed mounting of operation panel, the top surface of mount is installed and is glued the bucket, fixed mounting has the fixed plate in the bottom of mount, demountable installation has electric lift pole in the middle of the bottom surface of fixed plate, demountable installation has the point to glue the subassembly in the output of electric lift pole, install agitating unit in the glue bucket, agitating unit includes the motor, the output fixed mounting of motor has the (mixing) shaft, the fixed ring of evenly distributed is installed to the fixed surface mounting of (mixing) shaft, the fixed surface mounting of fixed ring has evenly distributed's stirring leaf, when the glue solution that needs to use to deposit in the glue bucket carries out the point to the chip to glue, open the switch of the motor in the agitating unit, drive the (mixing) shaft through the output of motor and rotate, drive a plurality of fixed ring surface mounting's stirring leaves and rotate, stir the glue solution that deposits in the glue bucket through the stirring leaf, stir the glue solution in to glue bucket, the effect of glue in the improvement point glue, the quality of electronic components.
Preferably, the top surface demountable installation of fixed plate has the air heater, the output of air heater is installed out the tuber pipe, the tip fixedly connected with tuber pipe that spouts out the tuber pipe, the surface mounting of two tuber pipes has evenly arranged's shower nozzle, open the switch of air heater, carry the hot-blast to two tuber pipes through the tuber pipe that go out that the air heater produced, evenly spout hot-blast through a plurality of shower nozzles of two tuber pipe surface mounting, carry out timely stoving processing to the chip that the point was glued and accomplish, install conveying mechanism in the top surface of operation panel, conveying mechanism and point glue the subassembly mutually support, place the chip that will take the point to glue on conveying mechanism, carry the chip to the point in proper order through conveying mechanism and transfer to the just under of gluing the subassembly, carry out the point to glue through the point through the cooperation electric lifter of point glue the subassembly and handle, the chip that the point was glued and accomplish, carry through conveying mechanism carry, carry out the hot-blast to the chip point that the shower nozzle spouts glues and carry out the stoving processing.
Preferably, the fixed plate top surface is located one side demountable installation of air heater has the pump body, the conveying pipeline is installed to the output of pump body, the conveying pipeline is installed in the point subassembly of gluing, the conveying pipeline is mutually supported with the point subassembly of gluing, install fixedly to the pump body through the fixed plate, open the switch of the pump body, under the work of the pump body, glue solution that deposits in the glue barrel is poured into the point subassembly of gluing into, fixed mounting has the inlet pipe in the middle of the bottom surface of glue barrel, the end connection of inlet pipe has the pump body, the pump body mutually supports through inlet pipe and glue barrel, open the switch of the pump body, under the cooperation of inlet pipe and conveying pipeline, make glue solution that deposits in the glue barrel flow into the point subassembly of gluing, carry out the point through the point subassembly and glue the chip that needs the point to glue.
Preferably, fixed mounting has the dead lever in the both sides of mount, and the fixed knot is installed to one side symmetry of two dead levers, installs the air-jet pipe in two fixed knots, installs two dead levers in the both sides of mount and fixes, installs fixedly two air-jet pipes through two fixed knots of two dead lever one side symmetry installations, and the bottom surface both sides fixed mounting of operation panel has the supporting leg, and two supporting legs mutually support with the operation panel, support fixedly through the equipment of two supporting legs to operation panel top surface installation, install this device at appointed region and work.
Compared with the prior art, the utility model has the beneficial effects that:
1. when glue solution stored in the glue barrel is required to be used for dispensing glue on the chip, a switch of a motor in the stirring device is turned on, the stirring shaft is driven to rotate through the output end of the motor, a plurality of stirring blades arranged on the surface of the fixing ring are driven to rotate while the stirring shaft rotates, the glue solution stored in the glue barrel is stirred through the stirring blades, the glue solution in the glue barrel is stirred through the stirring device, the glue dispensing effect is improved, and the quality of electronic components is improved;
2. in the utility model, the switch of the air heater is turned on, hot air generated by the air heater is conveyed into the two air spraying pipes through the air outlet pipe, the hot air is uniformly sprayed out through a plurality of spray heads arranged on the surfaces of the two air spraying pipes, and the chip subjected to dispensing is timely dried.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Figure 1 is a schematic diagram of the structure of the present utility model,
figure 2 is a front view of the overall structure of the present utility model,
FIG. 3 is a schematic view of the stirring device in the rubber barrel,
fig. 4 is an enlarged schematic view of the structure at a of the present utility model.
In the figure: 1. an operation table; 11. support legs; 2. a fixing frame; 21. a fixing plate; 22. a fixed rod; 3. a glue barrel; 31. a feed pipe; 4. a stirring device; 41. a motor; 42. a stirring shaft; 43. a fixing ring; 44. stirring the leaves; 5. a pump body; 51. a material conveying pipe; 6. an air heater; 62. an air outlet pipe; 63. an air spraying pipe; 64. a spray head; 65. a fixing buckle; 7. an electric lifting rod; 8. dispensing assembly; 9. and a conveying mechanism.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples: as shown in fig. 1-4, the utility model provides an electronic component dispensing device, which comprises an operation table 1, a fixing frame 2 is fixedly arranged on the top surface of the operation table 1, a glue barrel 3 is arranged on the top surface of the fixing frame 2, a fixing plate 21 is fixedly arranged in the bottom of the fixing frame 2, an electric lifting rod 7 is detachably arranged in the middle of the bottom surface of the fixing plate 21, a dispensing component 8 is detachably arranged at the output end of the electric lifting rod 7, a stirring device 4 is arranged in the glue barrel 3, the stirring device 4 comprises a motor 41, a stirring shaft 42 is fixedly arranged at the output end of the motor 41, a uniformly distributed fixing ring 43 is fixedly arranged on the surface of the stirring shaft 42, uniformly distributed stirring blades 44 are fixedly arranged on the surface of the fixing ring 43, when glue solution stored in the glue barrel 3 is required to be used for dispensing a chip, the motor 41 switch in the stirring device 4 is turned on, the stirring shaft 42 is driven to rotate through the output end of the motor 41, and simultaneously, a plurality of stirring blades 44 arranged on the surface of the fixing ring 43 are driven to rotate, the glue solution stored in the glue barrel 3 is processed through the stirring blades 44, the glue solution stored in the glue barrel 3 is stirred, the quality of the glue solution is dispensed in the stirring device is improved, and the electronic component dispensing device is improved.
The top surface of the fixed plate 21 is detachably provided with an air heater 6, the output end of the air heater 6 is provided with an air outlet pipe 62, the end part of the air outlet pipe 62 is fixedly connected with an air spraying pipe 63, and the surfaces of the two air spraying pipes 63 are fixedly provided with evenly arranged spray heads 64;
through adopting above-mentioned technical scheme, open the switch of air heater 6, in carrying two air-jetting pipes 63 with the hot-blast of air heater 6 production through air-out pipe 62, evenly spout hot-blast through a plurality of shower nozzles 64 of two air-jetting pipe 63 surface mounting, carry out timely drying treatment to the chip that the point gluing was accomplished.
A conveying mechanism 9 is arranged in the top surface of the operating platform 1, and the conveying mechanism 9 is matched with the dispensing assembly 8;
through adopting above-mentioned technical scheme, place the chip that needs the point to glue on conveying mechanism 9, carry the chip in proper order to the point through conveying mechanism 9 and glue the subassembly 8 under, glue the subassembly 8 through the point and cooperate electric lift pole 7 to carry out the point to glue the processing to the chip, the chip that the point was glued and is accomplished, carry through conveying mechanism 9, carry out drying treatment through shower nozzle 64 spun hot-blast to the chip point department of gluing.
The top surface of the fixing plate 21 is positioned on one side of the air heater 6, a pump body 5 is detachably arranged, a conveying pipe 51 is arranged at the output end of the pump body 5, the conveying pipe 51 is arranged in the dispensing assembly 8, and the conveying pipe 51 is matched with the dispensing assembly 8;
through adopting above-mentioned technical scheme, install fixedly through fixed plate 21 to the pump body 5, open the switch of pump body 5, under the work of pump body 5, pour into the glue solution that deposits in the glue barrel 3 into in the point glue subassembly 8.
A feeding pipe 31 is fixedly arranged in the middle of the bottom surface of the rubber barrel 3, the end part of the feeding pipe 31 is connected with a pump body 5, and the pump body 5 is matched with the rubber barrel 3 through the feeding pipe 31;
through adopting above-mentioned technical scheme, open the switch of the pump body 5, under the cooperation of inlet pipe 31 and conveying pipeline 51, make the glue solution that deposits in the glue barrel 3 flow into in the point subassembly 8 of gluing, carry out the point through the subassembly 8 of gluing and glue the chip that needs the point to glue and handle.
The fixing rods 22 are fixedly arranged in the two sides of the fixing frame 2, the fixing buckles 65 are symmetrically arranged on one side of the two fixing rods 22, and the air spraying pipes 63 are arranged in the two fixing buckles 65;
by adopting the above technical scheme, two fixing rods 22 are installed and fixed in two sides of the fixing frame 2, and two air injection pipes 63 are installed and fixed by two fixing buckles 65 symmetrically installed on one sides of the two fixing rods 22.
Support legs 11 are fixedly arranged on two sides of the bottom surface of the operation table 1, and the two support legs 11 are matched with the operation table 1;
through adopting above-mentioned technical scheme, support fixedly through the equipment of two supporting legs 11 to operation panel 1 top surface installations, install this device and work in appointed region.
Working principle: when glue solution stored in the glue barrel 3 is required to be used for dispensing a chip, a switch of a motor 41 in a stirring device 4 is turned on, an output end of the motor 41 drives a stirring shaft 42 to rotate, the stirring shaft 42 rotates and simultaneously drives a plurality of stirring blades 44 mounted on the surface of a fixing ring 43 to rotate, the glue solution stored in the glue barrel 3 is stirred through the stirring blades 44, the glue solution in the glue barrel 3 is stirred through the stirring device 4, the glue dispensing effect is improved, the quality of electronic components is improved, the chip required to be subjected to glue is placed on a conveying mechanism 9, the chip is sequentially conveyed to the normal position of a glue dispensing assembly 8 through the conveying mechanism 9, the chip subjected to glue dispensing treatment is matched with an electric lifting rod 7 through the glue dispensing assembly 8, the chip subjected to glue dispensing treatment is conveyed through the conveying mechanism 9, and the chip dispensing position is dried through hot air sprayed by a spray head 64;
the switch of the air heater 6 is turned on, hot air generated by the air heater 6 is conveyed into the two air spraying pipes 63 through the air outlet pipe 62, the hot air is uniformly sprayed out through a plurality of spray heads 64 arranged on the surfaces of the two air spraying pipes 63, and the chip subjected to dispensing completion is timely dried.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present utility model without departing from the spirit or scope of the utility model. Thus, it is intended that the present utility model also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (7)
1. The utility model provides an electronic components adhesive deposite device, includes operation panel (1), its characterized in that: the automatic glue dispensing device is characterized in that a fixing frame (2) is fixedly arranged on the top surface of the operating table (1), a glue barrel (3) is arranged on the top surface of the fixing frame (2), a fixing plate (21) is fixedly arranged in the bottom of the fixing frame (2), an electric lifting rod (7) is detachably arranged in the middle of the bottom surface of the fixing plate (21), and a glue dispensing assembly (8) is detachably arranged at the output end of the electric lifting rod (7);
install agitating unit (4) in glue bucket (3), agitating unit (4) include motor (41), the output fixed mounting of motor (41) has (mixing) shaft (42), the fixed surface of (mixing) shaft (42) installs evenly distributed's solid fixed ring (43), the fixed surface of solid fixed ring (43) installs evenly distributed's stirring leaf (44).
2. An electronic component dispensing device according to claim 1, wherein the top surface of the fixing plate (21) is detachably provided with a hot air blower (6), an air outlet pipe (62) is installed at the output end of the hot air blower (6), an air spraying pipe (63) is fixedly connected to the end part of the air outlet pipe (62), and evenly arranged spray heads (64) are fixedly installed on the surfaces of the two air spraying pipes (63).
3. An electronic component dispensing device according to claim 1, characterized in that a conveying mechanism (9) is arranged in the top surface of the operating table (1), and the conveying mechanism (9) is mutually matched with the dispensing assembly (8).
4. An electronic component dispensing device according to claim 2, characterized in that the top surface of the fixing plate (21) is located at one side of the air heater (6) and is detachably provided with a pump body (5), the output end of the pump body (5) is provided with a conveying pipe (51), the conveying pipe (51) is arranged in the dispensing assembly (8), and the conveying pipe (51) is mutually matched with the dispensing assembly (8).
5. An electronic component dispensing device according to claim 1, characterized in that a feeding pipe (31) is fixedly arranged in the middle of the bottom surface of the glue barrel (3), the end part of the feeding pipe (31) is connected with a pump body (5), and the pump body (5) is mutually matched with the glue barrel (3) through the feeding pipe (31).
6. An electronic component dispensing device according to claim 1, wherein fixing rods (22) are fixedly arranged in two sides of the fixing frame (2), fixing buckles (65) are symmetrically arranged on one sides of the two fixing rods (22), and air spraying pipes (63) are arranged in the two fixing buckles (65).
7. An electronic component dispensing device according to claim 1, characterized in that supporting legs (11) are fixedly arranged on two sides of the bottom surface of the operating table (1), and the two supporting legs (11) are mutually matched with the operating table (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320469994.6U CN219804873U (en) | 2023-03-13 | 2023-03-13 | Electronic component adhesive deposite device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202320469994.6U CN219804873U (en) | 2023-03-13 | 2023-03-13 | Electronic component adhesive deposite device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN219804873U true CN219804873U (en) | 2023-10-10 |
Family
ID=88212033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202320469994.6U Active CN219804873U (en) | 2023-03-13 | 2023-03-13 | Electronic component adhesive deposite device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN219804873U (en) |
-
2023
- 2023-03-13 CN CN202320469994.6U patent/CN219804873U/en active Active
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| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |