CN219678709U - High light transmittance heating structure - Google Patents
High light transmittance heating structure Download PDFInfo
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- CN219678709U CN219678709U CN202320925019.1U CN202320925019U CN219678709U CN 219678709 U CN219678709 U CN 219678709U CN 202320925019 U CN202320925019 U CN 202320925019U CN 219678709 U CN219678709 U CN 219678709U
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- China
- Prior art keywords
- electrothermal conversion
- conversion layer
- protective layer
- heating structure
- transmittance
- Prior art date
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- 238000002834 transmittance Methods 0.000 title claims abstract description 32
- 238000010438 heat treatment Methods 0.000 title claims abstract description 28
- 238000006243 chemical reaction Methods 0.000 claims abstract description 44
- 239000010410 layer Substances 0.000 claims abstract description 41
- 239000011241 protective layer Substances 0.000 claims abstract description 26
- 229910044991 metal oxide Inorganic materials 0.000 claims abstract description 4
- 150000004706 metal oxides Chemical class 0.000 claims abstract description 4
- 238000001771 vacuum deposition Methods 0.000 claims abstract description 3
- 239000000758 substrate Substances 0.000 claims description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 6
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000395 magnesium oxide Substances 0.000 claims description 3
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims description 3
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims description 3
- 229910001120 nichrome Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011787 zinc oxide Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- Surface Heating Bodies (AREA)
Abstract
The embodiment of the utility model provides a high-light-transmittance heating structure, wherein a high-light-transmittance heating film comprises a base material, an electrothermal conversion layer, an electrode and a protective layer, wherein the electrothermal conversion layer is a conductive film formed on the base material through metal oxide vacuum coating; the electrothermal conversion layer is used for electrothermal conversion when being electrified; the light transmittance of the electrothermal conversion layer is more than 50%; the electrodes are arranged on two sides of the electrothermal conversion layer and are used for being connected with a power supply; the protective layer covers the electrothermal conversion layer, and the refractive index of the protective layer is lower than that of the electrothermal conversion layer. The transparent electrothermal conversion layer is sputtered with a protective layer with low refractive index, so that the light transmittance of the electrothermal conversion layer is obviously improved, and the heating structure has high light transmittance.
Description
Technical Field
The utility model relates to the technical field of heating of transparent heating films, in particular to a high-transmittance heating structure.
Background
In the past, in transparent heating products, one is to pre-embed opaque heating wires in transparent substrates to realize the electric heating function of the products, such as the heating and snow melting functions of automobile glass, but a large amount of opaque heating wires exist in the products, so that the complete light transmission effect of the products cannot be realized. Another is to realize an electrothermal heating function using a transparent conductive thin film formed of indium tin oxide (hereinafter also referred to as "ITO") or the like as a heat generating layer, and to achieve high conductivity, a thick film is required because of the inherent low conductivity of the material of ITO, and the transmittance is reduced due to the color of ITO itself as the thickness of ITO increases, so that the effect of full transparency of the heated product is achieved, but the transmittance is generally lower than 70% or less due to the reduction of the transmittance of the entire product, and thus, some applications in high transmittance scenes cannot be satisfied. In order to overcome the above drawbacks, to achieve the effect that the transmittance is greater than 70% on the premise of achieving the full transparency of the heating product, it is necessary to improve the transmittance of the heating product to which the ITO conductive film is applied.
Disclosure of Invention
The embodiment of the utility model provides a high-transmittance heating structure, which aims to solve one or more technical problems in the prior art.
In a first aspect, an embodiment of the present utility model provides a high light transmittance heating structure, including:
a substrate;
the electrothermal conversion layer is a conductive film formed on the substrate through metal oxide vacuum coating; the electrothermal conversion layer is used for electrothermal conversion when being electrified; the light transmittance of the electrothermal conversion layer is more than 50%;
the electrodes are arranged on two sides of the electrothermal conversion layer and are used for being connected with a power supply;
and the protective layer covers the electrothermal conversion layer, and the refractive index of the protective layer is lower than that of the electrothermal conversion layer.
In a preferred embodiment, the protective layer includes at least one of silicon dioxide, zinc oxide, aluminum oxide, magnesium oxide, and titanium oxide.
In a preferred embodiment, the protective layer has a thickness of 15 to 150nm.
In a preferred embodiment, the thickness of the electrothermal conversion layer is 10 to 150nm.
In a preferred embodiment, the thickness of the electrode is greater than the thickness of the protective layer, which is disposed in a recess formed between two of the electrodes.
In a preferred embodiment, the electrothermal conversion layer comprises nichrome, silicon carbide, znOxS (1-x), inOxS (1-x), snxIn (1-x) O, znxMg (1-x) O, znxAl (1-x) O, niO, cu 2 One of O and SnO.
One of the above technical solutions has the following advantages or beneficial effects: the utility model has the advantages that the protective layer with low refractive index is sputtered on the transparent electrothermal conversion layer, the light transmittance of the electrothermal conversion layer is obviously improved, the heating structure has high light transmittance, and the protective layer can be provided for the electrothermal conversion layer so as to improve the scratch resistance.
The foregoing summary is for the purpose of the specification only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present utility model will become apparent by reference to the drawings and the following detailed description.
Drawings
In the drawings, the same reference numerals refer to the same or similar parts or elements throughout the several views unless otherwise specified. The figures are not necessarily drawn to scale. It is appreciated that these drawings depict only some embodiments according to the disclosure and are not therefore to be considered limiting of its scope.
Fig. 1 shows a schematic overall cross-sectional view of a high transmittance heating structure according to an embodiment of the utility model.
Detailed Description
Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
Fig. 1 shows a schematic overall cross-sectional view of a high transmittance heating structure according to an embodiment of the utility model.
The present embodiment provides a high light transmittance heating structure, which includes a substrate 110, a electrothermal conversion layer 120, an electrode 130, and a protective layer 140, as shown in fig. 1.
The electrothermal conversion layer 120 is a conductive film formed on the substrate 110 by metal oxide vacuum plating; the electrothermal conversion layer 120 is used for electrothermal conversion when energized; the transmittance of the electrothermal conversion layer 120 is greater than 50%.
The electrodes 130 are disposed on both sides of the electrothermal conversion layer 120, and the electrodes 130 are used for connecting to a power source.
The protective layer 140 covers the electrothermal conversion layer 120, and the refractive index of the protective layer 140 is lower than that of the electrothermal conversion layer 120.
In this embodiment, a protective layer 140 with a low refractive index is sputtered on the transparent electrothermal conversion layer 120, so that the transmittance of the electrothermal conversion layer 120 is significantly improved, the heating structure has high transmittance, and a protective layer can be provided for the electrothermal conversion layer 120 to improve the scratch resistance.
In a specific embodiment, the protective layer 140 includes at least one of silicon dioxide, zinc oxide, aluminum oxide, magnesium oxide, and titanium oxide.
In one embodiment, the thickness of the protective layer 140 is 15-150 nm.
In one embodiment, electrothermal conversion layer 120 has a thickness of 10 to 150nm.
In one embodiment, the thickness of the electrode 130 is greater than the thickness of the protective layer 140, and the protective layer 140 is disposed within a recess formed between the two electrodes 130.
In one particular embodiment, electrothermal conversion layer 120 comprises nichrome, silicon carbide, znOxS (1-x), inOxS (1-x), snxIn (1-x) O, znxMg (1-x) O, znxAl (1-x) O, niO, cu 2 One of O and SnO.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that various changes and substitutions are possible within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (6)
1. A high transmittance heating structure comprising:
a substrate;
the electrothermal conversion layer is a conductive film formed on the substrate through metal oxide vacuum coating; the electrothermal conversion layer is used for electrothermal conversion when being electrified; the light transmittance of the electrothermal conversion layer is more than 50%;
the electrodes are arranged on two sides of the electrothermal conversion layer and are used for being connected with a power supply;
and the protective layer covers the electrothermal conversion layer, and the refractive index of the protective layer is lower than that of the electrothermal conversion layer.
2. The high transmittance heating structure of claim 1 wherein the protective layer comprises at least one of silica, zinc oxide, aluminum oxide, magnesium oxide, and titanium oxide.
3. The high transmittance heating structure of claim 2, wherein the protective layer has a thickness of 15-150 nm.
4. A high light transmittance heating structure according to any one of claims 1-3, wherein the electrothermal conversion layer has a thickness of 10-150 nm.
5. The high transmittance heating structure of claim 4 wherein the thickness of the electrode is greater than the thickness of the protective layer, the protective layer being disposed within a recess formed between two of the electrodes.
6. The high transmittance heating structure of claim 4 wherein the electrothermal conversion layer comprises nichrome, silicon carbide, znOxS (1-x), inOxS (1-x), snxIn (1-x) O, znxMg (1-x) O, znxAl (1-x) O, niO, cu 2 One of O and SnO.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202320925019.1U CN219678709U (en) | 2023-04-23 | 2023-04-23 | High light transmittance heating structure |
Applications Claiming Priority (1)
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CN202320925019.1U CN219678709U (en) | 2023-04-23 | 2023-04-23 | High light transmittance heating structure |
Publications (1)
Publication Number | Publication Date |
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CN219678709U true CN219678709U (en) | 2023-09-12 |
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Family Applications (1)
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CN202320925019.1U Active CN219678709U (en) | 2023-04-23 | 2023-04-23 | High light transmittance heating structure |
Country Status (1)
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CN (1) | CN219678709U (en) |
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2023
- 2023-04-23 CN CN202320925019.1U patent/CN219678709U/en active Active
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